JP2560658B2 - Electrical equipment for printed circuit board mounting - Google Patents
Electrical equipment for printed circuit board mountingInfo
- Publication number
- JP2560658B2 JP2560658B2 JP63262541A JP26254188A JP2560658B2 JP 2560658 B2 JP2560658 B2 JP 2560658B2 JP 63262541 A JP63262541 A JP 63262541A JP 26254188 A JP26254188 A JP 26254188A JP 2560658 B2 JP2560658 B2 JP 2560658B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- relay
- shape
- tongue piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Casings For Electric Apparatus (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はプリント基板に実装されるリレー，スイッチ
等の電気機器、詳しくはその実装時の傾き防止のための
構造に関するものである。Description: TECHNICAL FIELD The present invention relates to electric devices such as relays and switches mounted on a printed circuit board, and more particularly to a structure for preventing inclination during mounting.
（従来の技術） 従来、この種の電気機器のプリント基板への実装は、
次にように行なわれている。すなわち、電気機器をプリ
ント基板上の所定の位置に、それらの端子をスルーホー
ルに差し込むことにより装着する。そして、はんだ付け
部にフラックスを塗布して自動はんだによりはんだ付け
し、洗浄してフラックス等を除去するようになってい
る。(Prior Art) Conventionally, mounting of this kind of electric equipment on a printed circuit board is
It is performed as follows. That is, the electric device is mounted at a predetermined position on the printed circuit board by inserting those terminals into the through holes. Then, flux is applied to the soldering portion, soldering is performed by automatic soldering, and cleaning is performed to remove the flux and the like.
（発明が解決しようとする課題） しかしながら、はんだ付け前の搬送中の振動，衝撃等
により電気機器が傾いたり、浮き上がると、その状態の
ままはんだ付けされるため、実装状態が見苦しく、また
隣接部品が取り付かないこともあった。このような部品
は、実装後に手修正する必要があるが、これに要する作
業が煩雑となっていた。(Problems to be Solved by the Invention) However, when an electric device tilts or floats up due to vibration or shock during transportation before soldering, soldering is performed in that state, so that the mounting state is unsightly and adjacent components Was not always attached. It is necessary to manually correct such components after mounting, but the work required for this is complicated.
そこで、このような傾き、浮き上がりを防止するた
め、電気機器の端子を予め略Ｓ字形等に変形させてお
き、その弾性によるスルーホールに圧接させて自立でき
るようにしたものがあるが、端子先端が不揃いとなって
スリーホールに合致せず、先端が折れ曲がることがあ
る。また、電気機器をプリント基板上に取り付けた後、
裏面に突出する端子を折り曲げる方法もあるが、折り曲
げ作業が煩雑であるという問題点を有している。Therefore, in order to prevent such tilting and floating, there is a terminal in which the terminal of the electric device is preliminarily deformed into a substantially S-shape or the like and is pressed against the through hole due to its elasticity so that it can stand by itself. The edges may be uneven and may not match the three holes, and the tip may be bent. Also, after mounting the electrical equipment on the printed circuit board,
There is also a method of bending the terminal protruding to the back surface, but there is a problem that the bending work is complicated.
本発明は斯かる問題点に鑑みてなされたもので、搬送
中等に傾いたり、浮き上がったりしても、はんだ付け前
に正しく自立するプリント基板実装用電気機器を提供す
ることを目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide an electric device for mounting a printed circuit board that is properly self-standing before soldering even if the device is tilted or lifted during transportation.
（課題を解決するための手段） 前記目的を達成するため、本発明は、形状記憶樹脂で
形成したケース又はベースに、プリント基板を貫通して
その先端が裏面に係止する形状に記憶させた少なくとも
２個の舌片を突設したものである。(Means for Solving the Problems) In order to achieve the above object, the present invention stores a shape in which a case or a base formed of a shape memory resin penetrates a printed circuit board and its front end is locked to the back surface. At least two tongue pieces are projected.
（作用） 前記構成において、まず舌片を加工してプリント基板
に係止しない形状に変形させる。これにより、舌片がプ
リント基板に係止しなくなるため、電気機器は正しくプ
リント基板に装着される。(Operation) In the above configuration, first, the tongue piece is processed and deformed into a shape that does not engage with the printed board. As a result, the tongue does not engage with the printed circuit board, so that the electric device is properly mounted on the printed circuit board.
そして、プリント基板に装着した電気機器をはんだ付
け前に加熱すると、舌片はプリント基板に係止しつつ変
形前の形状に復帰しようとする。このときの舌片の復帰
力により、電気機器は傾き又は浮き上がり状態にあった
としても、正しい姿勢に矯正される。Then, when the electric device mounted on the printed circuit board is heated before soldering, the tongue piece tries to return to the shape before deformation while being locked to the printed circuit board. The restoring force of the tongue at this time corrects the electric device to a correct posture even if the electric device is tilted or lifted.
（実施例） 次に、本発明の一実施例を添付図面に従って説明す
る。(Embodiment) Next, an embodiment of the present invention will be described with reference to the accompanying drawings.
第１図〜第３図は、本発明に係るリレー１を示し、２
はリレー本体、３はリレー本体２を上から組み付けたベ
ース、４は端子、５はリレー本体２を上から被せるよう
にしてベース３に嵌合して箱形のケースであり、ベース
３とケース５の嵌合部はシール剤が塗布されて密封され
ている。1 to 3 show a relay 1 according to the present invention, 2
Is a relay body, 3 is a base on which the relay body 2 is assembled from above, 4 is a terminal, and 5 is a box-shaped case fitted to the base 3 so as to cover the relay body 2 from above. A sealant is applied to the fitting portion 5 to seal it.
ケース５は形状記憶樹脂からなり、その下端の長手方
向の両縁に、ケース５の下端とプリント基板６との間に
スタンドオフをとるためのそれぞれ２個の突起７が形成
されている。また、ケース５の下端の長手方向に直角方
向の両縁に、略Ｊ字形の舌片８が形成されている。The case 5 is made of a shape memory resin, and two protrusions 7 for forming standoffs between the lower end of the case 5 and the printed circuit board 6 are formed on both edges of the lower end in the longitudinal direction. Further, substantially J-shaped tongue pieces 8 are formed on both edges of the lower end of the case 5 in a direction perpendicular to the longitudinal direction.
前記ケース５の形状記憶樹脂は、所定温度で一定の形
状に成形して形状記憶させておけば、その後に変形を加
えても、一定温度以上に加熱することにより、記憶され
た元の形状に復帰する樹脂である。本実施例のケース５
は、第１図に示すように、箱形で、しかも、舌片８が略
Ｊ字形に形状記憶されている。この舌片８の形状は、第
３図に示すように、リレー１がプリント基板６に実装さ
れたときに、プリント基板６に設けた舌片挿入穴９を貫
通してプリント基板６の裏面にその先端が当接して係止
する形状となっている。If the shape-memory resin of the case 5 is molded into a constant shape at a predetermined temperature and is stored in the shape, the shape-memory resin is heated to a predetermined temperature or higher even if it is deformed after that, and thus the shape is stored in the original shape. It is a resin that returns. Case 5 of this embodiment
As shown in FIG. 1, the box-shaped tongue piece 8 has a substantially J-shaped shape memory. As shown in FIG. 3, when the relay 1 is mounted on the printed circuit board 6, the shape of the tongue piece 8 penetrates through the tongue piece insertion hole 9 provided on the printed circuit board 6 and is formed on the back surface of the printed circuit board 6. Its tip is in contact with and locked.
以上の構成からなるリレー１をプリント基板６に実装
するには、まず舌片８を加工して、プリント基板６に係
止しない形状、すなわち第２図に示すように端子４の挿
入方向と平行に真っ直ぐに延ばしておく。In order to mount the relay 1 having the above structure on the printed circuit board 6, first, the tongue piece 8 is processed so that the tongue piece 8 is not locked to the printed circuit board 6, that is, parallel to the insertion direction of the terminal 4 as shown in FIG. Straighten it out.
次に、リレー１の端子４をプリント基板６のスルーホ
ール10に差し込んで、リレー１を所定の位置に装着す
る。このとき、舌片８は真っ直ぐに延ばされているの
で、プリント基板６の舌片挿入穴９に挿入されてプリン
ト基板６を貫通する。Next, the terminal 4 of the relay 1 is inserted into the through hole 10 of the printed circuit board 6 to mount the relay 1 at a predetermined position. At this time, since the tongue piece 8 is straightly extended, the tongue piece 8 is inserted into the tongue piece insertion hole 9 of the printed board 6 and penetrates the printed board 6.
プリント基板６へのリレー１その他の部品の装着が終
了した後、はんだ付け部にフラックスを塗布する。After mounting the relay 1 and other components on the printed circuit board 6, flux is applied to the soldered portion.
そして、はんだ付け前に予備加熱を行う。この予備加
熱により、舌片８は当初の略Ｊ字形の形状に復帰する。
ここで、リレー１が、第２図に示すように、搬送中ある
いはフラックス塗布時等に図において左側が開き上がっ
て長手方向に傾いていたとする。この場合、舌片８が元
の形状に復帰するにつれて先端が巻き上がってプリント
基板６の裏面に係止する結果、その復帰力により第２図
中左側が引き下げられ、第３図に示すように、正しい状
態にに矯正されて自立する。このとき、突起７がプリン
ト基板６に当接し、ベース３又はケース５の下端とプリ
ント基板６の間にスタンドオフが確保される。Then, preheating is performed before soldering. By this preheating, the tongue piece 8 returns to the initial substantially J-shaped shape.
Here, it is assumed that the relay 1 is tilted in the longitudinal direction by opening the left side in the figure upward during transportation or when applying flux as shown in FIG. In this case, as the tongue piece 8 returns to its original shape, the tip of the tongue piece is rolled up and locked on the back surface of the printed circuit board 6. As a result, the returning force pulls down the left side in FIG. 2, and as shown in FIG. , Corrected to the correct state and become independent. At this time, the protrusion 7 contacts the printed circuit board 6, and a standoff is secured between the lower end of the base 3 or the case 5 and the printed circuit board 6.
また、リレー１全体がプリトン基板６より浮き上がっ
ていた場合でも、舌片86の先端が巻き上がって復帰しよ
うとする力により、リレー１が引き下ろされて前記同様
に、正立状態に自立する。Further, even when the entire relay 1 is lifted from the preton board 6, the relay 1 is pulled down by the force of the tip of the tongue piece 86 to be rolled up and to return, so that the relay 1 is self-standing in the upright state as described above.
この予備加熱を終えると、自動はんだによりはんだ付
けを行う。このとき、前記のようにリレー１は傾きや浮
き上がりが矯正されているので、正しい状態に固着され
る。When this preheating is completed, soldering is performed by automatic soldering. At this time, since the inclination and the rising of the relay 1 are corrected as described above, the relay 1 is fixed in the correct state.
なお、前記実施例では、舌片８をケース５の長手方向
に直角方向の下端縁に設けたが、長手方向の下端縁に設
けてもよいし、また、第４図に示すように、スタンドオ
フをとるための突起７の先端に設けてもよい。また、舌
片８はケース５の下端に限らず、ベース３の裏面に突設
してもよい。In the above embodiment, the tongue piece 8 is provided at the lower end edge of the case 5 at right angles to the longitudinal direction, but it may be provided at the lower end edge of the longitudinal direction, or as shown in FIG. You may provide in the front-end | tip of the protrusion 7 for taking off. The tongue piece 8 is not limited to the lower end of the case 5 and may be provided on the back surface of the base 3.
（発明の効果） 以上の説明より明らかなように、本発明によれば、形
状記憶樹脂からなるケースの舌片が初期形状に復帰しよ
うとするとき復帰力により、電気機器ははんだ付け前に
成立状態に自立するため、傾きや浮き上がりがなく実装
され、端子を折り曲げたり、はんだ付け後の手修正が不
要となり、生産正が向上する等の効果を有している。(Effects of the Invention) As is clear from the above description, according to the present invention, when the tongue of the case made of the shape memory resin is about to return to the initial shape, the electric force is established before soldering due to the returning force. Since it is self-sustaining in a state, it is mounted without tilting or rising, and there is an effect that it is not necessary to bend the terminal or manually correct it after soldering, thereby improving production accuracy.
第１図は本発明に係るリレーの斜視図、第２図，第３図
はそれぞれ予備加熱前，後のリレーのプリント基板への
装着状態を示す一部破断正面図、第４図は他の実施例に
係るリレーの部分拡大図である。 １……リレー（電気機器）、３……ベース、 ５……ケース、６……プリント基板、 ８……舌片。FIG. 1 is a perspective view of a relay according to the present invention, FIGS. 2 and 3 are partially cutaway front views showing mounting states of a relay before and after preheating on a printed circuit board, and FIG. It is a partial enlarged view of the relay which concerns on an Example. 1 ... Relay (electrical device), 3 ... Base, 5 ... Case, 6 ... Printed circuit board, 8 ... Tongue piece.
Claims (1)
に、プリント基板を貫通してその先端が裏面に係止する
形状に記憶させたなくとも２個の舌片を突設したことを
特徴とするプリント基板実装用電気機器。1. A case or base formed of a shape memory resin, wherein two tongue pieces are provided in a protruding manner even if the tongue is not memorized in a shape such that the printed circuit board penetrates the printed circuit board and its front end is locked to the back surface. Electrical equipment for printed circuit board mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63262541A JP2560658B2 (en) | 1988-10-18 | 1988-10-18 | Electrical equipment for printed circuit board mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63262541A JP2560658B2 (en) | 1988-10-18 | 1988-10-18 | Electrical equipment for printed circuit board mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02109397A JPH02109397A (en) | 1990-04-23 |
| JP2560658B2 true JP2560658B2 (en) | 1996-12-04 |
Family
ID=17377243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63262541A Expired - Lifetime JP2560658B2 (en) | 1988-10-18 | 1988-10-18 | Electrical equipment for printed circuit board mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2560658B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6376495B2 (en) * | 2014-09-01 | 2018-08-22 | パナソニックＩｐマネジメント株式会社 | Functional module and lighting fixture |
-
1988
- 1988-10-18 JP JP63262541A patent/JP2560658B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02109397A (en) | 1990-04-23 |
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