JP2017174066A - Ic card inlet, ic card, and ic card fabrication method - Google Patents

Abstract

An IC card is provided in which the IC module is less likely to float and crack even when the dynamic bending force of the card is evaluated more than the number of times specified in JIS X6305-1. An IC card inlet 10 includes an antenna base 8 and an antenna circuit 2 on the antenna base, and includes a plurality of through holes 4a and 4b and an IC module installation planned area 6. The plurality of through-holes straddle the region overlapping with the IC module installation planned region and the region not overlapping, and two of the plurality of through-holes 4a pass through the center of the IC card inlet. One exists so as to overlap two curved corners close to the straight line 12 in the longitudinal direction of the IC card inlet, and at least one other is in the longitudinal direction between the two through holes. An IC card inlet that exists so as to overlap a part of one side of the IC module installation scheduled area that is close to a straight line. [Selection] Figure 1

Description

  The present invention relates to an IC card inlet, an IC card, and a method of manufacturing an IC card.

  With the development of card technology in recent years, there is an IC card applicable to a wide range of uses as an information recording medium used in various communication systems. This IC card includes a contact type IC card that can write and read information by inserting it into a dedicated device, and a non-contact type that can write and read information only by bringing it close to the dedicated device. There is an IC card.

  In particular, non-contact type IC cards do not need to be inserted into a dedicated device, and the cards themselves are convenient to handle, and are rapidly spreading in the industry. In a non-contact type IC card, an IC card having a function of a control unit for controlling communication processing, a memory, and the like, and an inlet sheet on which an antenna coil for electromagnetic wave transmission / reception is mounted serves as a card body. It is configured to be embedded in a substrate and performs data communication processing with an external device using electromagnetic waves or the like.

  In addition, an IC card in which a contact type IC card and a non-contact type IC card are combined is also widespread, and a hybrid type IC card on which a contact type IC chip and a non-contact type IC chip are respectively mounted. (Hybrid card) and a combination type IC card (combination card) on which one IC chip for both contact and non-contact type is mounted.

  In an IC card in which an opening area is formed for mounting an IC module exposed on the surface of the IC card, there arises a problem of delamination between the inlet sheet and the core base material sandwiching the inlet sheet. It was. In order to solve this problem, various means have been proposed.

  In Patent Document 1, the IC card is sandwiched between laminate substrates from the upper and lower surfaces of an inlet sheet on which a circuit pattern including an antenna coil is formed, and has an IC module exposed on the surface of the IC card, At least one through hole is formed in the inlet sheet so as to straddle a region that overlaps a COT (Chip On Tape) substrate that constitutes the IC module in the inlet sheet and a region that does not overlap the COT substrate. An IC card is disclosed in which a laminate base material sandwiched between upper and lower surfaces of an inlet sheet is bonded. This through hole has the same length as one side of the COT substrate corresponding to the longitudinal direction of the inlet sheet, or has a horizontally long shape longer than one side of the COT substrate.

  In Patent Document 2, an antenna module for a hybrid IC card having a non-contact type IC chip and a contact type IC chip, wherein an antenna body unit is wound around a wire and connected to the non-contact type IC chip. A sheet-like base material that supports the antenna main body, and a part of the sheet-like base material located in a rectangular region where the contact-type IC chip is provided, and a remaining part communicating with the part An antenna module is disclosed, wherein a plurality of openings located outside the region are provided through the four corners or four sides of the region, and the sheet-like base material remains in at least a part of the region. Has been.

Japanese Patent No. 4825522 Japanese Patent No. 5076346

  In an IC card in which an opening area is formed in order to mount an IC module exposed on the surface of the IC card, there is an increasing need to increase the durability of the card. In particular, the dynamic bending force of cards conforming to JIS X6305-1 has been required to satisfy the number of times (1000 times) or more determined by this standard.

  When the above dynamic bending force is evaluated with respect to Patent Document 1, no defect occurs in the above 1000 times. However, if the evaluation is performed beyond this number, a crack occurs on the back side of the IC module. Sometimes.

  Further, when the above-mentioned dynamic bending force is evaluated for the card of Patent Document 2, a defect does not occur at the above 1000 times, but if the evaluation is performed beyond this number, a through hole is formed. There is a case where the IC module floats in a portion where it is not.

  Therefore, even when the dynamic bending force of the card is evaluated more than the number specified in JIS X6305-1, there is a need to provide an IC card in which the IC module is less likely to float and crack.

As a result of intensive studies, the present inventors have found that the above problems can be solved by the following means, and have completed the present invention. That is, the present invention is as follows:
<1> An IC card inlet comprising an antenna substrate and an antenna circuit on the antenna substrate,
The IC card inlet includes a plurality of through holes that are not in contact with each other, and an IC module installation planned area for installing an IC module exposed on the surface of the IC card,
The IC module installation planned area is a rounded rectangle with curved corners,
The plurality of through holes exist across an area that overlaps the IC module installation planned area and an area that does not overlap the IC module installation planned area,
Two of the plurality of through holes overlap with two of the curved corners that are close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet. Each of the plurality of through holes, and at least one of the plurality of through holes is adjacent to the straight line in the longitudinal direction between the two through holes. Exist to overlap the part,
IC card inlet.
<2> The two through-holes existing so as to overlap the two curved corners close to the straight line in the longitudinal direction account for 75% to 95% of the length of the curved corner. The IC card inlet according to <1>, wherein the IC card inlet is present so as to surround it.
<3> The IC card inlet according to <1> or <2>, wherein the plurality of through holes are circular.
<4> The above-mentioned <1>, further including at least one through-hole that overlaps with another side that is parallel to one side of the IC module installation planned area that is close to the straight line in the longitudinal direction. The IC card inlet according to any one of to <3>.
<5> At least one of the through holes that are present so as to overlap another side that is parallel to one side of the IC module installation scheduled area that is close to the straight line in the longitudinal direction, The IC card inlet according to <4>, which is a rounded rectangle present so as to surround the curved corners existing at both ends thereof.
<6> The above <1> to <1>, wherein the antenna circuit further includes an antenna terminal for electrical connection with the IC module in a region where the through hole does not exist in the region where the IC module is to be installed. <5> The IC card inlet according to any one of items.
<7> The IC card inlet according to any one of <1> to <6> above,
A core base material present on both sides of the IC card inlet; and an IC module embedded in at least one of the core base material and exposed on the surface of the core base material. ,
The IC module exists so as to overlap the IC module installation planned area of the IC card inlet, and on both sides of the IC card inlet through the plurality of through holes of the IC card inlet. The core substrate present is bound,
IC card.
<8> In the IC card inlet having the antenna substrate and the antenna circuit on the antenna substrate, a plurality of through holes overlap with the IC module installation planned region for installing the IC module, and the IC module installation plan Cut one by one so as to overlap two curved corners that straddle the region and a region that does not overlap and that are close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet And further engraving at least one so as to overlap with a part of one side of the IC module installation planned area close to a straight line in the longitudinal direction,
Sandwiching the inlet between two core base materials, and connecting the core base materials present on both sides of the inlet through the plurality of through holes;
A method for manufacturing an IC card, comprising: forming an opening for installing the IC module from a surface of the core base material to a region where the IC module is to be installed; and embedding the IC module in the opening.

  According to the present invention, it is possible to provide an IC card in which the IC module is less liable to float and crack even when the dynamic bending force of the card is evaluated more than the number of times specified in JIS X6305-1.

FIG. 1 is a view showing an IC card inlet according to the present invention. FIG. 1A is a front view of the IC card inlet of the present invention, and FIG. 1B is an enlarged view of the periphery of the IC module installation planned area in FIG. FIG. 2 is a schematic diagram of the IC card of the present invention. 2A is a front view of the IC card of the present invention, and FIG. 2B is a side sectional view of the IC card of the present invention taken along line IIb-IIb in FIG. 2A. 2 (c) is a side sectional view of the IC card of the present invention taken along line IIc-IIc in FIG. 2 (a). FIG. 3 is a diagram showing the IC card manufacturing method of the present invention. 3A and 3B are diagrams showing the sandwiching step, FIG. 3C is a diagram showing the opening forming step, and FIG. 4D is a diagram showing the embedding step. FIG. 4 is a diagram showing the positions of the through holes in the IC cards of the example and the comparative example. 4A to 4E are diagrams showing the positions of through holes in Example 1, Example 2, Comparative Example 1, Comparative Example 2, and Comparative Example 3, respectively.

<Inlet for IC card>
As shown in FIG. 1A, the IC card inlet (10) of the present invention includes an antenna base (8) and an antenna circuit (2) on the antenna base (8). The IC card inlet (10) includes a plurality of through holes (4a, 4b) that are not in contact with each other, and an IC module installation planned area (6) for installing an IC module exposed on the surface of the IC card. ing. The IC module installation planned area (6) is a rounded rectangle having curved corners (6a) as shown in FIG. 1 (b).

  The plurality of through holes (4a, 4b) straddle a region that overlaps the IC module installation planned region (6) and a region that does not overlap the IC module installation planned region (6).

  Two of the plurality of through holes (4a) are close to the straight line (12) in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet in the curved corner (6a). One each exists so as to overlap two. The “center of the IC card inlet” as used herein refers to the intersection of diagonal lines of the IC card inlet.

  From the viewpoint of effectively preventing the floating of the IC module, these two through holes exist so as to surround 75% to 95% of the length of the curved corner of the IC module installation planned area. preferable. The two through-holes may be present so as to surround 75% or more, 80% or more, or 85% or more of the length of the curved corner and 95% or less, 92% or less, or 90% or less. it can. Here, the “curved corner” means a curved portion of the corner of the IC module installation planned area, and the ratio of the through hole surrounding the curved corner is { (The length of the portion surrounded by the through hole in the length of the specific curved corner portion / the length of the specific curved corner portion) × 100}.

  At least one other of the plurality of through holes (4a) overlaps with a part of one side of the IC module installation planned area that is close to the straight line (12) in the longitudinal direction between the two through holes. Exist.

  By arranging the through-holes as described above, the present inventors cause more floating and cracking of the IC module even when the bending durability of the card is evaluated more than the number of times specified in JIS X6305-1. It was found that it is difficult to provide an IC card. Although not wishing to be bound by theory, this is because by arranging the through holes as described above, the curved corners of the IC module that cause the IC module to float, and the center of the IC card inlet, The IC module and the core base material can be effectively bonded to one side of the IC module installation planned area close to the straight line in the longitudinal direction of the IC card inlet passing therethrough, and a through hole is formed on this side. It is considered that the provision of the unoccupied region reduces the tensile stress that the IC module receives when the card is bent.

  The IC card inlet exists so as to overlap another side that is parallel to one side adjacent to the straight line (12) in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet, at least One through hole (4b) may be further provided. This through hole may be the same as or different from the through hole (4a) existing so as to overlap one side close to the straight line (12) in the longitudinal direction.

  As shown in FIG. 1A, the antenna circuit (2) is electrically connected to the IC module in the area where the through holes (4a, 4b) do not exist in the IC module installation planned area (6). An antenna terminal (2a) may be further included.

  Below, each component of the inlet for IC cards of this invention is demonstrated.

<IC module installation area>
The IC module installation planned area is an area for installing an IC module exposed on the surface of the IC card. This IC module installation scheduled area is a rounded rectangle having a substantially the same shape and size as the IC module and having curved corners.

<Antenna circuit>
The antenna circuit can be an aluminum foil, a copper foil, or the like. A method of forming a loop shape by pasting these on an antenna substrate and etching, a method of forming a loop shape by printing silver paste by screen printing, a method of forming a loop shape by drawing a wire, and an antenna pattern An antenna circuit can be formed using a method of forming a loop shape by transferring a transfer foil.

  The antenna circuit may further include an antenna terminal in an area where no through hole exists in the IC module installation scheduled area.

(Antenna terminal)
The antenna terminal is a contact terminal for electrical connection with the IC module.

<Antenna substrate>
Examples of the antenna substrate include polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins, poly (meth) acrylate resins, acrylic resins, polyacetal resins, polyethylene terephthalate (PET), and low crystallinity. Polyester resins such as polyethylene terephthalate (PET-G), polybutylene terephthalate, and polyethylene naphthalate (PEN), and thermoplastic resins such as polyamide resin, polycarbonate resin, polyphenylene sulfide resin, and polyimide resin can be used. Examples of PET-G include polyethylene terephthalate copolymers such as terephthalic acid, ethylene glycol, and other diols. Particularly, copolymers of terephthalic acid, ethylene glycol, and cyclohexanedimethanol can be used.

  The thickness of the antenna substrate is, for example, 1 μm or more, 5 μm or more, or 10 μm or more, and can be in the range of 100 μm or less, 60 μm or less, or 30 μm or less.

(Through hole)
The through holes are a plurality of through holes that are not in contact with each other on the IC card inlet. These through holes exist so as to straddle the region that overlaps the IC module installation scheduled region and the region that does not overlap the IC module installation scheduled region.

  Two of the plurality of through holes overlap two of the curved corners of the IC module installation planned area that are close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet. One by one. At least one other of the plurality of through holes overlaps with a part of one side of the IC module installation planned area that is close to a straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet. Existing.

  The shape of the above-mentioned through hole can be a polygon, a rounded polygon, a circle, or an ellipse. However, the bond between the IC module and the core substrate and the tensile stress that the IC module receives when the card is bent are used. From the viewpoint of harmony, a circular shape is preferable.

  There is one more through-hole so as to overlap another side that is parallel to one side of the IC module installation planned area that is close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet. You may do it. The shape of this through hole can be polygonal, rounded polygonal, circular, or elliptical, but it balances the adhesion between the IC module and core substrate and the tensile stress that the IC module receives when the card is bent. In view of the above, it is preferable that the rounded rectangle is present so as to surround the curvilinear corners existing at the other side and both ends thereof.

<Other configurations>
The IC card inlet of the present invention may further include an IC chip connected to the antenna circuit. The IC chip is a chip component on which a semiconductor integrated circuit such as a CPU, RAM, ROM, or EEPROM is mounted.

《IC card》
As shown in FIG. 2, the IC card of the present invention has the IC card inlet (10), the core base material (30a, 30b), and the IC module (20). This IC module may have a substrate part (22) and a sealing part (24) as shown in FIG.

  The core base material (30a, 30b) exists on both sides of the IC card inlet (10). The IC module (20) is embedded in at least one of the core substrates (30a, 30b) and is exposed on the surface of the core substrate (30a).

  The IC module exists so as to overlap the IC module installation scheduled area of the IC card inlet.

  The core base materials (30a, 30b) existing on both sides (10) of the IC card inlet are joined through a plurality of through holes (4a) of the IC card inlet (10).

<Core substrate>
The core substrate is a core substrate existing on both sides of the IC card inlet.

  Examples of the core substrate include polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins, poly (meth) acrylate resins, acrylic resins, polyacetal resins, polyethylene terephthalate (PET, PET-G). Polyester resin such as polybutylene terephthalate and polyethylene naphthalate (PEN), thermoplastic resin such as polyamide resin, polycarbonate (PC) resin, polyphenylene sulfide resin, and polyimide resin can be used. The core base material may be one using these resins in a single layer, or may be a laminate thereof.

  The thickness of the core substrate layer is 680 μm or more, 700 μm or more, or 720 μm or more, and 840 μm or less, 820 μm or less when the IC card inlet is sandwiched between two or more core substrates and thermocompression bonded. Or 800 μm or less.

<IC module>
The IC module is an IC module embedded in at least one of the core substrates and exposed on the surface of the core substrate. This IC module exists so as to overlap with the IC module installation scheduled area of the IC card inlet.

  The IC module may have a substrate part and a sealing part.

  The board part may have, for example, a module board and external contact terminals that are present on the surface exposed to the outside of the module board. When the IC card of the present invention is used as a combination card, the board portion further includes an optional internal contact terminal for connecting to the antenna terminal of the IC card inlet on the side opposite to the side where the external contact terminal exists. You may have.

  The module substrate may be made of, for example, glass-epoxy or polyimide. In addition, the size of the surface exposed to the outside of the module substrate may be about 11.8 × about 13 mm.

  The external contact terminal may be an external contact terminal in which a plating layer made of nickel, gold, silver or the like is laminated on a pattern made of copper, for example.

  The sealing part has a contact type IC chip for performing communication processing in a contact state and a sealing resin for sealing the contact type IC chip, which are connected to the external contact terminals. It's okay.

  The connection between the IC chip and the external contact terminal can be performed by a connection member such as wire bonding.

<Other configurations>
The IC card of the present invention may have other optional configurations. Other configurations include, for example, a magnetic recording layer exposed on the surface of the core substrate and a spacer surrounding the side surface of the IC card inlet.

<IC card manufacturing method>
The method of the present invention for manufacturing an IC card includes a through-hole engraving step, a sandwiching step, an opening forming step, and an embedding step.

<Through-hole engraving process>
In the through hole engraving step, a plurality of through holes are straddled in the IC card inlet across an area overlapping the IC module installation planned area for installing the IC module and an area not overlapping the IC module installation planned area, and An IC card which is engraved one by one so as to overlap two curved corners close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet, and passes through the center of the IC card inlet This means that at least one further is engraved so as to overlap a part of one side of the IC module installation scheduled area that is close to the straight line in the longitudinal direction of the inlet.

<Pinching process>
The sandwiching process means that the inlet is sandwiched between two core base materials, and the core base materials existing on both sides of the inlet are bonded through a plurality of through holes.

  More specifically, in the sandwiching step, as shown in FIG. 3 (a), an IC card inlet (10) and two or more core substrates (30a, 30b) are arranged, and then FIG. 3 (b). As shown in Fig. 4, the IC card inlet (10) is sandwiched between the core base materials (30a, 30b) and then thermocompression bonded.

  During thermocompression bonding, optional spacers (40a, 40b) may be arranged so as to surround the side surface of the IC card inlet (10). As the spacer, the materials mentioned for the core substrate can be used.

<Opening process>
In the opening forming step, as shown in FIG. 3C, the opening (20a) for installing the IC module is formed from the surface of the core substrate (30a) to the IC module installation scheduled region. When the IC module has a sealing portion (24), the opening (20a) is formed so as to penetrate the antenna substrate (8) so that the sealing portion (24) can be embedded. May be.

<Embedding process>
The embedding process means that the IC module (20) is embedded in the opening as shown in FIG.

  When embedding the IC module (20), the antenna terminal (2a) and the IC module (20) may be bonded via, for example, silver paste.

  The present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited to these.

<Production of IC card>
<Example 1>
As the inlet, an inlet (thickness: 50 μm) in which an antenna circuit having an antenna terminal was sealed with PET was used. A through hole was formed in the inlet so that the antenna terminal, the IC card installation planned area, and the through hole have the positional relationship shown in FIG.

  More specifically, the through hole (4a) is close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet in the curved corner of the IC module installation planned area 2 One was engraved so as to overlap with each other, and one was engraved between two through holes so as to overlap with one side close to the straight line in the longitudinal direction. The two through-holes that overlap with the two corners adjacent to the straight line in the longitudinal direction surrounded 88% of the length of the curved corner.

  Further, a rounded rectangle that surrounds a through hole (4b) that overlaps with another side that is parallel to one side that is close to a straight line in the longitudinal direction, and surrounds the curved corners of that side and both ends. One was engraved in the shape.

  Next, PET-G (thickness 50 μm) as a spacer is disposed so as to surround the side surface of the inlet, and then PET-G (thickness 275 μm), PC (thickness 50 μm) as a core substrate, A pair of laminates having PET-G (thickness: 50 μm) in this order was placed so that PET-G (thickness: 275 μm) was on the inlet side, and these were thermocompression bonded from both sides.

  Next, an opening for embedding the IC module was formed, the IC module was embedded, and the antenna terminal and the IC module were joined via silver paste to produce the IC card of Example 1.

<Example 2>
The through hole is engraved in the inlet so that the antenna terminal, the IC card installation planned area, and the through hole are in the positional relationship shown in FIG. 4B, more specifically, in a straight line in the longitudinal direction. Same as Example 1 except that two through holes that exist so as to overlap two adjacent corners are engraved so as to surround 63% of the length of the curved corners. Thus, an IC card of Example 2 was produced.

<Comparative example 1>
As shown in FIG. 4C, an IC card of Comparative Example 1 was produced in the same manner as Example 1 except that no through hole was formed.

<Comparative example 2>
The through hole is engraved in the inlet so that the antenna terminal, the IC card installation planned area, and the through hole have the positional relationship shown in FIG. 4a) is a comparative example in the same manner as in Example 1, except that one side hole close to the straight line in the longitudinal direction and one round hole having a rounded rectangular shape surrounding the curved corners at both ends thereof are used. 2 IC cards were produced.

<Comparative Example 3>
The through hole is engraved in the inlet so that the antenna terminal, the IC card installation planned area, and the through hole have the positional relationship shown in FIG. 4B, that is, close to a straight line in the longitudinal direction. An IC card of Comparative Example 3 was produced in the same manner as in Example 1 except that the through hole between the two through holes existing so as to overlap the two corners was not engraved.

<Bending test>
About the IC card of Examples 1 and 2 and Comparative Examples 1-3, the bending test was done based on JISX6305-15.8. Specifically, the measurement was performed on the front surface, the back surface, the front surface and the back surface in the short side direction at a pitch of 250 times.

  The results are shown in Table 1. In Table 1, the area surrounded by the through hole in the curvilinear corners of the IC module installation planned area is defined as “envelopment ratio”.

  From Table 1, it can be understood that the IC cards of Examples 1 and 2 are less likely to be cracked and / or lifted when the bending test is performed than the IC cards of Comparative Examples 1 to 3.

  Further, when comparing the IC cards of the first and second embodiments, the two through holes are present so as to surround 75% to 95% of the length of the curved corner of the IC module installation planned area. It can be understood that the card No. 1 hardly causes the IC module to float.

DESCRIPTION OF SYMBOLS 2 Antenna circuit 2a Antenna terminal 4a, 4b Through-hole 6 IC module installation plan part 6a Curved corner part 8 Antenna base material 10 IC card inlet 12 Straight line of the longitudinal direction of the IC card inlet passing through the center of the IC card inlet 20 IC module 20a Opening 22 Substrate part 24 Sealing part 30a, 30b Core base material 40a, 40b Spacer 100 IC card

Claims (8)

An IC card inlet comprising an antenna substrate and an antenna circuit on the antenna substrate,
The IC card inlet includes a plurality of through holes that are not in contact with each other, and an IC module installation planned area for installing an IC module exposed on the surface of the IC card,
The IC module installation planned area is a rounded rectangle having a curved corner,
The plurality of through holes exist across an area overlapping the IC module installation planned area and an area not overlapping the IC module installation planned area,
2 so that two of the plurality of through holes overlap two of the curved corners that are close to a straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet. Each of the plurality of through holes, and at least one of the plurality of through holes is adjacent to the straight line in the longitudinal direction between the two through holes. Exist to overlap the part,
IC card inlet.   The two through-holes existing so as to overlap the two curved corners adjacent to the straight line in the longitudinal direction surround 75% to 95% of the length of the curved corner. The IC card inlet according to claim 1, wherein the IC card inlet is present.   The two through holes, at least one of the through holes existing so as to overlap a part of one side of the IC module installation planned area that is close to the straight line in the longitudinal direction between the two through holes. The IC card inlet according to claim 1, which is circular.   4. The apparatus according to claim 1, further comprising at least one through-hole that overlaps with another side that is parallel to one side of the IC module installation scheduled area that is close to the straight line in the longitudinal direction. The IC card inlet according to claim 1.   At least one of the through holes, which are present so as to overlap another side that is parallel to one side of the IC module installation planned area that is close to the straight line in the longitudinal direction, are formed on the other side and both ends thereof. The IC card inlet according to claim 4, which is a rounded rectangle present so as to surround the curved corner portion.   6. The antenna circuit according to claim 1, wherein the antenna circuit further includes an antenna terminal for electrically connecting to the IC module in an area where the through hole is not present in the IC module installation planned area. The IC card inlet according to one item. IC card inlet according to any one of claims 1 to 6,
A core base material present on both sides of the IC card inlet; and an IC module embedded in at least one of the core base material and exposed on the surface of the core base material. ,
The IC module is present so as to overlap the IC module installation planned area of the IC card inlet, and on both sides of the IC card inlet through the plurality of through holes of the IC card inlet. The core substrate present is bound,
IC card. An IC substrate inlet having an antenna base and an antenna circuit on the antenna base, a plurality of through holes overlapping with an IC module installation planned area for installing an IC module, and the IC module installation planned area Are cut one by one so as to overlap two curved corners that are close to the straight line in the longitudinal direction of the IC card inlet passing through the center of the IC card inlet, And further engrave at least one so as to overlap with a part of one side of the IC module installation planned area close to the straight line in the longitudinal direction,
Sandwiching the inlet between two core base materials, and connecting the core base materials present on both sides of the inlet through the plurality of through holes;
A method for manufacturing an IC card, comprising: forming an opening for installing the IC module from a surface of the core base material to a region where the IC module is to be installed; and embedding the IC module in the opening.

Images