JP2563147B2 - Aqueous resin dispersion - Google Patents
Aqueous resin dispersionInfo
- Publication number
- JP2563147B2 JP2563147B2 JP3145450A JP14545091A JP2563147B2 JP 2563147 B2 JP2563147 B2 JP 2563147B2 JP 3145450 A JP3145450 A JP 3145450A JP 14545091 A JP14545091 A JP 14545091A JP 2563147 B2 JP2563147 B2 JP 2563147B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molecular weight
- aqueous
- allyl
- ether type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 46
- 239000011347 resin Substances 0.000 title claims description 46
- 239000006185 dispersion Substances 0.000 title claims description 37
- 239000005011 phenolic resin Substances 0.000 claims description 70
- 229920001568 phenolic resin Polymers 0.000 claims description 52
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 51
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 claims description 37
- 239000004925 Acrylic resin Substances 0.000 claims description 25
- 229920000178 Acrylic resin Polymers 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 22
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 17
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 7
- 239000012736 aqueous medium Substances 0.000 claims description 5
- 239000000243 solution Substances 0.000 description 36
- 238000000576 coating method Methods 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 238000002360 preparation method Methods 0.000 description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000000178 monomer Substances 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 14
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 238000006266 etherification reaction Methods 0.000 description 8
- 239000003973 paint Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 5
- -1 allyl halide Chemical class 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000005028 tinplate Substances 0.000 description 5
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229960003328 benzoyl peroxide Drugs 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229960002887 deanol Drugs 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 241000257303 Hymenoptera Species 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 description 1
- HFEHLDPGIKPNKL-UHFFFAOYSA-N allyl iodide Chemical compound ICC=C HFEHLDPGIKPNKL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007922 dissolution test Methods 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- FYZZJDABXBPMOG-UHFFFAOYSA-N ethanol;n-methylmethanamine Chemical compound CCO.CNC FYZZJDABXBPMOG-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- IWVKTOUOPHGZRX-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical class CC(=C)C(O)=O.COC(=O)C(C)=C IWVKTOUOPHGZRX-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、水性樹脂分散体に関
し、更に詳しくは、本発明は、金属基材に塗布した際
に、硬化速度が早く、衛生性および可撓性に優れ、着色
変化の極めて小さい塗膜を形成し得る水性塗料などに用
いることのできる水性樹脂分散体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aqueous resin dispersion, and more specifically, the present invention has a high curing rate, excellent hygiene and flexibility, and a color change when applied to a metal substrate. The present invention relates to an aqueous resin dispersion that can be used in an aqueous paint that can form a coating film having an extremely small size.
【0002】[0002]
【従来の技術】従来より、缶塗料や防食塗料などでは、
省エネルギーあるいは環境・公害などの面より溶剤系よ
り水系への移行が望まれており、各種の検討がなされて
いる。その主なものとしては、エポキシ系樹脂をアクリ
ル系樹脂で変性して乳化力のある官能基をその分子内に
導入した自己乳化型樹脂をベースとし、これに硬化剤と
してフェノール系樹脂をコールドブレンドまたはホット
ブレンドしたタイプの塗料が知られている。2. Description of the Related Art Conventionally, in can paints and anticorrosion paints,
From the viewpoints of energy saving, environment and pollution, a shift from a solvent system to a water system is desired, and various studies have been made. The main one is a self-emulsifying type resin in which a functional group having emulsifying power is introduced into the molecule by modifying an epoxy resin with an acrylic resin, and a phenol resin is cold-blended as a curing agent. Alternatively, a hot-blended type paint is known.
【0003】しかしながら、従来より硬化剤として用い
られているフェノール系樹脂は、焼付け硬化時に自己縮
合が起こりやすく、これが硬化塗膜の可撓性の低下を招
き、かつ硬化時の塗膜を着色変化させるという問題点を
有していた。However, the phenolic resins conventionally used as curing agents tend to undergo self-condensation during baking and curing, which leads to a decrease in flexibility of the cured coating film, and changes the color of the coating film during curing. It had the problem of causing it.
【0004】また、従来のフェノール系樹脂を缶塗料や
防食塗料の硬化剤として用いた場合には、塗料を加熱乾
燥硬化させた後にフェノール系樹脂に起因する低分子量
成分が溶出し、安全衛生上問題がある。特にブリキ板、
ニッケルメッキ鋼板などの鉄系基材に上記塗料を用いる
場合には、硬化塗膜の耐食性を向上させるため、一般に
硬化剤としてのフェノール系樹脂を多量に配合する必要
があり、従って上記衛生面における問題が顕著になる欠
点を有する。Further, when a conventional phenol resin is used as a curing agent for can paints and anticorrosion paints, low molecular weight components due to the phenol resin are eluted after the paint is dried by heating and cured, which is a safety and health concern. There's a problem. Especially tinplate,
When the above-mentioned coating material is used for an iron-based base material such as a nickel-plated steel sheet, in order to improve the corrosion resistance of the cured coating film, it is generally necessary to add a large amount of a phenol-based resin as a curing agent. It has the drawback that the problem becomes noticeable.
【0005】[0005]
【発明が解決しようとする課題】本発明の目的は、従来
技術の欠点を克服し、硬化速度が早く、金属基材に塗布
した際に、金属基材に対する密着性が高く、衛生性、可
撓性、耐薬品性等に優れ、かつ着色変化の極めて小さい
塗膜を形成し得る水性樹脂分散体を提供するにある。DISCLOSURE OF THE INVENTION The object of the present invention is to overcome the drawbacks of the prior art, to have a high curing speed, to have high adhesion to a metal substrate when applied to a metal substrate, and to improve hygiene and hygiene. Another object of the present invention is to provide an aqueous resin dispersion which is excellent in flexibility, chemical resistance and the like and which can form a coating film having an extremely small color change.
【0006】[0006]
【課題を解決するための手段】本発明によって、上記目
的を達成し得る水性樹脂分散体が提供される。According to the present invention, there is provided an aqueous resin dispersion which can achieve the above object.
【0007】[0007]
【0008】すなわち、本発明は、カルボキシル基を含
有するアクリル系樹脂(A)、エポキシ系樹脂(B)お
よびフェノール系樹脂(C)とをアミンの存在下に水性
媒体中に分散せしめてなる水性樹脂分散体において、フ
ェノール系樹脂(C)としてフェノール系樹脂のフェノ
ール性水酸基の20%以上80%未満がアリルエーテル
化されており、重量平均分子量が250〜800であ
り、かつ分子量が250未満の低分子量成分の含有量が
10重量%以下のアリルエーテル型フェノール樹脂を使
用し、フェノール系樹脂(C)はカルボキシル基を含有
するアクリル系樹脂(A)および/またはエポキシ系樹
脂(B)と予備縮合されてなることを特徴とする水性樹
脂分散体に関する。That is, the present invention is an aqueous solution obtained by dispersing an acrylic resin (A), an epoxy resin (B) and a phenolic resin (C) containing a carboxyl group in an aqueous medium in the presence of an amine. In the resin dispersion, 20% or more and less than 80% of the phenolic hydroxyl groups of the phenolic resin as the phenolic resin (C) are allyl etherified, the weight average molecular weight is 250 to 800, and the molecular weight is less than 250. An allyl ether type phenol resin having a content of a low molecular weight component of 10% by weight or less is used, and the phenol resin (C) is a spare with a carboxyl group-containing acrylic resin (A) and / or epoxy resin (B). The present invention relates to an aqueous resin dispersion characterized by being condensed.
【0009】本発明において使用されるカルボキシル基
を含有するアクリル系樹脂(A)は、アクリル酸、メタ
クリル酸などの一塩基性カルボン酸モノマーと、その他
の共重合性モノマーからなるモノマー混合物をベンゾイ
ルパーオキサイドなどの通常のラジカル重合開始剤を用
いて、80〜150℃の温度で共重合せしめることによ
り得ることができる。その他の共重合性モノマーとして
は、アクリル酸メチル、アクリル酸エチル、アクリル酸
イソプロピル、アクリル酸n−ブチル、アクリル酸イソ
ブチル、アクリル酸n−オクチル、アクリル酸ドデシル
などのアクリル酸エステル類、メタクリル酸メチル、メ
タクリル酸プロピル、メタクリル酸n−ブチル、メタク
リル酸n−オクチル、メタクリル酸ドデシルなどのメタ
クリル酸エステル類、スチレン、ビニルトルエン、2−
メチルスチレン、クロルスチレンなどのスチレン系モノ
マー、アクリル酸ヒドロキシエチル、アクリル酸ヒドロ
キシプロピル、メタクリル酸ヒドロキシエチル、メタク
リル酸ヒドロキシプロピルなどのヒドロキシ基含有モノ
マー、N−メチロールアクリルアミド、N−ブトキシメ
チルアクリルアミドなどのN−置換アクリル系モノマ
ー、アクリル酸グリシジル、メタクリル酸グリシジルな
どのエポキシ基含有モノマー、アクリロニトリルなどが
あげられ、これらその他の共重合性モノマーは、必要に
応じて2種以上を併用することもできる。The carboxyl group-containing acrylic resin (A) used in the present invention is a benzoylperoxide containing a monomer mixture containing a monobasic carboxylic acid monomer such as acrylic acid or methacrylic acid and another copolymerizable monomer. It can be obtained by copolymerizing at a temperature of 80 to 150 ° C. using a usual radical polymerization initiator such as oxide. Other copolymerizable monomers include acrylates such as methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, n-octyl acrylate, dodecyl acrylate, methyl methacrylate Methacrylates such as propyl methacrylate, n-butyl methacrylate, n-octyl methacrylate, dodecyl methacrylate, styrene, vinyltoluene,
Styrene-based monomers such as methylstyrene and chlorostyrene, hydroxy group-containing monomers such as hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate and hydroxypropyl methacrylate, N-methylol acrylamide, N-butoxymethyl acrylamide and the like N Examples thereof include substituted acrylic monomers, epoxy group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, and acrylonitrile. These other copolymerizable monomers may be used in combination of two or more, if necessary.
【0010】一塩基性カルボン酸モノマーとその他の共
重合性モノマーの共重合割合は、一塩基性カルボン酸モ
ノマー30〜90重量%とその他の共重合性モノマー7
0〜10重量%であることが好ましい。The copolymerization ratio of the monobasic carboxylic acid monomer and the other copolymerizable monomer is such that 30 to 90% by weight of the monobasic carboxylic acid monomer and the other copolymerizable monomer 7 are used.
It is preferably 0 to 10% by weight.
【0011】その他の共重合性モノマーの共重合割合が
10重量%未満では、得られるカルボキシル基を含有す
るアクリル系樹脂(A)の水性媒体中への分散性が悪
い。また、その他の共重合性モノマーの共重合割合が7
0重量%より多い場合は、カルボキシル基を含有するア
クリル系樹脂(A)の粘度が高くなり過ぎて円滑に製造
できないばかりでなく、このアクリル系樹脂(A)を使
用して水性樹脂分散体を調整すると、水性樹脂分散体か
ら形成される塗膜の耐水性が悪くなる。When the copolymerization ratio of the other copolymerizable monomer is less than 10% by weight, the resulting acrylic resin (A) containing a carboxyl group has poor dispersibility in an aqueous medium. Further, the copolymerization ratio of the other copolymerizable monomer is 7
When the content is more than 0% by weight, not only the viscosity of the carboxyl group-containing acrylic resin (A) becomes too high to produce the resin smoothly, but also the aqueous resin dispersion is prepared using the acrylic resin (A). When adjusted, the water resistance of the coating film formed from the aqueous resin dispersion becomes poor.
【0012】カルボキシル基を含有するアクリル系樹脂
(A)の重量平均分子量は、1万〜5万の範囲のものが
望ましく、重量平均分子量が1万より小さいと塗膜の加
工性が低下する。また、重量平均分子量が5万より大き
い場合は、水性媒体中への分散性が悪くなる。The weight average molecular weight of the acrylic resin (A) containing a carboxyl group is preferably in the range of 10,000 to 50,000, and if the weight average molecular weight is less than 10,000, the processability of the coating film is deteriorated. When the weight average molecular weight is more than 50,000, dispersibility in an aqueous medium becomes poor.
【0013】また本発明において使用されるエポキシ系
樹脂(B)は、ビスフェノールAとエピクロロヒドリン
とをアルカリ触媒の存在下で縮合させることにより得ら
れ、1分子中に平均1〜2個のエポキシ基を有し、数平
均分子量が900以上のものが好ましい。市販品として
は、シェル化学株式会社製のエピコート1009、東都
化成株式会社製のYD−017,YD−019などがあ
る。また、前記ビスフェノールA型エポキシ樹脂のエポ
キシ基に脱水ヒマシ油などの植物油脂肪酸もしくはビス
フェノールAなどの変性剤を反応させた変性エポキシ樹
脂を用いることもできる。The epoxy resin (B) used in the present invention is obtained by condensing bisphenol A and epichlorohydrin in the presence of an alkali catalyst, and has an average of 1 to 2 molecules per molecule. Those having an epoxy group and having a number average molecular weight of 900 or more are preferable. As commercially available products, there are Epicoat 1009 manufactured by Shell Chemical Co., Ltd., YD-017, YD-019 manufactured by Tohto Kasei Co., Ltd., and the like. A modified epoxy resin obtained by reacting a vegetable oil fatty acid such as dehydrated castor oil or a modifying agent such as bisphenol A with an epoxy group of the bisphenol A type epoxy resin can also be used.
【0014】本発明において、フェノール系樹脂(C)
として使用されるアリルエーテル型フェノール樹脂は、
まず、フェノール類とフェノール類1モルに対して1〜
4モルのホルムアルデヒドを高濃度のアルカリ触媒の存
在下で、室温〜60℃程度の比較的低温で長時間の反応
を行い、更に、必要に応じ70〜90℃に温度を上げて
縮合を進めフェノール類にホルムアルデヒドを付加さ
せ、かつ生成物の重量平均分子量が所望の値になるま
で、および分子量が250未満の低分子量成分が10%
以下になるまで縮合反応を行ってフェノール系樹脂を合
成する。しかるのち、このフェノール系樹脂のフェノー
ル性水酸基1モルに対して0.2〜0.8モルのハロゲ
ン化アリルを反応させてフェノール性水酸基をアリルエ
ーテルに置換し、その後、常法により精製し、触媒など
の不純物を除去することにより得られる。In the present invention, the phenolic resin (C)
Allyl ether type phenol resin used as
First, 1 to 1 mol of phenols and phenols
In the presence of a high-concentration alkali catalyst, 4 mol of formaldehyde is reacted at a relatively low temperature of room temperature to 60 ° C for a long time, and further, if necessary, the temperature is raised to 70 to 90 ° C to promote the condensation and phenol. Formaldehyde is added to the compounds and the weight average molecular weight of the product reaches a desired value, and a low molecular weight component having a molecular weight of less than 250 is 10%.
A phenolic resin is synthesized by performing a condensation reaction until the temperature becomes below. Then, 0.2 to 0.8 mol of allyl halide was reacted with 1 mol of the phenolic hydroxyl group of this phenolic resin to substitute the allyl ether for the phenolic hydroxyl group, and then purified by a conventional method. It is obtained by removing impurities such as a catalyst.
【0015】本発明において使用されるアリルエーテル
型フェノール樹脂は、フェノール系樹脂中のフェノール
性水酸基の20%以上80%未満がアリルエーテル化さ
れ、重量平均分子量が250〜800であり、かつ分子
量が250未満の低分子量成分の含有量が10重量%以
下のものである。In the allyl ether type phenol resin used in the present invention, 20% or more and less than 80% of the phenolic hydroxyl group in the phenolic resin is allyl etherified, the weight average molecular weight is 250 to 800, and the molecular weight is The content of low molecular weight components less than 250 is 10% by weight or less.
【0016】アリルエーテル化率が20%未満のアリル
エーテル型フェノール樹脂を使用した場合は、アリルエ
ーテル化による本発明の顕著な効果が得られない。ま
た、アリルエーテル化率が80%以上のアリルエーテル
型フェノール樹脂を使用した場合は、硬化速度が遅くな
る傾向がある。When an allyl ether type phenol resin having an allyl etherification rate of less than 20% is used, the remarkable effects of the present invention due to allyl etherification cannot be obtained. When an allyl ether type phenolic resin having an allyl etherification rate of 80% or more is used, the curing speed tends to be slow.
【0017】また、アリルエーテル型フェノール樹脂の
重量平均分子量が250未満のものを使用した場合は、
加工性、衛生性が劣る傾向にあり、また、重量平均分子
量が800を超える場合は、分散性、相溶性が劣る。When an allyl ether type phenol resin having a weight average molecular weight of less than 250 is used,
Processability and hygiene tend to be poor, and when the weight average molecular weight exceeds 800, dispersibility and compatibility are poor.
【0018】さらに、分子量が250未満の低分子量成
分の含有量が10重量%を超えるアリルエーテル型フェ
ノール樹脂を使用した場合は、衛生性に劣る。Further, when an allyl ether type phenol resin having a low molecular weight component having a molecular weight of less than 250 and a content of more than 10% by weight is used, hygiene is poor.
【0019】アリルエーテル型フェノール樹脂のアリル
エーテル化率の測定は、 1H−NMRによる9ppm 付近
のフェノール性水酸基と5.2ppm 付近のアリルエーテ
ル基の比より同定することができる。The allyl etherification rate of the allyl ether type phenol resin can be identified by the ratio of the phenolic hydroxyl group around 9 ppm and the allyl ether group around 5.2 ppm by 1 H-NMR.
【0020】また、アリルエーテル型フェノール樹脂の
重量平均分子量は、ゲルパーミエーションクロマトグラ
フィー(GPC)により測定することができる。The weight average molecular weight of the allyl ether type phenol resin can be measured by gel permeation chromatography (GPC).
【0021】フェノール系樹脂を合成するために使用さ
れるフェノール類としては、フェノール、クレゾール、
エチルフェノール、ブチルフェノール、オクチルフェノ
ールなどのアルキルフェノール類、ビスフェノールA、
ビスフェノールFなどのビスフェノール類などがあげら
れ、これらは2種以上を併用することもできる。The phenols used to synthesize the phenolic resin include phenol, cresol,
Alkylphenols such as ethylphenol, butylphenol, octylphenol, bisphenol A,
Examples thereof include bisphenols such as bisphenol F, and these can be used in combination of two or more kinds.
【0022】アルカリ触媒としては、水酸化ナトリウ
ム、水酸化カリウムなどのアルカリ金属−水酸化物、水
酸化カルシウム、水酸化マグネシウムなどのアルカリ土
類−水酸化物を用いることができる。As the alkali catalyst, alkali metal hydroxides such as sodium hydroxide and potassium hydroxide, and alkaline earth hydroxides such as calcium hydroxide and magnesium hydroxide can be used.
【0023】ハロゲン化アリルとしては、塩化アリル、
臭化アリル、ヨウ化アリルなどがあげられる。As the allyl halide, allyl chloride,
Allyl bromide, allyl iodide and the like can be mentioned.
【0024】本発明の水性樹脂分散体は、フェノール系
樹脂(C)がカルボキシル基を含有するアクリル系樹脂
(A)および/またはエポキシ系樹脂(B)と予備縮合
されてなることを特徴とする。The aqueous resin dispersion of the present invention is characterized in that the phenol resin (C) is pre-condensed with the carboxyl group-containing acrylic resin (A) and / or epoxy resin (B). .
【0025】[0025]
【0026】上記のカルボキシル基を含有するアクリル
系樹脂(A)および/またはエポキシ系樹脂(B)とフ
ェノール系樹脂(C)が予備縮合している本発明の水性
樹脂分散体を得る方法としては、例えば下記(イ)〜
(ハ)の方法があげられる。As a method for obtaining the aqueous resin dispersion of the present invention in which the above-mentioned acrylic resin (A) and / or epoxy resin (B) containing a carboxyl group and phenolic resin (C) are precondensed. , For example (a) ~
Method (c) can be mentioned.
【0027】(イ)カルボキシル基を含有するアクリル
系樹脂(A)および/またはエポキシ系樹脂(B)とフ
ェノール系樹脂(C)とをアミンの存在下または不存在
下、親水性溶媒中で70〜120℃の温度で30分間〜
2時間反応させる方法。(A) Acrylic resin (A) and / or epoxy resin (B) containing a carboxyl group and phenolic resin (C) in a hydrophilic solvent in the presence or absence of amine in a hydrophilic solvent 70 ~ 30 minutes at a temperature of 120 ℃ ~
A method of reacting for 2 hours.
【0028】(ロ)カルボキシル基を含有するアクリル
系樹脂(A)とエポキシ系樹脂(B)とを親水性溶媒
中、アミンの存在下または不存在下で50〜150℃の
温度で30分間〜3時間予め反応させてカルボキシル基
を含有するアクリル系樹脂(A)とエポキシ系樹脂
(B)とを部分的に結合させたのち、フェノール系樹脂
(C)を加え、更に70〜120℃で30分間〜2時間
反応させる方法。(B) Carboxyl group-containing acrylic resin (A) and epoxy resin (B) in a hydrophilic solvent in the presence or absence of an amine at a temperature of 50 to 150 ° C. for 30 minutes to After preliminarily reacting for 3 hours to partially bond the acrylic resin (A) containing a carboxyl group and the epoxy resin (B), the phenolic resin (C) is added, and further at 70 to 120 ° C. for 30 minutes. Method of reacting for 2 minutes to 2 minutes.
【0029】(ハ)エポキシ系樹脂(B)とフェノール
系樹脂(C)とを親水性溶媒に溶解したのち、70〜1
20℃で30分間〜2時間の予備縮合反応を行い、次い
でカルボキシル基を含有するアクリル系樹脂(A)をア
ミンの存在下または不存在下に反応させる方法。(C) After dissolving the epoxy resin (B) and the phenol resin (C) in a hydrophilic solvent, 70 to 1
A method in which a precondensation reaction is performed at 20 ° C. for 30 minutes to 2 hours, and then the acrylic resin (A) containing a carboxyl group is reacted in the presence or absence of an amine.
【0030】本発明の水性樹脂分散体において、カルボ
キシル基を含有するアクリル系樹脂(A)、エポキシ系
樹脂(B)およびフェノール系樹脂(C)の使用割合
は、固形分重量比で(A)/(B)=100/200〜
500であり、かつ(A)+(B)/(C)=95/5
〜70/30であることが好ましい。In the aqueous resin dispersion of the present invention, the proportion of the acrylic resin (A), the epoxy resin (B) and the phenol resin (C) containing a carboxyl group used is (A) in terms of solid content weight ratio. / (B) = 100/200 ~
500 and (A) + (B) / (C) = 95/5
It is preferably about 70/30.
【0031】前記アミンとしては、例えばアンモニア水
溶液、モノエタノールアミン、ジメチルアミンエタノー
ル等のごときアルコールアミンがあげられる。アミン
は、水性樹脂分散体のpHが4〜11の範囲内になるよ
うな割合で使用すればよく、具体的にはカルボキシル基
を含有するアクリル系樹脂(A)、エポキシ系樹脂
(B)およびフェノール系樹脂(C)の総計重量に対し
て約1%程度である。Examples of the amine include alcohol amines such as aqueous ammonia solution, monoethanolamine and dimethylamine ethanol. The amine may be used in a ratio such that the pH of the aqueous resin dispersion is within the range of 4 to 11, and specifically, the acrylic resin (A), the epoxy resin (B) and the carboxyl group-containing acrylic resin (B) and It is about 1% based on the total weight of the phenolic resin (C).
【0032】また、前記親水性溶媒としては、例えばn
−ブタノール、ブチルセロソルブ等があげられる。The hydrophilic solvent is, for example, n
-Butanol, butyl cellosolve and the like.
【0033】本発明において水性媒体とは、水と親水性
溶媒との混合物を意味する。親水性溶媒の割合は、水性
樹脂分散体中の20重量%以下であることが好ましい。In the present invention, the aqueous medium means a mixture of water and a hydrophilic solvent. The proportion of the hydrophilic solvent is preferably 20% by weight or less in the aqueous resin dispersion.
【0034】本発明の水性樹脂分散体において、カルボ
キシル基を含有するアクリル系樹脂(A)とエポキシ系
樹脂(B)との部分結合物の確認は、GPCによる分子
量分布のチャートによって知ることができる。カルボキ
シル基を含有するアクリル系樹脂(A)および/または
エポキシ系樹脂(B)とフェノール系樹脂(C)との予
備縮合物の確認は、 1H−NMRによる2.5〜2.9
ppm に観測されるオキシラン量の測定、GPCによる分
子量分布のチャートによって知ることができる。In the aqueous resin dispersion of the present invention, confirmation of a partially bound product of the acrylic resin (A) containing a carboxyl group and the epoxy resin (B) can be confirmed by the molecular weight distribution chart by GPC. . Confirmation of a precondensate of a carboxyl group-containing acrylic resin (A) and / or epoxy resin (B) and a phenolic resin (C) can be confirmed by 1 H-NMR from 2.5 to 2.9.
It can be known from the measurement of the amount of oxirane observed in ppm and the chart of the molecular weight distribution by GPC.
【0035】本発明の水性樹脂分散体には、必要に応じ
て塗工性を改良するための界面活性剤、消泡剤などを添
加することもできる。また、用途に応じて、適当な防錆
剤、顔料、充填剤などを配合して、防錆プライマー、印
刷インキ、防食性塗料などに使用することができる。If necessary, a surfactant, an antifoaming agent or the like may be added to the aqueous resin dispersion of the present invention to improve the coatability. Further, an appropriate rust inhibitor, pigment, filler or the like may be blended depending on the use and used for a rust-preventive primer, a printing ink, an anti-corrosion paint and the like.
【0036】適用される基材としては、未処理鋼板、処
理鋼板、ブリキ板、アルミ板などの金属板が適してお
り、塗装方法としては、エアースプレー、エアーレスス
プレーなどのスプレー塗装、ロールコーター塗装などの
方法を用いることができる。As a base material to be applied, a metal plate such as an untreated steel plate, a treated steel plate, a tin plate and an aluminum plate is suitable, and a coating method includes spray coating such as air spray and airless spray, and a roll coater. A method such as painting can be used.
【0037】[0037]
【作用】従来のフェノール系樹脂を硬化剤として用いた
場合は、エポキシ系樹脂とフェノール系樹脂の反応の他
に、フェノール系樹脂の自己縮合も同時に進行するた
め、均一な硬化塗膜を得ることが難しく、従って硬化塗
膜は部分的に海島構造をとってしまい、このため硬化塗
膜は可撓性に劣るものと推定される。本発明において
は、従来のフェノール系樹脂のフェノール性水酸基を部
分的にアリルエーテル化させたアリルエーテル型フェノ
ール樹脂を用いるため、フェノール系樹脂の自己縮合速
度が抑制され、可撓性に優れた均一な硬化塗膜が得られ
るものと推定される。[Function] When a conventional phenolic resin is used as a curing agent, in addition to the reaction between the epoxy resin and the phenolic resin, the self-condensation of the phenolic resin also proceeds at the same time, so that a uniform cured coating film can be obtained. Therefore, the cured coating film partially takes a sea-island structure, and it is presumed that the cured coating film has poor flexibility. In the present invention, since the allyl ether type phenol resin in which the phenolic hydroxyl group of the conventional phenol resin is partially allyl etherified is used, the self-condensation rate of the phenol resin is suppressed and the flexibility is uniform. It is presumed that such a cured coating film can be obtained.
【0038】また、従来のフェノール系樹脂では、分子
量が250未満の低分子量成分はある程度の水溶性を持
ち、これが硬化塗膜の衛生性を低下させるものと推定さ
れるが、この低分子量成分を極力少なくすることによ
り、衛生性が向上するものと想定される。Further, in the conventional phenolic resin, the low molecular weight component having a molecular weight of less than 250 has water solubility to some extent, which is presumed to reduce the hygiene of the cured coating film. It is assumed that the hygiene will be improved by reducing it as much as possible.
【0039】さらに、従来のフェノール系樹脂を硬化剤
として使用した場合の硬化塗膜の着色変化は、フェノー
ル性水酸基の酸化による脱水素反応−メチレン結合部の
酸化による着色色素の生成が主因であり、本発明におけ
るフェノール性水酸基のアリルエーテル化は、この着色
メカニズムの第一歩であるフェノール性水酸基の酸化を
抑制することができるため、硬化時に不要の着色色素を
生成することなく、従って、着色変化の極めて小さい塗
膜を得ることができるものと想定される。Further, the color change of the cured coating film when a conventional phenolic resin is used as a curing agent is mainly due to the dehydrogenation reaction due to the oxidation of the phenolic hydroxyl group and the formation of the coloring pigment due to the oxidation of the methylene bond. The allyl etherification of the phenolic hydroxyl group in the present invention can suppress the oxidation of the phenolic hydroxyl group, which is the first step of this coloring mechanism, and thus does not generate an unnecessary coloring dye at the time of curing, and therefore, coloring It is assumed that a coating film with extremely small change can be obtained.
【0040】[0040]
【実施例】以下、実施例および比較例をあげて本発明を
更に詳細に説明する。なお、実施例および比較例中、
「部」,「%」は特に断りのない限りそれぞれ「重量
部」,「重量%」を示す。The present invention will be described below in more detail with reference to examples and comparative examples. In the examples and comparative examples,
Unless otherwise specified, "part" and "%" indicate "part by weight" and "% by weight", respectively.
【0041】また、実施例および比較例中の各種の試験
法は、以下の通りである。Various test methods used in Examples and Comparative Examples are as follows.
【0042】(1)密着性 塗装面にナイフを利用して1.5mm幅で縦横それぞれ1
1本の切り目をいれ、そこに24mm幅のセロハン粘着テ
ープを密着させ強く剥したときのゴバン目部の未剥離数
を表す。(1) Adhesion Using a knife on the coated surface, a width of 1.5 mm and a length and width of 1
The number of unstripped portions of the gobang when a single cut is made and a cellophane adhesive tape having a width of 24 mm is closely adhered to the cut and strongly peeled off is shown.
【0043】(2)MEKラビング 硬化塗膜上でMEK(メチルエチルケトン)を充分にし
み込ませたガーゼを付した2ポンドハンマーを往復さ
せ、ブリキ面が露出したときの往復数を表す。(2) MEK rubbing This is the number of reciprocations when the tin plate surface is exposed by reciprocating a 2 pound hammer with a gauze sufficiently impregnated with MEK (methyl ethyl ketone) on the cured coating film.
【0044】(3)加工性 特殊ハゼ折り型デュポン衝撃試験器を用い、下部に2つ
折りしたブリキ板に塗装した試料をおき、接触面が平ら
な重さ1kgの鉄の重りを高さ50cmから落下させたとき
に生じる折り曲げ部分の亀裂の長さを測定した。 0〜10mm…○ 10〜20mm…△ 20mm以上……×(3) Workability Using a special goby folding type DuPont impact tester, put a sample painted on a tin plate folded in two at the bottom and place a 1 kg iron weight with a flat contact surface from a height of 50 cm. The length of the crack in the bent portion generated when dropped was measured. 0-10mm ... ○ 10-20mm… △ 20mm or more …… ×
【0045】(4)耐沸騰水性 ブリキに塗装した試験パネルを100℃−30分で水中
処理後、塗膜を視覚及び(1)の密着性と同一の評価で
判定する。(4) Resistance to boiling water A test panel coated on a tin plate was treated in water at 100 ° C. for 30 minutes, and then the coating film was judged by the same evaluation as the visual observation and the adhesion property of (1).
【0046】(5)耐酸性 30 vol%硫酸を塗膜に滴下し、50℃−3時間保存し
た後、硫酸分を拭き取り、痕跡の無いものを○、痕跡の
残るものを×として評価した。(5) Acid resistance 30 vol% sulfuric acid was added dropwise to the coating film and stored at 50 ° C. for 3 hours, and then the sulfuric acid content was wiped off.
【0047】(6)衛生性 耐圧びんに、塗膜と塗膜1cm2 当り純水1mlを入れ、1
30℃で30分間処理した後、食品衛生法記載の試験法
(溶出試験)に準じて測定した。 10ppm 以下…○ 10ppm 以上…×(6) Hygiene The coating film and 1 ml of pure water per 1 cm 2 of coating film were put in a pressure resistant bottle, and 1
After treating at 30 ° C. for 30 minutes, the measurement was performed according to the test method (dissolution test) described in the Food Sanitation Law. 10ppm or less ... ○ 10ppm or more ... ×
【0048】実施例1 アクリル系樹脂溶液(A)の合成 スチレン 300部 アクリル酸エチル 210部 メタクリル酸 90部 ブチルセロソルブ 388部 過酸化ベンゾイル 12部Example 1Synthesis of acrylic resin solution (A) Styrene 300 parts Ethyl acrylate 210 parts Methacrylic acid 90 parts Butyl cellosolve 388 parts Benzoyl peroxide 12 parts
【0049】上記組成の混合物の1/3を窒素ガスで置
換した4つ口フラスコに仕込み、90℃に加熱し、残り
の全量をその温度のまま1時間30分かけて滴下した。
滴下終了後、更にその温度で2時間反応させた後冷却
し、酸価110、固形分60.2%のアクリル系樹脂溶
液(A)を得た。アクリル系樹脂の重量平均分子量は2
1,000であった。One-third of the mixture having the above composition was charged into a four-necked flask whose atmosphere was replaced with nitrogen gas, heated to 90 ° C., and the remaining whole amount was added dropwise at that temperature over 1 hour and 30 minutes.
After completion of the dropwise addition, the mixture was further reacted at that temperature for 2 hours and then cooled to obtain an acrylic resin solution (A) having an acid value of 110 and a solid content of 60.2%. The weight average molecular weight of the acrylic resin is 2
It was 1,000.
【0050】 エポキシ系樹脂溶液(B)の調整 エピコート1009(数平均分子量5,300) 300部 ブチルセロソルブ 200部[0050]Preparation of epoxy resin solution (B) Epicoat 1009 (number average molecular weight 5,300) 300 parts Butyl cellosolve 200 parts
【0051】上記の成分を窒素ガスで置換した4つ口フ
ラスコに仕込み、120℃に加熱し完全に溶解したとこ
ろで冷却し、固形分60%のエポキシ系樹脂溶液(B)
を得た。An epoxy resin solution (B) having a solid content of 60% was placed in a four-necked flask in which the above components were replaced with nitrogen gas, heated to 120 ° C. and completely cooled.
I got
【0052】アリルエーテル型フェノール系樹脂溶液
(C−I)の調整 フェノール94部、37%ホルマリン水243部、25
%水酸化ナトリウム水溶液160部を4つ口フラスコに
仕込み、40℃で6時間反応させ、更に70℃で1時間
反応させた。次いで、このフェノール系樹脂に塩化アリ
ル38.3部を仕込み、40℃で4時間反応させた後、
分離した水を除去した。続いて10%リン酸水溶液を添
加してpH3.2に調整し、水洗4回を繰り返した後、
減圧下にて水を除去しn−ブタノールを添加し、固形分
60%のアリルエーテル型フェノール系樹脂溶液(C−
I)を得た。得られたアリルエーテル型フェノール系樹
脂溶液の重量平均分子量(GPCにより測定)は480
であり、分子量が250未満の低分子量成分の含有量は
4.3重量%であった。なお、 1H−NMRによってア
リルエーテル型フェノール系樹脂溶液のアリルエーテル
化率を測定したところ、アリルエーテル化率は48%で
あった。[0052]Allyl ether type phenolic resin solution
Adjustment of (C-I) Phenol 94 parts, 37% formalin water 243 parts, 25
% 160% sodium hydroxide solution in a 4-necked flask
Charge, react at 40 ° C for 6 hours, and further at 70 ° C for 1 hour
It was made to react. The phenolic resin is then added to the chloride
After charging 38.3 parts of the mixture and reacting at 40 ° C. for 4 hours,
The separated water was removed. Then, add 10% phosphoric acid aqueous solution.
After adjusting the pH to 3.2 and repeating washing 4 times with water,
Water was removed under reduced pressure and n-butanol was added to the solid content.
60% allyl ether type phenolic resin solution (C-
I) was obtained. Obtained allyl ether type phenolic tree
The weight average molecular weight of the fat solution (measured by GPC) is 480.
And the content of low molecular weight components having a molecular weight of less than 250 is
It was 4.3% by weight. In addition,1By H-NMR
Allyl ether of rill ether type phenolic resin solution
When the conversion rate was measured, the allyl ether conversion rate was 48%.
there were.
【0053】 水性樹脂分散体の調整 アクリル系樹脂溶液(A) 25部 エポキシ系樹脂溶液(B) 100部 n−ブタノール 10部 ブチルセロソルブ 10部 ジメチルアミノエタノール 1部 ジメチルアミノエタノール 5部 アリルエーテル型フェノール系樹脂溶液(C−I) 31部 脱イオン水 205部 窒素ガス置換した4つ口フラスコに〜を仕込み、1
00℃に昇温した後、を滴下し、100℃で2時間反
応させた。次いで、を添加し、更に、を添加し、1
00℃の温度で10分間保持したのちにを添加して固
形分25%の安定な水性樹脂分散体を得た。[0053]Preparation of aqueous resin dispersion Acrylic resin solution (A) 25 parts Epoxy resin solution (B) 100 parts n-Butanol 10 parts Butyl cellosolve 10 parts Dimethylaminoethanol 1 part Dimethylaminoethanol 5 parts Allyl ether type phenolic resin solution (CI) 31 parts Deionized water 205 parts Nitrogen gas-substituted four-necked flask was charged with
After raising the temperature to 00 ° C, add dropwise and incubate at 100 ° C for 2 hours.
I responded. Then add, and then add 1
Hold at a temperature of 00 ° C for 10 minutes and then add
A stable aqueous resin dispersion of 25% form was obtained.
【0054】実施例2アリルエーテル型フェノール系樹脂溶液(C−II)の調
整 実施例1において、アリルエーテル型フェノール系樹脂
溶液(C−I)の調整の際に塩化アリルの仕込み量を6
1.2部にした以外は、実施例1と同様に反応させ、固
形分60%のアリルエーテル型フェノール系樹脂溶液
(C−II)を得た。得られたアリルエーテル型フェノー
ル系樹脂溶液の重量平均分子量は550であり、分子量
が250未満の低分子量成分の含有量は3.1重量%で
あった。また、アリルエーテル型フェノール系樹脂溶液
のアリルエーテル化率を測定したところ、アリルエーテ
ル化率は78%であった。Example 2Preparation of allyl ether type phenolic resin solution (C-II)
Order In Example 1, allyl ether type phenolic resin
When preparing the solution (CI), the charged amount of allyl chloride was adjusted to 6
The reaction was carried out in the same manner as in Example 1 except that the amount was changed to 1.2 parts.
Allyl ether type phenolic resin solution with 60% form factor
(C-II) was obtained. Obtained allyl ether type pheno
The weight average molecular weight of the resin resin solution is 550.
The content of low molecular weight component of less than 250 is 3.1% by weight
there were. Also, allyl ether type phenolic resin solution
The rate of allyl etherification of
The conversion rate was 78%.
【0055】水性樹脂分散体の調整 実施例1において、水性樹脂分散体の調整の際にアリル
エーテル型フェノール系樹脂溶液(C−I)の代りに上
記アリルエーテル型フェノール系樹脂溶液(C−II)を
用いた以外は、実施例1の水性樹脂分散体の調整と同様
な配合、方法によって固形分25%の安定な水性樹脂分
散体を得た。[0055]Preparation of aqueous resin dispersion In Example 1, allyl was added during the preparation of the aqueous resin dispersion.
Instead of the ether type phenolic resin solution (CI)
Allyl ether type phenolic resin solution (C-II)
Same as the preparation of the aqueous resin dispersion of Example 1 except that it was used
Stable aqueous resin content with solid content of 25% depending on the composition and method
I got a scatter.
【0056】実施例3アリルエーテル型フェノール系樹脂溶液(C−III)の調
整 ビスフェノールA228部、37%ホルマリン水324
部、25%水酸化ナトリウム水溶液160部を4つ口フ
ラスコに仕込み、60℃で5時間反応させた。次いで、
塩化アリル38部を仕込み40℃で4時間反応させた。
水層を分離し、更に10%リン酸水溶液でpHを3.4
に調整し、水洗を4回を繰り返した後、減圧下にて水を
除去しn−ブタノールを添加して、固形分60%のアリ
ルエーテル型フェノール系樹脂溶液(C−III)を得た。
得られたアリルエーテル型フェノール系樹脂溶液の重量
平均分子量は420であり、分子量が250未満の低分
子量成分の含有量は0重量%であった。また、アリルエ
ーテル型フェノール系樹脂のアリルエーテル化率を測定
したところ、アリルエーテル化率は22%であった。Example 3Preparation of allyl ether type phenolic resin solution (C-III)
Order Bisphenol A 228 parts, 37% formalin water 324
Parts, 160 parts of 25% aqueous sodium hydroxide solution in 4 mouths
The mixture was placed in a Rasco and reacted at 60 ° C. for 5 hours. Then
38 parts of allyl chloride was charged and reacted at 40 ° C. for 4 hours.
Separate the aqueous layer and adjust the pH to 3.4 with 10% aqueous phosphoric acid.
And repeat washing 4 times with water, and then add water under reduced pressure.
Remove and add n-butanol to remove ants with 60% solids.
A ether type phenolic resin solution (C-III) was obtained.
Weight of the obtained allyl ether type phenolic resin solution
It has an average molecular weight of 420 and a low molecular weight of less than 250.
The content of the molecular weight component was 0% by weight. In addition,
Measurement of allyl etherification rate of ether type phenolic resin
As a result, the allyl etherification rate was 22%.
【0057】水性樹脂分散体の調整 実施例1において、水性樹脂分散体の調整の際にアリル
エーテル型フェノール系樹脂溶液(C−I)の代りに上
記アリルエーテル型フェノール系樹脂溶液(C−III)を
用いた以外は、実施例1の水性樹脂分散体の調整と同様
な配合方法により、固形分25%の安定な水性樹脂分散
体を得た。[0057]Preparation of aqueous resin dispersion In Example 1, allyl was added during the preparation of the aqueous resin dispersion.
Instead of the ether type phenolic resin solution (CI)
Allyl ether type phenolic resin solution (C-III)
Same as the preparation of the aqueous resin dispersion of Example 1 except that it was used
Stable aqueous resin dispersion with solid content of 25% by various blending methods
Got the body
【0058】比較例1アリルエーテル型フェノール系樹脂溶液(C−IV)の調
整 フェノール94部、37%ホルマリン水243部、25
%水酸化ナトリウム水溶液160部を4つ口フラスコに
仕込み、40℃で6時間反応させた後、70℃に昇温
し、その温度で1時間反応させた。次いで、このフェノ
ール系樹脂に塩化アリル7.7部を仕込み、40℃で4
時間反応させた後、10%リン酸水溶液を添加してpH
を3.2に調整した。水洗を4回繰り返した後、減圧下
にて水を除去しn−ブタノールを添加し、固形分60%
のアリルエーテル型フェノール系樹脂溶液(C−IV)を
得た。得られたアリルエーテル型フェノール系樹脂溶液
の重量平均分子量は550であり、分子量が250未満
の低分子量成分の含有量は4.2重量%であった。ま
た、アリルエーテル型フェノール系樹脂のアリルエーテ
ル化率は、9.5%であった。Comparative Example 1Preparation of allyl ether type phenolic resin solution (C-IV)
Order Phenol 94 parts, 37% formalin water 243 parts, 25
% 160% sodium hydroxide solution in a 4-necked flask
After charging and reacting at 40 ° C for 6 hours, the temperature was raised to 70 ° C.
And allowed to react at that temperature for 1 hour. Then this pheno
7.7 parts of allyl chloride was added to a resin and the mixture was mixed at 40 ° C
After reacting for 10 hours, add 10% phosphoric acid aqueous solution to adjust the pH.
Was adjusted to 3.2. After washing with water 4 times, under reduced pressure
To remove water and add n-butanol, solid content 60%
Allyl ether type phenolic resin solution (C-IV)
Obtained. Obtained allyl ether type phenolic resin solution
Has a weight average molecular weight of 550 and a molecular weight of less than 250
The content of the low molecular weight component was 4.2% by weight. Well
Allyl ether type phenolic resin
The conversion rate was 9.5%.
【0059】水性樹脂分散体の調整 実施例1において、水性樹脂分散体の調整の際にアリル
エーテル型フェノール系樹脂溶液(C−I)の代りに上
記アリルエーテル型フェノール系樹脂溶液(C−IV)を
用いた以外は、実施例1の水性樹脂分散体の調整と同様
な配合方法によって固形分25%の安定な水性樹脂分散
体を得た。[0059]Preparation of aqueous resin dispersion In Example 1, allyl was added during the preparation of the aqueous resin dispersion.
Instead of the ether type phenolic resin solution (CI)
Allyl ether type phenolic resin solution (C-IV)
Same as the preparation of the aqueous resin dispersion of Example 1 except that it was used
Stable aqueous resin dispersion with solid content of 25% by various blending methods
Got the body
【0060】比較例2アリルエーテル型フェノール系樹脂溶液(C−V)の調
整 フェノール94部、37%ホルマリン243部、25%
水酸化ナトリウム水溶液160部を4つ口フラスコに仕
込み、40℃で6時間反応させた。次いで、塩化アリル
76.5部を仕込み40℃で4時間反応させた後、分離
した水を除去した。続いて、10%リン酸水溶液を添加
してpHを3.2に調整した。水洗を4回繰り返した
後、減圧下にて水を除去しn−ブタノールを添加し、固
形分60%のアリルエーテル型フェノール系樹脂溶液
(C−V)を得た。得られたアリルエーテル型フェノー
ル系樹脂溶液の重量平均分子量は280、分子量が25
0未満の低分子量成分の含有量は42.6重量%、アリ
ルエーテル化率は、94%であった。Comparative Example 2Preparation of allyl ether type phenolic resin solution (CV)
Order Phenol 94 parts, 37% Formalin 243 parts, 25%
160 parts of sodium hydroxide aqueous solution is prepared in a 4-necked flask.
And reacted at 40 ° C. for 6 hours. Then allyl chloride
Charge 76.5 parts and react at 40 ° C for 4 hours, then separate
The water removed was removed. Then, add 10% phosphoric acid aqueous solution
The pH was adjusted to 3.2. Washing with water was repeated 4 times
After that, water was removed under reduced pressure, and n-butanol was added to solidify.
Allyl ether type phenolic resin solution with 60% form factor
(CV) was obtained. Obtained allyl ether type pheno
Resin solution has a weight average molecular weight of 280 and a molecular weight of 25.
The content of low molecular weight components less than 0 is 42.6% by weight, ant
The rate of ruthelation was 94%.
【0061】水性樹脂分散体の調整 実施例1において、水性樹脂分散体の調整の際にアリル
エーテル型フェノール系樹脂溶液(C−I)の代りに上
記アリルエーテル型フェノール系樹脂溶液(C−V)を
用いた以外は、実施例1の水性樹脂分散体の調整と同様
な配合方法で、固形分25%の安定な水性樹脂分散体を
得た。[0061]Preparation of aqueous resin dispersion In Example 1, allyl was added during the preparation of the aqueous resin dispersion.
Instead of the ether type phenolic resin solution (CI)
Allyl ether type phenolic resin solution (CV)
Same as the preparation of the aqueous resin dispersion of Example 1 except that it was used
Stable aqueous resin dispersion with solid content of 25%
Obtained.
【0062】実施例1〜3および比較例1〜2で得られ
た水性樹脂分散体をそれぞれブリキ板に8〜10ミクロ
ン厚になるように塗布し、210℃で10分間焼き付け
て試験パネルを作成した。試験結果を表1に示した。The aqueous resin dispersions obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were applied to tin plates to a thickness of 8 to 10 microns and baked at 210 ° C. for 10 minutes to prepare test panels. did. The test results are shown in Table 1.
【0063】[0063]
【表1】 [Table 1]
【0064】[0064]
【発明の効果】本発明の水性樹脂分散体は、実施例の結
果から明らかなように、金属基材に塗布した際に極めて
可撓性に富み、かつ衛生性に優れた塗膜を形成できる。As is apparent from the results of the examples, the aqueous resin dispersion of the present invention can form a coating film having extremely high flexibility and hygiene when applied to a metal substrate. .
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08L 63/00 NJP C08L 63/00 NJP C09D 5/00 C09D 5/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C08L 63/00 NJP C08L 63/00 NJP C09D 5/00 C09D 5/00
Claims (1)
脂(A)、エポキシ系樹脂(B)およびフェノール系樹
脂(C)とをアミンの存在下に水性媒体中に分散せしめ
てなる水性樹脂分散体において、フェノール系樹脂
(C)としてフェノール系樹脂のフェノール性水酸基の
20%以上80%未満がアリルエーテル化されており、
重量平均分子量が250〜800であり、かつ分子量が
250未満の低分子量成分の含有量が10重量%以下の
アリルエーテル型フェノール樹脂を使用し、フェノール
系樹脂(C)はカルボキシル基を含有するアクリル系樹
脂(A)および/またはエポキシ系樹脂(B)と予備縮
合されてなることを特徴とする水性樹脂分散体。 1. An aqueous resin dispersion comprising a carboxyl group-containing acrylic resin (A), an epoxy resin (B) and a phenolic resin (C) dispersed in an aqueous medium in the presence of an amine. As the phenolic resin (C), 20% or more and less than 80% of the phenolic hydroxyl groups of the phenolic resin are allyl etherified,
An allyl ether type phenolic resin having a weight average molecular weight of 250 to 800 and a low molecular weight component having a molecular weight of less than 250 is 10% by weight or less, and the phenolic resin (C) is a carboxyl group-containing acrylic resin. An aqueous resin dispersion characterized by being pre-condensed with a resin (A) and / or an epoxy resin (B).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145450A JP2563147B2 (en) | 1991-05-21 | 1991-05-21 | Aqueous resin dispersion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145450A JP2563147B2 (en) | 1991-05-21 | 1991-05-21 | Aqueous resin dispersion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0593167A JPH0593167A (en) | 1993-04-16 |
| JP2563147B2 true JP2563147B2 (en) | 1996-12-11 |
Family
ID=15385508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3145450A Expired - Fee Related JP2563147B2 (en) | 1991-05-21 | 1991-05-21 | Aqueous resin dispersion |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2563147B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102838912A (en) * | 2012-09-12 | 2012-12-26 | 湖南大学 | Preparation method for water-based rustproof coating |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6143332B2 (en) * | 2013-02-05 | 2017-06-07 | 日本化薬株式会社 | Allyl ether resin and method for producing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2868611B2 (en) * | 1990-11-15 | 1999-03-10 | 日本ペイント株式会社 | Aqueous paint composition |
-
1991
- 1991-05-21 JP JP3145450A patent/JP2563147B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102838912A (en) * | 2012-09-12 | 2012-12-26 | 湖南大学 | Preparation method for water-based rustproof coating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0593167A (en) | 1993-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |