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JP2553870B2 - Manufacturing method of taped electric wire with shield - Google Patents
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JP2553870B2 - Manufacturing method of taped electric wire with shield - Google Patents

Manufacturing method of taped electric wire with shield

Info

Publication number
JP2553870B2
JP2553870B2 JP62171688A JP17168887A JP2553870B2 JP 2553870 B2 JP2553870 B2 JP 2553870B2 JP 62171688 A JP62171688 A JP 62171688A JP 17168887 A JP17168887 A JP 17168887A JP 2553870 B2 JP2553870 B2 JP 2553870B2
Authority
JP
Japan
Prior art keywords
electric wire
shield
tape
shield layer
tape electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62171688A
Other languages
Japanese (ja)
Other versions
JPS6414813A (en
Inventor
耕作 中野
清一 西川
一男 谷平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP62171688A priority Critical patent/JP2553870B2/en
Publication of JPS6414813A publication Critical patent/JPS6414813A/en
Application granted granted Critical
Publication of JP2553870B2 publication Critical patent/JP2553870B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Communication Cables (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 計算機、プリンタ、オーディオ、VTR、測定器などの
各種電子、電気機器の内部配線に、第4図に例示するよ
うな、テープ電線16が使用されている。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] A tape electric wire 16 as illustrated in FIG. 4 is used for internal wiring of various electronic and electric devices such as computers, printers, audios, VTRs, and measuring instruments. Has been done.

これは、複数本の導体10(丸または平角)を、横1列
に、互いに平行に、等ピッチpの間隔で並べ、上下か
ら、接着層12付きの絶縁層14ではさみ、一体化したもの
である。
This is one in which a plurality of conductors 10 (round or rectangular) are arranged in a row in parallel with each other at an equal pitch p, and are sandwiched and integrated from above and below by an insulating layer 14 with an adhesive layer 12. Is.

第5図は、テープ電線16の使用状況の一例を示し、18
はコネクタ、20はプリント基板である。
FIG. 5 shows an example of the usage status of the tape electric wire 16,
Is a connector and 20 is a printed circuit board.

一方、EMI(電磁波障害)対策及び特性インピーダン
スの安定化等から、上記のテープ電線16にシールドを施
す必要がでている。
On the other hand, it is necessary to shield the tape electric wire 16 in order to prevent EMI (electromagnetic interference) and stabilize the characteristic impedance.

この発明は、上記のようなテープ電線16にシールドを
施した電線の製造方法に関するものである。
The present invention relates to a method of manufacturing an electric wire in which the above-described tape electric wire 16 is shielded.

[従来の技術] (1)第6図のように、テープ電線16の片面または両面
に、シールド層22を設ける。
[Prior Art] (1) As shown in FIG. 6, a shield layer 22 is provided on one side or both sides of the tape electric wire 16.

(2)第7図のように、テープ電線16をシールド層22で
くるむ。
(2) As shown in FIG. 7, the tape electric wire 16 is wrapped with the shield layer 22.

などの手法を講じている。I am taking such a method.

[発明が解決しようとする問題点] 上記の場合、シールド層22をドレンに落すために、た
とえば、第6図のように、新たに、ドレン線32をシール
ド層22に結線する必要があった。
[Problems to be Solved by the Invention] In the above case, in order to drop the shield layer 22 to the drain, it is necessary to newly connect the drain wire 32 to the shield layer 22 as shown in FIG. 6, for example. .

[問題点を解決するための手段] この発明は、特別にドレン線を接続する必要をなく
し、テープ電線16の導体10の1本(もし必要があれば、
それ以上の本数)10aをドレン用に使用できるようにし
たもので、第1a〜d図のように、 絶縁層14の少なくとも片側にシールド層22を設けた後、
導体10の少なくとも1本10aとシールド層22とを、超音
波融着することを特徴とするものである。
[Means for Solving the Problems] The present invention eliminates the need for specially connecting the drain wire, and one of the conductors 10 of the tape electric wire 16 (if necessary,
(More than that) 10a can be used for the drain, and after providing the shield layer 22 on at least one side of the insulating layer 14 as shown in FIGS. 1a to 1d,
At least one of the conductors 10a and the shield layer 22 are ultrasonically fused.

[その説明] 第1a図のように、上記のテープ電線16のたとえば片側
にシールド層22を設ける。
[Explanation] As shown in FIG. 1a, a shield layer 22 is provided, for example, on one side of the tape electric wire 16 described above.

それから、第1b図のように、公知の超音波融着機の口
金34により、ドレン用の導体10aとシールド層22とを、
適当間隔ごとに、超音波融着する(第1c図,第1d図)。
44は融着部分を示す。
Then, as shown in FIG. 1b, by the mouthpiece 34 of a known ultrasonic fusion machine, the conductor 10a for the drain and the shield layer 22,
Ultrasonic welding is performed at appropriate intervals (Figs. 1c and 1d).
Reference numeral 44 indicates a fused portion.

なお、超音波振動を加えることにより、導体10aとシ
ールド層22との間の絶縁層14は排除され、導体10aとシ
ールド層22とは電気的に接続する。
By applying ultrasonic vibration, the insulating layer 14 between the conductor 10a and the shield layer 22 is removed, and the conductor 10a and the shield layer 22 are electrically connected.

なお、融着部分44を上記のようにスポット的としない
で、口金34の形状を変える(回転可能な円板状にするな
ど)ことにより、導体の長手方向の全長にわたるように
してもよい。
Note that the fused portion 44 may not be spot-shaped as described above, but the shape of the mouthpiece 34 may be changed (such as a rotatable disc shape) so as to cover the entire length in the longitudinal direction of the conductor.

上記の第1a〜1d図は、従来の通常のテープ電線16をシ
ールド付きにした場合であるが、はじめからシールド付
きとする場合は、次のようにする。
The above-mentioned FIGS. 1a to 1d show the case where the conventional ordinary tape electric wire 16 is provided with a shield, but when it is provided with a shield from the beginning, the following is performed.

すなわち、第2a図のように、接着層12,絶縁層14,シー
ルド層22,絶縁層24からなる複合テープ30を用い、これ
を当間隔に並べた導体10の上下両側にはり付ける(第2b
図)。
That is, as shown in FIG. 2a, a composite tape 30 including an adhesive layer 12, an insulating layer 14, a shield layer 22, and an insulating layer 24 is used, and the composite tape 30 is attached to the upper and lower sides of the conductor 10 arranged at the same intervals (second b
Figure).

それから後は、上記同様にドレン用の導体10aとシー
ルド層22間を、スポット的、あるいは連続的に超音波融
着する(第2c図) シールド層22には、従来同様に、フィルム状や箔状や
メッシュ状の銅、アルミなどの金属を使用する。
After that, spotwise or continuous ultrasonic welding is performed between the drain conductor 10a and the shield layer 22 in the same manner as described above (Fig. 2c). -Shaped or mesh-shaped metal such as copper or aluminum is used.

36はシールドテープ電線の全体を示す。 36 shows the whole shield tape electric wire.

[作 用] 第3図に、シールドテープ電線36の使用状況の一例を
示す。なお、同図は、コネクタ18は見上げる状態で、ま
た基板20は見下げる状態で描いてある。
[Operation] FIG. 3 shows an example of the usage status of the shield tape electric wire 36. In the figure, the connector 18 is drawn up and the substrate 20 is drawn down.

シールドテープ電線36は従来のテープ電線16と同じ使
い方ができる。
The shield tape electric wire 36 can be used in the same manner as the conventional tape electric wire 16.

導体10aは、シールド層22と電気的に接続しているの
で、ドレン線として、そのまま使用することができる。
Since the conductor 10a is electrically connected to the shield layer 22, it can be used as it is as a drain wire.

コネクタ18のピン38をプリント基板20のピン孔40に挿
入すると、導体10aに接続するピン38は接地用導電体42
と接続し、シールドテープ電線36のシールド層22が、接
地される。
When the pin 38 of the connector 18 is inserted into the pin hole 40 of the printed circuit board 20, the pin 38 connected to the conductor 10a becomes a grounding conductor 42.
And the shield layer 22 of the shield tape electric wire 36 is grounded.

[発明の効果] (1)ドレン線となる導体10aが、他の導体10と等しい
間隔pで並んでいるため、シールド効果を持ちながら、
従来のテープ電線16と同等の扱いで結線(コネクタ接
続、ハンダ付け接続など)ができる。
[Advantages of the Invention] (1) Since the conductors 10a to be the drain wires are arranged at the same interval p as the other conductors 10, while having a shielding effect,
Wiring (connector connection, soldering connection, etc.) can be performed in the same way as the conventional tape electric wire 16.

(2)どの位置の導体でも、容易にドレンワイヤとする
ことができる。
(2) The drain wire can be easily formed at any position of the conductor.

(3)上記第2a図の複合テープ30のようなものを使用す
ることにより、従来のテープ電線の製造技術をそのまま
利用し、それに超音波融着工程を付加するだけで製造で
きる。
(3) By using such a composite tape 30 as shown in FIG. 2a, the conventional tape wire manufacturing technique can be used as it is, and an ultrasonic fusion process can be added thereto.

【図面の簡単な説明】[Brief description of drawings]

第1a〜1d図は本発明の実施例に係り、 第1a図と第1b図は、超音波融着の前および後の状況の説
明図、 第1c図は超音波融着後の平面図、 第1d図は第1c図のD−Dの拡大断面図、 第2a図〜第2c図は、本発明の別の実施例の工程順に示し
た説明図、 第3図は本発明のシールドテープ電線36の使用状況の説
明図、 第4図は従来のテープ電線16の説明図で 第5図はその使用状況の説明図、 第6図と第7図は、従来のテープ電線16にシールドを施
す手法の異なる例の説明図。 10:導体、12:接着層 14:絶縁層、16:テープ電線 18:コネクタ、20:プリント基板 22:シールド層、24:絶縁テープ 30:複合テープ、32:ドレン線 34:口金、36:シールドテープ電線 38:ピン、40:ピン孔 42:接地用導電体、44:融着部分
FIGS. 1a to 1d relate to an embodiment of the present invention, FIGS. 1a and 1b are explanatory views of a situation before and after ultrasonic fusion, and FIG. 1c is a plan view after ultrasonic fusion, FIG. 1d is an enlarged cross-sectional view taken along the line DD of FIG. 1c, FIGS. 2a to 2c are explanatory views showing the order of steps of another embodiment of the present invention, and FIG. 3 is a shield tape electric wire of the present invention. 36 is an explanatory view of the usage status, FIG. 4 is an explanatory view of the conventional tape electric wire 16, FIG. 5 is an explanatory view of the usage status thereof, and FIGS. 6 and 7 show the conventional tape electric wire 16 with a shield. Explanatory drawing of the example where a method differs. 10: Conductor, 12: Adhesive layer 14: Insulation layer, 16: Tape electric wire 18: Connector, 20: Printed circuit board 22: Shield layer, 24: Insulation tape 30: Composite tape, 32: Drain wire 34: Base, 36: Shield Tape wire 38: Pin, 40: Pin hole 42: Grounding conductor, 44: Fusion part

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】複数の導体10を横一列に、互いに平行に、
等ピッチで並べ、それらの上下両側に絶縁層14を設け、
絶縁層14の少なくとも片側にシールド層22を設けた後、 導体10の少なくとも1本とシールド層22とを、超音波融
着することを特徴とする、シールド付きテープ電線の製
造方法。
1. A plurality of conductors 10 arranged in a row in parallel with each other,
Arrange at equal pitch, and provide the insulating layer 14 on the upper and lower sides of them,
A method of manufacturing a shielded tape electric wire, comprising providing a shield layer 22 on at least one side of an insulating layer 14 and then ultrasonically welding at least one of the conductors 10 and the shield layer 22.
JP62171688A 1987-07-09 1987-07-09 Manufacturing method of taped electric wire with shield Expired - Lifetime JP2553870B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62171688A JP2553870B2 (en) 1987-07-09 1987-07-09 Manufacturing method of taped electric wire with shield

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171688A JP2553870B2 (en) 1987-07-09 1987-07-09 Manufacturing method of taped electric wire with shield

Publications (2)

Publication Number Publication Date
JPS6414813A JPS6414813A (en) 1989-01-19
JP2553870B2 true JP2553870B2 (en) 1996-11-13

Family

ID=15927848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171688A Expired - Lifetime JP2553870B2 (en) 1987-07-09 1987-07-09 Manufacturing method of taped electric wire with shield

Country Status (1)

Country Link
JP (1) JP2553870B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828139B2 (en) * 1988-09-20 1996-03-21 株式会社フジクラ Manufacturing method of tape electric wire
JPH03108207A (en) * 1989-09-21 1991-05-08 Fujikura Ltd Shielded flat cable and manufacture thereof
JPH03112014A (en) * 1989-09-26 1991-05-13 Fujikura Ltd Flat electric wire with shielding and manufacture thereof
JP4560185B2 (en) * 2000-08-07 2010-10-13 矢崎総業株式会社 Conductor thin film sheet with electric wire and method for producing conductor thin film sheet with electric wire
JP2002163935A (en) * 2000-11-24 2002-06-07 Yazaki Corp Flat shield harness and method of manufacturing flat shield harness
JP4704588B2 (en) * 2001-03-16 2011-06-15 矢崎総業株式会社 Conductor thin film sheet and shield harness
JP6520544B2 (en) * 2015-08-10 2019-05-29 住友電気工業株式会社 Flat cable
IT201900017129A1 (en) * 2019-09-24 2021-03-24 Innoventa S R L PROCESS OF INSULATING AN ELEMENT IN CONDUCTIVE MATERIAL

Also Published As

Publication number Publication date
JPS6414813A (en) 1989-01-19

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