JP2541997B2 - Curing method with active energy rays - Google Patents
Curing method with active energy raysInfo
- Publication number
- JP2541997B2 JP2541997B2 JP62200135A JP20013587A JP2541997B2 JP 2541997 B2 JP2541997 B2 JP 2541997B2 JP 62200135 A JP62200135 A JP 62200135A JP 20013587 A JP20013587 A JP 20013587A JP 2541997 B2 JP2541997 B2 JP 2541997B2
- Authority
- JP
- Japan
- Prior art keywords
- active energy
- temperature
- curable compound
- curable
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001723 curing Methods 0.000 title description 21
- 150000001875 compounds Chemical class 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 16
- 230000009477 glass transition Effects 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000000576 coating method Methods 0.000 description 32
- 239000011248 coating agent Substances 0.000 description 31
- 239000000203 mixture Substances 0.000 description 24
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- -1 acrylate compound Chemical class 0.000 description 7
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000004809 Teflon Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- IMPRSCUWYGENLJ-UHFFFAOYSA-N 1-(2-hydroxyethoxy)butan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCC(O)COCCO IMPRSCUWYGENLJ-UHFFFAOYSA-N 0.000 description 1
- KCTLVMHZZFCDJL-UHFFFAOYSA-N 1-[2-(2-hydroxyethoxy)ethoxy]propan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(O)COCCOCCO KCTLVMHZZFCDJL-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- QKTWWGYCVXCKOJ-UHFFFAOYSA-N 2-methoxy-1-(2-methoxyphenyl)-2-phenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1OC QKTWWGYCVXCKOJ-UHFFFAOYSA-N 0.000 description 1
- BSMGLVDZZMBWQB-UHFFFAOYSA-N 2-methyl-1-phenylpropan-1-one Chemical compound CC(C)C(=O)C1=CC=CC=C1 BSMGLVDZZMBWQB-UHFFFAOYSA-N 0.000 description 1
- PRCVHFWBVJHZSS-UHFFFAOYSA-N 2-methylnonan-2-yl prop-2-enoate Chemical compound CCCCCCCC(C)(C)OC(=O)C=C PRCVHFWBVJHZSS-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 125000006539 C12 alkyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- RFVHVYKVRGKLNK-UHFFFAOYSA-N bis(4-methoxyphenyl)methanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1 RFVHVYKVRGKLNK-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- FSPSELPMWGWDRY-UHFFFAOYSA-N m-Methylacetophenone Chemical compound CC(=O)C1=CC=CC(C)=C1 FSPSELPMWGWDRY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Polymerisation Methods In General (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、活性エネルギー線による硬化性化合物の硬
化方法に関する。さらに詳しくは硬化速度に優れ、基板
への密着性能、折曲げ強度に優れ、かつ耐候性能に優れ
た硬化塗膜を与える活性エネルギー線による硬化性化合
物の硬化方法に関する。TECHNICAL FIELD The present invention relates to a method for curing a curable compound with active energy rays. More specifically, it relates to a method for curing a curable compound by an active energy ray that provides a cured coating film having excellent curing speed, excellent adhesion to a substrate, excellent bending strength, and excellent weather resistance.
[従来の技術] 金属、プラスチック、木材、合板、紙などのコーテイ
ングに用いられる硬化性化合物を、電子線を始めとする
放射線や紫外線などの活性エネルギー線の照射により硬
化させる方法は既に知られている。一般にこのような活
性エネルギー線の照射によつて硬化し塗膜を形成する材
料として、多くの提案がなされているが、その代表的な
ものとしては、ビニル基、(メタ)アクリロイル基、ビ
ニリデン基、などを有する化合物が挙げられ、特に最近
では不飽和ポリエステル系、および不飽和ウレタン系樹
脂などを主成分とした硬化性化合物が多用されている。[Prior Art] A method for curing a curable compound used for coating metals, plastics, wood, plywood, paper, etc. by irradiation with active energy rays such as electron beams and other radiation and ultraviolet rays is already known. There is. Generally, many proposals have been made as a material which is cured by irradiation with such an active energy ray to form a coating film. Typical examples thereof include a vinyl group, a (meth) acryloyl group and a vinylidene group. , And the like. Particularly, recently, curable compounds mainly containing unsaturated polyester resins and unsaturated urethane resins have been widely used.
これらの硬化性化合物に活性エネルギー線を照射する
際、通常、室温のまま特に硬化性化合物の温度を制御せ
ずに行つていたが、硬化性化合物の硬化速度を高めるた
めに、種々の方法が提案されている。When irradiating these curable compounds with active energy rays, it was usually carried out at room temperature without controlling the temperature of the curable compounds, but various methods were used to increase the curing rate of the curable compounds. Is proposed.
例えば、特開昭50−56425号公報には、光硬化性塗料
を酸素濃度3容量%以下の不活性ガス雰囲気下で光を照
射して硬化させることを特徴とする、高速硬化性で、平
滑な硬化表面を与えかつ欠陥のすくない硬化塗膜を形成
する方法が記載されている。For example, JP-A-50-56425 discloses that a photocurable coating material is cured by irradiating it with light in an inert gas atmosphere having an oxygen concentration of 3% by volume or less. A method of forming a cured coating that provides a smooth cured surface and is defect free is described.
更に、ピンホールの発生防止および変形の防止のため
に、紫外線硬化型塗料の塗布に際して、被塗装物および
/または該塗料を塗布前に加熱し、塗布し、塗布後急冷
して塗料を固定化し、次いで、紫外線を照射する方法が
特開昭54−8868号公報に記載されている。Further, in order to prevent the generation of pinholes and the prevention of deformation, when applying the ultraviolet curable coating material, the object to be coated and / or the coating material is heated and coated before coating, and then rapidly cooled after coating to fix the coating material. Then, a method of irradiating with ultraviolet rays is described in JP-A-54-8868.
[発明が解決しようとする問題点] しかし、これまで提案された種々の活性エネルギー線
硬化性組成物は、一般にこれらを金属、プラスチツク、
木材、合板、紙などの被塗装体に塗装し活性エネルギー
線によつて硬化させた場合、硬化後の塗膜の密着性が劣
り、更に加工のための折曲げなどによつて塗膜にクラツ
クが発生しやすいという欠点を有していた。これは、活
性エネルギー線の照射によつて硬化性化合物が瞬間的に
硬化するため、硬化後の塗膜に内部応力が発生するため
と推察される。[Problems to be Solved by the Invention] However, various active energy ray-curable compositions that have been proposed so far generally include metal, plastic, and
When coated on wood, plywood, paper, etc. and cured with active energy rays, the adhesion of the coating after curing is poor, and the coating is cracked by bending for processing. It had a drawback in that It is speculated that this is because the curable compound is instantaneously cured by the irradiation of the active energy ray, and thus internal stress is generated in the coating film after curing.
上記特開昭50−56425号公報に記載された方法は、上
記欠点に加えて硬化速度を速めるという点では効果を有
するものの照射雰囲気を不活性ガスで置換する必要があ
り、装置が複雑化するという問題がある。加えて、硬化
後の塗膜の耐候性能においても十分満足できるものが得
られるには至つていない。The method described in JP-A-50-56425 is effective in terms of speeding up the curing rate in addition to the above-mentioned drawbacks, but it is necessary to replace the irradiation atmosphere with an inert gas, which complicates the apparatus. There is a problem. In addition, the weather resistance of the coating film after curing has not been sufficiently satisfactory.
また、上記特開昭54−8868号公報に記載された方法は
ピンホールの発生防止という点では効果があるものの硬
化後の塗膜の耐候性能においては満足すべきものが得ら
れないという欠点を有する。Further, although the method described in JP-A-54-8868 is effective in preventing the generation of pinholes, it has a drawback that satisfactory weather resistance of the coating film after curing cannot be obtained. .
[問題点を解決するための手段] すなわち、本発明は、硬化性化合物を活性エネルギー
線を照射することにより硬化する際に、硬化物のガラス
転移温度が40℃〜200℃の範囲内にある硬化性化合物の
同温度より10℃低い温度から同温度より10℃高い温度の
範囲内に該硬化性化合物を保持することを特徴とする硬
化性化合物の硬化方法、を提供するものである。[Means for Solving Problems] That is, according to the present invention, when the curable compound is cured by irradiation with active energy rays, the glass transition temperature of the cured product is in the range of 40 ° C to 200 ° C. The present invention provides a method for curing a curable compound, characterized in that the curable compound is retained within a range of 10 ° C lower than the same temperature of the curable compound to 10 ° C higher than the same temperature.
本発明において、ガラス転移温度は硬化性化合物の硬
化物(以下、単に「硬化物」という)が非晶性物質の場
合または硬化物が結晶性物質であつても、部分的に非晶
性である場合に適用される。In the present invention, the glass transition temperature is partially amorphous when the cured product of the curable compound (hereinafter simply referred to as “cured product”) is an amorphous substance or even when the cured product is a crystalline substance. Applies in some cases.
本発明において、ガラス転移温度は硬化物の非晶性物
質部の膨張率、熱含量、屈折率、拡散係数、誘電率、弾
性率等の諸特性の温度係数を測定した場合に、それら諸
特性の温度係数の変曲点として定義される温度である。
硬化物のガラス転移温度は上記の温度係数を測定するこ
とによつて得ることができるが、簡便には、硬化物の有
する弾性率の温度依存性の測定によつて得られる損失正
接が極大値を示す温度、もしくは示差走査型熱量分析法
で硬化物の比熱の温度依存性の測定によつて得られる比
熱が変曲点を示す温度等を用いることができる。In the present invention, the glass transition temperature is various characteristics when the temperature coefficient of various characteristics such as expansion coefficient, heat content, refractive index, diffusion coefficient, dielectric constant, elastic modulus of the amorphous substance portion of the cured product is measured. It is the temperature defined as the inflection point of the temperature coefficient of.
The glass transition temperature of the cured product can be obtained by measuring the above temperature coefficient, but simply, the loss tangent obtained by measuring the temperature dependence of the elastic modulus of the cured product has a maximum value. Or the temperature at which the specific heat obtained by measuring the temperature dependence of the specific heat of the cured product by the differential scanning calorimetry shows an inflection point.
本発明を適用することのできる硬化性化合物として
は、その硬化物のガラス転移温度が40〜200℃の範囲内
にあるものが挙げられる。Examples of the curable compound to which the present invention can be applied include those in which the glass transition temperature of the cured product is within the range of 40 to 200 ° C.
本発明においては、硬化性化合物を硬化させる際に前
記ガラス転移温度より10℃低い温度から10℃高い温度範
囲(以下、この温度範囲を「特定温度」という)に硬化
性化合物を保持しながら活性エネルギー線を照射するこ
とが必要である。In the present invention, when the curable compound is cured, it is active while maintaining the curable compound in a temperature range 10 ° C. lower to 10 ° C. higher than the glass transition temperature (hereinafter, this temperature range is referred to as “specific temperature”). It is necessary to irradiate with energy rays.
ここで、ガラス転移温度より10℃を超えて低い温度で
は、硬化物の耐候性が充分ではなくなり、一方、ガラス
転移温度より10℃を超えて高い温度では、硬化性化合物
を塗膜とした場合、塗膜が流動性が増し膜厚の制御が困
難となるという問題が生じる。Here, at a temperature higher than 10 ° C. lower than the glass transition temperature, the weather resistance of the cured product becomes insufficient, while at a temperature higher than 10 ° C. higher than the glass transition temperature, when the curable compound is used as a coating film. However, there arises a problem that the fluidity of the coating film increases and it becomes difficult to control the film thickness.
なお、本発明において、硬化物とは、硬化前の硬化性
化合物に対する良溶剤で硬化物を抽出した場合、抽出分
率が20重量%以下であるものを意味する。In the present invention, the cured product means that the extraction fraction is 20% by weight or less when the cured product is extracted with a good solvent for the curable compound before curing.
硬化性化合物に活性エネルギー線を照射して硬化させ
る際に、該硬化性化合物を特定温度に保つ方法として
は、(1)あらかじめ該硬化性化合物等または該硬化性
化合物を塗布した被塗装体を特定温度に管理された恒温
槽の中に置き温度平衡に到達せしめた後に取り出し、速
やかに活性エネルギー線を照射し硬化させる方法、
(2)該硬化性化合物または該硬化性化合物を塗布した
被塗装体を加熱および冷却装置を備えた平板状およびま
たはロール状の熱浴に接触させることによつて該硬化性
化合物または該硬化性化合物を塗布した被塗装体の温度
を特定温度に到達せしめたのち活性エネルギー線を照射
して硬化させる方法、(3)活性エネルギー線の照射雰
囲気を特定温度にコントロールされた恒温の気体、例え
ば窒素、二酸化炭素、ヘリウム、アルゴン等の不活性ガ
スおよび/または空気で置換し、活性エネルギー線照射
時に該硬化性化合物等または該硬化性化合物を塗布した
被塗装体の温度を特定温度範囲に至らしめる方法等が挙
げられるが、必ずしもこれらの方法に限定されるもので
はない。When the curable compound is irradiated with an active energy ray to be cured, the curable compound can be maintained at a specific temperature by (1) applying the curable compound or the like or an article to be coated with the curable compound in advance. A method of placing in a constant temperature bath controlled to a specific temperature to reach temperature equilibrium, then taking out, and rapidly irradiating with active energy rays to cure
(2) The curable compound or the curable compound is obtained by bringing the curable compound or the object to be coated with the curable compound into contact with a flat and / or roll-shaped heat bath equipped with a heating and cooling device. A method of irradiating an active energy ray to cure after the temperature of an object to be coated to which the compound is applied reaches a specific temperature, and (3) a constant temperature gas in which the irradiation atmosphere of the active energy ray is controlled to a specific temperature, for example, nitrogen. The temperature of the curable compound or the like or the object to be coated on which the curable compound has been applied is replaced with a specific temperature range by irradiating with an inert gas such as carbon dioxide, carbon dioxide, helium or argon and / or air. Examples thereof include, but are not necessarily limited to, these methods.
本発明の方法を適用することができる硬化性化合物と
しては、ビニル基、(メタ)アクリロイル基、アリル
基、ビニリデン基等の活性エネルギー線感応基を有する
プレポリマーおよび低分子化合物を挙げることができ
る。Examples of the curable compound to which the method of the present invention can be applied include a prepolymer and a low molecular weight compound having an active energy ray-sensitive group such as a vinyl group, a (meth) acryloyl group, an allyl group and a vinylidene group. .
前記活性エネルギー線感応基を有する低分子化合物と
しては、常圧下で150℃以上の沸点を有する単官能もし
くは多官能性の(メタ)アクリレート化合物およびビニ
ル化合物等を挙げることができ、以下のものを例示する
ことができる。Examples of the low molecular weight compound having an active energy ray-sensitive group include a monofunctional or polyfunctional (meth) acrylate compound and a vinyl compound having a boiling point of 150 ° C. or higher under normal pressure. It can be illustrated.
多官能性化合物:2−ヒドロキシエチルアクリレート、2
−ヒドロキシプロピルアクリレート、テトラヒドロフル
フリルアクリレート、ブトキシエチルアクリレート、エ
チルジエチレングリコールアクリレート、2−エチルヘ
キシルアクリレート、シクロヘキシルアクリレート、ジ
シクロペンタジエンアクリレート、ポリエチレングリコ
ールアクリレート、ポリプロピレングリコールアクリレ
ート、メチルトリエチレングリコールアクリレート、ジ
エチルアミノエチルアクリレート、7−アミノ−3,7−
ジメチルオクチルアクリレート等のアクリル系化合物、
2−ヒドロキシエチルメタクリレート、2−ヒドロキシ
プロピルメタクリレート、ポリプロピレングリコールメ
タクリレート、ジエチルアミノエチルメタクリレート等
のメタクリル系化合物、ビニルピロリドン、ビニルフエ
ノール、アクリルアミド、酢酸ビニル、ビニルエーテ
ル、スチレン および一般式: [ここで、R1は水素原子またはメチル基であり、R2は水
素原子またはメチル基であり、R3はC1〜C8のアルキル基
またはC1〜C12のアルキル基を有するアルキルフエニル
基であり、nは1〜12の整数である]で表わされる化合
物。Polyfunctional compound: 2-hydroxyethyl acrylate, 2
-Hydroxypropyl acrylate, tetrahydrofurfuryl acrylate, butoxyethyl acrylate, ethyldiethylene glycol acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dicyclopentadiene acrylate, polyethylene glycol acrylate, polypropylene glycol acrylate, methyltriethylene glycol acrylate, diethylaminoethyl acrylate, 7 -Amino-3,7-
Acrylic compounds such as dimethyloctyl acrylate,
Methacrylic compounds such as 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, polypropylene glycol methacrylate, diethylaminoethyl methacrylate, vinylpyrrolidone, vinylphenol, acrylamide, vinyl acetate, vinyl ether, styrene and general formulas: [Wherein R 1 is a hydrogen atom or a methyl group, R 2 is a hydrogen atom or a methyl group, and R 3 is an alkyl group having a C 1 to C 8 alkyl group or a C 1 to C 12 alkyl group. Is an enyl group, and n is an integer of 1 to 12].
多官能性化合物:トリメチロールプロパントリアクリレ
ート、エチレングリコールジアクリレート、テトラエチ
レングリコールジアクリレート、ポリエチレングリコー
ルジアクリレート、1,4−ブタンジオールジアクリレー
ト、1,6−ヘキサンジオールジアクリレート、ネオペン
チルグリコールジアクリレート、ポリエステルジアクリ
レート、ジアリルアジペート、ジアリルフタレート、ト
リアリルイソシアヌレート。Polyfunctional compounds: trimethylolpropane triacrylate, ethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate , Polyester diacrylate, diallyl adipate, diallyl phthalate, triallyl isocyanurate.
また、前記活性エネルギー線感応基を有するプレポリ
マーとしては、ウレタン変性(メタ)アクリレート、ポ
リエステル変性(メタ)アクリレート、エポキシ変性
(メタ)アクリレート、アルキド変性(メタ)アクリレ
ート等を挙げることができる。Examples of the prepolymer having an active energy ray sensitive group include urethane-modified (meth) acrylate, polyester-modified (meth) acrylate, epoxy-modified (meth) acrylate, and alkyd-modified (meth) acrylate.
本発明において、これらの硬化性化合物は1種または
2種以上を併用することができ、2種以上を併用する場
合にはその混合物の硬化物のガラス転移温度を適用す
る。In the present invention, these curable compounds may be used alone or in combination of two or more kinds, and when two or more kinds are used in combination, the glass transition temperature of the cured product of the mixture is applied.
さらに、後記する添加剤等を含む場合には、硬化性化
合物と添加剤との混合物のガラス転移温度を適用する。Further, in the case of containing the additives described below, the glass transition temperature of the mixture of the curable compound and the additives is applied.
本発明の方法は特に活性エネルギー線感応性基を有す
るプレポリマーおよび活性エネルギー線感応性基を有す
る化合物から選ばれる少なくとも一種の化合物であっ
て、その硬化物のガラス転移温度が40〜200℃程度の硬
化性組成物に好適に適用することができ、この硬化性
は、必要に応じて活性エネルギー線重合開始剤、活性エ
ネルギー線増感剤、活性エネルギー線吸収剤、酸化防止
剤、重合禁止剤、有機および無機顔料、可塑剤、界面活
性剤およびその他の添加剤等を含んでいてもよい。The method of the present invention is at least one compound selected from a prepolymer having an active energy ray-sensitive group and a compound having an active energy ray-sensitive group, and the glass transition temperature of the cured product thereof is about 40 to 200 ° C. Can be suitably applied to the curable composition of, the curability, active energy ray polymerization initiator, active energy ray sensitizer, active energy ray absorber, antioxidant, polymerization inhibitor as required. , Organic and inorganic pigments, plasticizers, surfactants and other additives may be included.
本発明において用いられる活性エネルギー線として
は、紫外線を始めとして、電子線、γ線、中性子線、β
線、X線等を例示することができるが、特に活性エネル
ギー線の制御および活性エネルギー線照射装置の製造工
程への導入の容易さ等の点から紫外線または電子線を用
いることが好ましい。Examples of the active energy ray used in the present invention include ultraviolet rays, electron beams, γ rays, neutron rays, and β.
Rays, X-rays and the like can be used, but it is particularly preferable to use ultraviolet rays or electron beams from the viewpoints of control of active energy rays and ease of introduction into the manufacturing process of the active energy ray irradiation apparatus.
活性エネルギー線が紫外線である場合には、硬化性化
合物等に光重合開始剤を併用することが好ましく、光重
合開始剤としては、 2,2′−ジメトキシ−2−フエニルアセトフエノン、
アセトフエノン、ベンゾフエノン、キサントン、フルオ
レノン、ベンズアルデヒド、フルオレン、アントラキノ
ン、トリフエニルアミン、カルバゾール、3−メチルア
セトフエノン、4−クロロベンゾフエノン、4,4′−ジ
メトキシベンゾフエノン、4,4′−ジアミノベンゾフエ
ノン、ミヒラーケトン、ベンゾインプロピルエーテル、
ベンゾインエチルエーテル、ベンジルジメチルケター
ル、1−(4−イソプロピルフエニル)−2−ヒドロキ
シ−2−メチルプロパン−1−オン、2−ヒドロキシ−
2−メチル−1−フエニルプロパン−1−オン、チオキ
サントン系化合物等があげられる。When the active energy rays are ultraviolet rays, it is preferable to use a photopolymerization initiator in combination with the curable compound, and as the photopolymerization initiator, 2,2′-dimethoxy-2-phenylacetophenone,
Acetophenone, benzophenone, xanthone, fluorenone, benzaldehyde, fluorene, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, 4-chlorobenzophenone, 4,4'-dimethoxybenzophenone, 4,4'-diamino Benzophenone, Michler's ketone, benzoin propyl ether,
Benzoin ethyl ether, benzyl dimethyl ketal, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 2-hydroxy-
Examples thereof include 2-methyl-1-phenylpropan-1-one and thioxanthone compounds.
これらの光重合開始剤は1種または2種以上を組合わ
せて用いられる。These photopolymerization initiators are used alone or in combination of two or more.
合成例1 温度計、攪拌器および還流冷却管を備えたフラスコ
に、4,4′−ジシクロヘキシルメタンジイソシアネート2
37.3g、ジブチルスズジラウレート0.5gおよびメチルエ
チルケトンとシクロヘキサノンの混合溶媒(容量比50:5
0)550gを仕込んだ。これらの混合物を60℃に加温した
のち、滴下ロートより、系の温度が上昇しない様に注意
しながら、ポリブチレンアジペート(日本ポリウレタン
社製ニッポラン4009)222.4g、ポリオキシエチレンビス
フエノールAエーテル(日本油脂社製DA−350F)173.8
g、ビスフエノールAのプロピレンオキサイド付加物の
アクリル酸付加物(共栄社油脂社製エポキシエステル30
02A、49.4g2−ヒドロキシエチルアクリレート9.6g、4
価アルコール化合物(旭電化社製アデカクオドロール)
6.1gおよびメチルエチルケトンとシクロヘキサノンの混
合溶媒(容量比50:50)500gを均一に混合したものを滴
下し、滴下終了後、60℃で8時間反応させて、硬化性プ
レポリマー(1)とメチルエチルケトンとシクロヘキサ
ノンとの混合物(重量比40:60)を得た。このものにつ
いて赤外吸収スペクトルにより系中にイソシアネート基
が残存していないことを確認した。Synthesis Example 1 4,4'-Dicyclohexylmethane diisocyanate 2 was placed in a flask equipped with a thermometer, a stirrer and a reflux condenser.
37.3g, dibutyltin dilaurate 0.5g and mixed solvent of methyl ethyl ketone and cyclohexanone (volume ratio 50: 5
0) 550g was charged. After heating these mixtures to 60 ° C., 222.4 g of polybutylene adipate (Nipporan 4009 manufactured by Nippon Polyurethane Co., Ltd.), polyoxyethylene bisphenol A ether (with the dropping funnel being careful not to raise the temperature of the system). DA-350F manufactured by NOF CORPORATION 173.8
g, acrylic acid adduct of propylene oxide adduct of bisphenol A (Kyoeisha Yushi Co., Ltd. epoxy ester 30
02A, 49.4g 2-hydroxyethyl acrylate 9.6g, 4
Polyhydric alcohol compound (Adeka quadrol manufactured by Asahi Denka Co., Ltd.)
A uniform mixture of 6.1 g and 500 g of a mixed solvent of methyl ethyl ketone and cyclohexanone (volume ratio 50:50) was added dropwise, and after completion of the addition, the mixture was reacted at 60 ° C. for 8 hours to give a curable prepolymer (1) and methyl ethyl ketone. A mixture with cyclohexanone (weight ratio 40:60) was obtained. It was confirmed from this infrared absorption spectrum that no isocyanate group remained in the system.
合成例2 温度計、攪拌器および還流冷却管を備えたフラスコ
に、トルエンジイソシアネート345gおよびジブチルスズ
ジラウレート0.5gを仕込んだ。これらの混合物を60℃に
加温したのち、滴下ロートより、系の温度が上昇しない
様に注意しながら、ポリテトラメチレングリコール(三
菱化成社製PTMG 1000)、661.0gエチレングリコール4
1.0gおよびヒドロキシエチルアクリレート153.4gを均一
に混合したものを滴下した。さらに合成系の粘度を下げ
る目的でビニルピロリドン133.3gを系に加えた。滴下終
了後、60℃で8時間反応させて、硬化性プレポリマー
(2)のビニルピロリドン混合物(重量比90:10)を
得、このものについて、赤外吸収スペクトルにより系中
にイソシアネート基が残存していないことを確認した。Synthesis Example 2 A flask equipped with a thermometer, a stirrer and a reflux condenser was charged with 345 g of toluene diisocyanate and 0.5 g of dibutyltin dilaurate. After heating these mixtures to 60 ° C, pay attention not to raise the temperature of the system from the dropping funnel, taking care that polytetramethylene glycol (PTMG 1000 manufactured by Mitsubishi Kasei), 661.0 g ethylene glycol 4
A homogeneous mixture of 1.0 g and 153.4 g of hydroxyethyl acrylate was added dropwise. Further, 133.3 g of vinylpyrrolidone was added to the system in order to reduce the viscosity of the synthetic system. After the completion of the dropping, the mixture was reacted at 60 ° C for 8 hours to obtain a vinylpyrrolidone mixture of the curable prepolymer (2) (weight ratio 90:10). About this product, an isocyanate group remained in the system by infrared absorption spectrum. I confirmed that I did not.
合成例3 温度計、攪拌器および還流冷却管を備えたフラスコ
に、トルエンジイソシアネート120.6g、ジブチルスズジ
ラウレート0.5gおよび希釈モノマーとしてイソボロニル
アクリレート158.4gを加えた。Synthesis Example 3 To a flask equipped with a thermometer, a stirrer and a reflux condenser, 120.6 g of toluene diisocyanate, 0.5 g of dibutyltin dilaurate and 158.4 g of isobornyl acrylate as a diluting monomer were added.
これらの混合物を60℃に加温したのち、滴下ロートよ
り、系の温度が上昇しない様に注意しながら、ポリテト
ラメチレングリコール(三菱化成社製PTMG 3000)103
9.3gおよび2−ヒドロキシエチルアクリレート40.2gを
希釈モノマーであるイソボロニルアクリレート200gに溶
解、均一混合したものを滴下した。滴下終了後、60℃で
8時間反応させて、硬化性プレポリマー(3)とイソボ
ロニルアクリレートとの混合物(重量比77:23)を得
た。このものについての赤外吸収スペクトルにより系中
にイソシアネート基が存在していないことを確認した。After heating these mixtures to 60 ° C, pay attention to the temperature of the system from the dropping funnel, taking care not to raise the temperature of the system. Polytetramethylene glycol (PTMG 3000 manufactured by Mitsubishi Kasei) 103
A mixture of 9.3 g and 40.2 g of 2-hydroxyethyl acrylate dissolved in 200 g of isoboronyl acrylate as a diluting monomer and uniformly mixed was added dropwise. After completion of the dropping, the mixture was reacted at 60 ° C. for 8 hours to obtain a mixture (weight ratio 77:23) of curable prepolymer (3) and isobornyl acrylate. The infrared absorption spectrum of this product confirmed that there were no isocyanate groups in the system.
[実施例1〜6、比較例1〜3] 合成例1、2および3に示す方法で合成した活性エネ
ルギー線感応基を有する硬化性プレポリマー(1)、
(2)および(3)にそれぞれ必要に応じて活性エネル
ギー線感応基を有する化合物、光重合開始剤、光増感剤
を表1に示す割合で配合し、硬化性組成物(A)、
(B)および(C)を得た。[Examples 1 to 6, Comparative Examples 1 to 3] Curable prepolymer (1) having an active energy ray-sensitive group synthesized by the method shown in Synthesis Examples 1, 2 and 3.
If necessary, a compound having an active energy ray-sensitive group, a photopolymerization initiator, and a photosensitizer are added to (2) and (3) at a ratio shown in Table 1 to prepare a curable composition (A),
(B) and (C) were obtained.
これらの硬化性組成物(A)、(B)および(C)を
それぞれテフロンシート上にキヤストし、溶剤を含むも
のについては減圧下であらかじめ十分に脱溶剤した後、
各硬化性樹脂組成物を室温に保持しながら、それぞれ紫
外線または電子線の照射を行ない各組成物を硬化させ
た。このようにして得た各組成物(A)、(B)および
(C)の硬化塗膜をテフロンシート上から剥離し、自動
粘弾性測定装置(東洋ボールドウイン社製)を用いて各
組成物の硬化塗膜の損失正接の温度依存性を測定した。
測定条件は、歪周波数35Hz、昇温速度2℃/分である。
各組成物(A)、(B)および(C)の硬化塗膜の損失
正接が極大値を示す温度をガラス転移温度とし、表1に
示した。Each of these curable compositions (A), (B) and (C) is cast onto a Teflon sheet, and those containing a solvent are sufficiently desolvated under reduced pressure in advance,
While holding each curable resin composition at room temperature, each composition was cured by irradiation with ultraviolet rays or electron beams. The cured coating films of the respective compositions (A), (B) and (C) thus obtained were peeled off from the Teflon sheet and each composition was measured using an automatic viscoelasticity measuring device (manufactured by Toyo Baldwin Co., Ltd.). The temperature dependence of the loss tangent of the cured coating film of No. 1 was measured.
The measurement conditions are a strain frequency of 35 Hz and a heating rate of 2 ° C./min.
The temperature at which the loss tangent of the cured coating film of each of the compositions (A), (B) and (C) exhibits a maximum value is defined as the glass transition temperature and is shown in Table 1.
次いで、上記と同様にしてテフロンシート上およびに
ポリエステルフイルム(東レ(株)製 ルミラー75ミク
ロン厚)上に硬化性組成物(A)、(B)および(C)
をキヤストし、溶剤を含むものについては減圧下であら
かじめ十分に脱溶剤し、膜厚50ミクロンの未硬化塗膜を
作製した。ついで、それぞれ表2に示す様に照射時の各
キヤストフイルムの温度を変えてそれぞれ紫外線または
電子線の照射を行ない各組成物を硬化させた。次にあら
かじめ実施例1〜6および比較例1〜3についての各キ
ヤストフイルムは紫外線、電子線等の活性エネルギー線
照射雰囲気の温度と同一の温度雰囲気に置き各キヤスト
フイルムの温度と活性エネルギー線照射雰囲気の温度が
十分に熱平衡に達していることを白金抵抗体で確認した
後、活性エネルギー線を照射した。また、硬化性組成物
(A)、(B)および(C)についてそれぞれ活性エネ
ルギー線照射時のキヤストフイルムの温度を変化させ
た。Then, in the same manner as described above, the curable compositions (A), (B) and (C) were applied on a Teflon sheet and on a polyester film (Lumirror 75 micron thickness manufactured by Toray Industries, Inc.).
Was cast, and those containing a solvent were sufficiently removed in advance under reduced pressure to prepare an uncured coating film having a film thickness of 50 μm. Then, as shown in Table 2, the temperature of each cast film at the time of irradiation was changed and each composition was cured by irradiation with ultraviolet rays or electron beams. Next, each cast film in Examples 1 to 6 and Comparative Examples 1 to 3 was previously placed in an atmosphere having the same temperature as the active energy ray irradiation atmosphere such as ultraviolet rays and electron beams, and the temperature of each cast film and the active energy ray irradiation. After confirming that the temperature of the atmosphere reached the thermal equilibrium sufficiently with the platinum resistor, the active energy ray was irradiated. Further, the temperature of the cast film at the time of irradiation with active energy rays was changed for each of the curable compositions (A), (B) and (C).
この様にして表2に示すように、実施例1〜6、比較
例1〜3に相当する硬化塗膜を得た。In this way, as shown in Table 2, cured coating films corresponding to Examples 1 to 6 and Comparative Examples 1 to 3 were obtained.
[試験例] 実施例1〜6および比較例1〜3でテフロンシート上
に作製したこれらの硬化塗膜については、該硬化塗膜を
テフロンシートから剥離した後、ASTM D750−55Tに準
じてウェザオメーターによる耐候性試験を行なつた。す
なわち、スプレーによる水噴霧を6時間毎に1時間づつ
繰り返し100時間後に重合硬化塗膜をとりだし、重合硬
化塗膜の着色劣化の度合いをそれぞれ比較した。著しく
黄変着色しているものを不適(×)、黄変の着色の程度
が軽微なものを適(○)と評価して、表2にその評価結
果を示した。[Test Example] Regarding these cured coating films prepared on the Teflon sheet in Examples 1 to 6 and Comparative Examples 1 to 3, after peeling the cured coating film from the Teflon sheet, weathering was performed according to ASTM D750-55T. A weather resistance test was performed with an odometer. That is, water spraying was repeated every 6 hours for 1 hour, and after 100 hours, the polymerization-cured coating film was taken out, and the degree of color deterioration of the polymerization-cured coating film was compared. Table 2 shows the results of evaluation, in which those marked with yellowing were evaluated as unsuitable (x), and those with a slight degree of yellowing were evaluated as suitable (∘).
また耐候性試験前後の硬化塗膜の引張弾性率をJIS
K−7113に準じて測定し、耐候性試験前後での引張弾性
率の変化が20%未満であるものを耐候性良とし、20%以
上であるものを耐候性不良として表2に示した。In addition, the tensile modulus of the cured coating film before and after the weather resistance test
It was measured according to K-7113, and when the change in tensile modulus before and after the weather resistance test was less than 20%, the weather resistance was good, and when it was 20% or more, the weather resistance was poor.
さらにポリエステルフイルム上で作製した硬化塗膜に
ついては、基板への密着性の良否を判定するためJIS
K−5400に準じて碁盤目試験を行なつた。碁盤目試験の
結果は、100個のクロスハツチのうち一つでも剥離した
ものを基盤密着性不良とし、まつたく剥離を示さなかつ
たものを基盤密着性良として表2に示した。また、実施
例1〜6、比較例1〜3で得られた硬化塗膜について表
面タツクの有無を試験し、表2にその評価結果を示し
た。Furthermore, for cured coatings made on polyester film, JIS is used to judge the quality of the adhesion to the substrate.
A cross-cut test was conducted according to K-5400. The results of the cross-cut test are shown in Table 2 in which even one of 100 crosshatches is peeled, the substrate adhesion is poor, and when no crosshatch is peeled, the substrate adhesion is good. The cured coating films obtained in Examples 1 to 6 and Comparative Examples 1 to 3 were tested for the presence of surface tack, and Table 2 shows the evaluation results.
[発明の効果] 本発明は下記の効果を有するものである。 [Effects of the Invention] The present invention has the following effects.
1. 本発明の硬化方法によれば、耐候性能に優れた硬化
塗膜を得ることができる。1. According to the curing method of the present invention, a cured coating film having excellent weather resistance can be obtained.
2. 本発明の硬化方法によれば、基板への密着性能に優
れた硬化塗膜を得ることができる。2. According to the curing method of the present invention, it is possible to obtain a cured coating film having excellent adhesion performance to a substrate.
3. 本発明の硬化方法によれば、優れた硬化速度を実現
することができる。3. According to the curing method of the present invention, an excellent curing rate can be realized.
4. 本発明の硬化方法によれば、活性エネルギー線照射
時に発生する余剰の熱エネルギーを利用することができ
エネルギーコストを低減することができる。4. According to the curing method of the present invention, surplus thermal energy generated at the time of irradiation with active energy rays can be used and energy cost can be reduced.
5. 本発明の硬化方法は光フアイバーのコーテイング材
の硬化、磁気記録媒体の磁気記録層の硬化などに好適に
用いることができる。5. The curing method of the present invention can be suitably used for curing a coating material for an optical fiber, curing a magnetic recording layer of a magnetic recording medium, and the like.
フロントページの続き (72)発明者 松村 喜雄 東京都中央区築地2丁目11番24号 日本 合成ゴム株式会社内 (72)発明者 ロバート イー.アンセル アメリカ合衆国イリノイ州ホフマン イ ーステイツ,カルドウエル レーン 1440 (56)参考文献 特開 昭51−66323(JP,A)Front page continuation (72) Inventor Yoshio Matsumura 2-11-24 Tsukiji, Chuo-ku, Tokyo Japan Synthetic Rubber Co., Ltd. (72) Inventor Robert E. Ansel United States Illinois, Hoffman, Ill., Caldwell Lane, 1440 (56) References JP-A-51-66323 (JP, A)
Claims (1)
ることにより硬化する際に、硬化物のガラス転移温度が
40〜200℃の範囲内にある硬化性化合物の同温度より10
℃低い温度から同温度より10℃高い温度の範囲内に該硬
化性化合物を保持することを特徴とする硬化性化合物の
硬化方法。1. When curing a curable compound by irradiating it with an active energy ray, the glass transition temperature of the cured product is
10 from the same temperature of the curable compound in the range of 40 ~ 200 ℃
A method for curing a curable compound, which comprises holding the curable compound within a range of a temperature lower by 10 ° C to a temperature higher by 10 ° C than the same temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62200135A JP2541997B2 (en) | 1987-08-12 | 1987-08-12 | Curing method with active energy rays |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62200135A JP2541997B2 (en) | 1987-08-12 | 1987-08-12 | Curing method with active energy rays |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6451403A JPS6451403A (en) | 1989-02-27 |
| JP2541997B2 true JP2541997B2 (en) | 1996-10-09 |
Family
ID=16419378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62200135A Expired - Fee Related JP2541997B2 (en) | 1987-08-12 | 1987-08-12 | Curing method with active energy rays |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2541997B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2646181B2 (en) * | 1993-04-22 | 1997-08-25 | 株式会社エフアイテイ | Feeding machine |
| US7776937B2 (en) * | 2004-08-19 | 2010-08-17 | Kansai Paint Co., Ltd. | Photocurable composition for forming an anti-fogging coating |
| JP5146624B2 (en) | 2011-01-20 | 2013-02-20 | 株式会社湯山製作所 | Drug supply device and drug counting device using the drug supply device |
| WO2013118838A1 (en) | 2012-02-10 | 2013-08-15 | 株式会社湯山製作所 | Medication cassette |
| US10099806B2 (en) | 2013-09-18 | 2018-10-16 | Yuyama Mfg. Co., Ltd. | Drug cassette and drug packaging device |
| CN106535859B (en) | 2014-07-23 | 2019-06-14 | 株式会社汤山制作所 | kit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823420B2 (en) * | 1974-12-05 | 1983-05-14 | 東レ株式会社 | Housiyasenkoukaseifuntaiyoyososeibutsu |
-
1987
- 1987-08-12 JP JP62200135A patent/JP2541997B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6451403A (en) | 1989-02-27 |
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