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GB2188657A - Wooden flooring with a covering layer to allow other materials to be laid above - Google Patents
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GB2188657A - Wooden flooring with a covering layer to allow other materials to be laid above - Google Patents

Wooden flooring with a covering layer to allow other materials to be laid above Download PDF

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Publication number
GB2188657A
GB2188657A GB08607967A GB8607967A GB2188657A GB 2188657 A GB2188657 A GB 2188657A GB 08607967 A GB08607967 A GB 08607967A GB 8607967 A GB8607967 A GB 8607967A GB 2188657 A GB2188657 A GB 2188657A
Authority
GB
United Kingdom
Prior art keywords
mesh
floor
sub
underlayment
boarded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08607967A
Other versions
GB8607967D0 (en
GB2188657B (en
Inventor
John Sutton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DORKING FLOORS Ltd
Original Assignee
DORKING FLOORS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DORKING FLOORS Ltd filed Critical DORKING FLOORS Ltd
Priority to GB8607967A priority Critical patent/GB2188657B/en
Publication of GB8607967D0 publication Critical patent/GB8607967D0/en
Publication of GB2188657A publication Critical patent/GB2188657A/en
Application granted granted Critical
Publication of GB2188657B publication Critical patent/GB2188657B/en
Expired legal-status Critical Current

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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/12Flooring or floor layers made of masses in situ, e.g. seamless magnesite floors, terrazzo gypsum floors

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Floor Finish (AREA)

Abstract

A boarded sub-floor is treated to provide a firm surface on which a decorative floor covering can be laid. The treatment consists in covering the sub-floor with a layer of reinforcing absorbent floppy and inert mesh in close contact with the floor and coating the mesh with an underlayment composition whereby the mesh absorbs moisture from the underlayment composition so that it forms a crust. The mesh is preferably a hessian or scrim having a mesh size of between 1 and 5 millimetres. The underlayment may be a water based cementitious material.

Description

SPECIFICATION Improvements in flooring The present invention relates to flooring and more particularly to a treatment for sub-flooring which results in a smooth and firm surface on which a decorative floorcovering can be laid.
It is well known to cover a rigid sub-floor, such as a concrete floor, with a thin layer of a cementitious composition of creamy or slurry like consistency, sometimes known as a screeded layer or underlayment, in order to produce a smooth and firm surface on which a floorcovering can be laid. However in the case of a boarded sub-floor, for example a wooden or chipboard sub-floor, such a method of treatment is not satisfactory. This is firstly because a boarded floor is liable to flex, resulting in cracking and break-up of the underlayment and secondly because the cementitious composition tends to run down any holes or gaps in the floor so that a satisfactory overall covering cannot be achieved.It is therefore common practice to use sheets of hardboard or plywood which are either nailed or glued to the sub-floor in order to provide the smooth surface necessary for the proper laying of a floorcovering. This is both expensive and inconvenient.
It is an object of the present invention to provide a treatment for a boarded sub-floor which enables a smooth surface to be obtained without the necessity of using sheets of hardboard, plywood or the like.
According to the present invention a boarded sub-floor is first covered with a layer of a reinforcing mesh and the underlayment composition is then spread over the reinforcing mesh such as to permeate and cover the mesh and provide a firm and smooth surface when the underlayment composition has set.
The reinforcing mesh should be of small mesh size, for example within the range of 1 to 5 millimetres and preferably round about 2 millimetres; and the mesh material is advantageously floppy and inert so that it readily lays flat on and in close contact with the sub-floor.
The floppy and inert nature of the mesh material helps to prevent rucking or creasing as the underlayment composition is spread over the mesh. Suitable mesh materials are, for example hessian, scrim, and fibre glass; although other materials e.g. plastics materials can be used; preferably those which have a reasonably floppy characteristic. It will be understood that the mesh may be of a random nature as is sometimes the case with a fibre glass mat.
Provided that the mesh material is of a floppy and inert nature, it does not need to be fastened to the sub-floor before the underlayment composition is spread over it.
The underlayment may comprise a water based cementitious material consisting of a powder, e.g. a sand and cement mix, dispersed in a natural or synthetic water soluble latex, acrylic, or other polymer. Such materials are readily available as proprietary items.
It has been found that the use of a mesh in accordance with the present invention, serves to reinforce and support the underlayment composition as it is spread and substantially prevent it from flowing down cracks and holes in a boarded sub-floor. This is particularly so where the mesh is made of a highly absorbent material such as hessian or scrim which absorbs the water in the cementitious material very quickly so that it forms a crust and therefore does not run down holes and cracks in the sub-floor, or fill up the joints between the boards. The underlayment thus formed is only very thin, for example about 2 millimetres in thickness, and it is much cheaper than using sheets of a material such as hardboard or plywood. Moreover, the underlayment is able to withstand flexing of the sub-floor to a degree without cracking to an unacceptable extent.
If desired, the amount of reinforcement can be increased by using two or more layers of mesh to form a multi-ply reinforcement.
The structure provided by the present invention also possesses improved fire resistance as compared with that provided by laid sheets of hardboard or plywood.
1. A method of treatment for a boarded sub-floor which consists in covering the subfloor with a layer of a reinforcing absorbent material in the form of a floppy and inert mesh which can readily lay flat on and in close contact with the sub-floor and then spreading an underlayment composition over the mesh whereby the latter absorbs moisture from the underlayment composition so that it forms a crust.
2. A method as claimed in claim 1, in which the reinforcing absorbent material is a hession or scrim.
3. A method as claimed in claim 1 or 2, in which two or more layers of reinforcing material are used to form a multi-ply reinforcement.
4. A method as claimed in claim 1, 2 or 3, in which the reinforcing absorbent material has a mesh size within the range 1 to 5 millimetres.
5. A method as claimed in claim 4, in which the reinforcing absorbent material has mesh size of about 2 millimetres.
6. A method as claimed in any preceding claim, in which the underlayment comprises a water based cememtitious material.
7. A method of treatment for a boarded sub-floor substantially as hereinbefore described.
8. A boarded sub-floor treated according
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (14)

**WARNING** start of CLMS field may overlap end of DESC **. SPECIFICATION Improvements in flooring The present invention relates to flooring and more particularly to a treatment for sub-flooring which results in a smooth and firm surface on which a decorative floorcovering can be laid. It is well known to cover a rigid sub-floor, such as a concrete floor, with a thin layer of a cementitious composition of creamy or slurry like consistency, sometimes known as a screeded layer or underlayment, in order to produce a smooth and firm surface on which a floorcovering can be laid. However in the case of a boarded sub-floor, for example a wooden or chipboard sub-floor, such a method of treatment is not satisfactory. This is firstly because a boarded floor is liable to flex, resulting in cracking and break-up of the underlayment and secondly because the cementitious composition tends to run down any holes or gaps in the floor so that a satisfactory overall covering cannot be achieved.It is therefore common practice to use sheets of hardboard or plywood which are either nailed or glued to the sub-floor in order to provide the smooth surface necessary for the proper laying of a floorcovering. This is both expensive and inconvenient. It is an object of the present invention to provide a treatment for a boarded sub-floor which enables a smooth surface to be obtained without the necessity of using sheets of hardboard, plywood or the like. According to the present invention a boarded sub-floor is first covered with a layer of a reinforcing mesh and the underlayment composition is then spread over the reinforcing mesh such as to permeate and cover the mesh and provide a firm and smooth surface when the underlayment composition has set. The reinforcing mesh should be of small mesh size, for example within the range of 1 to 5 millimetres and preferably round about 2 millimetres; and the mesh material is advantageously floppy and inert so that it readily lays flat on and in close contact with the sub-floor. The floppy and inert nature of the mesh material helps to prevent rucking or creasing as the underlayment composition is spread over the mesh. Suitable mesh materials are, for example hessian, scrim, and fibre glass; although other materials e.g. plastics materials can be used; preferably those which have a reasonably floppy characteristic. It will be understood that the mesh may be of a random nature as is sometimes the case with a fibre glass mat. Provided that the mesh material is of a floppy and inert nature, it does not need to be fastened to the sub-floor before the underlayment composition is spread over it. The underlayment may comprise a water based cementitious material consisting of a powder, e.g. a sand and cement mix, dispersed in a natural or synthetic water soluble latex, acrylic, or other polymer. Such materials are readily available as proprietary items. It has been found that the use of a mesh in accordance with the present invention, serves to reinforce and support the underlayment composition as it is spread and substantially prevent it from flowing down cracks and holes in a boarded sub-floor. This is particularly so where the mesh is made of a highly absorbent material such as hessian or scrim which absorbs the water in the cementitious material very quickly so that it forms a crust and therefore does not run down holes and cracks in the sub-floor, or fill up the joints between the boards. The underlayment thus formed is only very thin, for example about 2 millimetres in thickness, and it is much cheaper than using sheets of a material such as hardboard or plywood. Moreover, the underlayment is able to withstand flexing of the sub-floor to a degree without cracking to an unacceptable extent. If desired, the amount of reinforcement can be increased by using two or more layers of mesh to form a multi-ply reinforcement. The structure provided by the present invention also possesses improved fire resistance as compared with that provided by laid sheets of hardboard or plywood. CLAIMS
1. A method of treatment for a boarded sub-floor which consists in covering the subfloor with a layer of a reinforcing absorbent material in the form of a floppy and inert mesh which can readily lay flat on and in close contact with the sub-floor and then spreading an underlayment composition over the mesh whereby the latter absorbs moisture from the underlayment composition so that it forms a crust.
2. A method as claimed in claim 1, in which the reinforcing absorbent material is a hession or scrim.
3. A method as claimed in claim 1 or 2, in which two or more layers of reinforcing material are used to form a multi-ply reinforcement.
4. A method as claimed in claim 1, 2 or 3, in which the reinforcing absorbent material has a mesh size within the range 1 to 5 millimetres.
5. A method as claimed in claim 4, in which the reinforcing absorbent material has mesh size of about 2 millimetres.
6. A method as claimed in any preceding claim, in which the underlayment comprises a water based cememtitious material.
7. A method of treatment for a boarded sub-floor substantially as hereinbefore described.
8. A boarded sub-floor treated according to the method of any of the preceding claims.
9. A flooring providing a firm surface on which a decorative floor covering can be laid comprising a boarded sub-floor, and a layer of absorbent floppy and inert mesh in close contact with the sub-floor, said mesh having a coating of an underlayment composition in the form of a crust and of which the moisture content is absorbed by the mesh.
10. A flooring as claimed in claim 9, in which the absorbent floppy and inert mesh is formed of hessian or scrim.
11. A flooring as claimed in claim 10, in which the mesh has a size within the range 1 to 5 millimetres.
12. A flooring as claimed in claim 9, 10 or 11, in which the underlayment composition comprises a water based cementitious material.
13. A flooring as claimed in claim 12, in which the cementitious material consists of a sand and cement mix dispersed in a natural or synthetic water soluble latex, acrylic or other polymer.
14. A flooring as claimed in claim 9 and substantially as hereinbefore described.
GB8607967A 1986-04-01 1986-04-01 Improvements in flooring Expired GB2188657B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8607967A GB2188657B (en) 1986-04-01 1986-04-01 Improvements in flooring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8607967A GB2188657B (en) 1986-04-01 1986-04-01 Improvements in flooring

Publications (3)

Publication Number Publication Date
GB8607967D0 GB8607967D0 (en) 1986-05-08
GB2188657A true GB2188657A (en) 1987-10-07
GB2188657B GB2188657B (en) 1989-11-29

Family

ID=10595504

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8607967A Expired GB2188657B (en) 1986-04-01 1986-04-01 Improvements in flooring

Country Status (1)

Country Link
GB (1) GB2188657B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014118410A1 (en) * 2013-02-01 2014-08-07 Torrecid, S.A. Construction element for raised floors and the like and manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB310491A (en) * 1928-04-27 1929-09-12 Tanners Products Company Floor covering and method of forming the same
GB1310247A (en) * 1970-03-25 1973-03-14 Newman D F R Roofing material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB310491A (en) * 1928-04-27 1929-09-12 Tanners Products Company Floor covering and method of forming the same
GB1310247A (en) * 1970-03-25 1973-03-14 Newman D F R Roofing material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014118410A1 (en) * 2013-02-01 2014-08-07 Torrecid, S.A. Construction element for raised floors and the like and manufacturing method
US10052841B2 (en) 2013-02-01 2018-08-21 Torrecid, S.A. Construction element for raised floors and the like and manufacturing method

Also Published As

Publication number Publication date
GB8607967D0 (en) 1986-05-08
GB2188657B (en) 1989-11-29

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PCNP Patent ceased through non-payment of renewal fee