JP2500866B2 - Multilayer film capacitor and manufacturing method thereof - Google Patents
Multilayer film capacitor and manufacturing method thereofInfo
- Publication number
- JP2500866B2 JP2500866B2 JP3016310A JP1631091A JP2500866B2 JP 2500866 B2 JP2500866 B2 JP 2500866B2 JP 3016310 A JP3016310 A JP 3016310A JP 1631091 A JP1631091 A JP 1631091A JP 2500866 B2 JP2500866 B2 JP 2500866B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- adhesive layer
- film
- thin film
- metal thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、製造工程の改善とセル
フヒーリング性に有効な接着性を備えた積層型フィルム
コンデンサおよびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated film capacitor having an adhesive property effective for improving the manufacturing process and self-healing property, and a manufacturing method thereof.
【0002】[0002]
【従来の技術】近年、エレクトロニクス技術の進歩は著
しく、エレクトロニクス技術を使用した電気機器,電子
機器などは多機能化,小型化が進んでいる。これら機器
の小型化を図るための高密度実装技術の開発や回路を構
成する部品への小型化が強く要望されている。特に単独
部品として使用される抵抗器,コンデンサ,コイルなど
にはその傾向が強い。その要望に応えるため、有機フィ
ルムコンデンサの構成は巻回タイプから積層タイプへ移
りつつあるが、実用されている積層タイプのフィルムコ
ンデンサは図4に示すように表面に金属薄膜層を形成し
長手方向に連続的にマージンを設けた広幅の高分子誘電
体フィルムを必要な層数だけ積層した後、長手方向にス
リットし、スリット面にメタリコンによる取り出し電極
を形成し、さらに幅方向に切断すると図5に示すような
構造のコンデンサとなる。なお図4,図5において、1
は高分子誘電体フィルム、2は金属薄膜層、3はマージ
ン部、4はメタリコンによる取り出し電極である。高分
子誘電体フィルム1には、ポリエチレンテレフタレート
(PET)やポリフェニレンサルファイド(PPS)
が、また金属薄膜層2には真空蒸着法によるアルミニウ
ムが、またメタリコンには銅を主成分とする合金が通常
用いられている。またマージン部3を設ける方法として
は、真空蒸着中に高分子誘電体フィルム1の表面に一定
間隔で一定の幅にオイル蒸気を塗布して、金属薄膜層2
の形成されない部分であるマージン部3を設ける。2. Description of the Related Art In recent years, the progress of electronic technology has been remarkable, and electric equipment and electronic equipment using the electronic technology have become more multifunctional and smaller. There is a strong demand for development of high-density packaging technology for miniaturization of these devices and miniaturization of components constituting circuits. This tendency is particularly strong for resistors, capacitors, coils, etc. used as individual parts. To meet this demand, the structure of the organic film capacitor is shifting from the winding type the stacking type film capacitor multilayer type being practically used to form a metal thin film layer on the surface as shown in FIG. 4 longitudinally After laminating the necessary number of layers of wide polymer dielectric film with a continuous margin, slit in the longitudinal direction, form the extraction electrode by metallikon on the slit surface, and further cut in the width direction. The capacitor has a structure as shown in. 4 and 5, 1
Is a polymer dielectric film, 2 is a metal thin film layer, 3 is a margin portion, and 4 is an extraction electrode made of metallikon. The polymer dielectric film 1 includes polyethylene terephthalate (PET) and polyphenylene sulfide (PPS).
However, aluminum by vacuum deposition is usually used for the metal thin film layer 2, and an alloy containing copper as the main component is usually used for the metallikon. Further, as a method of providing the margin portion 3, oil vapor is applied to the surface of the polymer dielectric film 1 at a constant interval and a constant width during vacuum vapor deposition to form the metal thin film layer 2
The margin portion 3 which is a portion in which the above is not formed is provided.
【0003】[0003]
【発明が解決しようとする課題】上記のような構造のフ
ィルムコンデンサでは、積層した高分子誘電体フィルム
は熱と圧力だけで接着しているため図4のようにスリッ
トした条の機械的強度が弱く、特に条の幅が狭くなると
製造工程中で条が折れたり積層している金属化フィルム
が剥離するなどの問題が発生した。In the film capacitor having the above structure, since the laminated polymer dielectric films are bonded only by heat and pressure, the mechanical strength of the slit strip as shown in FIG. When the width was weak, particularly when the width of the strip became narrow, there were problems such as the strip being broken during the manufacturing process and the laminated metallized film being peeled off.
【0004】本発明はこのような製造工程中で条が折れ
るなどの問題の発生がなく、絶縁のセルフヒーリング性
の良好なフィルムコンデンサを提供することを目的とす
る。It is an object of the present invention to provide a film capacitor having a good insulation self-healing property without problems such as breakage of the strip during the manufacturing process.
【0005】[0005]
【課題を解決するための手段】本発明は上記目的を達成
するために、高分子誘電体フィルムの表面に加熱により
接着性が発現する接着剤層を設けるとともに、その接着
剤層の表面に接着剤層の一部あるいは複数部分が露出す
るように金属薄膜層を設けて金属化フィルムとし、その
金属化フィルムを積層するとともに、加熱により隣接す
る金属化フィルムどうしを接着剤層によって接着したも
のである。Means for Solving the Problems The present invention to achieve the above object, Rutotomoni provided an adhesive layer to express adhesiveness upon heating on the surface of the dielectric polymer film, the adhesive
A metal thin film layer is provided as a metallized film such that part or multiple parts of the adhesive layer on the surface of the adhesive layer is exposed, the
Laminate the metallized films and place them adjacent to each other by heating .
The metallized films are bonded together by an adhesive layer .
【0006】また、高分子誘電体フィルムの表面に加熱
により接着性が発現する接着剤層を設け、その上層に水
洗除去可能な塗料層を接着剤層を露出させる部分にだけ
塗布し、さらに金属薄膜層を形成した後に水洗し、水洗
除去可能な塗料層とともにその塗料層上の金属薄膜層を
除去することにより金属化フィルムを得るものである。Further, an adhesive layer, which exhibits adhesiveness by heating, is provided on the surface of the polymer dielectric film, and a paint layer which can be washed off and removed by water is applied only on the exposed portion of the adhesive layer. A metallized film is obtained by forming a thin film layer, followed by washing with water, and removing the paint layer which can be washed off with water and the metal thin film layer on the paint layer.
【0007】[0007]
【作用】本発明は金属化フィルムの層間接着力を強くす
ることにより、製造工程中で条が折れたり、金属化フィ
ルムが剥離するなどの問題の発生がなくなり、しかも接
着部分には金属薄膜層がないためにセルフヒーリング性
が良好で、さらにその接着部分をマージン部分と共用す
ることができる。By [action] The present invention is to increase the interlayer adhesion of the metallized film, or broken conditions in the manufacturing process, it does not generate a problem such as metalized film is peeled, moreover the metal thin film in the bonded portion Since there is no layer, the self-healing property is good, and the adhesive portion can be shared with the margin portion.
【0008】[0008]
【実施例】以下本発明の一実施例を図面とともに説明を
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0009】図1は本発明の一実施例によるコンデンサ
の構造図で、高分子誘電体フィルム1に、加熱により接
着性を発現する接着剤層5と金属薄膜層2とが順次形成
され、そして金属薄膜層2のマージン部分から露出して
いる接着剤層の一部が、積層される高分子誘電体フィル
ム1の裏面に接着している。そのマージン部5aは一層
おきに同位置にくるように交互に設けられている。[0009] Figure 1 is a structural view of a capacitor according to an embodiment of the present invention, the dielectric polymer film 1, and the adhesive layer 5 which exhibits adhesiveness with the metal thin film layer 2 are sequentially formed by heating, and A part of the adhesive layer exposed from the margin portion of the metal thin film layer 2 adheres to the back surface of the polymer dielectric film 1 to be laminated . The margin portions 5a are alternately provided so that they are at the same position in every other layer.
【0010】図2,図3は本発明のコンデンサの構成要
素の形成過程を示した断面図で、図2では高分子誘電体
フィルム1に厚さ4μmのポリフェニレンサルファイド
(PPS)フィルムを用い、加熱により接着性を発現す
る接着剤層は下記組成Aの塗料をロールコーターによっ
て乾燥厚みが0.1μmになるように塗布形成し、水洗
除去可能な塗料層6は下記組成Bの塗料を乾燥厚み1.
5μm,幅0.3mmになるように塗布形成し、金属薄膜
層2は真空蒸着法によって、アルミニウムを厚みが30
0オングストロームになるように形成した。2 and 3 are cross-sectional views showing the process of forming the constituent elements of the capacitor of the present invention. In FIG. 2, a polyphenylene sulfide (PPS) film having a thickness of 4 μm is used as the polymer dielectric film 1 and heated. The adhesive layer exhibiting adhesiveness is formed by coating a coating composition of the following composition A with a roll coater so that the dry thickness becomes 0.1 μm. .
The metal thin film layer 2 is formed by coating so as to have a thickness of 5 μm and a width of 0.3 mm.
It was formed to have a thickness of 0 angstrom.
【0011】 組成Aの塗料 ポリアクリル酸エステル樹脂 10部 イソプロピルアルコール 40部 水 50部 組成Bの塗料 ポリビニルアルコール樹脂 100部 炭酸カルシュウム微粉末 20部 界面活性剤 1部 水 500部 図3は金属薄膜層2までを順次形成した後に水洗により
水洗除去可能な塗料層6とともに金属薄膜層2の一部を
除去した状態である。接着剤層5の露出部分は層間の接
着部分となるとともに通常のコンデンサに用いられてい
るマージン部としても働く。Composition A paint Polyacrylate ester resin 10 parts Isopropyl alcohol 40 parts Water 50 parts Composition B paint polyvinyl alcohol resin 100 parts Calcium carbonate fine powder 20 parts Surfactant 1 part Water 500 parts FIG. 3 shows a metal thin film layer This is a state in which the metal thin film layer 2 is partially removed together with the paint layer 6 which can be removed by washing with water after sequentially forming up to 2. The exposed portion of the adhesive layer 5 serves as an adhesive portion between layers and also serves as a margin portion used in a normal capacitor.
【0012】このようにして得られた金属化フィルムの
接着剤層の露出部分が交互に同位置にくるように積層
し、幅4mmにスリットし、スリット面両面にメタリコン
による引き出し電極を設け、さらに条の長手方向に対し
て垂直方向に所定の大きさとなるように切断しコンデン
サを作成した。The metallized film thus obtained was laminated so that the exposed portions of the adhesive layer were alternately located at the same position, slitted to a width of 4 mm, and extraction electrodes made of metallikon were provided on both sides of the slit surface. A capacitor was prepared by cutting the strip to a predetermined size in a direction perpendicular to the longitudinal direction.
【0013】実施例で作成したコンデンサのセルフヒー
リング性を所定の方法で評価したところ、100個のサ
ンプルすべてにセルフヒーリング性が認められた。また
製造工程中でのスリットした条の折れや積層フィルムの
層間の剥離も認められなかった。When the self-healing property of the capacitors prepared in the examples was evaluated by a predetermined method, the self-healing property was recognized in all 100 samples. In addition, breakage of slit lines and peeling between layers of the laminated film were not observed during the manufacturing process.
【0014】(比較例1) 比較例1として金属化フィルムの層間の接着のための接
着剤層を設けずに高分子誘電体フィルムの表面に金属薄
膜層を形成した金属化フィルムを積層,加熱,加圧し、
以下実施例1と同様の方法で図5に示すような構造のコ
ンデンサを作成した。なおマージン部は高分子誘電体フ
ィルムの表面に金属薄膜層を形成後、レーザーを照射す
ることにより形成した。COMPARATIVE EXAMPLE 1 As Comparative Example 1, a metallized film having a metal thin film layer formed on the surface of a polymer dielectric film was laminated and heated without providing an adhesive layer for adhesion between layers of the metallized film. , Pressurize,
A capacitor having a structure as shown in FIG. 5 was prepared in the same manner as in Example 1 below. The margin portion was formed by irradiating a laser after forming a metal thin film layer on the surface of the polymer dielectric film.
【0015】この比較例1で作成したコンデンサを評価
したところ100個のサンプル全てにセルフヒーリング
性が認められたが、積層した金属化フィルムの層間の接
着力が弱いために製造工程中でスリットした条が折れた
り積層フィルムの層間剥離も見られ、これらの不良が原
因で歩留が約60%程度であった。When the capacitor prepared in Comparative Example 1 was evaluated, all 100 samples were found to have self-healing properties, but slits were formed during the manufacturing process due to weak adhesion between the laminated metallized films. Strips were broken and delamination of the laminated film was also observed, and the yield was about 60% due to these defects.
【0016】(比較例2) 比較例2として高分子誘電体フィルムの表面に金属薄膜
層を形成し、レーザーを照射することによりマージン部
を形成した金属薄膜層およびマージン部分全面に下記組
成の接着剤溶液をロールコーターで乾燥厚みが0.1μ
mになるように塗布乾燥後、積層,加熱,加圧し、以下
実施例1と同様の方法でコンデンサを作成した。Comparative Example 2 As Comparative Example 2, a metal thin film layer is formed on the surface of a polymer dielectric film, and a metal thin film layer having a margin portion formed by irradiating a laser and the entire surface of the margin portion are bonded with the following composition. Dry the agent solution with a roll coater to a thickness of 0.1μ
After coating and drying so as to have a thickness of m, lamination, heating and pressurization were performed, and a capacitor was prepared in the same manner as in Example 1 below.
【0017】 接着剤溶液の組成 ポリアクリル酸エステル樹脂 3部 イソプロピルアルコール 40部 水 50部 この比較例2で作成したコンデンサを評価したところ、
工程中の条の折れや層間剥離など層間の接着力不足によ
る不良は見られなかったが、セルフヒーリング性は10
0個のサンプル全てに認められなかった。Composition of Adhesive Solution Polyacrylic ester resin 3 parts Isopropyl alcohol 40 parts Water 50 parts The capacitor prepared in Comparative Example 2 was evaluated.
Defects due to insufficient adhesive strength between layers such as folds in the process and peeling between layers were not observed, but the self-healing property was 10
Not found in all 0 samples.
【0018】なお、本発明における高分子誘電体フィル
ムとしてはポリフェニレンサルファイドの他に、ポリエ
チレンテレフタレート,ポリプロピレン,ポリエチレン
ナフタレートなどが、また加熱により接着性が発現する
接着剤層の材料としては、実施例以外のエチレン酢酸ビ
ニル系,ポリウレタン系,ポリエステル系などの熱溶融
性樹脂,熱可塑性樹脂やその他の接着剤を、また水洗に
より除去可能な塗料としては実施例以外の水溶性塗料
を、さらに金属薄膜層としてはアルミニウムのほかに
錫,ニッケル,亜鉛,クロム,銅,金,銀などの単一あ
るいは混合金属の単層薄膜、もしくは積層薄膜を用いて
もよい。また寸法,形状なども実施例に限られるもので
はない。また、絶縁のセルフヒーリング性にとっては、
金属薄膜層部分に接着剤層を形成しない方がよく実施例
のようにマージン部分に接着剤層を形成することが望ま
しいが、誘電体フィルムの厚さ、金属薄膜電極の形成条
件によっては接着剤層と金属薄膜層が部分的に重なり合
っても実用上支障のない性能のコンデンサを得ることは
できる。In addition to polyphenylene sulfide as the polymer dielectric film in the present invention, polyethylene terephthalate, polypropylene, polyethylene naphthalate, etc. are used as the material of the adhesive layer which exhibits adhesiveness by heating. Other than ethylene vinyl acetate-based, polyurethane-based, polyester-based heat-melting resins, thermoplastic resins and other adhesives, and as a paint that can be removed by washing with water, a water-soluble paint other than those of the examples, and a metal thin film As the layer, in addition to aluminum, a single layer thin film of a single or mixed metal such as tin, nickel, zinc, chromium, copper, gold and silver, or a laminated thin film may be used. The size and shape are not limited to those in the embodiment. In addition, for the self-healing property of insulation,
It is better not to form the adhesive layer on the metal thin film layer portion, and it is desirable to form the adhesive layer on the margin portion as in the embodiment. However, depending on the thickness of the dielectric film and the forming conditions of the metal thin film electrode, the adhesive layer may be formed. It is possible to obtain a capacitor having a performance that does not hinder practical use even if the layer and the metal thin film layer partially overlap.
【0019】[0019]
【発明の効果】以上のように本発明は、高分子誘電体フ
ィルムの表面に加熱により接着性が発現する接着剤層を
設け、さらにその表面に接着剤層の一部あるいは複数部
分が露出するように金属薄膜層を設けた金属化フィルム
を積層し、加熱によりそれぞれの層の一部あるいは複数
部分が接着されたもので、製造工程中で条折れや金属化
フィルムの層間剥離の発生がなく、コンデンサ特性を損
わず、セルフヒーリング性の良好なコンデンサを高い歩
留で生産することができる。INDUSTRIAL APPLICABILITY As described above, according to the present invention, the surface of the polymer dielectric film is provided with an adhesive layer which exhibits adhesiveness by heating, and a part or plural parts of the adhesive layer are exposed on the surface. As described above, metallized films provided with metal thin film layers are laminated, and part or multiple parts of each layer are adhered by heating, and there is no crease or delamination of the metallized film during the manufacturing process. Therefore, it is possible to produce a capacitor having a good self-healing property with a high yield without deteriorating the capacitor characteristics.
【図1】本発明の一実施例における積層型フィルムコン
デンサの構造図FIG. 1 is a structural diagram of a laminated film capacitor according to an embodiment of the present invention.
【図2】本発明のフィルムコンデンサに用いる金属化フ
ィルムの水洗処理前の断面図FIG. 2 is a cross-sectional view of a metallized film used in the film capacitor of the present invention before washing with water.
【図3】同水洗処理後の断面図FIG. 3 is a cross-sectional view after the water washing process.
【図4】積層した金属化フィルムを条にスリットしてい
る状態図FIG. 4 is a state diagram in which laminated metallized films are slit into strips.
【図5】従来の積層型フィルムコンデンサの構造図FIG. 5 is a structural diagram of a conventional laminated film capacitor.
1 高分子誘電体フィルム 2 金属薄膜層 4 取り出し電極 5 接着剤層 5a マージン部 6 水洗除去可能な塗料層 1 Polymer Dielectric Film 2 Metal Thin Film Layer 4 Extraction Electrode 5 Adhesive Layer 5a Margin 6 Paint Layer Removable by Washing
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01G 4/18 B29L 9:00 // B29L 9:00 7924−5E H01G 4/24 321D (56)参考文献 特開 昭50−153269(JP,A) 実開 昭48−110637(JP,U) 特公 昭43−9336(JP,B1) 実公 昭44−10220(JP,Y1)─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H01G 4/18 B29L 9:00 // B29L 9:00 7924-5E H01G 4/24 321D (56) References Japanese Unexamined Patent Publication No. 50-153269 (JP, A) Actual Development 48-110637 (JP, U) Japanese Patent Publication 43-9336 (JP, B1) Actual Publication 44-10220 (JP, Y1)
Claims (3)
り接着性が発現する接着剤層を設けるとともに、その接
着剤層の表面に接着剤層の一部または複数部分が露出す
るように金属薄膜層を設けて金属化フィルムとし、その
金属化フィルムを積層するとともに、加熱により隣接す
る金属化フィルムどうしを接着剤層によって接着してな
る積層型フィルムコンデンサ。1. A Rutotomoni provided an adhesive layer expresses adhesiveness by heating the surface of the polymer dielectric film, the contact
A metal thin film layer is provided on the surface of the adhesive layer so that a part or a plurality of parts of the adhesive layer are exposed to form a metallized film , and
Laminate the metallized films and place them adjacent to each other by heating .
A laminated film capacitor in which metallized films are bonded together with an adhesive layer .
きに同位置にくるように設けた請求項1記載の積層型フ
ィルムコンデンサ。2. The laminated film capacitor according to claim 1 , wherein the exposed portions of the adhesive layer are provided so that they are in the same position every other layer during lamination.
り接着性が発現する接着剤層を設け、その接着剤層上に
水洗除去可能な塗料層を部分的に形成した後、その塗料
層を含めて接着剤層上に金属薄膜層を設け、その後これ
を水洗して前記水洗除去可能な塗料層とともにその塗料
層上の金属薄膜層を除去することにより金属化フィルム
を構成した請求項1記載の積層型フィルムコンデンサの
製造方法。3. An adhesive layer, which exhibits adhesiveness when heated, is provided on the surface of a polymer dielectric film, and a paint layer which can be washed off and removed is partially formed on the adhesive layer , and then the paint.
Including a layer of metallic thin film layer provided on the adhesive layer, the claims have configured metallized film by removing the metal thin film layer on the paint layer with subsequent the washing removable coating layer by washing with water 1. The method for manufacturing the laminated film capacitor as described in 1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3016310A JP2500866B2 (en) | 1991-02-07 | 1991-02-07 | Multilayer film capacitor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3016310A JP2500866B2 (en) | 1991-02-07 | 1991-02-07 | Multilayer film capacitor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04255209A JPH04255209A (en) | 1992-09-10 |
| JP2500866B2 true JP2500866B2 (en) | 1996-05-29 |
Family
ID=11912955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3016310A Expired - Lifetime JP2500866B2 (en) | 1991-02-07 | 1991-02-07 | Multilayer film capacitor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2500866B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4410220Y1 (en) * | 1966-12-27 | 1969-04-24 | ||
| JPS50153269A (en) * | 1974-06-01 | 1975-12-10 |
-
1991
- 1991-02-07 JP JP3016310A patent/JP2500866B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04255209A (en) | 1992-09-10 |
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