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GB2199592B - Silicon wafer treatment trays - Google Patents
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GB2199592B - Silicon wafer treatment trays - Google Patents

Silicon wafer treatment trays

Info

Publication number
GB2199592B
GB2199592B GB8800230A GB8800230A GB2199592B GB 2199592 B GB2199592 B GB 2199592B GB 8800230 A GB8800230 A GB 8800230A GB 8800230 A GB8800230 A GB 8800230A GB 2199592 B GB2199592 B GB 2199592B
Authority
GB
United Kingdom
Prior art keywords
silicon wafer
wafer treatment
treatment trays
trays
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8800230A
Other versions
GB2199592A (en
GB8800230D0 (en
Inventor
Gaylord D Smith
Wei Kwang Chang
Charles N Dornfest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Huntington Alloys Corp
Original Assignee
Applied Materials Inc
Inco Alloys International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Inco Alloys International Inc filed Critical Applied Materials Inc
Publication of GB8800230D0 publication Critical patent/GB8800230D0/en
Publication of GB2199592A publication Critical patent/GB2199592A/en
Application granted granted Critical
Publication of GB2199592B publication Critical patent/GB2199592B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
    • C22C19/058—Alloys based on nickel or cobalt based on nickel with chromium without Mo and W

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
GB8800230A 1987-01-08 1988-01-06 Silicon wafer treatment trays Expired - Lifetime GB2199592B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US152887A 1987-01-08 1987-01-08

Publications (3)

Publication Number Publication Date
GB8800230D0 GB8800230D0 (en) 1988-02-10
GB2199592A GB2199592A (en) 1988-07-13
GB2199592B true GB2199592B (en) 1990-09-26

Family

ID=21696503

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8800230A Expired - Lifetime GB2199592B (en) 1987-01-08 1988-01-06 Silicon wafer treatment trays

Country Status (2)

Country Link
JP (1) JPS63198316A (en)
GB (1) GB2199592B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2398212A1 (en) * 2000-01-24 2001-07-26 Inco Alloys International, Inc. High temperature thermal processing alloy

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2548092A (en) * 1949-10-06 1951-04-10 Thompson Prod Inc Cooled hollow article
US2570193A (en) * 1946-04-09 1951-10-09 Int Nickel Co High-temperature alloys and articles
EP0069452A1 (en) * 1981-05-21 1983-01-12 Huntington Alloys, Inc. Articles or parts resistant to stress corrosion cracking
EP0091279A1 (en) * 1982-04-02 1983-10-12 Hitachi, Ltd. Ni-base alloy member and method of producing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631345B2 (en) * 1972-01-27 1981-07-21
US3871928A (en) * 1973-08-13 1975-03-18 Int Nickel Co Heat treatment of nickel alloys
GB1520630A (en) * 1974-07-08 1978-08-09 Johnson Matthey Co Ltd Platinum group metal-containing alloys
JPS5162126A (en) * 1974-11-29 1976-05-29 Mitsubishi Metal Corp TAINETSUSEINITSUKERUKIGOKIN
JPS5681661A (en) * 1979-12-06 1981-07-03 Daido Steel Co Ltd Heat resistant cast alloy
JPS57149441A (en) * 1981-03-12 1982-09-16 Res Inst Electric Magnetic Alloys Elinver type alloy for high temperature and preparation thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2570193A (en) * 1946-04-09 1951-10-09 Int Nickel Co High-temperature alloys and articles
US2548092A (en) * 1949-10-06 1951-04-10 Thompson Prod Inc Cooled hollow article
EP0069452A1 (en) * 1981-05-21 1983-01-12 Huntington Alloys, Inc. Articles or parts resistant to stress corrosion cracking
EP0091279A1 (en) * 1982-04-02 1983-10-12 Hitachi, Ltd. Ni-base alloy member and method of producing the same

Also Published As

Publication number Publication date
GB2199592A (en) 1988-07-13
JPS63198316A (en) 1988-08-17
GB8800230D0 (en) 1988-02-10

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930106