JP2522403B2 - Thermo module - Google Patents

Description

The present invention relates to an assembly structure of a thermo module used as an electronic cooling device.

[Conventional technology]

As is well known, the electronic cooling device utilizes the Peltier effect, and a thermoelectric element formed by connecting thermoelectric material chips as dissimilar metals or p-type and n-type semiconductors with a junction electrode is used from the outside. The heat load is cooled by the endothermic action of the joining electrode obtained when a current is applied to the. Since the amount of heat absorbed by one of the thermoelectric elements is extremely small, it is practically used in the form of a thermo module assembled by connecting a large number of thermoelectric elements in series.

Next, FIG. 3 shows a basic conventional structure of the above-mentioned thermo module. In the figure, 1 and 2 are p-type semiconductors and n-type semiconductors as thermoelectric material chips, 3 and 4 are heat absorbing side and heat generating side bonding electrodes, and 5 and 6 are heat absorbing materials that are thermally coupled to the bonding electrodes 3 and The fins, the radiation fins, and 7 are power supplies, and a plurality of pairs of thermoelectric elements are combined in series to form a thermo module, as shown in the figure.

With such a configuration, when a current is supplied from the power source 7 to each thermoelectric element of the thermomodule, the joint electrode 3 absorbs heat and the joint electrode 4 on the opposite side generates heat. In addition, since the heat absorbed from the heat load is transferred to the heat generating side, in order to perform efficient cooling, normally the heat generating side is forcibly cooled by water cooling, air cooling, etc., and the heat transferred from the heat absorbing side is promptly transferred to the system. It is dissipated outside to prevent heat saturation inside the thermoelectric element. The amount of heat absorbed by the thermoelectric element depends on the Seebeck coefficient of the thermoelectric material (p-type semiconductor, n-type semiconductor), the current, the temperature between the heat absorbing side and the heat generating side, and the thermal conductivity of the element, that is, the thermal resistance of each joint surface. It is well known that it depends.

[Problems to be Solved by the Invention]

By the way, the above-mentioned conventional thermomodule has the following drawbacks in terms of assemblability and performance. That is, as shown in FIG. 3, in the assembly structure in which the p-type semiconductor 1 and the n-type semiconductor 2 are arranged in a line, and the joining electrodes 3 and 4, the heat absorbing fins 5, and the heat radiating fins 6 are individually joined across them, (1) If the height dimensions of individual thermoelectric material chips (p-type semiconductor 1, n-type semiconductor 2) vary, a height difference occurs between the end faces, so the bonding electrodes 3 and 4 adhere to the end faces of the chip. It becomes extremely difficult to combine.

(2) Also, regarding the attachment of the heat absorbing fins 5 and the heat radiating fins 6, the heat transfer resistance greatly affects the heat absorbing characteristics of the thermoelectric element as described above, so that the heat resistance of the joint surface in the fin mounting portion can be obtained. It is necessary to keep it as low as possible, but in the conventional structure it is difficult to press and fasten all the fins together to the thermoelectric elements collectively, so it is unavoidable that they are individually soldered and assembled. In many thermomodules, the soldering work requires a great deal of labor, which is a major cause of cost increase.

The present invention has been made in view of the above points, does not require any soldering work at the time of assembly, and suppresses the thermal resistance of each joint to a low level by a simple work without being influenced by dimensional variation of individual parts. An object is to provide a thermo module that can be assembled and configured.

[Means for solving the problem]

In order to solve the above-mentioned problems, the present invention relates to a thermoelectric material chip in which thermoelectric material chips as dissimilar metals or p-type and n-type semiconductors, and heat-absorbing and heat-dissipating fins also serving as electrodes for heat-absorbing and heat-generating junctions are stacked in alternating rows. It is configured as a series laminated body of elements, and the heat absorbing fins and the heat radiating fins are individually aligned and drawn out in different directions from the laminated body, and then the entire laminated body is integrally pressure-fastened in the laminating direction. It shall be.

[Action]

With the above-described configuration, by using fastening studs, disc springs, and the like as fastening means, the series laminated body of thermoelectric elements is collectively pressure-fastened, so that even pressure is applied to each thermoelectric element in the thermomodule. Further, in this case, even if the thermoelectric material chips such as semiconductors have variations in dimensions, as long as the laminated end faces are processed flat, the chips and the heat absorbing / radiating fins are not affected by the variations in dimensions. Since they are in close contact with each other, the thermal resistance of their contact portions can be kept low. With this configuration, no soldering work is required when assembling the thermomodule.

〔Example〕

1 and 2 show the structure of an embodiment of the present invention, and the same members corresponding to FIG. 3 are designated by the same reference numerals.

That is, in the illustrated embodiment, the thermoelectric material chip p
Type semiconductor 1 and n type semiconductor 2 and heat absorbing fins 8 and heat radiating fins 9 also serving as electrodes for heat absorption and heat generation junctions are stacked alternately in a row to form a series laminated body of thermoelectric elements, and The entire laminated body is integrally pressure-bonded in the laminating direction through the fastening studs 10, the disc springs 11, and the cuts 12 to form a thermo module. The heat-absorbing fins 8 and the heat-dissipating fins 9 are individually aligned for each fin, and are laterally drawn out so as to be located on the opposite side of the laminated body. In the figure, reference numeral 13 is an insulating tube attached to the stud 10, 14 is a holding plate inserted at both ends of the stud 10, 15 is an insulating washer, 16 is a heat absorbing surface of the heat absorbing fin 8, and a heat radiating surface of the heat radiating fin 9. Is a heat insulating material that exposes the above and surrounds the periphery of the thermoelectric element laminate to thermally isolate the heat absorbing side and the heat radiating side.

With such a structure, a predetermined tightening force is applied to the studs 10 to collectively fasten the thermoelectric element stacks in the stacking direction, so that the p-type semiconductor 1 and the n-type semiconductor 2 of each thermoelectric element in the thermomodule are fastened. Then, a uniform pressing force is applied to the heat absorbing fins 8 and the heat radiating fins 9, and these are closely joined to each other. Moreover, even if the chip thicknesses of the p-type and n-type semiconductors 1 and 2 and the thicknesses of the heat absorbing fins 8 and the heat radiating fins 9 vary,
The pressure applied to each joint is equal, so as long as the laminated end faces of each component are processed flat, the components adhere to each other and the thermal resistance of the contact part inside each heat transfer element can be kept low. it can.

〔The invention's effect〕

Since the thermomodule according to the present invention is configured as described above, it has the following effects.

(1) No soldering work is required when assembling the thermomodule, and the thermomodule can be assembled and configured simply by stacking the parts and fastening them with studs.
Compared with the conventional structure, the assembly work can be greatly simplified and the manufacturing cost can be reduced.

(2) Since the thermoelectric material chip, the heat absorbing fins, and the heat radiating fins are directly overlapped and fastened together, even pressure is applied to each component in the thermo module, and the heat transfer resistance of each joint surface can be suppressed to a low level. This makes it possible to obtain an electronic cooling device having a high endothermic performance.

[Brief description of drawings]

FIG. 1 is a sectional view showing the construction of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line II--II in FIG. 1, and FIG. 3 is a basic construction view of a conventional thermomodule. In the figure, 1: p type semiconductor, 2: n type semiconductor, 8: heat absorbing fin, 9: radiating fin, 10: fastening stud.

Claims (1)

(57) [Claims] 1. A thermomodule comprising a plurality of pairs of thermoelectric elements, which comprises a thermoelectric material chip as a dissimilar metal or p-type or n-type semiconductor, heat absorption, and heat absorption fins also serving as electrodes at a heat generation junction, and heat dissipation. The fins are stacked alternately in a row to form a series stack of thermoelectric elements, and the heat-absorbing fins and the heat-dissipating fins are individually aligned and drawn out from the stack in different directions, and then the entire stack is stacked in the stacking direction. A thermo module characterized by being assembled by press-fastening from.