JP2547565B2 - Manufacturing method of hybrid integrated circuit - Google Patents

Description

The present invention relates to a method for manufacturing a hybrid integrated circuit.

(B) Prior Art The formation of a hybrid integrated circuit on a metal substrate such as aluminum has already been proposed in Japanese Patent Publication No. 46-13234. In such a technique, a thin insulating film of aluminum oxide is formed on the surface of an aluminum substrate by anodic oxidation, and a conductive path and a resistor are formed on the insulating film to fix circuit elements such as transistors and integrated circuits on the conductive path. To provide a hybrid integrated circuit.

When used as a hybrid LSI, a microcomputer chip or an LSI chip such as a ROM or a microprocessor may be fixed and used as a large-capacity hybrid integrated circuit. In such a case, the RO with the prescribed data written
A mask ROM is usually used for M. However, since the mask ROM forms the program code that is the data by the mask, the manufacturing period becomes long, or the mask cost is expensive. EPROM or writable PROM is used.

(C) Problems to be Solved by the Invention However, since the EPROM or PROM is packaged with a conventional resin and overlaps with the thick film IC package, there is a limitation in miniaturization. In addition, since the external terminals of the packaged elements such as EPROM are derived, there is a problem that the program data can be easily decoded from the terminals and the confidentiality cannot be maintained at the prototype stage.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and as shown in FIG. 1A, a conductive path having a desired shape is formed on the hybrid integrated circuit board (1). (3) is formed, and as shown in FIG. 1B, desired data is written in advance to the programmable semiconductor element (4) or the semiconductor element (5) having a programmable area by the ROR writer (10). 1 Figure C
As shown in FIG. 3, a programmable semiconductor element (4) or a semiconductor element (5) having a programmable region is fixed on the conductive path (3), and its connection is made on another conductive element (3). Simultaneously with the wire (8) connection of the semiconductor element (12), the programmable semiconductor element (4) or the semiconductor element (5) having a programmable region is bonded to the resin (6) as shown in FIG. 1D. Seal and solve.

(E) Operation As described above, according to the present invention, the programmable semiconductor element (4) or the semiconductor element (5) having the programmable region is mixed in a bare chip (bare chip) state. The semiconductor element (4) is fixed to the conductive path (3) on the integrated circuit board (1) and is connected to the conductive path (3) at the time of wire connection of another semiconductor element (12) provided on the conductive path (3).
By encapsulating (5) with resin (6), the external terminals are not led out from the programmable or region-containing semiconductor elements (4) and (5), so that the program code (data) cannot be read easily. is there.

(F) Embodiments The present invention will be described below based on the embodiments shown in FIGS. 1A to 1E.

First, as shown in FIG. 1A, a hybrid integrated circuit board (1)
A conductive path (3) having a desired shape is formed thereon. Ceramic or metal is used for the hybrid integrated circuit substrate (1), and in this embodiment, a metal substrate of aluminum having excellent heat dissipation and mechanical strength is used. An aluminum oxide film is formed on the surface of the aluminum substrate by anodic oxidation so as to have an insulating property. An insulating resin film (2) is formed on one surface of the aluminum oxide film with a resin such as epoxy or polyimide. A copper foil is attached on the insulating resin film (2), and the copper foil is etched into a desired pattern to form a conductive path (3) having a desired shape.

A programmable semiconductor element (4), for example an EPROM or a semiconductor element (5), for example a microcomputer, having a programmable region fixed on the conductive path (3) is
As shown in Fig. B, the ROM writer (1
By 0), a predetermined program code or predetermined information corresponding to each user is written. At this time, a semiconductor device (4) which is programmable or has a region
(5) is written in the wafer state or after being separated individually. Here, they are separated and placed on the stage (11), and the needle (9) of the ROM writer (10) is brought into contact with the pad of the semiconductor element (4) to write data.

After writing the data, as shown in FIG. 1C, the semiconductor elements (4) and (5) which are programmable or have regions are fixed on the conductive paths (3). Furthermore, a semiconductor element (4) having a programmable or region on the conductive path (3)
Semiconductor elements such as transistors, chip resistors, and chip capacitors that interface external devices with (5) (1
2) is stuck. Semiconductor device (4) having programmable or regions fixed on conductive paths (3)
The connection of (5) is made at the same time when the wire (8) of another semiconductor element (12) provided on the conductive path (3) is connected (ultrasonic bonding). Further, a plurality of external leads (13) for connecting to an external circuit are fixed to one peripheral edge of the substrate (1) on which the conductive paths (3) extend.

After fixing the external leads (13), as shown in FIG. 1D, a semiconductor element (4) having a programmable or region
After the resin (6) such as an epoxy resin or a silicon resin is applied on (5) to seal the semiconductor elements (4) and (5), as shown in FIG. 1E, the semiconductor elements (4) and (5) (1
In order to seal 2), a box-shaped case material (7) is fixed to the substrate (1), and a fixed portion of the external lead (13) is reinforced with a resin (14) to be integrated.

(G) Effects of the Invention As described in detail above, according to the present invention, a semiconductor element having a programmable or programmable area such as an EPROM or a microcomputer is directly formed on a hybrid integrated circuit substrate in a bare chip state. By fixing and connecting it at the same time as connecting other semiconductor elements, the conventional manufacturing process can be used as it is, and written program data cannot be easily decoded. An integrated circuit can be provided.

[Brief description of drawings]

1A to 1E are sectional views showing an embodiment of the present invention. (1) is a hybrid integrated circuit board, (2) is an insulating resin film,
(3) is a conductive path, (4), (5) and (12) are semiconductor elements,
(6) is a resin, (7) is a case.

Claims (1)

(57) [Claims] 1. A programmable bare-chip type semiconductor element having a desired shape of a conductive path formed on an insulated metal substrate and having desired data written therein, or a bare-chip type semiconductor element having a programmable area is provided. After the fixing, the programmable semiconductor element or the semiconductor element having a programmable region is connected to the conductive path at the time of wire connection of another semiconductor element that interfaces with an external device provided on the conductive path, and A hybrid integrated device characterized in that a resin is applied onto a programmable semiconductor element or a semiconductor element having a programmable region, the case material is fixed to a substrate, and the applied resin is removed and sealed in a hollow state. Circuit manufacturing method.