JP2540774B2 - Backup pin automatic placement device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in an automatic component mounting apparatus to prevent warpage, flexure, vibration and the like of a printed circuit board, and is arranged so as to hold the printed circuit board from the solder side. The present invention relates to an automatic pin placement device.

[0002]

2. Description of the Related Art Conventionally, in an automatic component mounting apparatus, a backup pin for supporting a printed circuit board when mounting a component on the printed circuit board is used by an operator while confirming a non-mounted portion of the printed circuit board. Had been placed. In such a method, when one automatic component mounting apparatus mounts automatic components on different types of printed circuit boards, it takes a lot of time to arrange backup pins corresponding to these printed circuit boards. There was a point.

In order to solve this problem, a pair of backup pins and sensor pins arranged in a matrix on a printed circuit board on which components are to be mounted and a pair of backup pins and sensor pins are independently or interlocked. The sensor pin detects whether or not there is a mounted component at the corresponding portion of the printed circuit board and the backup pin.If it is detected that no component is mounted, the vertical driving unit is activated. The backup pin automatic placement device that holds the backup pin at the position in contact with the printed circuit board surface is
It is disclosed in the microfilm of No. 51773 (Japanese Utility Model Laid-Open No. 4-10399).

[0004]

In the conventional backup pin automatic arrangement device of this kind, since one sensor pin is provided for each backup pin, a drive unit for driving each pin is provided. Structure becomes complicated. In addition, since the backup pin driving unit becomes large in size and takes up space, the intervals between the backup pins become wide and it is difficult to arrange the backup pins accurately.

[0005]

In order to solve the above-mentioned problems, a back-up pin automatic arrangement device of the present invention is provided with a plurality of back-up pins for pressing down the printed circuit board when automatically mounting electronic parts and the like on the printed circuit board. Pin and back
Back-up pin drive provided for each one of the up-pins
Moving parts and component mounting showing the mounting position of components on the printed circuit board
Based on the data, the component non-mounting position on the printed circuit board is determined.
CPU part for calculating the non-mounting part data shown, and CPU part
Print based on the non-implemented partial data output by
Be prepared for the back-up pins corresponding to the non-mounting parts of the board.
Control unit for driving the back-up pin drive unit
This back-up pin drive is equipped with a back-up pin
Holding mechanism that holds the
The air sent from the compressor backs up the air.
The first hole that moves the poppin up and down and the
And the air sent from the air conditioner press
And a second hole for operating the holding mechanism .

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a backup pin automatic placement device of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the backup pin automatic placement device of the present invention.

In the automatic backup pin arranging apparatus of the present invention, the mechanical section 10 arranges the backup pins 11 for pressing the printed circuit board from the solder surface side and the backup pins 11 in a matrix form, and prints them at the time of automatic component mounting. Backup pin unit 1 on which the board is placed
And each backup pin 11 is equipped with
The valve 9 controls the injection of the air 14 by opening and closing the valve 14 and drives the backup pin 11 by the pressure of the air 14. The storage medium 5 is a floppy disk or the like in which the component mounting data 4, which is data required when mounting electronic components or the like on the printed circuit board, is stored in advance. Is read from the storage medium 5, non-mounting portion data 3 which is information on a position where an electronic component is not placed on the printed circuit board is calculated, and is output to the control unit 7. Based on the non-mounting part data 3 output from the CPU part 6, the control part 7 has a backup pin 1 to be arranged in a non-mounting part of a component on a printed circuit board.
The control signal 2 is output to the valve 9 in order to control the opening and closing of the valve 9 provided in 1. Air compressor 8
Previously sends air 14 to the valve 9 at a predetermined pressure.

As the component mounting data 4, the component name of the target printed circuit board and its specifications, the designation of the product name of the mounted component mounted on the printed circuit board, the mounting position of the mounted component on the printed circuit board (for example, in XY coordinates). , And the external dimensions and their shapes (for example, SOP, QFP, etc.) of the mounted components. The component mounting data 4 is used not only for the automatic arrangement of backup pins of the present invention, but also as data for automatically mounting electronic components on a printed circuit board.

FIG. 2 is an external view showing the mechanism section 10.

The backup pin unit 1 has backup pins 11 arranged in a matrix, and each of the backup pins 11 is provided with a valve 9 at a lower portion thereof, and is injected by opening and closing the valve 9. The backup pin 11 provided on the valve 9 into which the air 14 is injected drives upward due to the pressure of the air 14 that is injected.

At the time of automatic component mounting, the printed circuit board is placed on the backup pin unit 1 and is pressed by the backup pin 11 driven above it.

Next, the operation of the backup pin automatic placement device of the present invention will be described in detail according to the procedure of the flow chart shown in FIG.

In order to automatically mount components and the like on the printed circuit board, component mounting data 4 which is data required by the component automatic mounting machine is stored in advance in a storage medium 5 such as a floppy disk (S31).

Next, the CPU section 6 reads the component mounting data 4 stored in the storage medium 5, and based on the data, the external dimensions of the printed circuit board and the position data on which the component is mounted. The data of the portion where the component is not placed above, that is, the non-mounting portion data 3 is calculated and output to the control unit 7 (S32).

Next, the control section 7 is provided on the backup pin 11 corresponding to the part where no component is mounted on the printed circuit board, based on the non-mounting part data 3 output from the CPU part 6. A control signal 2 is transmitted to open the valve 9 (S33).

The valve 9 opened by the control signal 2
The air 14 which has been sent out at a predetermined pressure by the air compressor 8 is injected into the chamber (S34).

Only the backup pin 11 provided in the valve 9 into which the air 14 is injected is driven upward to press the printed circuit board arranged on the backup pin unit 1 (S35).

Next, the structure and operation of the drive portion of the backup pin 11 arranged in the backup pin unit 1 will be described in detail with reference to FIGS. 4 and 5.

The drive portion of the backup pin 11 includes a backup pin 11 that is driven up and down to press the printed circuit board, and a pin that locks the backup pin 11 to keep the backup pin 11 driven upward. The lock 13, the spring 12 attached to the pin lock 13 and controlling the position of the pin lock 13 by its elastic force, and the backup pin 11 are pressed against the lower surface of the backup pin 11 in order to drive the backup pin 11 up and down. A hole 15 for injecting or exhausting air 14 and a hole provided in the middle of the hole 15 are provided so as to be branched, and in order to drive the pin lock 13, the pin lock 13 is pressed against the surface on which the spring 12 is attached. A hole 16 for injecting or exhausting air 14.

Next, the operation of arranging the backup pin 11 will be described.

As shown in FIG. 4, the air 14 sent through the valve 9 is injected into the holes 15 and 16. The air 14 injected into the hole 15 presses the lower surface of the backup pin 11 housed in the backup pin unit 1 and pushes it upward. Almost at the same time as this operation, the pressure of the air 14 injected into the hole 16 causes the pin lock 13 to protrude and join the recessed portion provided in the lower portion of the backup pin 11 driven upward,
The backup pin 11 is fixed while being driven upward. Here, the spring 12 attached to the pin lock 13 is in a stretched state. By this operation, air 14
Backup pin 1 provided in the valve 9 into which is injected
Only one, that is, only the backup pin 11 corresponding to the non-mounting part of the component of the printed circuit board is driven and arranged upward.

Next, the operation of storing the arranged backup pin 11 in the original position will be described.

As shown in FIG. 5, the hole 15 and the hole 1
By exhausting the air 14 inside 6, the pressure of the air 14 against the pin lock 13 is weakened, and the elastic force of the spring 12 in the extended state pulls the pin lock 13 back to its original position. As a result, the fixing of the backup pin 11 is released, and simultaneously with the operation of the pin lock 13, the pressure of the air 14 against the lower surface of the backup pin 11 is weakened, and the backup pin 11 is stored in the original position.

As a structure for injecting or exhausting the air 14 into the valve 9, a pipe 17 for injecting the air 14 from the air compressor 8 into the valve 9 as shown in FIGS. 6 and 7.
And a pipe 18 for exhausting air from the inside of the valve 9, and the control signal 2 output from the control unit 7 sends the air 14 from the pipe 17 for injecting the air 14 when the backup pin 11 is driven. When the backup pin 11 is stored, the air 14 is controlled to be exhausted from the exhaust pipe 18.

[0026]

As described above, the backup pin automatic placement device of the present invention is used in an automatic component mounting machine to mount components on a printed circuit board. Mounting data (CAM data) used for automatic component mounting. Automatically reduces the backup pin placement position, greatly reducing the work required to place this backup pin.Also, even if the types of printed circuit boards and mounted components change, You just need to change it. Further, it is not necessary to add information for automatically arranging the backup pin on the printed circuit board.

Furthermore, since the backup pin is driven by air, the backup pin drive mechanism can be simplified and the backup pin can be miniaturized. As a result, the pitch of the backup pins can be narrowed, so that the backup pins can be arranged accurately.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of an automatic backup pin placement device of the present invention.

FIG. 2 is an external view of a backup pin driving portion of the backup pin automatic placement device of the present invention.

FIG. 3 is a flowchart showing the operation of the backup pin automatic placement device of the present invention.

FIG. 4 is an explanatory diagram of a backup pin driving portion of the backup pin automatic placement device of the present invention.

FIG. 5 is an explanatory diagram of a backup pin driving portion of the backup pin automatic placement device of the present invention.

FIG. 6 is an explanatory view of air injection and exhaust to the valve of the backup pin automatic placement device of the present invention.

FIG. 7 is an explanatory diagram of air injection and exhaust to a valve of the backup pin automatic placement device of the present invention.

[Explanation of symbols]

 1 Backup Pin Unit 2 Control Signal 3 Non-Mounted Parts Data 4 Parts Mounted Data 5 Storage Medium 6 CPU Section 7 Control Section 8 Air Compressor 9 Valve 10 Mechanism Section 11 Backup Pin 12 Spring 13 Pin Lock 14 Air 15 Hole 16 Hole 17 Tube 18 tube

Claims (1)

(57) [Claims] 1. A plurality of back-up pins that hold down the printed circuit board when electronic components and the like are automatically mounted on the printed circuit board, a back-up pin driving unit provided for each of the back-up pin, and the printed circuit board on the printed circuit board. Component mounting data indicating the component mounting position of
A CPU section for calculating non-mounting partial data indicating a non-mounting position of a component on the printed circuit board based on the data, and a non-mounting partial data output from the CPU section for the printed circuit board. the Batsukuatsupupin driving unit provided in the Batsukuatsupupin corresponding to the non-implementation part and a control unit for driving, the Batsukuatsupupin driver may be held in a state of driving the Batsukuatsupupin the top
Holding mechanism and the air sent from the air conditioner press
From the air conditioner presser, which is branched from the first hole for moving the back up pin up and down and the first hole.
Second operation of the holding mechanism by the sent air
Automatic back-up pin arranging device having a hole .