JP2504232B2 - Lead frame for semiconductor device - Google Patents

Description

The present invention relates to a semiconductor device lead frame, and more particularly to a semiconductor device lead frame having an improved internal lead structure.

[Conventional technology]

Conventionally, as shown in FIG. 3, a lead frame used for a semiconductor device of this type has a structure in which the electrode 5 on the semiconductor element 4 and the inner lead 2 are wire-bonded to each other in consideration of the position of the electrode 5. Had to design.

[Problems to be Solved by the Invention]

In the conventional lead frame for a semiconductor device described above, the internal leads are designed in consideration of the arrangement of the electrodes on the semiconductor element. Therefore, even if the semiconductor elements have the same size, different lead frames may be provided depending on the arrangement of the electrodes. There is a drawback that will be used.

An object of the present invention is to provide a lead frame for a semiconductor device that can be shared by semiconductor elements of the same size.

[Means for solving the problem]

A plurality of external leads led out from the sealing region of the semiconductor element, and the external leads provided on the semiconductor element mounting pedestal and extended to the tip of each semiconductor element mounting pedestal side. In a lead frame for a semiconductor device having an electrode of a semiconductor element and an internal lead connected by a wire, a connection which is arranged at an intermediate position between the external leads and is connected to at least one of the adjacent external leads. At least one intermediate internal lead having a portion is attached, and the connection portion with the external lead is selected and cut according to the position of the electrode on the semiconductor element to be used separately from each of the external leads. Is characterized by.

〔Example〕

FIGS. 1 (a) and 1 (b) are plan views showing a method of manufacturing a semiconductor device using a semiconductor device lead frame according to a first embodiment of the present invention in the order of steps.

In the first embodiment, as shown in FIGS. 1 (a) and 1 (b), the internal leads 2a located at the respective tips of the external leads 1 and connected to these tips, and the external leads 1 are connected. Inner leads 2b located at the respective intermediate portions and connected to at least one position on each of the adjacent outer leads 1 are formed.

When manufacturing a semiconductor device, the internal lead 2b is selected according to the arrangement of the electrodes 5 on the semiconductor element 4, and unnecessary connection parts are cut to be used as a semiconductor device lead frame.

 FIG. 2 is a plan view of a second embodiment of the present invention.

As shown in FIG. 2, the second embodiment has a structure in which the internal leads 2d formed between the external leads 1 and the external leads 1 are connected in a grid pattern, as in the first embodiment. Internal lead 2d used according to the arrangement of the electrode 5 on the semiconductor element 4
Select to disconnect unnecessary connections.

This embodiment has an advantage that the degree of freedom in selecting the inner lead 2d can be increased by making the lattice as fine as possible in terms of processing capability, strength of the inner lead, and the like. For example,
If it is a lead frame material with a thickness of 0.15 mm that is usually used,
If the lead frame material has a grid line width of about 0.12 mm or a thinner 0.12 mm thickness, the grid line width can be set to about 0.11 mm, so that 4 to 5 grids can be formed per 1 mm.

〔The invention's effect〕

INDUSTRIAL APPLICABILITY As described above, according to the present invention, by forming an inner lead that is connected to each of the adjacent outer leads at least at one place, and the inner lead can be selected and used according to the arrangement of the electrodes on the semiconductor element, Since it is not necessary to design and produce a lead frame for each semiconductor element, there is an effect that a wide variety of products can be shared until the intermediate process.

Further, there is an effect that the length of the bonding wire can be made relatively short, and a stable semiconductor device can be manufactured.

Further, since the lead frame can be designed and produced in advance, the semiconductor device development period can be shortened.

[Brief description of drawings]

1 (a) and 1 (b) are plan views showing a method of manufacturing a semiconductor device using the semiconductor device lead frame according to the first embodiment of the present invention in the order of steps, and FIG. Second
And FIG. 3 is a plan view of an example of a conventional lead frame for a semiconductor device. 1 ... External lead, 2,2a, 2b, 2c, 2d ... Internal lead, 3
…… Semiconductor element mounting base, 4 …… Semiconductor element, 5 …… Electrode, 6 …… Gold wire.

Claims (1)

(57) [Claims] 1. A plurality of external leads led out from a sealing region of a semiconductor element, and the semiconductor element mounting base provided by extending to the tip of each of the external leads on the side of the semiconductor element mounting base. In a lead frame for a semiconductor device having an internal lead connected to the electrode of the semiconductor element mounted on a wire by a semiconductor device, the external lead is arranged at an intermediate position between the external leads and at least adjacent external leads are provided at least. Each of the external leads is provided with at least one intermediate inner lead having a connecting portion for connecting at one location, and selecting and disconnecting the connecting portion with the external lead according to the position of the electrode on the semiconductor element. A lead frame for a semiconductor device, which is used separately from the lead frame.