JP2556615B2 - How to repair a conductor defect - Google Patents
How to repair a conductor defectInfo
- Publication number
- JP2556615B2 JP2556615B2 JP2264662A JP26466290A JP2556615B2 JP 2556615 B2 JP2556615 B2 JP 2556615B2 JP 2264662 A JP2264662 A JP 2264662A JP 26466290 A JP26466290 A JP 26466290A JP 2556615 B2 JP2556615 B2 JP 2556615B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- repairing
- photoresist
- substrate
- repair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は導体欠損部の修正方法に係り、特に修正用導
体と既存の基板上成膜導体との導通性に優れた修正方法
に関する。Description: TECHNICAL FIELD The present invention relates to a method for repairing a conductor defect portion, and more particularly to a repair method having excellent conductivity between a repairing conductor and an existing film-forming conductor on a substrate.
［従来の技術］ 従来、大型の基板上に薄膜抵抗体、Al導体、及び保護
膜（耐酸化膜、耐磨耗膜）等から成る回路を形成し、例
えばサーマルヘッド等を作成する製造方法が知られてい
る。この様な製造方法においては、回路の欠損が避けら
れず、修正を必要とする場合が多々発生する。[Prior Art] Conventionally, there is a manufacturing method in which a circuit including a thin film resistor, an Al conductor, a protective film (an oxidation resistant film, an abrasion resistant film) and the like is formed on a large-sized substrate, and a thermal head or the like is formed. Are known. In such a manufacturing method, a loss of a circuit is unavoidable, and correction often occurs.
第３図は従来の導体欠損部の修正方法を示す工程図で
ある。FIG. 3 is a process diagram showing a conventional method for repairing a conductor defect portion.
第３図（ａ）はサーマルヘッドの断面図を示し、基板
10上に薄膜抵抗体あるいはAl導体等の導体、ここではAl
導体12が成膜パターン形成されている。Al導体12には、
図示のように欠損部14が発生している。FIG. 3 (a) shows a cross-sectional view of the thermal head,
Conductor such as thin film resistor or Al conductor on 10
The conductor 12 is formed into a film pattern. In the Al conductor 12,
As shown in the figure, the defective portion 14 has occurred.
修正工程は、まず第３図（ｂ）に示すように、基板全
面にフォトレジスト16を塗布することから始める。次
に、第３図（ｃ）に示すように、露光現像を行い、フォ
トレジスト16に開口部を設け、欠損部14を露出させる。
続いて、第３図（ｄ）に示すように、基板の全面に修正
用Al導体18を成膜する。そして、欠損部14以外のフォト
レジスト16上の修正用Al導体18を剥離し（第３図（ｅ）
参照）、さらにフォトレジスト16をも剥離する（第３図
（ｆ）参照）。こうして、Al導体12の欠損を修正してい
た。The repair process starts by first applying a photoresist 16 to the entire surface of the substrate as shown in FIG. 3 (b). Next, as shown in FIG. 3C, exposure and development are performed to form an opening in the photoresist 16 to expose the defective portion 14.
Subsequently, as shown in FIG. 3D, a correction Al conductor 18 is formed on the entire surface of the substrate. Then, the correction Al conductor 18 on the photoresist 16 other than the defective portion 14 is peeled off (see FIG. 3 (e)).
Then, the photoresist 16 is also removed (see FIG. 3 (f)). Thus, the defect of the Al conductor 12 was corrected.
［発明が解決しようとする課題］ しかしながら、従来の導体欠損部の修正方法によれ
ば、以下のような欠点があった。[Problems to be Solved by the Invention] However, the conventional method for repairing a conductor defect has the following drawbacks.
既存の基板上Al導体12の表面には成膜後、酸化膜が自
然形成されるため、Al導体12と修正用Al導体18との導通
性が不良となり、リード抵抗が高くなってしまう。Since an oxide film is naturally formed on the surface of the existing Al conductor 12 on the substrate after the film is formed, the conductivity between the Al conductor 12 and the correcting Al conductor 18 becomes poor, and the lead resistance increases.
修正用Al導体18は、フォトレジスト16の特性上、成膜
温度の上限が制限されているため、基板10あるいはAl導
体12に対する密着性が悪く剥れ易い。Since the upper limit of the film forming temperature of the repairing Al conductor 18 is limited due to the characteristics of the photoresist 16, the repairing Al conductor 18 has poor adhesion to the substrate 10 or the Al conductor 12 and is easily peeled off.
Al導体12の端部では、修正用Al導体18の膜の回り込み
が悪く、Al導体12と修正用Al導体18との間に隙間（マイ
クロスリット）が発生し、導体間の導通性が不良とな
る。At the end of the Al conductor 12, the wraparound of the film of the repairing Al conductor 18 is poor, and a gap (micro slit) is generated between the Al conductor 12 and the repairing Al conductor 18, resulting in poor conductivity between the conductors. Become.
本発明は、上記課題を解決するためになされたもので
あり、その目的は、導通性、密着性、及び修復性に優れ
た導体欠損部の修正方法を提供することにある。The present invention has been made to solve the above problems, and an object of the present invention is to provide a method of repairing a conductor defect portion having excellent conductivity, adhesion, and repairability.
［課題を解決するための手段］ 上記目的を達成するために、本発明は、基板上に成膜
された導体の欠損部を修正する導体欠損部の修正方法に
おいて、基板上に成膜された導体上にフォトレジストを
塗布する工程と、前記フォトレジストに露光現象を行な
い、前記導体に発生した欠損部及びこの欠損部が発生し
た導体端部を露出させる開口部を前記フォトレジストに
形成する露光現像工程と、前記開口部から露出された欠
損部上及び導体端部上を含み前記フォトレジスト上に修
正用導体を成膜する修正工程と、前記導体の導体幅より
も小さい照射範囲で前記開口部内の導体端部と修正用導
体とをレーザ照射により溶融させる溶融工程と、溶融
後、不要な修正用導体とフォトレジストを除去する除去
工程と、を含むことを特徴とする。さらに、本発明は、
前記修正用導体と導体とを同一材質で、又は異なる材質
で形成したことを特徴とする。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a conductor defect portion repairing method for repairing a conductor defect portion formed on a substrate. A step of applying a photoresist on a conductor, and an exposure that performs an exposure phenomenon on the photoresist to form an opening in the photoresist for exposing a defective portion generated in the conductor and a conductor end portion in which the defective portion is generated. A developing step, a repairing step of forming a repairing conductor on the photoresist including the defect portion and the conductor end portion exposed from the opening, and the opening in an irradiation range smaller than the conductor width of the conductor It is characterized by including a melting step of melting the conductor end portion in the portion and the repairing conductor by laser irradiation, and a removing step of removing the unnecessary repairing conductor and the photoresist after the melting. Further, the present invention provides
The correction conductor and the conductor are made of the same material or different materials.
［作用］ 上記構成を有する本発明の導体欠損部の修正方法にお
いては、修正用導体と既存の基板上成膜導体とをレーザ
照射により、短時間及び部分的に溶融させることで、導
体間の導通性に優れ、修正用導体と基板との密着性を向
上させることができる。[Operation] In the conductor defect repairing method of the present invention having the above-described configuration, the repairing conductor and the existing film-forming conductor on the substrate are melted by laser irradiation for a short period of time to partially melt the conductor and The conductivity is excellent, and the adhesion between the correction conductor and the substrate can be improved.
［実施例］ 以下、図面に基づいて本発明の実施例を説明する。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明に係る導体欠損部の修正方法の一実施
例を示す工程図である。なお、第３図と同一部分には同
一の符号を付してある。FIG. 1 is a process drawing showing an embodiment of a method for repairing a conductor defect portion according to the present invention. The same parts as those in FIG. 3 are designated by the same reference numerals.
まず、第１図（ａ）に示すように、抵抗体、Al導体12
等の成膜、パターン形成後に、電気的特性（導通性）を
測定し、基板10において導体欠損部14が発生している部
分を検出する。First, as shown in FIG. 1 (a), a resistor and an Al conductor 12
After film formation and pattern formation such as the above, electrical characteristics (conductivity) are measured to detect a portion of the substrate 10 where the conductor defect portion 14 is generated.
次に、第１図（ｂ）に示すように、前記基板10の全面
に例えばポジ型フォトレジスト16を塗布する。Next, as shown in FIG. 1B, for example, a positive photoresist 16 is applied to the entire surface of the substrate 10.
続いて、第１図（ｃ）に示すように、欠損部14を露光
し現象することにより、Al導体12が欠損している部分を
露出させる。このとき、修正により接続させるべきAl導
体12の端部を両側共に露出させる。Subsequently, as shown in FIG. 1 (c), the defective portion 14 is exposed to a phenomenon to expose the defective portion of the Al conductor 12. At this time, both ends of the Al conductor 12 to be connected by the correction are exposed.
次に、第１図（ｄ）に示すように、露出された欠損部
14を含む基板上に修正用Al導体18を成膜する。Next, as shown in FIG. 1 (d), the exposed defect portion
A correction Al conductor 18 is formed on the substrate including 14.
続いて、第１図（ｅ）に示すように、修正用Al導体18
と既存の基板上成膜Al導体12とをレーザ照射により溶融
させる。第２図はレーザ照射部分を示す基板平面図であ
る。図中、斜線にて示すようにレーザ照射部分20は、例
えばスリットによりスポット径10□〜200□μｍ程度、A
l導体12の1/3幅程度に設定される。このレーザ照射によ
り、修正用Al導体18とAl導体12とが２層に重なっている
部分、そしてマイクロスリットが発生し易いAl導体12の
端部、さらに基板10に接する修正用Al導体18が確実に溶
融される。Then, as shown in FIG. 1 (e), the correcting Al conductor 18
The existing film-formed Al conductor 12 on the substrate is melted by laser irradiation. FIG. 2 is a plan view of a substrate showing a laser irradiation portion. In the figure, as shown by the diagonal lines, the laser irradiation portion 20 has a spot diameter of, for example, about 10 □ to 200 □ μm due to a slit, A
l The width is set to about 1/3 of the conductor 12. By this laser irradiation, the portion where the correction Al conductor 18 and the Al conductor 12 are overlapped with each other in two layers, the end portion of the Al conductor 12 where microslits are likely to occur, and the correction Al conductor 18 contacting the substrate 10 are surely performed. To be melted.
このため、修正用Al導体18とAl導体12の層間の酸化皮
膜が無くなり、良好な導通状態と密着力が得られる。ま
た、マイクロスリットの不連続面も溶融させてしまう
為、連続したAl導体が得られる。さらに、Al導体12のな
かった欠損部14の下地とも密着性が良くなる。For this reason, the oxide film between the correction Al conductor 18 and the Al conductor 12 is eliminated, and good conduction and adhesion can be obtained. Further, since the discontinuous surface of the micro slit is also melted, a continuous Al conductor can be obtained. Further, the adhesion is improved with the base of the defective portion 14 where the Al conductor 12 was not present.
なお、レーザの照射時間はμsec程度とし、そのパワ
ーはAl導体が溶融し、全てが飛散してしまわない程度と
される。The laser irradiation time is set to about μsec, and the power is set so that the Al conductor is not melted and not scattered.
次に、第１図（ｅ）に示す余分な修正用Al導体18を例
えば剥離用粘着テープで除去する。そして、フォトレジ
スト16を剥離後にて除去する。なお、余分な修正用Al導
体は、レーザ照射時の金属蒸気のマスキング材となって
いる。また、欠損部14の修正用Al導体18は、溶融して下
地と密着している為、余分な修正用Al導体と同時に剥れ
てしまう事はない。さらに、レーザ照射条件により、余
分な修正用Al導体を切断することも可能である。Next, the extra correction Al conductor 18 shown in FIG. 1 (e) is removed with, for example, a peeling adhesive tape. Then, the photoresist 16 is removed after peeling. The extra correction Al conductor serves as a masking material for metal vapor during laser irradiation. Further, since the repairing Al conductor 18 of the defective portion 14 is melted and adheres to the base, it does not peel off at the same time as the extra repairing Al conductor. Furthermore, it is also possible to cut the extra correction Al conductor depending on the laser irradiation conditions.
上気レーザ照射によって修正用Al導体18は、溶融して
確実にAl導体12と結合しており、欠損の無かったAl導体
12に対して良好な導通状態が得られる。このため、レー
ザ照射時に照射状態をモニターする事により、外観上か
ら導通の可否が判断できる。この事から、修正出来たか
否かを、抵抗値（導通性）で確認する必要がなく、その
まま、後工程に流す事ができる。The Al conductor 18 for correction was melted and reliably bonded to the Al conductor 12 by irradiation of the upper air laser, and there was no defect in the Al conductor.
Good conduction for 12 is obtained. Therefore, by monitoring the irradiation state at the time of laser irradiation, it is possible to determine from the appearance whether or not conduction is possible. From this fact, it is not necessary to confirm whether or not the correction has been made by the resistance value (conductivity), and the flow can be directly passed to the subsequent process.
上気のような本発明の修正方法は、例えばサーマルヘ
ッドを製作するときの回転欠損部の修正に特に有効であ
る。サーマルヘッドは、発熱体とつながる例えばAl導体
の抵抗値が低く、バラツキの小さい方が好ましい。この
導体の抵抗値変化が、そのサーマルヘッドの抵抗値特
性、すなわち印字品位に影響する。従って、サーマルヘ
ッドにおいて、高品質の印字を目的とする場合、当然そ
のサーマルヘッドの抵抗値のバラツキは、できるだけ小
さい方が印字品質も向上する。この様な導体抵抗値のバ
ラツキは、本発明の修正方法を用いることにより小さく
することが可能であり、本発明は、抵抗値のバラツキを
小さくしたい回路の修正に特に有効である。The above-described correction method of the present invention is particularly effective for correction of a rotational defect when manufacturing a thermal head, for example. It is preferable that the thermal head has a low resistance value of, for example, an Al conductor connected to the heating element and has a small variation. The change in the resistance value of the conductor affects the resistance value characteristic of the thermal head, that is, the print quality. Therefore, in the case of aiming at high quality printing in the thermal head, naturally the variation in the resistance value of the thermal head is as small as possible, the printing quality is improved. Such variation in conductor resistance value can be reduced by using the correction method of the present invention, and the present invention is particularly effective for correction of a circuit in which variation in resistance value is desired to be small.
なお、以上説明した実施例では修正用導体が既存の基
板上成膜導体と同一材質（実施例中はAl）である場合を
例示したが、本発明は上気実施例に限定されるものでは
なく、異なる材質の修正用導体を用いても良い。In the embodiment described above, the case where the repairing conductor is the same material as the existing film-forming conductor on the substrate (Al in the embodiment) is illustrated, but the present invention is not limited to the above-described embodiment. Instead, a correction conductor made of a different material may be used.
［発明の効果］ 以上説明したように、本発明の導体欠損部の修正方法
によれば、基板上成膜導体と修正用導体とがレーザによ
って溶融する事により、連続した導体となる為、欠損の
ない導体と同等の信頼性が得られ、かつ、リード抵抗
も、同等の値が得られる。[Effects of the Invention] As described above, according to the conductor defect repairing method of the present invention, the film-forming conductor on the substrate and the repairing conductor are melted by the laser to be a continuous conductor. It is possible to obtain the same level of reliability as a conductor without a lead wire and an equivalent value for the lead resistance.
また、余分な修正用導体を剥す以前に、レーザ処理を
行なう為、熱蒸気による汚染が無く、保護膜等の密着力
の低下も招かない。Further, since the laser treatment is performed before the extra correction conductor is stripped off, there is no contamination by hot steam and the adhesion of the protective film or the like is not reduced.
さらに、確実な導体間の溶融接続ができる為、修正前
に導体の表面酸化状態の確認、及び、その酸化膜の除去
を行なわなくて良く修正用導体の成膜条件も密着力があ
る程度得られれば良く成膜条件が簡易になる。Furthermore, since reliable fusion connection between conductors is possible, it is not necessary to check the surface oxidation state of the conductor and to remove the oxide film before repair, and the adhesion conditions can be obtained to some extent under the film formation conditions of the repair conductor. The film forming conditions are simple and easy.
また、確実に導体欠損不良を良品とできる為、繰り返
し修正と廃棄が無くなり、修正効率が向上する。Further, since the defective conductor defect can be surely made into a good product, repeated correction and disposal are eliminated, and the correction efficiency is improved.
第１図（ａ）〜（ｆ）は本発明に係る導体欠損部の修正
方法の一実施例を示す工程図、 第２図はレーザ照射部分を示す基板平面図、 第３図（ａ）〜（ｆ）は従来の導体欠損部の修正方法を
示す工程図である。 10……基板 12……Al導体 14……欠損部 16……フォトレジスト 18……修正用Al導体 20……レーザ照射部分1 (a) to 1 (f) are process drawings showing an embodiment of a method for repairing a conductor defect portion according to the present invention, FIG. 2 is a plan view of a substrate showing a laser irradiation portion, and FIGS. 3 (a) to 3 (a). (F) is a process drawing showing a conventional method of repairing a conductor defect portion. 10 …… Substrate 12 …… Al conductor 14 …… Defective area 16 …… Photoresist 18 …… Correcting Al conductor 20 …… Laser irradiated area
Claims (3)
る導体欠損部の修正方法において、 基板上に成膜された導体上にフォトレジストを塗布する
工程と、 前記フォトレジストに露光現象を行ない、前記導体に発
生した欠損部及びこの欠損部が発生した導体端部を露出
させる開口部を前記フォトレジストに形成する露光現像
工程と、 前記開口部から露出された欠損部上及び導体端部上を含
み前記フォトレジスト上に修正用導体を成膜する修正工
程と、 前記導体の導体幅よりも小さい照射範囲で前記開口部内
の導体端部と修正用導体とをレーザ照射により溶融させ
る溶融工程と、 溶融後、不要な修正用導体とフォトレジストを除去する
除去工程と、 を含むことを特徴とする導体欠損部の修正方法。1. A method for repairing a defective conductor portion formed on a substrate, comprising: applying a photoresist onto the conductor formed on the substrate; and exposing the photoresist. An exposure and development step of performing a phenomenon to form an opening in the photoresist that exposes a defective portion generated in the conductor and a conductor end portion in which the defective portion is generated; and a conductor exposed on the defective portion and the conductor. A repairing step of forming a repairing conductor on the photoresist including the end portion, and melting the conductor end portion in the opening and the repairing conductor by laser irradiation in an irradiation range smaller than the conductor width of the conductor. A method of repairing a conductor defect portion, comprising: a melting step; and a removal step of removing unnecessary repairing conductor and photoresist after melting.
る導体欠損部の修正方法。2. The repair method according to claim 1, wherein the repair conductor and the conductor are made of the same material.
する導体欠損部の修正方法。3. The repair method according to claim 1, wherein the repair conductor and the conductor are made of different materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2264662A JP2556615B2 (en) | 1990-10-01 | 1990-10-01 | How to repair a conductor defect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2264662A JP2556615B2 (en) | 1990-10-01 | 1990-10-01 | How to repair a conductor defect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04142037A JPH04142037A (en) | 1992-05-15 |
| JP2556615B2 true JP2556615B2 (en) | 1996-11-20 |
Family
ID=17406467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2264662A Expired - Fee Related JP2556615B2 (en) | 1990-10-01 | 1990-10-01 | How to repair a conductor defect |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2556615B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4701036B2 (en) * | 2005-07-15 | 2011-06-15 | 株式会社ブイ・テクノロジー | Wiring pattern repair method and wiring pattern repair device for electronic circuit board |
| JP7403875B1 (en) * | 2022-08-10 | 2023-12-25 | 株式会社スカイテクノロジー | Method for repairing printed wiring boards and method for manufacturing recycled printed wiring boards |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53116790A (en) * | 1977-03-22 | 1978-10-12 | Mitsubishi Electric Corp | Electrical connection method within semiconductor chip |
| JPH0266545A (en) * | 1988-08-31 | 1990-03-06 | Hoya Corp | Method for correcting deficient or defective part of thin film pattern |
-
1990
- 1990-10-01 JP JP2264662A patent/JP2556615B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04142037A (en) | 1992-05-15 |
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