JP2552675B2 - Plating equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a plating apparatus for continuously performing stripe plating of a desired width on a lower edge of a strip-shaped material such as a strip material for electronic parts.

(Prior Art and Problems Thereof) In the conventional plating apparatus (A) as described above, for example, as shown in FIG. 6, the left and right side walls (1c) of the plating treatment tank (6) containing the plating solution (9). ), The cut groove (8) is opened in a facing manner, and the supply port (11) is opened at a desired position on the tank wall, and the other end of the supply port (11) is connected to the plating tank and One end of a liquid raising pipe (16) provided with a pump (19) for feeding the plating liquid in the tank into the tank (6) was connected to the portion.

In this plating apparatus (A), the strip-shaped material (B) on which the cathode is applied is run in a standing manner across the cut grooves (8).
The liquid level (12) in the tank (6) is positioned higher than the lower edge of the strip (B) so that the plating phase is deposited on the lower edge and the plating liquid is discharged from the lower end of the kerf (8). Supply port (1
1) Adjust the amount of plating liquid supplied from
Hold 2) at a constant height or adjust it to any height,
As shown in FIG. 7, the strip material (B) is subjected to stripe plating (B ') having a desired width.

By the way, in the above prior art, the supply port (1
The supply port (11) is opened in the bottom wall (1d) of the plating tank (6) to prevent the liquid surface (12) from wavy by the plating liquid supplied from 1). Since the plating liquid sent out by the pump (19) directly flows into the plating layer (6), it is difficult to prevent the liquid surface (12) from waviness, and the stripe plating ( B ')
Could not always be kept within a certain range, which could reduce the reliability of the product.

In addition, if the plating width of the stripe plating (B ') is changed by changing the height of the liquid surface (12),
By increasing or decreasing the liquid feed rate from the pump (19), the liquid level (1
Since the height was adjusted in 2), it was difficult to finely adjust it, and thus it was difficult to finely adjust the plating width of the try plating (B ').

(Technical Problem of the Invention) The technical problem of the present invention for solving the above problems is as follows.
When supplying the plating solution into the plating tank, the plating solution sent from the plating tank is indirectly flown into the plating tank, and the height of the liquid surface in the plating tank is controlled by the liquid pressure of the plating solution. It is to adjust.

(Technical Means for Achieving the Technical Problem) The technical means of the present invention for achieving the above technical problem is to provide cut grooves on the left and right side walls to face each other and supply the plating solution to the bottom wall. A liquid level adjusting tank is arranged in parallel adjacent to the plating tank having an opening, and a liquid outlet and a liquid inlet are provided on the bottom wall of the adjusting tank, and the liquid outlet and the supply port are connected by a communication pipe. Then, the liquid inlet for connecting the plating liquid in the plating tank is connected to the liquid inlet, and the drain pipe rising from the bottom wall of the bath is arranged in the liquid level adjusting tank, and the upper end opening of the drain pipe is provided. Is that it is positioned near the surface of the plating solution stored in the bath and is provided slidably in the height direction, and the strip-shaped material on which the cathode is applied is run across the cut grooves.

(Operation) According to the above means, according to the present invention, the plating solution is communicated with the liquid level adjusting tank by the communicating pipe, and the plating solution is sent from the plating tank and supplied to the liquid level adjusting tank through the liquid inlet. Is sent to the lower part of the plating treatment tank by the liquid pressure, and the liquid levels of the plating liquid in the plating treatment tank and in the liquid level adjusting tank are always kept at the same height, and are stored in the plating treatment tank. When the level of the plating solution is positioned above the kerf and discharged from the kerf, the same amount of plating solution is sent out from the plating tank, and the lower edge of the strip running across the kerf is the level of the processing tank. Then, the lower edge is continuously subjected to stripe plating.

Further, the liquid level of the plating solution in the plating tank and the liquid surface tank is roughly set by adjusting the amount of plating solution supplied from the plating tank as described above. If the upper end opening of the pipe is positioned higher than the liquid level of the plating liquid stored in the liquid level adjusting tank, and if the upper end opening is lowered from the liquid level of the plating liquid in the liquid level adjusting tank after the rough setting is made, plating The liquid is discharged to the outside of the liquid level adjusting tank through the drain pipe so that the liquid level becomes the same height as the upper end opening.
Therefore, by finely adjusting the upper end opening position, it is possible to finely adjust the liquid level height in the liquid level adjusting tank and the plating processing tank.

(Effects) The present invention having the above-described configurations has the following effects.

The plating liquid sent from the plating tank is supplied to the lower part of the plating treatment tank by the liquid pressure through the liquid level adjusting tank, so that the ripple of the liquid surface due to the liquid supply can be prevented. It is possible to improve the reliability of the product by keeping the plating width of the striped plating constantly constant.

By adjusting the upper end opening of the drainage pipe to an arbitrary height, the liquid level in the liquid level adjusting tank can be finely adjusted, and the liquid level in each of the plating tank and the liquid level adjusting tank is a communicating pipe. Since it is always held at the same height, the liquid level in the plating tank can be finely adjusted to an arbitrary height, and thus the plating width of stripe plating applied to the strip-shaped material can be finely adjusted.

The plating liquid sent from the plating tank is sent to the plating treatment tank via the liquid level adjustment tank, so the liquid is sufficiently agitated during its flow, increasing the plating speed of the strip-shaped material in the plating treatment tank. be able to.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.

In the figure, (1) is the plating layer, (2) is the liquid level adjustment tank,
(3) is a mount, (4) is a plating tank, and (B) is a strip-shaped material.

The plating layer (1) is a horizontally long box body whose five faces other than the top face are covered by a front wall (1a), a back wall (1b), left and right side walls (1c), and a bottom wall (1d), and a pedestal (3). ) Is mounted and fixed on the side wall (1c), and a longitudinally elongated notch (5) is formed in the substantially central portion of the left and right side walls (1c) so as to face each other. ) Is designed to run vertically.

Further, the plating layer (1) is divided into three parts in the tank by the left and right partition walls (1e) standing upright between the front wall (1a) and the back wall (1b), and the left and right partition walls ( A plating tank (6) is formed between 1e) and a partition wall (1e) and a side wall (1d)
A recovery tank (7) is formed between the and.

The strip-shaped material (B) is a thin metal strip for electronic parts such as transistors, ICs, diodes, connectors, contact materials, etc., and the plating layer (1) passes through the notch (5) while the cathode is applied. It is running upright inside.

The partition wall (1e) is a flat plate whose lower end is in contact with the bottom wall (1d) and both side ends are in contact with the front wall (1a) and the back wall (1b). The lower half part is fixed in the tank. (1e ′) and groove pieces (1e ″) on both ends
The upper half (1e ') is fitted to the lower half (1e') and is supported on the upper edge of the upper half (1e) so that the upper half (1e) can be freely removed.
), The upper edge thereof is located higher than the lower edge of the band-shaped material (B), and a kerf (8) through which the lower edge of the band-shaped material (B) passes is opened in the central portion of the upper edge.

The plating treatment tank (6) contains the strip-shaped material (B) inside the tank.
In a plating process tank in which the plating solution (9) reaching the upper level from the lower edge is stored, and the anode (10) is immersed in the plating solution (9) to perform stripe plating (B ') on the lower edge of the strip-shaped material (B), The bottom wall (1d) is formed with a plurality of supply ports (11) to discharge the plating solution (9) from the cut groove (8) and reinforce the plating solution (9) from the supply port (11). Then the liquid level in the tank (12)
Is maintained at a constant height, and the plating solution in the bath is circulated.

In addition, this processing tank (6) supports a punching board (13) having a large number of through holes (13a) opened at a desired interval from the bottom wall (1d) in a laid state, and supplies the supply port. The plating liquid (9) flowing in from (11) is dispersed by the through small holes (13a) so that the liquid surface (12) does not become wavy.

The anode (10) has an anode back (10b) containing a metal block (10a) to be plated, and an anode bar (10c) for suspending and supporting the anode back (10b).
It consists of

The anode bag (10b) is a horizontally elongated cage formed by a wire mesh and having an opening on the upper surface. The anode bag (10d) is supported by the anode bar (10c) and runs in the treatment layer (6). They are arranged along both sides of (B).

The anode bar (10c) is a rod made of metal, and both ends thereof are supported by support plates (14) arranged above the front wall (1a) or the back wall (1b).

An anode is applied to the anode bar (10c) so that the metal block (10a) in the anode bag (10b) releases metal ions (not shown).

The recovery tank (7) has a recovery port (7a) opened on the bottom wall (1d), and the recovery port (7a) has the other end provided with one end of a recovery pipe (7b) arranged in the plating tank (4). Connecting, the kerf (8)
The discharged plating solution (9) is returned to the plating tank (4).

The liquid level adjusting tank (2) is a horizontally long box with an open top surface.
A plurality of liquid outlets (15) are opened in the bottom wall (2d), a liquid raising pipe (16) and a drain pipe (17) are arranged, and the plating liquid in the treatment bath (6) is placed in the bath. The plating liquid (9 ') is stored up to the same height as the liquid surface (12), is placed in parallel with the processing tank (6), and is mounted and fixed on the mount (3).

The liquid outlets (15) are opened in parallel so as to correspond to the supply ports (11), and are connected to the supply ports (11) by communication pipes (18).

The communication pipe (18) is in the shape of a front sill with both ends of the horizontal pipe bent upward, one end of which is connected to the supply port (11) and the other end of which is connected to the liquid outlet (15). The liquid level (12) of the plating liquid (9) (9 ') stored in the treatment tank (6) and the liquid level adjusting tank (2) by connecting the tank (6) and the liquid level adjusting tank (2). ) (12 ') is always kept at the same height.

The liquid riser pipe (16) is a rising pipe whose upper end projects slightly from the bottom wall (2d) toward the inside of the tank, and the lower end is arranged in the plating tank (4), and the upper end opening is closed by the plug (16a). In addition, a pump (19) is arranged in the middle.

Further, the liquid inlet (20) is provided on the upper peripheral wall of the liquid pipe (16).
Are perforated.

The liquid inlet (20) is a supply port for feeding the plating liquid in the plating tank (4) fed by the pump (19) into the liquid level adjusting tank (2), and the side wall (2c) of the adjusting tank (2). The liquid surface (12 ') of the adjusting tank (2) is not ruffled by the plating solution sent out.

The drainage pipe (17) penetrates the bottom wall (2d) of the liquid level adjusting tank (2) so that the upper part rises into the adjusting tank (2) and the lower side is below the liquid level adjusting tank (2). A rising pipe (17a) whose lower end is disposed in the plating tank (4) and which is slidably fitted to the upper end of the rising pipe (17a) and has its upper end opening (17c). Sliding pipe (17) to be positioned near the liquid surface (12 ') of the plating liquid stored in the surface adjustment tank (2)
b) consists of

The sliding pipe (17b) has its upper end opening (17c) at the liquid surface (12 ').
A short tube that opens in parallel with the height adjustment mechanism (21) provided at the edge of the opening (17c).

The height adjusting mechanism (21) has a erected frame (21a) having a front gate shape and fixed in an upright shape at the upper edge of the upper end opening (17c).
The height adjustment bolt (21b) is fixed to the upper edge of the standing frame (21a) with its lower end fixed, and the height adjustment bolt (21c) fixed on the liquid level adjusting tank (2). It consists of a height adjustment nut (21d) that is screwed onto the upper end of the bolt (21b).

In addition, this height adjustment mechanism (21)
By rotating d) and screwing the height adjustment bolt (21b) in the vertical direction, the sliding pipe (17b) slides in the vertical direction via the standing frame (21a), and the upper end opening (17c ) Height adjustment.

As a result, the height of the upper end opening (17c) of the drainage pipe (17) can be arbitrarily adjusted by sliding the sliding pipe (17b) by the operation of the height adjusting mechanism (21). Fine adjustment of the height of the liquid surface (12 ') by sliding the upper end opening (17c) located above the liquid surface (12') of the plating liquid stored in the adjusting tank (2) downward. It can be performed.

The plating apparatus (A) having the above-described structure includes a plating treatment tank (6) for discharging the plating liquid (9) from the cut groove (8) and a liquid level adjusting tank (2) to which the plating liquid is supplied by the pump (19). ) Is connected by a communication pipe (18), the plating liquid (9 ') in the liquid level adjusting tank (2) is sent to the plating treatment tank (6) by its liquid pressure and each tank (2) The liquid levels (12 ') and (12) in (6) are maintained at the same height. And
By adjusting the feed amount of the pump (19), the supply amount is made the same as the discharge amount, and the liquid level (12) of the plating treatment tank (6)
Is always controlled to a constant height.

On the other hand, the lower edge of the belt-shaped material (B) that runs while passing through the notch (5) and the notch (8) while immersing the lower edge into the liquid surface (12) of the plating tank (6) always has a constant width. Stripe plating (B ') is applied.

Further, the heights of the liquid surfaces (12) and (12 ') in the plating treatment tank (6) and the liquid surface treatment tank (2) should be adjusted by adjusting the plating liquid supply amount from the plating tank (4) as described above. , And the upper end opening (17c) of the drainage pipe (17) is set higher than the liquid level (12 ') of the plating liquid (9') stored in the liquid level adjusting tank (2). , And after the rough setting is made, lowering the upper end opening (17c) from the liquid level (12 ') of the plating liquid in the liquid level adjusting tank (2),
The plating liquid (9 ') is discharged through the sliding pipe (17b) and the drain pipe (17), and the liquid level (12') becomes the same height as the upper end opening (17c). Therefore, by finely adjusting the position of the upper end opening (17c), the heights of the liquid levels (12) and (12 ') in the liquid level adjusting tank (2) and the plating treatment tank (6) can be finely adjusted. .

In this embodiment, the upper half (1e) of the partition wall (1e)
A plurality of strips, and the height of each upper half (1e) or the depth of the kerf (8) is formed to have an arbitrary different dimension, and the dimension of the strip (B) and the stripe plating (B) to be obtained. By exchanging according to the plating width of ′), various strip materials (B) and plating width can be supported.

In the figure, (22) is a lid that closes the plating layer (1) or the upper surface of the liquid level adjusting tank (2), and (23) is the respective tank (1).
(2) An exhaust port for exhausting the inside.

[Brief description of drawings]

The drawing shows one embodiment of the present invention, FIG. 1 is a plan view of a plating apparatus, and a part thereof is cut away, and FIG. 2 is (2)-of FIG.
(2) Cross-sectional view, FIG. 3 is a cross-sectional view taken along line (3)-(3) of FIG. 2, FIG. 4 is a cross-sectional view taken along line (4)-(4) of FIG. 2, and FIG. FIG. 6 is a drawing, FIG. 6 shows a conventional plating apparatus, and FIG. 7 is an enlarged vertical sectional view of a strip-shaped material subjected to stripe plating. In the figure, plating tank (6), supply port (11) kerf (8), strip material (B) liquid level adjusting tank (2), drain pipe ... (17) Liquid outlet …… (15), top opening …… (17c) Liquid inlet …… (20), communication pipe …… (18) Liquid rise pipe …… (16), plating tank …… (4)

Claims (1)

(57) [Claims] 1. A liquid level adjusting tank is provided side by side adjacent to a plating treatment tank in which cut grooves are provided on the left and right side walls so as to face each other and a supply port for the plating solution is opened on the bottom wall. A liquid outlet and a liquid inlet are provided on the bottom wall, the liquid outlet and the supply port are connected by a communication pipe, and the liquid inlet is connected to a liquid raising pipe for sending out the plating liquid in the plating tank, while the liquid level is adjusted. A drainage pipe rising from the bottom wall of the bath is arranged in the bath, and the upper end opening of the liquid delivery pipe is located near the surface of the plating solution stored in the bath and slidable in the height direction. Further, a stripping device is characterized in that a strip-shaped material on which a cathode is applied is run across the cut grooves.