JP2574218B2 - Component mounting method - Google Patents
Component mounting methodInfo
- Publication number
- JP2574218B2 JP2574218B2 JP60001582A JP158285A JP2574218B2 JP 2574218 B2 JP2574218 B2 JP 2574218B2 JP 60001582 A JP60001582 A JP 60001582A JP 158285 A JP158285 A JP 158285A JP 2574218 B2 JP2574218 B2 JP 2574218B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- components
- speed
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品実装機の信頼性を向上させる部品
実装方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a component mounting method for improving the reliability of an electronic component mounter.
従来の技術 近年、電子部品実装機には、高速で、信頼性の高い部
品実装が求められている。2. Description of the Related Art In recent years, there has been a demand for high-speed and highly reliable component mounting in electronic component mounting machines.
以下、図面を参照しながら、上述した従来の部品実装
方法の一例について説明する。Hereinafter, an example of the above-described conventional component mounting method will be described with reference to the drawings.
第１図において、１は装着部品をセットする部品供給
部、２は部品供給部から部品を取り出し、被装着物へ部
品を装着する装着ヘッド部、３は被装着物を装着位置へ
移動させる為のテーブル部、４は、テーブル部３を移動
させるドライバー部、５は、プログラムに従って装着手
順を制御する制御部である。In FIG. 1, reference numeral 1 denotes a component supply unit for setting a component to be mounted, 2 denotes a component head for taking out a component from the component supply unit, and 3 to move the component to a mounting position. And 4, a driver for moving the table 3 and a controller 5 for controlling the mounting procedure according to a program.
以上のように構成された電子部品実装機の部品実装方
法について、以下その動作について説明する。The operation of the component mounting method of the electronic component mounter configured as described above will be described below.
まず、プログラムにもとづき、テーブル３上の被装着
物を、ドライバー部４により、装着位置へ移動させる。
同時に、指定された装着部品を、部品供給部１により、
取り出し位置へ移動させ、装着部品をヘッド２で取り出
す。へッド部２で取り出した装着部品を指定された装着
方向に被装着物へ装着する。このようにして、テーブル
部３の速度一定で、プログラムに従って繰り返す。First, an object to be mounted on the table 3 is moved to a mounting position by the driver unit 4 based on a program.
At the same time, the designated mounting parts are
The head 2 is moved to the take-out position and the mounted component is taken out. The mounting component taken out by the head unit 2 is mounted on the mounting object in a specified mounting direction. In this way, the process is repeated according to the program while the speed of the table unit 3 is constant.
発明が解決しようとする問題点 しかしながら、上記のような構成で、第２図のように
大きさの異なる部品を混合して装着しようとした場合、
大きい部品を装着後、次の装着位置へテーブルが移動す
る際、慣性等で、装着された部品が位置ズレを起こすこ
とがあった。しかし、この装着された部品の位置ズレを
解決しようとするには、最初から、テーブルの移動スピ
ードを遅くするというのが１つの方法であるが、この方
法では、１サイクル（装着タクト）内でのテーブル移動
可能距離が減少し、高速化が図れないといった問題点が
あった。Problems to be Solved by the Invention However, in the above-described configuration, when components of different sizes are mixed and mounted as shown in FIG.
When the table is moved to the next mounting position after mounting a large component, the mounted component may be displaced due to inertia or the like. However, in order to solve the positional deviation of the mounted components, one method is to reduce the moving speed of the table from the beginning. In this method, however, within one cycle (mounting tact). However, there has been a problem that the distance that the table can be moved is reduced and the speed cannot be increased.
本発明は、上記問題点に鑑み、高速で、信頼性の高い
部品実装を提供するものである。The present invention has been made in view of the above problems, and provides a high-speed and highly reliable component mounting.
問題点を解決するための手段 上記問題点を解決するために、本発明部品実装方法
は、摺動又は、回転する部品供給部から制御プログラム
の指令により部品を順次取り出し、摺動するテーブル上
に置かれたプリント基板上に、装着ヘッドにて装着する
部品実装方法において、予め部品の種類毎に、その大き
さに応じて決定される、前記テーブルの移動速度を設定
しておき、大きさの異なる部品をプリント基板上に実装
していく際に、設定された前記移動速度が大きい部品か
ら順に、設定された移動速度でテーブルを移動させなが
ら実装していくものである。Means for Solving the Problems In order to solve the above problems, the component mounting method of the present invention uses a sliding or rotating component supply unit to sequentially take out components in accordance with a command of a control program and place the components on a sliding table. In the component mounting method of mounting on the mounted printed circuit board by the mounting head, the moving speed of the table, which is determined according to the size of each type of component in advance, is set, When mounting different components on the printed circuit board, the components are mounted while moving the table at the set moving speed in order from the component having the higher moving speed.
作用 本発明は、上記した構成によって、装着部品に応じ
て、小さい部品より順次装着し全体としてテーブルの位
置決め速度を変えることにより、高速で、信頼性の高い
実装が可能となる。Operation According to the present invention, high-speed and highly reliable mounting can be achieved by sequentially mounting smaller components according to the mounted components and changing the positioning speed of the table as a whole according to the configuration described above.
実施例 以下、本発明の一実施例の部品実装方法について、図
面を参照しながら、説明する。Embodiment Hereinafter, a component mounting method according to an embodiment of the present invention will be described with reference to the drawings.
第２図は、装着しようとする大きさの異なる３種類の
部品図（大きさはＡ＞Ｂ＞Ｃ）である。FIG. 2 is a drawing of three types of parts (sizes A>B> C) of different sizes to be mounted.
まず、第２図Ｃの部品を、装着ヘッド２により部品供
給部１より取り出し、第３図ａのスピードで、装着位置
へ移動させたテーブル部３上へ装着を行なう。次に第２
図Ｂの部品を、装着ヘッド２により、部品供給部１より
取り出す。同時にあらかじめ、プログラムに従って、制
御部５は、ドライバー部４へ、速度ダウン（第３図ｂの
スピード）を指示し、ドライバー部４は、指示された第
３図ｂのスピードで、次の装着位置へテーブル部３を移
動させ、装着を行なう。First, the component shown in FIG. 2C is taken out of the component supply unit 1 by the mounting head 2 and mounted on the table unit 3 moved to the mounting position at the speed shown in FIG. 3A. Then the second
The component shown in FIG. B is taken out from the component supply unit 1 by the mounting head 2. At the same time, the control unit 5 instructs the driver unit 4 to reduce the speed (the speed shown in FIG. 3B) in advance according to the program, and the driver unit 4 executes the next mounting position at the indicated speed shown in FIG. 3B. The table unit 3 is moved to be mounted.
以下第２図Ａの部品も同様に、第３図ｃのスピード
で、テーブル部３を位置決めを行ない、装着を行なう。
（位置決めスピードはａ＜ｂ＜ｃ） 以上の様に、本実施例によれば、電子部品実装機で、
大きい部品、小さい部品を混合して装着する場合、テー
ブルの速度を速くできるもの、すなわち、小さい部品か
ら部品実装を行ない、段階をおって、スピードダウンの
機能を設けることにより、高速で、信頼性の高い部品実
装を行なうことができる。Hereinafter, the components of FIG. 2A are similarly positioned and mounted at the speed of FIG. 3C.
(Positioning speed is a <b <c) As described above, according to this embodiment, in the electronic component mounting machine,
When large and small components are mixed and mounted, the speed of the table can be increased, that is, components are mounted from small components, and a step-by-step speed reduction function is provided to achieve high speed and reliability. Component mounting can be performed with high reliability.
なお、実施例において、プログラムによって部品の大
きさを指示するとしたが、部品判定装置を設け、指示し
てもよい。In the embodiment, the size of the component is instructed by the program, but a component determination device may be provided to instruct.
発明の効果 以上のように、本発明は、電子部品実装機に、スピー
ドダウンの機能を設け、小さい部品より順次装着するこ
とで大きさの異なる部品を混合して装着する場合、全体
として高速で信頼性の高い実装を行なうことができる効
果を有する。Effect of the Invention As described above, the present invention provides an electronic component mounter with a speed-down function, and when components of different sizes are mixed and mounted by sequentially mounting smaller components, the overall speed is higher. This has the effect that highly reliable mounting can be performed.
第１図は本実施例における電子部品実装機の構成図、第
２図Ａ〜Ｃは装置部品の斜視図、第３図は位置決めスピ
ードの一例を示す図である。 １……部品供給部、２……装着へッド部、３……テーブ
ル部、４……ドライバー部、５……制御部、Ａ〜Ｃ……
装着部品、ａ〜ｃ……位置決めスピード。FIG. 1 is a configuration diagram of an electronic component mounter in this embodiment, FIGS. 2A to 2C are perspective views of device components, and FIG. 3 is a diagram showing an example of a positioning speed. DESCRIPTION OF SYMBOLS 1 ... Component supply part, 2 ... Mounting head part, 3 ... Table part, 4 ... Driver part, 5 ... Control part, A-C ...
Mounting parts, a to c: Positioning speed.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐々木 秀俊 門真市大字門真1006番地 松下電器産業 株式会社内 (56)参考文献 実開 昭57−48672（ＪＰ，Ｕ) 実開 昭55−93441（ＪＰ，Ｕ) 実開 昭59−192710（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hidetoshi Sasaki 1006 Kadoma, Kadoma Matsushita Electric Industrial Co., Ltd. (56) References Japanese Utility Model Sho 57-48672 (JP, U) Japanese Utility Model Sho 55-93441 (JP) , U) Actually open sho 59-192710 (JP, U)
Claims (1)
ログラムの指令により部品を順次取り出し、摺動するテ
ーブル上に置かれたプリント基板上に、装着ヘッドにて
装着する部品実装方法において、予め部品の種類毎に、
その大きさに応じて決定される、前記テーブルの移動速
度を設定しておき、大きさの異なる部品をプリント基板
上に実装していく際に、設定された前記移動速度が大き
い部品から順に、設定された移動速度でテーブルを移動
させながら実装していく部品実装方法。1. A component mounting method in which components are sequentially taken out from a sliding or rotating component supply unit in accordance with a command of a control program and mounted on a printed circuit board placed on a sliding table by a mounting head. In advance, for each type of parts,
The moving speed of the table, which is determined according to the size, is set in advance, and when components having different sizes are mounted on a printed circuit board, the set moving speed is set in descending order of the components. A component mounting method in which a table is mounted while moving at a set moving speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60001582A JP2574218B2 (en) | 1985-01-09 | 1985-01-09 | Component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60001582A JP2574218B2 (en) | 1985-01-09 | 1985-01-09 | Component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61160999A JPS61160999A (en) | 1986-07-21 |
| JP2574218B2 true JP2574218B2 (en) | 1997-01-22 |
Family
ID=11505509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60001582A Expired - Lifetime JP2574218B2 (en) | 1985-01-09 | 1985-01-09 | Component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2574218B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6952869B2 (en) | 2000-12-28 | 2005-10-11 | Fuji Machine Mfg. Ltd. | Electric-component mounting system for mounting electric component on a circuit substrate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2589063B2 (en) * | 1985-01-10 | 1997-03-12 | 三洋電機株式会社 | Automatic mounting device for electronic components |
| JP2582946Y2 (en) * | 1992-06-05 | 1998-10-15 | 三洋電機株式会社 | Parts supply device |
| JP4781572B2 (en) * | 2001-08-03 | 2011-09-28 | パナソニック株式会社 | Electronic component mounting method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593441U (en) * | 1978-10-20 | 1980-06-28 | ||
| JPS5748672U (en) * | 1980-09-03 | 1982-03-18 | ||
| JPS59192710U (en) * | 1983-06-08 | 1984-12-21 | フアナツク株式会社 | Positioning controller of numerical control device |
-
1985
- 1985-01-09 JP JP60001582A patent/JP2574218B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6952869B2 (en) | 2000-12-28 | 2005-10-11 | Fuji Machine Mfg. Ltd. | Electric-component mounting system for mounting electric component on a circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61160999A (en) | 1986-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |