JP2553802B2 - Sealing method for carrier tape for packaging electronic parts - Google Patents
Sealing method for carrier tape for packaging electronic partsInfo
- Publication number
- JP2553802B2 JP2553802B2 JP14919792A JP14919792A JP2553802B2 JP 2553802 B2 JP2553802 B2 JP 2553802B2 JP 14919792 A JP14919792 A JP 14919792A JP 14919792 A JP14919792 A JP 14919792A JP 2553802 B2 JP2553802 B2 JP 2553802B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- sealing
- type electronic
- carrier tape
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 17
- 238000004806 packaging method and process Methods 0.000 title claims 2
- 238000009751 slip forming Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000009191 jumping Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
Landscapes
- Closing Of Containers (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、チップ型電子部品の保
管、輸送、装着に際しチップ型電子部品を汚染から保護
し電子回路基板に実装するために整列させ、取り出させ
る機能を有する包装体のうち収納ポケットを形成したプ
ラスチック製キャリアテープのシール方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having a function of aligning and taking out the chip type electronic parts for the purpose of protecting the chip type electronic parts from contamination and mounting them on an electronic circuit board during storage, transportation and mounting of the chip type electronic parts. The present invention relates to a method for sealing a plastic carrier tape having a storage pocket formed therein.
【０００２】[0002]
【従来の技術】近年，ＩＣを始めとして、トランジスタ
ー、ダイオード、コンデンサー、圧電素子レジスターな
どの表面実装用チップ型電子部品は電子部品の形状に合
わせて、収納しうるエンボス成形されたポケットを連続
的に形成したプラスチック製キャリアテープとキャリア
テープにシール可能なカバーテープからなる包装体に包
装されて供給されている。内容物の電子部品はキャリア
テープ内に収納された状態で輸送、保管の後、包装体の
カバーテープを剥離した後、自動的に取り出され電子回
路基板に表面実装されている。この表面実装技術の発達
に伴い、チップ化される電子部品は次第に機構部品から
ＩＣ，ＬＳＩといった高集積化部品に広がっている。こ
れらの高集積化部品は電子回路を保護している封止樹脂
が大気中の湿度を吸収しハンダ実装時のクラックを引き
起こし大きな問題となるため、防湿素材のキャリアテー
プによる包装材が考えられているがキャリアテープシー
ル方法はチップ電子部品を収納する収納ポケットの連設
する方向の両側面のシールであってチップ型電子部品を
収納するポケットの密封性が悪い欠点があり、より気密
性の高い防湿キャリアテープのシール方法が切望されて
いる。従来のシール方法は、図３に示したようにチップ
型電子部品を収納する収納ポケット３、リブ４及びスプ
ロケット２を有するキャリアテープ１とカバーテープ６
とを図４に示したようなヒーターブロック７にて該収納
ポケット両側を直線状に連続的にシールされており、該
収納ポケットは気密性が保たれていないかった。そのた
めに、チップ型電子部品を実装機へ取り出す工程が途中
で停止された場合に収納ポケットに納められたチップ型
電子部品が吸湿を起こしハンダ実装時のクラックを引き
起こし問題とされ、これを解決する手段が切望されてい
る。2. Description of the Related Art In recent years, chip-type electronic parts for surface mounting such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, etc. have continuous embossed pockets which can be accommodated according to the shape of the electronic parts. It is packaged and supplied in a package body made of a plastic carrier tape formed in 1 above and a cover tape sealable to the carrier tape. The electronic components of the contents are transported and stored in a state of being housed in a carrier tape, and after peeling off the cover tape of the package, they are automatically taken out and surface-mounted on the electronic circuit board. With the development of this surface mounting technology, electronic parts to be made into chips are gradually spreading from mechanical parts to highly integrated parts such as IC and LSI. For these highly integrated components, the encapsulating resin that protects electronic circuits absorbs humidity in the atmosphere and causes cracks during solder mounting, which poses a major problem.Therefore, packaging materials using moisture-proof carrier tape have been considered. However, the carrier tape sealing method has the disadvantage that the pockets for storing chip-type electronic components have poor sealing performance because they are seals on both sides in the direction in which the storage pockets for storing chip electronic components are arranged in a row. A method of sealing a moisture-proof carrier tape has been earnestly desired. As shown in FIG. 3, the conventional sealing method includes a carrier tape 1 and a cover tape 6 having a storage pocket 3 for storing a chip-type electronic component, a rib 4 and a sprocket 2.
Both sides of the storage pocket are continuously sealed linearly by a heater block 7 as shown in FIG. 4, and the storage pocket is not kept airtight. Therefore, when the process of taking out the chip type electronic component to the mounting machine is stopped midway, the chip type electronic component stored in the storage pocket absorbs moisture and causes a crack at the time of solder mounting, which is a problem, and it is solved The means are coveted.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、チップ型電
子部品のはんだ実装による封止樹脂のクラックを防ぐた
めの防湿キャリアテープを得んとしてなされたものであ
り、チップ型電子部品を収納する収納ポケット個々の気
密性を高めチップ型電子部品の実装時のカバーテープ剥
離においてチップ型電子部品のジャンピング防止が可能
なキャリアテープのシール方法を提供するにある。SUMMARY OF THE INVENTION The present invention has been made to obtain a moisture-proof carrier tape for preventing cracks in a sealing resin due to solder mounting of a chip-type electronic component, and accommodates the chip-type electronic component. It is another object of the present invention to provide a method of sealing a carrier tape capable of increasing the airtightness of each storage pocket and preventing jumping of the chip-type electronic component when the cover tape is peeled off when the chip-type electronic component is mounted.
【０００４】[0004]
【課題を解決するための手段】本発明は、チップ型電子
部品を収納する収納ポケットを連続に形成したプラスチ
ック製エンボステープであって、製品の輸送、保管工程
中にポケットに納められた、チップ型電子部品が吸湿す
ることを抑え実装機へチップ型電子部品を取り出し時に
チップ型電子部品がジャンピングしないカバーテープの
剥離方法について種々鋭意に研究を重ねた結果、連続に
形成された個々の収納ポケットをシールで囲み収納ポケ
ット間のリブにおいてシールを交差させることに手段を
見いだし完成させたものである。即ち本発明は、チップ
型電子部品を収納する収納ポケットを連続に形成したプ
ラスチック製エンボステープと、そのカバーテープをシ
ールするシール方法であって、該収納ポケット間のリブ
の部分をＸ状にシールして、個々の収納ポケットのシー
ル形状が六角状になるようにシールし、収納ポケットを
完全に密封することを特徴とするチップ型電子部品包装
用キャリアテープのシール方法である。DISCLOSURE OF THE INVENTION The present invention is a plastic embossed tape in which storage pockets for storing chip-type electronic parts are continuously formed, and the chips are stored in the pockets during the transportation and storage processes of products. Suppressing moisture absorption of the die-type electronic parts to prevent the chip-type electronic parts from jumping when the chip-type electronic parts are taken out from the mounting machine. It was completed by finding means for surrounding the seal with a seal and crossing the seal at the rib between the storage pockets. That is, the present invention is a sealing method for sealing a plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed and a cover tape for the same, wherein a rib portion between the storage pockets is sealed in an X shape. Then, each of the storage pockets is sealed so that the sealing shape is hexagonal, and the storage pockets are completely sealed.
【０００５】[0005]
【実施例】本発明の包装体を図面によって詳しく説明す
ると、図１はチップ型電子部品を収納した収納ポケット
３、リブ４及びスプロケット２を有するキャリアテープ
１とカバーテープ６とをシールした包装体の斜視図であ
って、一部カバーテープ６を剥離して状態図である。シ
ール方法としては図２に示したようなヒーターブロック
７にてシールする方法であって、収納ポケット３の個々
のリブ４の長さを収納ポケット３が連設する長手方向の
収納ポケットの長さの１／２〜１／３としたキャリアテ
ープを使用し、リブの部分のシール形状を該リブ４の中
心を交点とするＸ状とし、ヒーターブロック７のシール
先端形状が六角状のものを使用し、個々の収納ポケット
３のシール形状を六角状に間欠的にシールして連続的に
収納ポケットをシールしていく。従って個々の収納ポケ
ットは完全に密封され、個々の収納ポケット３はシール
後は連続的なシール跡が残りシールが途絶えることがな
くシールすることができる。ヒーターブロック７の先端
形状（ヒーターコテ）を六角状としたものを一個又は複
数個有し、一個又は複数個の収納ポケット３を間欠的に
シールし、収納ポケットのリブ４間はでシールがＸ状に
交差するようにシールしていくことが必要である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The package of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a package in which a carrier tape 1 having a storage pocket 3 for storing chip-type electronic components, ribs 4 and a sprocket 2 and a cover tape 6 are sealed. FIG. 6 is a perspective view of the first embodiment with a part of the cover tape 6 peeled off. The sealing method is a method of sealing with the heater block 7 as shown in FIG. 2, and the length of each rib 4 of the storage pocket 3 is the length of the storage pocket in the longitudinal direction in which the storage pockets 3 are arranged in series. 1/2 to 1/3 of the carrier tape is used, and the seal shape of the rib portion is X-shaped with the center of the rib 4 as an intersection, and the heater block 7 has a hexagonal seal tip shape. Then, the sealing shape of each storage pocket 3 is intermittently sealed in a hexagonal shape to continuously seal the storage pockets. Therefore, the individual storage pockets are completely sealed, and the individual storage pockets 3 can be sealed without leaving a continuous seal mark after the sealing. The heater block 7 has one or a plurality of hexagonal tips (heater irons), and intermittently seals one or a plurality of storage pockets 3, and seals are formed between the ribs 4 of the storage pockets. It is necessary to seal them so that they cross each other.
【０００６】[0006]
【発明の効果】本発明に従うと、チップ型電子部品を実
装機へ取り出す工程を途中で停止してもキャリアテープ
に残されたチップ型電子部品の吸湿を防止し、チップ型
電子部品を取り出す際のチップ電子部品のジャンピング
が防止され、安定した実装機へのチップ電子部品取り出
しが可能となり、チップ型電子部品のはんだ実装による
封止樹脂のクラックを防止することができるようになっ
た。According to the present invention, even when the process of taking out a chip-type electronic component to a mounting machine is stopped midway, moisture absorption of the chip-type electronic component left on the carrier tape is prevented and the chip-type electronic component is taken out. The jumping of the chip electronic component is prevented, the chip electronic component can be stably taken out to the mounting machine, and the crack of the sealing resin due to the solder mounting of the chip type electronic component can be prevented.
【図１】本発明によるシール方法を示す斜視図FIG. 1 is a perspective view showing a sealing method according to the present invention.
【図２】本発明のシール方法に使用するシールコテの一
例を示す斜視図FIG. 2 is a perspective view showing an example of a seal iron used in the sealing method of the present invention.
【図３】従来のシール方法の一例を示す斜視図FIG. 3 is a perspective view showing an example of a conventional sealing method.
Claims (1)
トを連続に形成したプラスチック製エンボステープと、
そのカバーテープをシールするシール方法であって、該
収納ポケット間のリブ部をＸ状にシールして、個々の収
納ポケットのシール形状が六角状になるようにシール
し、収納ポケットを完全に密封することを特徴とするチ
ップ型電子部品包装用キャリアテープのシール方法。1. A plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed,
A sealing method for sealing the cover tape, wherein the rib portion between the storage pockets is sealed in an X shape so that the sealing shape of each storage pocket is hexagonal, and the storage pockets are completely sealed. A method of sealing a carrier tape for packaging a chip-type electronic component, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14919792A JP2553802B2 (en) | 1992-06-09 | 1992-06-09 | Sealing method for carrier tape for packaging electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14919792A JP2553802B2 (en) | 1992-06-09 | 1992-06-09 | Sealing method for carrier tape for packaging electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05338617A JPH05338617A (en) | 1993-12-21 |
| JP2553802B2 true JP2553802B2 (en) | 1996-11-13 |
Family
ID=15469948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14919792A Expired - Lifetime JP2553802B2 (en) | 1992-06-09 | 1992-06-09 | Sealing method for carrier tape for packaging electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2553802B2 (en) |
-
1992
- 1992-06-09 JP JP14919792A patent/JP2553802B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05338617A (en) | 1993-12-21 |
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