HK40119971A - Liquid immersion cooling platform with localized cooling and fluid quality detection - Google Patents

Description

Liquid immersion cooling platform with localized cooling and fluid quality monitoring

Cross-references to related applications

This application claims priority to U.S. Provisional Application No. 63/346,061, filed May 26, 2022, the entire disclosure of which is incorporated herein by reference.

This application relates to PCT publication WO2020/102090 entitled "Liquid Immersion Cooling Platform" owned by TMGCore, LLC and filed on November 11, 2019, which is incorporated herein by reference.

Technical Field

The present invention relates to a liquid immersion cooling system suitable for housing computing devices, for example, a liquid immersion cooling system including a control system for optimizing the temperature of the system.

Background Technology

Traditional computing and/or server systems utilize air to cool the various components of these systems. Traditional liquid or water-cooled computers use a flowing liquid to absorb heat from the computer components, but avoid direct contact between the components and the liquid itself. The development of non-conductive and/or dielectric fluids has enabled immersion cooling, in which computer components and other electronic devices are immersed in a dielectric or non-conductive liquid, allowing heat to be absorbed directly from the components into the liquid. Immersion cooling can reduce the total energy required to cool computer components and can also reduce the amount of space and equipment needed for adequate cooling.

Summary of the Invention

Liquid immersion cooling systems are being implemented for various computing needs. Therefore, it is beneficial to describe an immersion cooling system that can be readily adapted for localized cooling and on-demand filtration of dielectric fluids.

Advantageously, this application relates to an exemplary immersion cooling system and a method for operating the system. In one example embodiment, the system includes: a management system including a processor and a memory; a storage tank capable of holding a thermally conductive dielectric fluid; computer components that can be at least partially immersed in the dielectric fluid; and a fluid circulation system including a pump and valve system. In this example, the management system can instruct the pump and valve system to extract the dielectric fluid from the storage tank, pass the dielectric fluid through a heat exchanger, and transport the dielectric fluid back to the storage tank.

In one example, the system may include sensors, and the management system may receive sensor data from the sensors and instruct the pump and valve system based on the data. In one example, the sensor data is the fluid level in the storage tank. In one example, the management system may add the dielectric fluid to the storage tank when the sensor data drops below a threshold amount. In one example, the system includes a rack, and the computer component is housed in the rack. In one example, the system includes RFID tags on the rack or the computer component. In one example, the storage tank includes an RFID scanner configured to transmit or receive radio frequency waves and detect the RFID tags. In one example, the management system is configured to determine the inventory of multiple computer components in the storage tank based on data detected by the RFID scanner.

In one example, the rack further includes a fan or pump for circulating the dielectric fluid within the rack. In one example, the sensor data includes the tank temperature of the dielectric fluid in the storage tank, the rack temperature of the dielectric fluid in the rack, and the computer component temperature of the computer component. In one example, the management system may instruct the pump and valve system to circulate the dielectric fluid based on the tank temperature, the rack temperature, and the computer component temperature. In one example, the fluid circulation system is configured to circulate the dielectric fluid in at least one of the following loops: a first loop in which the dielectric fluid can be extracted from the storage tank and transported back to the storage tank; a second loop in which the dielectric fluid can be extracted from the rack and transported back to the storage tank; and a third loop in which the dielectric fluid can be extracted from the vicinity of the computer component and transported back to the storage tank.

In one example, the fluid circulation system is configured to circulate the dielectric fluid in the first loop, the second loop, and the third loop when the tank temperature exceeds a first threshold. In one example, the fluid circulation system is configured to circulate the dielectric fluid in the second loop when the rack temperature exceeds a second threshold. In one example, the fluid circulation system is configured to circulate the dielectric fluid in the third loop when the computer component temperature exceeds a third threshold.

In one example, the system includes an overflow tray extending below the tank. In one example, the overflow tray can collect any dielectric fluid overflowing from the tank. In one example, the system includes a fluid sensor (or marker sensor) in the overflow tray. In one example, the management sensor is configured to shut down the system when the fluid sensor detects an increase in the dielectric fluid level in the overflow tank below a threshold level.

In one example, the fluid circulation system further includes multiple filters, and the valve system is configured to connect each filter to or disconnect each filter from the pump. In one example, the multiple filters include coarse filters, particulate filters, or adsorption filters. In one example, the system includes a sensor system comprising a conductivity sensor, a resistivity sensor, a permittivity sensor, a relative humidity sensor, or a pressure sensor. In one example, the management system is configured to connect or disconnect at least one of the multiple filters based on sensor data received from the sensor system. In one example, the management system may determine the pressure difference of at least one of the multiple filters based on the sensor data received from the sensor system. In one example, the management system may determine that at least one of the multiple filters has failed based on the pressure difference.

This overview is provided to introduce, in a simplified form, a series of concepts that will be further described in the specific embodiments below. This overview is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

Attached Figure Description

To describe how the above and other advantages and features can be obtained, the subject matter briefly described above will be described in more detail with reference to specific embodiments shown in the accompanying drawings. It should be understood that these drawings depict only typical embodiments and are therefore not to be considered limiting; the embodiments will be described and explained with additional specificity and detail using the drawings, in which:

Figure 1 illustrates a liquid immersion cooling system according to an example embodiment of the present disclosure.

Figure 2 illustrates another liquid immersion cooling system according to an example embodiment of the present disclosure.

Figure 3 illustrates another liquid immersion cooling system according to an example embodiment of the present disclosure.

Figure 4 illustrates an exemplary computer component according to an example embodiment of the present disclosure.

Figure 5 illustrates an exemplary heat transfer system according to an example embodiment.

Figure 6 illustrates another liquid immersion cooling system according to an example embodiment of the present disclosure.

Throughout the accompanying drawings, unless otherwise stated, the same reference numerals and characters are used to denote the same features, elements, components, or portions of the illustrated embodiments. Furthermore, while this disclosure will now be described in detail with reference to the accompanying drawings, the description of this disclosure is made in conjunction with exemplary embodiments and is not limited to the specific embodiments shown in the drawings and claims.

Detailed Implementation

Exemplary embodiments of the invention will now be described to illustrate various features of the invention. The embodiments described herein are not intended to limit the scope of the invention, but rather to provide examples of components, use, and operation of the invention.

Immersion cooling system

In one example embodiment, the immersion cooling system or container may include a bath area, a tank area, a weir (e.g., between the bath area and the tank area), computing devices, optional automated machines, optional pressure control systems, and management systems. In one example, the container may be a pressure-controlled tank maintained at atmospheric pressure (or within a range of atmospheric pressure), which may be cooled using a heat exchanger. In another example, the container is not pressure-controlled. The computing devices may be immersed in a dielectric fluid within the bath area of the container. The computing devices may be connected to a network and perform various processing and computational tasks while immersed in the dielectric fluid (or “fluid”). The container may include a lid for access to the bath area, and for accessing the computing devices and the tank area.

In one example, the heat exchanger can be a fluid-to-fluid heat exchanger. For example, the heat exchanger can receive warm dielectric fluid from the container and simultaneously receive cold working medium. The heat exchanger can transfer heat from the dielectric fluid to the working medium. In one example, the working medium can be transferred to a cooling device (which can be an on-site cooling device or a remote cooling device). In another example, the heat exchanger can be a cooling device, such as a heat sink with or without a fan, a refrigerator, a cooler, etc. In this example, cooling of the working medium may not be necessary because the heat exchanger can cool the dielectric fluid without transferring the working medium to another facility. In one example, the heat exchanger can be placed inside a storage tank. In another example, the heat exchanger can be placed outside the storage tank.

In one example, when the lid is opened, the automated manipulator can lift the computing device from the bath area of the container. The automated manipulator can place the lifted computing device into a compartment provided for storing the computing device or onto a vehicle. The automated manipulator can also lift the computing device from the compartment (or vehicle) and place it in place of the computing device lifted from the bath area. The automated manipulator can be attached to the container, vehicle, or other location. In this example embodiment, the container may be a two-phase cooling system. In other example embodiments, the container may be a single-phase cooling system, which may or may not have one or more of the components mentioned above.

In one example embodiment, the pump can circulate fluid within the container. For example, the pump can draw dielectric fluid from a tank area and transfer the fluid to a bath area. The fluid can then flow over a weir and return to the tank area. Before transferring the fluid to the bath area, the pump can circulate the fluid through, for example, heat exchangers, filters, various pipes, and valves. The pump can circulate the fluid upon receiving instructions from the management system. In one example, the pump can draw fluid from a tank area and transfer it to a bath area. In another example, the pump can draw fluid from a bath area and transfer it to a tank area.

In one example, the management system may receive data generated by sensors included in the liquid immersion cooling system. In another example, the management system may provide an alarm and/or take another appropriate action, such as shutting down the container based on sensor readings. For example, the management system may adjust or control heating elements, fluid flow rate or temperature, pressure in the tank, fluid level, fluid purity, and/or any number of other system parameters. Such adjustment is typically based on one or more sensed parameters of the liquid immersion cooling system (e.g., parameters detected by sensors). The sensed parameters may include, for example, temperature (temperature inside or outside the container), pressure, fluid level (fluid level in the bath or tank area), or system power consumption. In one example, when the fluid level drops below a threshold level, the management system may instruct the tank's pump and/or valve system to allow the addition of dielectric fluid to the tank. The dielectric fluid may originate from an external tank or reservoir.

In one example embodiment, the immersion cooling system can be a single-phase immersion cooling system. In this example, the dielectric fluid can remain in liquid form throughout the operation of the immersion cooling system. This can differ from a two-phase system, in which the dielectric fluid can evaporate and condense, for example, while cooling computer components.

In one example, an immersion cooling system may include a tank that holds a volume of dielectric fluid. The tank may also be configured to hold computer components. A pump can draw dielectric fluid from a tank and transfer it to the tank. In this example embodiment, the pump can cause fluid to flow over a weir into the tank. In one example embodiment, a liquid immersion cooling system may include a bath area without a tank. A pump can draw fluid from the bath area and transfer it to, for example, a heat exchanger, a filter, and/or other components. The fluid can then return to the bath area (e.g., after heat dissipation in a heat exchanger or after cleaning in a filter). In this example embodiment, there may be no need for fluid to flow over a weir into the tank, but in other embodiments, the immersion cooling system may include a weir.

Figure 1 illustrates a liquid immersion cooling system 100 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 100 may include a container 105 and a vehicle 130. The container 105 may include a storage tank 110, which includes a bath area 111, a tank area 112, a weir 140, fluid 113, a computer component 114, a pump 115, a filter 118, a door 116, a management system 117, and a heat exchanger 119. The computer component 114 may be immersed in the fluid 113. The vehicle 130 may include an automated manipulator 131. The automated manipulator 131 may lift the computer component 114 when the door 116 is open and place the computer component 114 on the vehicle 130. The fluid 113 may flow through the weir 140 and accumulate in the tank area 112. In one example, pump 115 may draw fluid 113 from tank area 112 and transfer the fluid to bath area 111 after passing it through heat exchanger 119 and filter 118. Those skilled in the art will recognize that an embodiment may include other components or arrangements of components in the fluid transfer and circulation system, such as valves, pipes, etc., which may not be shown in the exemplary embodiment of FIG1.

Figure 2 illustrates a liquid immersion cooling system 200 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 200 may include a tank 210, which includes a bath zone 211, a fluid 213, a computer component 214, a pump 215, a heat exchanger 219, a door 216, and a management system 217. The computer component 214 may be immersed in the fluid 213. In this exemplary embodiment, the tank 210 may not be pressure-controlled, but in some other exemplary embodiments, the tank may be pressure-controlled. In this exemplary embodiment, the immersion cooling system may be a single-phase system, but in some other exemplary embodiments, the immersion cooling system may be a two-phase system.

In this example embodiment, pump 215 may receive instructions from management system 217 to extract fluid from bath 211 and transport it to a heat exchanger, for example, to maintain the temperature of fluid 213 below a threshold temperature or to cool computer components 214. In response, pump 215 may extract fluid 213 from bath 211 and pass fluid 213 through heat exchanger 219. Fluid 213 may then be transferred to bath 211. Those skilled in the art will recognize that other embodiments may include additional or fewer components to extract fluid 213 from bath 211, and these components may be arranged differently in different embodiments; for example, the heat exchanger may be placed before pump 215.

In one example embodiment, the liquid immersion cooling system 200 may include a fluid level sensor 251 and an external reservoir 250. In this example embodiment, the fluid level sensor may detect the fluid level within the reservoir 210 and transmit the data to a management system 217. When the fluid level drops below a threshold level, the management system 217 may instruct a pump 215 to draw fluid from the external reservoir 250. In one example, when the fluid level exceeds the threshold level, the management system 217 may instruct the pump 215 to return the fluid to the external reservoir 250. In one example, the rack may include a fluid level sensor, and the management system may instruct the pump to draw fluid from (or return) the fluid to the external reservoir based on data transmitted by the sensor located in the rack.

Local heat dissipation

In one example embodiment, in addition to circulating fluid within a bath area, or as an alternative, various devices can be provided to draw fluid from the vicinity of one or more computer components (e.g., servers, racks, or CPUs) and transfer the fluid to a heat exchanger. In one example, each computer component may be housed in a rack, and the rack may include inputs for receiving dielectric fluid and outputs for transferring fluid outside the rack. In this example, the rack outputs may be fluidly coupled to a heat exchanger or absorber (e.g., via hoses or pipes), and optionally, a pump may be present to draw fluid from the rack. In this example, the computer component may heat fluid in its vicinity or within the rack, and the pump may draw the fluid. Because the fluid is drawn from an area close to the heat-generating component, the pump can draw the hottest fluid and effectively cool the fluid.

In another example, each computer component (e.g., CPU) may include a component for extracting fluid (e.g., an inlet valve, a heat absorber, or a metal plate with a liquid inlet and outlet). This component can be connected to a heat exchanger using a pump and various pipes or hoses. Thus, the pump can extract warm fluid from near the computer component.

In another example, heat from computer components can be transferred using heat pipes. In one example, a heat receiving component can be placed above or near the computer components (e.g., the heat receiving component can be thermodynamically coupled to the computer components). The heat receiving component can also be coupled to various heat pipes that can transfer heat from the computer components to a separate absorber or radiator. In this example, the heat from the computer components can be dissipated where the absorber or radiator is located.

Figure 3 illustrates a liquid immersion cooling system 300 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 300 may include a storage tank 310, fluid 213, a door 316, a management system 217, a pump 215, and a heat exchanger 219. The storage tank 310 may also include a rack 323 for housing computer components 314. The rack 323 may include an input 321 and an output 322. Fluid 213 may enter the rack 323, for example, through the input 321 and exit the rack through the output 322. In this example, the output is connected to the pump 215, for example, using a pipe. The pump 215 may draw fluid from the storage tank 310 and deliver it to the heat exchanger 219 to cool the fluid 213. Subsequently, the fluid may be returned to the storage tank 310. In this exemplary embodiment, the pump 215 may draw fluid 213 from near the computer components 314, thereby enabling the cooling of the hottest fluid 213 in the storage tank 310.

In one example embodiment, the rack may include one or more auxiliary pumps, fans, or any other means that can improve the flow of fluid into or out of the rack (e.g., pumpless or pumpless aerator). In another example, the pump or fan may be mounted on or near the computer components. For example, in the liquid immersion cooling system 300 of FIG. 3, the rack 323 may include an auxiliary pump 324 to facilitate the transfer and/or movement of fluid 213 within the rack 323. Pump 324 may draw fluid from input 321 and/or push fluid into the rack 323, such that fluid 213 is transferred from outside the rack 323 to output 322. In this example, pump 324 may transfer heat generated by the computer components 314 to the outside of the rack 324 more quickly.

In one example embodiment, the liquid immersion cooling system 300 may include an overflow tray 360. In the event of fluid 213 overflow, the fluid can be directed to the overflow tray 360. The overflow tray 360 can prevent fluid 213 from overflowing onto the floor. In one example, the overflow tray 360 may include a fluid sensor 361. The fluid sensor 361 can detect the presence of fluid 213 in the overflow tray 360. The fluid sensor 361 can transmit data to the management system 217. In one example, the fluid sensor 361 may be a continuous float level sensor, a miniature continuous float level sensor, a miniature side-mounted 90-degree float switch, a high-level float switch, a low-level float switch, a combination of high-level and low-level float switches, an oil-water interface, an adjustable float switch, a side-mounted, multi-point float switch, a visual level indicator, a submersible suspended float switch, an optical liquid level sensor, an oil level sensor, an oil pressure sensor, a conductivity sensor, or a point level sensor.

If fluid sensor 361 detects fluid in overflow tray 360, management system 217 can transmit a message to a central server indicating a possible leak at the liquid immersion cooling system 300. In one example, if fluid sensor 361 detects fluid in overflow tray 360 and detects that the fluid level exceeds a threshold, management system 217 can send a message indicating that overflow tray 360 should be emptied or replaced. If the fluid level exceeds the threshold level, or if the increase in fluid level exceeds the threshold for a given time period, management system can detect an active leak. In this case, in one example, management system can shut down operation of liquid immersion cooling system 300. In one embodiment, if management system 217 detects an active leak, management system 217 can instruct pump 215 to return fluid 213 to reservoir 250.

Figure 4 illustrates an exemplary computer component 414 according to an example embodiment of the present disclosure. In this exemplary embodiment, fluid may circulate in a component attached to the computer component 414, in addition to or instead of circulating fluid in a tank, and/or in addition to or instead of circulating fluid in a rack. In this example embodiment, the component may be a heat absorber 430, which may include an input 421 and an output 422. Fluid 213 may enter the heat absorber 430 from the input 421 and exit the heat absorber 430 through the output 422. Fluid 213 may be drawn from the output 422, for example, through a pump and various pipes, and supplied to a heat exchanger for cooling. In one example, the component attached to the computer component 414 may be an input valve or a housing having an input and an output. In one example embodiment, a fan 415 may be placed on the heat absorber 430 to allow additional cooling of the computer component 414. In one example, a heat diffuser 416 (or a steam chamber, cold plate, heat pipe, or absorber) may be provided to transfer heat from computer component 414 to fluid 213.

In one example, fluid may be drawn from near computer components and cooled at a heat exchanger within a tank or rack. For instance, the tank may include a primary heat exchanger (or, the primary heat exchanger may be external to the tank, but a secondary heat exchanger may be internal). A pump may draw fluid from near the computer components and deliver it to the heat exchanger in the tank. The heat exchanger in the tank may be located near, for example, the input point of the cooled dielectric fluid within the tank.

In one example embodiment, the liquid immersion cooling system can circulate fluid in various operating modes. For example, in one operating mode, a pump can circulate fluid in a tank. In another alternative mode, the pump can circulate fluid in one or more racks. In this mode, fluid can circulate in a selected number of racks, but other racks may be excluded from this fluid circulation. However, in another alternative mode, the pump can circulate fluid in one or more components attached to one or more computer components. In this mode, fluid can circulate in a selected number of computer components (or components attached to computer components), but other computer components may be excluded from this fluid circulation. In this example, the management system can instruct the valve system and/or pump to enable the liquid immersion cooling system to operate in one or more of the above-described operating modes, for example, switching valves between a first loop, a second loop, and/or a third loop, each loop enabling fluid circulation for a specific rack and/or computer component and/or multiple racks and/or computer components. In this example, the management system can circulate fluid in a selective set of individual racks and/or computer components. In another example, the management system can instruct fluid to circulate in all or multiple racks and/or computer components. In one example, the management system can circulate fluid in a combination of first, second, and third loops.

In one example, the management system may receive sensor data indicating that one or more of the aforementioned operating modes must be activated. For example, the sensor data may include the temperature of the dielectric fluid in the tank, the temperature of one or more racks, and the temperature of one or more computer components. If the management system detects that the temperature or the temperature increase exceeds an acceptable threshold amount, the management system may instruct pumps and valves to activate one or more of these loops. For example, if the temperature of a rack increases beyond an acceptable temperature or the temperature around the rack, the management system may activate fluid circulation for that rack to maintain the temperature of that rack at an acceptable level. As another example, if the temperature of a computer component increases beyond an acceptable temperature or the temperature around the computer component, the management system may activate fluid circulation for that computer component to maintain the temperature of that computer component at an acceptable level. In one example, if the temperature of the fluid in the tank increases beyond a first threshold amount, the management system may activate fluid circulation for the entire tank. If the temperature increase of the fluid in the tank also exceeds a second threshold, the management system may activate fluid circulation in one or more racks and/or one or more computer components, in addition to fluid circulation in the tank.

In one example embodiment, the management system can activate auxiliary pumps within or attached to the rack or computer component based on the temperature of the rack or computer component. For example, if the temperature of the rack or computer component exceeds a threshold, the management system can activate one or more auxiliary pumps to facilitate rapid heat transfer from the rack or computer component.

Figure 5 illustrates an exemplary heat transfer system 500 according to an example embodiment. In this example embodiment, the heat transfer system 500 may include a heat receiving component 510 that may be thermodynamically coupled to a computer component 514. The heat receiving component 510 may be a thermal interface material, a heat diffuser, a cold plate with or without small channels or microchannels, a steam chamber, or a combination of one or more of the foregoing.

The heat transfer system 500 may also include a heat pipe 515 and a heat absorber 520 (or radiator 520). In this example, a heat receiving component 510 may receive heat from the computer component 514 and transfer the heat to the heat absorber 520 using the heat pipe 515. The heat absorber 520 may be located in the rack in which the computer component 514 is housed. The heat absorber 520 may also be located in a tank, for example, near a fluid inlet or near a fluid outlet. By using the heat transfer system 500, the heat generated by the computer component 514 can be dissipated elsewhere in the tank.

In one example embodiment, the liquid immersion cooling system may include one or more of the systems described above in the localized heat dissipation system. For example, the rack may include a pump, a heat transfer system, and a radiator for dissipating heat.

RFID tags

In one example embodiment, the management system and/or subsystem can track components installed or operated in the immersion cooling system. In this example embodiment, the management system and/or subsystem can scan these components, for example, using an automated manipulator or other scanner. In one example, each trackable component, such as a rack or computer component, can have an RFID tag. For example, the management system and/or subsystem can transmit radio frequency within the tank and determine which RFID tags are present in the tank. In another example, each trackable component can include a visual barcode, such as a QR code, and the management system and/or subsystem can scan the visual barcode. In one example, the RFID tag can be placed on a computer component. In another example, the RFID tag can be placed on a rack.

In one example embodiment, the storage tank may include an automated manipulator (AMA) that can move inside or outside the tank and scan each trackable component within it. For example, the AMA could be a gantry-type AMA or an automated manipulator arm on a vehicle, capable of moving close to and scanning each trackable component, for example, by transmitting or receiving RF signals. The AMA can then transmit the data to a management system. In another example, the storage tank may include one or more scanners within it, for example, each scanner may be located at a distance from another scanner. Each scanner can be configured to detect trackable components within its scanning range.

In one example embodiment, the management system may receive data regarding the temperature of the rack and/or computer components. If the rack or computer component operates above a threshold temperature for a longer period than the threshold time interval, the management system may infer that the rack and/or computer component requires maintenance and/or replacement. In one example, the management system may infer that the rack and/or computer component requires maintenance, for example, if the rack and/or computer component operates below a threshold temperature, e.g., significantly below the operating temperature of the rack and/or computer component.

When the management system determines that a rack and/or computer component requires maintenance, it can transmit a message to a central server to dispatch, for example, an automated maintenance manipulator (AMA). The management system can also transmit a message even if the rack or computer component is not damaged, for example, when monthly or annual maintenance is required. In this example embodiment, the AMA can approach the tank and communicate with the management system, for example, directly or through the central server. The management system can provide data about the rack and/or computer component requiring maintenance. This data may include identification information for the rack or computer component (e.g., RFID tags) and/or its location within the tank. In this example, the AMA can locate the damaged component, for example, using identification or location information or by scanning the component's RFID tag. The AMA can also be configured to lift the component from the tank.

fluid filter

In one example embodiment, the liquid immersion cooling system may include one or more filters. The liquid immersion cooling system may also include one or more sensors (e.g., a sensor system including multiple sensors) that can detect whether fluid filtration is required. In one example embodiment, each filter can be connected to or disconnected from the fluid line as required by the management system. For example, each filter can be connected or disconnected based on sensor readings. On-demand filtration can provide several benefits. For example, when filters can be connected on demand, the pump does not need to continuously pass the dielectric fluid through all filters. This selective connection of filters can save power because lower pressures are required to circulate the fluid in the fluid circulation system. Furthermore, because each filter can be isolated, the pressure differential, temperature, and/or conductivity of each filter can be detected over time. This information can indicate whether a filter has failed and therefore needs replacement or repair.

Figure 6 illustrates a liquid immersion cooling system 600 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 600 may include a sensor system 671, a plurality of filters 672-674, and a plurality of valves 675. During operation of the system 600, the sensor system 671 may detect conditions that may require fluid filtration. For example, the sensor system 671 may detect particles, whiskers, plasticizers, or moisture in the fluid 213. The sensor system 671 may transmit this information to a management system 217. In this example, the management system 217 may determine that one or more of the filters 672-674 may be activated or connected to remedy the conditions detected by the sensor system 671. Thus, the management system 217 may instruct one or more of the valves 675 to open or close to direct the fluid 213 in the appropriate direction. In one example, the filters may include a coarse filter, a particulate filter, an adsorption filter, and/or a water separator. In one example, the sensor system may include a conductivity sensor, a resistivity sensor, a permittivity sensor, a relative humidity sensor, and/or a pressure sensor.

In one example, when an adsorption filter (e.g., a carbon or aluminum filter) operates under suboptimal conditions, the filter's conductivity may decrease. In this example, a conductivity sensor can be used to determine whether the filter requires maintenance and/or replacement. In one example embodiment, a sensor system can be provided in the storage tank. This sensor system can be, for example, a Raman spectrometer, a humidity sensor, and/or a conductivity sensor. In this example, the sensor system can trigger filtration in the storage tank.

In the example embodiment of Figure 6, the management system 217 can isolate each of the filters 672-674. In one example, the management system 217 can record the pressure difference and/or temperature of each filter over time. For example, when installing each filter, the management system can record the pressure difference and/or temperature of the filter during its operation. If the change in the pressure difference and/or temperature of the filter exceeds a threshold amount, this may indicate that the filter is not operating as expected, such as a filter failure. In this example embodiment, the management system can transmit a message to a central server informing the filter that it must be replaced and/or needs maintenance. In some embodiments, if a particular filter fails, the management system can stop the operation of the system to prevent damage to computer component 214. In one example embodiment, if the change in the pressure difference and/or temperature of the filter is less than another threshold amount, this may indicate that the filter is not operating as expected.

In one exemplary embodiment, the liquid immersion cooling system may include one or more filter loops. Each filter loop may draw fluid from a tank and circulate the fluid through one or more filters and/or other components, such as pumps, heat exchangers, sensors, etc. In the example embodiment of FIG. 6, there are two exemplary filter loops. One exemplary filter loop may include filters 672-674. The filter loop may also include pump 215, heat exchanger 219, and various sensors, such as temperature and pressure sensors. The second filter loop may include filter 681. In this example embodiment, the second filter loop may also include valve 682, various pipes, pumps, and sensors (not shown in FIG. 6). The management system 217 may activate each filter loop individually and/or in combination with other filters. For example, the management system 217 may instruct the pump of the second loop to draw fluid from the tank, for example, when one of the filters 672-674 of the first loop fails to operate properly, or when another condition is met. By using multiple filter loops, the liquid immersion cooling system can provide redundancy. For example, in one instance, even if one filter fails, the system can still operate when the failed filter is replaced because the filters are set on separate loops.

Various embodiments have been described in the foregoing description with reference to the accompanying drawings. However, it will be apparent that various modifications and alterations can be made thereto, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Therefore, the description and drawings should be considered illustrative rather than restrictive.

Claims (27)

1. A system comprising: A management system, the management system including a processor and a memory; A storage tank configured to retain a thermally conductive dielectric fluid; Computer components, the computer components being configured to be at least partially immersed in the dielectric body; and A fluid circulation system, the fluid circulation system including a pump and valve system; The management system is configured to instruct the pump and valve system to extract the dielectric fluid from the storage tank, pass the dielectric fluid through a heat exchanger, and transport the dielectric fluid back to the storage tank. 2. The system of claim 1 further includes a sensor, wherein the management system is configured to receive sensor data from the sensor and instruct the pump and the valve system based on the data. 3. The system according to claim 2, wherein the sensor data is the fluid level in the storage tank. 4. The system of claim 3, wherein the management system is configured to: add the dielectric fluid to the storage tank when the sensor data drops below a threshold amount. 5. The system of claim 2 further includes a rack, wherein the computer component is placed in the rack. 6. The system of claim 5 further includes an RFID tag on the rack or the computer component. 7. The system of claim 6, wherein the storage tank includes an RFID scanner configured to transmit or receive radio frequency waves and detect the RFID tag. 8. The system of claim 7, wherein the management system is configured to determine the inventory of a plurality of computer components in the storage tank based on data detected by the RFID scanner. 9. The system of claim 5, wherein the rack further comprises a heat transfer system including a heat receiving component, a heat pipe, and a heat absorber, wherein the heat receiving component is thermodynamically coupled to the computer component and configured to transfer heat from the computer component to the heat absorber using the heat pipe. 10. The system of claim 5, wherein the rack further includes a fan or pump for circulating the dielectric fluid within the rack. 11. The system of claim 5, wherein the sensor data includes the tank temperature of the dielectric fluid in the tank, the rack temperature of the dielectric fluid in the rack, and the computer component temperature of the computer component. 12. The system of claim 11, wherein the management system is configured to instruct the pump and the valve system to circulate the dielectric fluid based on the tank temperature, the rack temperature and the computer component temperature. 13. The system of claim 11, wherein the fluid circulation system is configured to circulate the dielectric fluid in at least one of the following loops: In the first circuit, the dielectric fluid is extracted from the tank and transported back to the tank. In the second circuit, the dielectric fluid is extracted from the rack and transported back to the storage tank; and In the third circuit, the dielectric fluid is extracted from the vicinity of the computer component and transported back to the storage tank. 14. The system of claim 13, wherein the fluid circulation system is configured to: when the tank temperature exceeds a first threshold, the fluid circulation system circulates the dielectric fluid in the first loop, the second loop, and the third loop. 15. The system of claim 13, wherein the fluid circulation system is configured to: when the rack temperature exceeds a second threshold, the fluid circulation system circulates the dielectric fluid in the second loop. 16. The system of claim 13, wherein the fluid circulation system is configured to: when the temperature of the computer component exceeds a third threshold, the fluid circulation system circulates the dielectric fluid in the third loop. 17. The system of claim 1, further comprising an overflow tray extending below the storage tank. 18. The system of claim 17, wherein the overflow tray is configured to collect any dielectric fluid overflowing from the tank. 19. The system of claim 17, further comprising a fluid sensor in the overflow tray. 20. The system of claim 19, wherein the management sensor is configured to: shut down the system when the fluid sensor detects an increase in the dielectric fluid level in the overflow tank below a threshold level. 21. The system of claim 1, wherein the fluid circulation system further comprises a plurality of filters, and the valve system is configured to connect each filter to the pump or disconnect each filter from the pump. 22. The system of claim 21, wherein the plurality of filters comprises a coarse filter, a particulate filter, or an adsorption filter. 23. The system of claim 21 further includes a sensor system, the sensor system including a conductivity sensor, a resistivity sensor, a permittivity sensor, a relative humidity sensor, or a pressure sensor. 24. The system of claim 23, wherein the management system is configured to connect or disconnect at least one of the plurality of filters based on sensor data received from the sensor system. 25. The system of claim 23, wherein the management system is configured to determine the pressure difference of at least one of the plurality of filters based on sensor data received from the sensor system. 26. The system of claim 25, wherein the management system is configured to determine, based on the pressure difference, that at least one of the plurality of filters has failed. 27. The system of claim 23, wherein the management system is configured to determine the conductivity of at least one of the plurality of filters based on sensor data received from the sensor system.