JP2554917B2 - Soldering method for electronic parts - Google Patents
Soldering method for electronic partsInfo
- Publication number
- JP2554917B2 JP2554917B2 JP63106909A JP10690988A JP2554917B2 JP 2554917 B2 JP2554917 B2 JP 2554917B2 JP 63106909 A JP63106909 A JP 63106909A JP 10690988 A JP10690988 A JP 10690988A JP 2554917 B2 JP2554917 B2 JP 2554917B2
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- parts
- electronic component
- soldering
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は回路基板に電子部品をリフロー法により、は
んだ付けする方法の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to an improvement in a method of soldering an electronic component on a circuit board by a reflow method.
＜従来の技術＞ 回路基板に電子部品をはんだ付けする場合、リフロー
法を用いることがある。このリフロー法においては、ク
リームはんだを回路基板に印刷し、この印刷したクリー
ムはんだの粘着力によって電子部品を仮固定し、而るの
ち、加熱してクリームはんだにより電子部品を回路基板
にはんだ付けし、はんだ付け後の残存フラックスを最終
的に洗浄除去している。<Prior Art> When soldering an electronic component to a circuit board, a reflow method may be used. In this reflow method, cream solder is printed on a circuit board, the electronic components are temporarily fixed by the adhesive force of the printed cream solder, and then heated to solder the electronic components to the circuit board by cream solder. The residual flux after soldering is finally cleaned and removed.
＜解決しようとする課題＞ 而して、リフロー法においては、クリームはんだに電
子部品を仮固定できるに足る粘着力を付与する必要があ
る。而るに、クリームはんだの組成は粉末はんだとロジ
ンと溶剤剤から成り、クリームはんだの印刷後に溶剤が
気化逸散して固型分が増大していき、電子部品の載置時
には粘着性が相当に低下してしまい上記電子部品の粘着
固定を行い難いことがある。<Problems to be Solved> Therefore, in the reflow method, it is necessary to provide the cream solder with an adhesive force sufficient to temporarily fix the electronic component. Therefore, the composition of cream solder consists of powdered solder, rosin, and solvent agent, and after printing cream solder, the solvent evaporates and the solid content increases, and the adhesiveness is considerable when mounting electronic parts. In some cases, it may be difficult to fix the electronic component by adhesion.
また、上記フラックスの特性としては、本来のフラッ
クス作用以外に従来においては、はんだ付後での残存フ
ラックスを容易かつ、確実に洗浄除去できるように易洗
浄性を不可欠としている。特に、近来の高密度印刷配線
のもとでは印刷導体間のギヤップが著しく狭く、そのギ
ヤップの絶縁処理が極めて短くされているので、上記残
存フラックスがそのまま存在すれば、導体間の絶縁性を
大きく低下させるとして、洗浄性が重要視されている。Further, as the characteristic of the above-mentioned flux, in addition to the original function of flux, conventionally, easy cleaning property is indispensable so that residual flux after soldering can be easily and surely removed by cleaning. In particular, under the recent high-density printed wiring, the gap between printed conductors is extremely narrow, and the insulation treatment of the gap is extremely short, so if the above residual flux remains, the insulation between conductors will increase. Detergency is regarded as important as it is lowered.
本発明の目的は、印刷したクリームはんだによる電子
部品の仮固定を良好に行い得、かつはんだ付け後での残
存フラックスの洗浄除去を確実・容易に行い得る電子部
品のはんだ付け方法を提供することにある。An object of the present invention is to provide a soldering method for an electronic component, which can satisfactorily perform temporary fixing of an electronic component with a printed cream solder, and which can reliably and easily clean and remove residual flux after soldering. It is in.
＜課題を解決するための手段＞ 本発明に係る電子部品のはんだ付け方法は、液状のプ
ロピレン低重合体を粘着性付与剤として添加したクリー
ムはんだを回路基板に印刷し、次いで印刷クリームはん
だで電子部品を仮固定し、而るのち、加熱してクリーム
はんだの溶融凝固により電子部品をはんだ付けすること
を特徴とする構成である。<Means for Solving the Problems> A method for soldering an electronic component according to the present invention is a method of printing a cream solder to which a liquid propylene low polymer is added as a tackifier on a circuit board, and then electronically using a printed cream solder. The component is temporarily fixed, and then heated to melt and solidify the cream solder to solder the electronic component.
本発明において使用するクリームはんだの組成化は粉
末はんだ80〜90部に対し、フラックス20〜10部である。
粉末はんだの粒度は一般に400〜100メッシュである。フ
ラックスの組成は一般にロジン40〜70部、溶剤50〜10
部、チキソ剤１〜10部、活性剤０〜３部、液状絶縁性低
重合体１〜20部である。ロジンは重量ロジン、天然ロジ
ン、水素添加ロジン、マレイン化ロジン、フェノール変
性ロジン、不均等ロジン等を使用でき、溶剤にはカルビ
トール（ジエチレングリコールモノエチルエーテル）、
ヘキシレングリコール、ブチルセロソルブ、プロパンジ
オール、プロピレングリコール等を使用でき、チキソ剤
には水素添加ヒマシ油を使用でき、活性剤含窒素塩基の
ハロゲン化水素塩例えばジエチルアミンHC1を使用でき
る。The composition of the cream solder used in the present invention is 80 to 90 parts of powder solder and 20 to 10 parts of flux.
The particle size of powdered solder is generally 400-100 mesh. The composition of the flux is generally 40 to 70 parts of rosin and 50 to 10 parts of solvent.
Parts, 1 to 10 parts of thixotropic agent, 0 to 3 parts of activator, and 1 to 20 parts of liquid insulating low polymer. As the rosin, heavy rosin, natural rosin, hydrogenated rosin, maleated rosin, phenol-modified rosin, heterogeneous rosin and the like can be used, and the solvent is carbitol (diethylene glycol monoethyl ether),
Hexylene glycol, butyl cellosolve, propanediol, propylene glycol, etc. can be used, hydrogenated castor oil can be used as a thixotropic agent, and a hydrogen halide salt of an activator nitrogen-containing base such as diethylamine HC1 can be used.
本発明により電子部品を回路基板にはんだ付けするに
あたって、まず上記の液状低重合体を添加したクリーム
はんだをスクリーン印刷法等により所定のパターンで回
路基板に印刷塗布する。而るのち、電子部品をこの印刷
クリームはんだに、その粘着力によって仮固定する。In soldering an electronic component to a circuit board according to the present invention, first, the cream solder to which the liquid low polymer is added is printed and applied to the circuit board in a predetermined pattern by a screen printing method or the like. After that, the electronic component is temporarily fixed to this printing cream solder by its adhesive force.
この間、上記液状低重合体の粘着性のために電子部品
の粘着仮固定を良好に保持できる。During this period, the temporary adhesion of the electronic component can be satisfactorily held due to the adhesiveness of the liquid low polymer.
而るのちは、電子部品をはんだ付け温度に加熱し、印
刷クリームはんだ中の粉末はんだを溶融させて電子部品
を回路基板に、はんだ付けする。After that, the electronic component is heated to the soldering temperature to melt the powdered solder in the printing cream solder to solder the electronic component to the circuit board.
その後は洗浄工程に搬送し、残存フラックスを洗浄除
去する。プロピレン低重合体ははんだ付け時の加熱では
ゲル化せず液状を保持するから、容易に洗浄除去でき
る。また、ロジンも洗浄性に優れている。従って、残存
フラックスを確実・容易に洗浄除去できる。After that, it is conveyed to a cleaning step and the residual flux is removed by cleaning. The propylene low polymer does not gel when heated during soldering and retains a liquid state, so that it can be easily washed and removed. Rosin is also excellent in cleaning properties. Therefore, the residual flux can be removed reliably and easily.
＜実施例＞ ＜実施例＞ フラックスの組成は、WWロジン:50部、カルビトール:
26部、カスターワックス:3部、ジエチルアミン:1部、液
状ポリプロピレン:20部である。このフラックス10部と
粉末はんだ（Sn63−Pb粉末はんだ、250メッシュ）90部
とを混合して、クリームはんだを得、このクリームはん
だを回路基板に所定のパターンでスキージ圧2.0kg/cm2
にて印刷し、24時間放置後、単一面積1.8mm2のランド間
に面積:3.0×1.5mm2、重量:9.5mgのチップ抵抗を1300個
マウンドした。<Example><Example> The composition of the flux was as follows: WW rosin: 50 parts, carbitol:
26 parts, castor wax: 3 parts, diethylamine: 1 part, liquid polypropylene: 20 parts. 10 parts of this flux and 90 parts of powder solder (Sn63-Pb powder solder, 250 mesh) are mixed to obtain cream solder, and this cream solder is squeegee pressure 2.0 kg / cm 2 on a circuit board in a predetermined pattern.
After printing for 24 hours, 1300 mounds of chip resistors having an area of 3.0 × 1.5 mm 2 and a weight of 9.5 mg were mounted between lands having a single area of 1.8 mm 2 .
＜比較例＞ フラックスの組成を次の通りとした以外、実施例に同
じとした。<Comparative example> The same as the example except that the composition of the flux was as follows.
WWロジン:58部、カルビトール:38部、カスターワック
ス:3部、ジエチルアミン:1部。WW rosin: 58 parts, carbitol: 38 parts, castor wax: 3 parts, diethylamine: 1 part.
本発明によりチップ抵抗をマウンドした回路基板と比
較例によりチップ抵抗をマウンドした回路基板に所定の
振動試験を課したところ比較例品では約80％のチップ抵
抗が脱落したのに対し、実施例品では脱落したチップ抵
抗は無であった。When a predetermined vibration test was applied to the circuit board with the chip resistance mounted according to the present invention and the circuit board with the chip resistance mounted according to the comparative example, about 80% of the chip resistance was dropped in the comparative example product, whereas the example product Then, there was no chip resistor that dropped out.
＜発明の効果＞ 本発明に係る電子品のはんだ付方法においては、上述
した通り、リフロー法においてクリームはんだに液状の
プロピレン低重合体を粘着付与剤として添加しているか
ら、電子部品の印刷クリームはんだによる仮固定を良好
に行い得、また、はんだ付け後での洗浄も容易である。<Effects of the Invention> In the electronic product soldering method according to the present invention, as described above, since the liquid propylene low polymer is added to the cream solder as the tackifier in the reflow method, the printing cream for the electronic component is used. Temporary fixing with solder can be performed well, and cleaning after soldering is easy.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−21896（ＪＰ，Ａ) 特開 昭58−169993（ＪＰ，Ａ) 特開 昭62−127194（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-57-21896 (JP, A) JP-A-58-169993 (JP, A) JP-A-62-127194 (JP, A)
Claims (1)
として添加したクリームはんだを回路基板に印刷し、次
いで印刷クリームはんだで電子部品を仮固定し、而るの
ち、加熱してクリームはんだの溶融凝固により電子部品
をはんだ付けすることを特徴とする電子部品のはんだ付
け方法。1. A cream solder to which a liquid propylene low polymer is added as a tackifier is printed on a circuit board, and then electronic parts are temporarily fixed with the printed cream solder, and then heated to form a cream solder. A method for soldering an electronic component, which comprises soldering the electronic component by melting and solidifying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63106909A JP2554917B2 (en) | 1988-04-28 | 1988-04-28 | Soldering method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63106909A JP2554917B2 (en) | 1988-04-28 | 1988-04-28 | Soldering method for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01278091A JPH01278091A (en) | 1989-11-08 |
| JP2554917B2 true JP2554917B2 (en) | 1996-11-20 |
Family
ID=14445571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63106909A Expired - Lifetime JP2554917B2 (en) | 1988-04-28 | 1988-04-28 | Soldering method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2554917B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5721896A (en) * | 1980-07-15 | 1982-02-04 | Matsushita Electric Industrial Co Ltd | Method of mounting circuit parts |
| JPS58169993A (en) * | 1982-03-31 | 1983-10-06 | 株式会社日立製作所 | Part mounting method |
| JPS62127194A (en) * | 1985-11-28 | 1987-06-09 | Fujikura Ltd | Production of anisotropic conductive solder joining material |
-
1988
- 1988-04-28 JP JP63106909A patent/JP2554917B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01278091A (en) | 1989-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4438974B2 (en) | Solder paste | |
| JP2694385B2 (en) | Adhesive | |
| US5176759A (en) | Paste solder with minimized residue | |
| JP2004025305A (en) | Residue-free solder paste | |
| GB2198676A (en) | Solder cream composition | |
| JPH1177377A (en) | Flux composition | |
| EP0707524B1 (en) | Solderable anisotropically conductive composition and method of using same | |
| JPH11186712A (en) | Solder paste and connection method | |
| JP3379679B2 (en) | Solder paste | |
| JP2001150184A (en) | Solder paste composition for reflow soldering and circuit board | |
| JP2554917B2 (en) | Soldering method for electronic parts | |
| EP0413540A2 (en) | Manufacture of printed circuit board assemblies | |
| JP2002283097A (en) | Solder paste composition and reflow soldering method | |
| JPH09277082A (en) | Solder paste | |
| US4657589A (en) | Solder cream | |
| JP2002126893A (en) | Soldering paste and soldering method | |
| JP2554915B2 (en) | Cream solder | |
| JPH1177368A (en) | Lead-free solder alloy | |
| JPH01241395A (en) | Cream solder | |
| JP2561452B2 (en) | Solder paste | |
| JP2987227B2 (en) | Low melting point solder deposition composition and method for producing low melting point solder precoated circuit board | |
| JPH0596396A (en) | Cream solder | |
| JPH0675796B2 (en) | Cream solder | |
| JP2566813B2 (en) | Reflow soldering flux for cream solder | |
| JPH0542389A (en) | Flux composition |