JP2561388B2 - Cooling mechanism - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling mechanism, and more particularly to a cooling structure for a transformer or a choke coil used in a power supply unit of an electronic computer and a DC-DC converter used in an electronic computer.

[0002]

2. Description of the Related Art Conventionally, as a cooling method for a DC-DC converter, it has been common to use a fan provided below the DC-DC converter for forced air cooling. For it,
In recent years, power consumption has increased as the density of logic boards has increased, so that a DC-DC converter with a large capacity and a small size has been required. However, if an attempt is made to cool a large capacity DC-DC converter by forced air cooling, the heat sink required to perform forced air cooling will become large, so miniaturization of the DC-DC converter cannot be expected. Further, when the air volume of the fan is increased, noise regulation cannot be satisfied, and therefore a soundproof structure must be provided. Therefore, a liquid cooling method is required instead of the forced air cooling.

A cooling structure of this liquid cooling system is shown in FIG.
As shown in FIG. 3, there is a structure in which the DC-DC converter 25 is housed in a metal or plastic hermetic container 23, and the DC-DC converter 25 is immersed in the refrigerant liquid 6 in the hermetic container 23. In this case, since the heat exchanger 24 is provided in the upper part of the sealed container 23, the refrigerant liquid 6 is cooled or the vapor of the refrigerant liquid 6 is condensed by flowing a refrigerant such as water into the heat exchanger 24. . This allows DC
-The heat generated by the DC converter 25 is absorbed by the refrigerant liquid 6, and D
The C-DC converter 25 is cooled. As the coolant liquid 6, various fluorocarbons which are non-corrosive and non-dissociative solutions are used.

On the other hand, as shown in FIG. 12, the secondary rectifying diode 13 of the DC-DC converter 25 is fixed on the cold plate 11 provided with the flow path 12 for flowing the coolant inside the metal, or the circuit board 8 is used. The main switching transistors 9a and 9b mounted on the upper side are fixed via the heat transfer plate 14 to heat and cool the secondary rectifying diode 13 and the main switching transistors 9a and 9b, and the transformer 5 which is another heat generating component. There is also a structure in which the choke coil 7, etc. are forcedly cooled by a fan (not shown).

In such a conventional liquid cooling type cooling structure, since the total heat generation amount of all the heat generating components is very large, the heat exchanger 2 for cooling the refrigerant liquid 6 in which these heat generating components are immersed.
4 becomes large, so DC-DC converter 2
It is difficult to downsize 5. In addition, the DC-DC converter 25
Since the hermetically sealed container 23 itself that accommodates is also large due to the increased sealing effect, it is difficult to downsize the DC-DC converter 25.

Further, even when the cold plate 11 is used, since there are many kinds of heat-generating components and various shapes in the DC-DC converter 25, heat is conducted by directly fixing it to the cold plate 11 like the transformer 5 and the choke coil 7. Some heat-generating components cannot be cooled. Therefore,
There is also a problem in that a separate fan must be provided because such a heat-generating component must be forcedly cooled by a fan.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned problems of the prior art, and is miniaturized without providing a fan for forcibly air-cooling a heat-generating component that cannot perform heat conduction cooling. It is an object of the present invention to provide a cooling mechanism capable of achieving the above.

[0008]

The cooling mechanism according to the present invention is a cooling mechanism for cooling a plurality of heat-generating components with a cold plate , wherein the cold plate among the plurality of heat-generating components is used.
It can be fixed directly to the
A plurality of sealed container for storing the refrigerant liquid to provided and immersed cooling the specific heat generating component and the specific heat generating component Te, the double by the refrigerant in the cold plate
It is characterized in that the refrigerant liquid in several sealed containers is cooled.

[0009]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a side view of an embodiment of the present invention,
2 is a plan view of FIG. 1, FIG. 3 is a perspective view of a sealed container according to an embodiment of the present invention, and FIG. 4 is a sectional view taken along the line AA of FIG. In these drawings, the transformers 5a and 5b and the choke coils 7a and 7b are respectively immersed in the refrigerant liquid 6 in the sealed containers 1a to 1d. The lids 2a to 2d (the lids 2b to 2d are not shown) of the sealed containers 1a to 1d are finned pipes 3a to 3d as heat exchangers, respectively.
3d is attached. Finned pipes 3a-3d
Is connected via a pipe 15 to a flow path 12 provided for flowing a coolant such as water into a cold plate 11 made of a metal having good thermal conductivity.

Therefore, the flow path 12 of the cold plate 11
When the refrigerant is flowed to the fins, the refrigerant sequentially flows to the finned pipes 3a to 3d through the pipe 15, so that the finned pipes 3a to 3d cool the refrigerant liquid 6 or condense the vapor of the refrigerant liquid 6. . As a result, the heat generated by the transformers 5a, 5b and the choke coils 7a, 7b is absorbed by the refrigerant liquid 6, and the transformers 5a, 5b and the choke coils 7a, 7b are cooled. Also, transformer 5
The terminals a, 5b and the choke coils 7a, 7b can be electrically connected to the outside by connecting terminals 4a to 4d. As the coolant liquid 6, various fluorocarbons which are non-corrosive and non-dissociative solutions are used.

On the other hand, on the cold plate 11, the secondary rectifying diodes 13a and 13b and the heat transfer plate 14 are screwed.
It is fixed by 0. The heat transfer plate 14 has a main switching transistor 9 mounted on the circuit board 8.
a and 9b are fixed by screws 10. Therefore,
By flowing the coolant through the flow path 12 of the cold plate 11, the main switching transistors 9a and 9b and the secondary rectifier diodes 13a and 13b are cooled by heat conduction.

FIG. 5 is a perspective view of a sealed container according to another embodiment of the present invention, and FIG. 6 is a sectional view taken along the line BB of FIG. In these figures, the transformer 5 is immersed in the refrigerant liquid 6 in the sealed container 1. The lid 16 of the hermetically sealed container 1 is provided with a flow passage 17 connected to the flow passage 12 of the cold plate 11 and a cooling fin 18. Therefore, by flowing the refrigerant from the flow path 12 of the cold plate 11 to the flow path 17, the cooling of the cooling liquid 6 or the condensation of the vapor of the cooling liquid 6 is performed. As a result, the heat generated by the transformer 5 is absorbed by the refrigerant liquid 6, and the transformer 5 is cooled. The electrical connection between the transformer 5 and the outside can be made by the connection terminal 4.

FIG. 7 is a side view of another embodiment of the present invention, FIG. 8 is a plan view of FIG. 7, and FIG. 9 is a perspective view of a sealed container according to another embodiment of the present invention. 10 is C in FIG.
It is sectional drawing of the arrow view along the C line. In these figures, the transformers 5a, 5b and the choke coils 7a, 7
b is immersed in the refrigerant liquid 6 in the sealed containers 1a to 1d, respectively. The lids 19a to 19d of the sealed containers 1a to 1d (the lid 19
c and 19d are not shown) inside (sealed containers 1a to 1d)
The cooling fins 21a to 21d (the cooling fin 21)
c and 21d are provided, and a plurality of threaded holes 20 are provided on the outer side which is a smooth surface.

The lids 19a to 19d of the sealed containers 1a to 1d are
The smooth surfaces of 19d are brought into contact with the cold plates 11,
Screw 10 through cold plate 11 and threaded hole 2
The sealed containers 1a to 1d are fixed by being screwed into 0.

As a result, the heat of the refrigerant liquid 6 which has absorbed the heat generated by the transformers 5a and 5b and the choke coils 7a and 7b is cooled by the cooling fins 21a to 21d and the lids 19a to 19d.
Is transmitted to the cold plate 11 via. Therefore, by flowing the refrigerant through the flow path 12 of the cold plate 11, the cooling of the refrigerant liquid 6 or the condensation of the vapor of the refrigerant liquid 6 is performed, and the transformers 5a and 5b and the choke coil 7 are connected.
Cooling of a and 7b is performed. Also, the transformers 5a, 5b
Electrical connection between the choke coils 7a and 7b and the outside can be made by the connection terminals 4a to 4d.

On the other hand, the secondary rectifier diodes 13a and 13b are fixed on the cold plate 11 by the screws 10, and the main switching transistors 9a to 9h mounted on the circuit boards 8a and 8b are insulated by the insulating plates 22a to 22h (insulating plate 22c). 22h are fixed by the screw 10 via (not shown). Therefore, by flowing the coolant in the flow path 12 of the cold plate 11, the main switching transistors 9a to 9h and the secondary rectifying diode 13 are
A and 13b are cooled by heat conduction.

In this way, the transformers 5a, 5 which are directly fixed to the cold plate 11 and cannot be cooled by heat conduction.
b and the choke coils 7a and 7b are immersed in the refrigerant liquid 6 in the sealed containers 1a to 1d, and the flow path 12 of the cold plate 11 is
Cooling of the refrigerant liquid 6 or the refrigerant liquid 6 depending on the refrigerant flowing through
All the heat-generating components can be liquid-cooled by carrying out the condensation of the vapor. Therefore, it is not necessary to provide a fan for forcedly cooling the transformers 5a and 5b and the choke coils 7a and 7b that cannot perform heat conduction cooling.

Further, since the transformers 5a and 5b and the choke coils 7a and 7b are respectively housed in the sealed containers 1a to 1d and individually immersed and cooled, a small heat exchanger may be used. Furthermore, since it is not necessary to house all the heat-generating components in a large sealed container, it is possible to reduce the size.

[0020]

As described above, according to the present invention, a heat generating component capable of heat conduction cooling is cooled by a cold plate,
Heat-conducting cooling is not possible by individually immersing heat-generating components that cannot be cooled by heat conduction in the refrigerant liquid in the sealed container and cooling the refrigerant liquid in the sealed container by the refrigerant in the cold plate. There is an effect that the size can be reduced without providing a fan for forcedly cooling the heat-generating component.

[Brief description of drawings]

FIG. 1 is a side view of an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a perspective view of a sealed container according to an exemplary embodiment of the present invention.

FIG. 4 is a sectional view taken along line AA in FIG.

FIG. 5 is a perspective view of a sealed container according to another embodiment of the present invention.

6 is a cross-sectional view taken along the line BB of FIG. 5 and seen in the direction of the arrow.

FIG. 7 is a side view of another embodiment of the present invention.

FIG. 8 is a plan view of FIG.

FIG. 9 is a perspective view of a sealed container according to another embodiment of the present invention.

10 is a cross-sectional view taken along the line CC of FIG. 9 and seen in the direction of the arrow.

FIG. 11 is a diagram showing a conventional immersion cooling mechanism.

FIG. 12 is a view showing a conventional liquid cooling type cooling mechanism.

[Explanation of symbols]

 1a-1d Sealed container 2a, 16, 19a, 19b Lid 3a-3d Finned pipe 5a, 5b Transformer 6 Refrigerant liquid 7a, 7b Choke coil 11 Cold plate 12 Flow path 15 Pipe 17 Flow path 18, 21a, 21b Cooling fin

Claims (3)

(57) [Claims] 1. A cooling mechanism for cooling a plurality of heat-generating components by a cold plate, the cooling mechanism comprising:
It cannot be cooled by fixing it directly to our cold plate.
It is provided for each specific heat generating component and
A plurality of sealed container for storing the refrigerant liquid for immersion cooling heat component and the specific heat generating component, that is to cool the refrigerant liquid of said plurality of sealing the container by the refrigerant in the cold plate Characteristic cooling mechanism. 2. The inside of each of the plurality of sealed containers is provided.
2. The cooling according to claim 1, further comprising a flow path through which the refrigerant in the cold plate flows in and out, and the refrigerant liquid in the plurality of sealed containers is cooled by the refrigerant in the flow path. mechanism. 3. The cooling medium in each of the plurality of hermetically sealed containers is cooled by the refrigerant in the cold plate by abutting each of the plurality of hermetically sealed containers on the cold plate. Cooling mechanism.