JP2582829B2 - Electronic parts molding equipment - Google Patents

Description

Description: Object of the Invention (Industrial Application Field) The present invention relates to an electronic component molding apparatus formed by pressing a carrier tape on which a semiconductor chip is subjected to inner lead bonding.

(Prior Art) As an electronic component, there is a so-called TAB component which is formed by forming a metal pattern on a long carrier tape such as a polyimide film at a predetermined interval and bonding a semiconductor chip to each metal pattern by inner lead bonding.

Conventionally, TAB parts made in this way are wound up on a tape reel while the carrier tape is long, and supplied to the mounting machine in that state, where the carrier tape is fed out from the tape reel and the TAB parts are pressed by a press device. After punching one by one, the TAB component is outer lead bonded to a lead frame.

However, when the TAB component is subjected to the outer lead bonding in this manner, it is not possible to inspect whether or not the inner lead bonded semiconductor chip is securely and electrically connected to the pattern of the carrier tape. Therefore, even if the inner lead bonding state is defective, a problem arises in that the TAB component is outer lead bonded to the lead frame by the mounting machine.

In order to eliminate such a problem, if the semiconductor chip is subjected to inner lead bonding, the carrier chip is cut into pieces of a predetermined length without winding the carrier tape, at which point the semiconductor chip is formed into a carrier tape pattern. It has been considered to inspect whether or not the inner lead bonding has been performed well.

As described above, when the quality of the inner lead bonding state is inspected, the TAB component must be punched from the cut piece by pressing the cut piece after the inspection. Then, since the punching residue remains in the press working device, unless the punching residue is removed,
There arises a problem that the press working of the cut piece cannot be performed favorably.

(Problems to be Solved by the Invention) As described above, conventionally, the carrier tape is supplied in a long state to the mounting machine and the outer lead bonding is performed. It is not possible to inspect whether or not the inner lead bonding is performed, and in order to perform the inspection properly, the carrier tape is cut into a predetermined length in advance, and an electronic component is punched from the cut piece. In such a case, punching debris accumulates in the press working device, and the press working cannot be performed well.

The present invention has been made based on the above circumstances, and it is an object of the present invention to provide a method for punching an electronic component from a cut piece obtained by previously cutting a carrier tape to a predetermined length. An object of the present invention is to provide a molding device for an electronic component that can be favorably removed from a processing device.

[Structure of the Invention] (Means and Action for Solving the Problems) In order to solve the above problems, the present invention includes a long carrier tape in which a plurality of semiconductor chips are inner-lead bonded to the semiconductor chip. In a molding device for forming an electronic component by punching out a cut piece formed by cutting to a predetermined length with a press working device, a punch chip generated in the press working device by punching the cut piece in a predetermined area is: The punching waste is suction-removed by a discharge device having a pair of suction nozzles for sucking one end and the other end of the punching waste in a predetermined direction. Thereby, the punching work of the electronic component can be performed smoothly and reliably.

(Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to FIG. 1 to FIG. In FIG. 1, reference numeral 1 denotes a tray, on which a large number of storage sections 2 are formed in a matrix. TABs as electronic components are provided in each housing 2
The cut piece 4 formed as described later is accommodated in the component 21. The cut piece 4 is obtained by subjecting a semiconductor chip 5 to a long carrier tape made of a polyimide film or the like by inner lead bonding, and then cutting the carrier tape to a predetermined length. Therefore, by cutting the carrier tape into the cut pieces 4, the inner lead bonding state of the semiconductor chip 5 in each cut piece 4 can be inspected.
Can be accommodated.

The cut pieces 4 stored in the storage section 2 of the tray 1 are supplied to a molding device 7 shown in FIGS. 2 to 4 by a transfer device 6. The transfer device includes an X arm 8 driven in the X direction and a Y arm 9 driven in the Y direction orthogonal to the X arm 8.
A suction nozzle 11 for vacuum-sucking the cut piece 4 is provided at a tip of the cylinder so as to be vertically driven by a cylinder 10. Then, when the cut piece 4 is sucked from the tray 1 by the suction nozzle 11 provided on the Y arm 9, the transfer device 6 supplies the cut piece to the forming device 7 shown in FIG. ing.

The molding device 7 is a press working device as shown in FIG.
12 and a discharge device 13. This press working device 12 includes a lower holder 14. A fixed mold 15 is placed and fixed on the upper surface of the lower holder 14, and columns 16 are provided on both sides of the fixed mold 15, respectively. An upper holder 17 is slidably provided on the pair of columns 16. The upper holder 17 is driven up and down along the columns by a drive mechanism (not shown), and a movable mold 18 is held and fixed on the lower surface facing the fixed mold 15. Then, a fixed mold is provided by the transfer device 6.
The cut piece 4 supplied on the top 15 is punched as shown by a broken line s in FIG. 2 when the movable mold 18 descends. By such a punching process, the center of the cut piece 4 becomes the TAB component 21 and the peripheral portion becomes the frame-shaped punched chip 22.

The TAB component 21 thus punched is supplied to the mounting machine (not shown) from above the fixed mold 15 by a transfer device (not shown) separate from the transfer device 6, where the lead frame (not shown) is used. Outer lead bonding). In addition, the punching residue 22 remaining on the fixed mold 18 is suctioned and removed by the discharging device 13.

The discharging device 13 has a base as shown in FIGS.
It has 23. A mounting plate 24 is erected vertically on the base 23, and a rotary actuator 25 is mounted on one side of an upper end of the mounting plate 24. One end of an L-shaped member 27 is attached to a rotation shaft 26 of the rotary actuator 25, and one end of a swing arm 28 is fixed to the other end. The other end of the swing arm 28 has a first pulley
29 is rotatably provided by a support shaft 31. Also,
A second pulley 32 is integrally provided at an end of the rotary shaft 26 protruding from one end of the L-shaped member 27. A toothed belt 33 is stretched between the second pulley 32 and the first pulley 29. The support shaft 31 is rotatably provided on the swing arm 28, and one end of the support shaft 31 is fixed to one end of a nozzle head 35 having a pair of suction nozzles provided at predetermined intervals.

Therefore, when the swing arm 28 is driven to rotate in the direction indicated by the arrow in FIG. 2 by the rotation shaft 26 of the rotary actuator 25, the belt 33 The vehicle is driven to run in the direction opposite to the rotation direction. Then, the nozzle head 35 is moved from a state retracted from between the pair of dies 15 and 18 of the press working device 12 as shown in FIG. 2 to a state of entering between the dies 15 and 18 as shown in FIG. Rotate. At this time, the pair of suction nozzles 34 move in parallel with the axes perpendicular to each other, and the tips are punched and scraped on the fixed mold 15.
One end and the other end of the predetermined direction 22 are opposed to each other with a slight gap. In this state, a suction force is applied to these suction nozzles 34 to vacuum-punch the punched chips 22.

When the suction nozzle 34 vacuum sucks the punched residue 22,
The swing arm 28 is driven to rotate from the state shown in FIG. 3 in the direction opposite to the direction indicated by the arrow, and the nozzle head 35 is retracted from between the pair of dies 15 and 18 as shown in FIG. In this state, if the suction force generated in the suction nozzle 34 is released, the punched chips 22 can be discharged to an appropriate position.

The punched chips 22 remaining in the fixed mold 15 may be in a state where it is difficult to separate from the fixed mold 15 due to burrs or the like generated at the time of punching. However, fixed mold
Since the one end and the other end of the punching chip 22 remaining in the predetermined direction are adsorbed by the pair of adsorption nozzles 34, they can be surely adsorbed and removed from the fixed mold 15.

Therefore, according to the molding device 7 having the above-described configuration, the punching chips 22 generated by pressing the cut pieces 4 are formed.
Can be reliably removed by the discharge device 13, so that the operation of forming the TAB component 21 from the cut pieces 4 can be performed reliably and quickly.

FIG. 5 is a modified example of the discharge device 13 showing the second embodiment of the present invention. That is, the shaft 42 of the actuator 41 is driven in the rotation direction and the vertical direction, and one end of a swing arm 43 is fixed to the shaft 42. The other end of the swing arm 43 is provided with a pair of suction nozzles 34 as in the first embodiment. With this configuration, the swing arm 43 can be turned on a horizontal plane, so that even when the pair of dies 15 and 18 has a small opening size, the suction nozzle 34 can easily enter between them.

FIG. 6 shows a third embodiment of the present invention. In this embodiment, a shaft 52 of an actuator 51 is driven only in a vertical direction, and a cylinder 53 is mounted on the shaft 52 with its axis horizontal. A pair of suction nozzles 34 is attached to the rod 54 of the cylinder 53.
Is attached. According to such a configuration, since the nozzle head 35 can be linearly driven to enter between the pair of molds 15 and 18, when the pair of molds 15 and 18 are open, The nozzle head 35 can be satisfactorily entered not only in the direction but also when the frontage in the left and right direction is narrow.

[Effects of the Invention] As described above, the present invention relates to a method of forming an electronic component by punching a cut piece obtained by cutting a carrier tape into a predetermined length by a press working device, and removing the punched chips generated by the press working device. A suction device is provided with a pair of suction nozzles for sucking one end and the other end in a predetermined direction. Therefore, punching residue can be prevented from accumulating in the press working device, so that the operation of cutting the carrier tape to a predetermined length and then forming the electronic component can be performed reliably and favorably. Moreover,
Since the punching residue remaining in the fixed mold of the press working device was made to adsorb one end and the other end by a pair of suction nozzles, even if the punching dust is in a state where it is difficult to peel off from the fixed mold, The pair of suction nozzles for sucking the one end and the other end can reliably suck and remove.

[Brief description of the drawings]

1 to 4 show a first embodiment of the present invention. FIG. 1 is a schematic view of an electronic component housed in a tray and a transfer device for taking out the electronic component, and FIG. FIG. 3 is a perspective view of a state in which the swing arm is in a standby state, FIG. 3 is a perspective view of a state in which the swing arm has entered between a pair of molds, FIG. FIG. 5 is a perspective view of a discharge device showing a second embodiment of the present invention, and FIG. 6 is a perspective view of a discharge device showing a third embodiment of the present invention. 4 ... cut piece, 5 ... semiconductor chip, 12 ... press working device, 13 ... discharge device, 15 ... fixed mold, 18 ... movable mold, 28 ... swing arm, 34 ... suction nozzle , 35 ……
Nozzle head.

 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-58-108762 (JP, A) JP-A-59-186333 (JP, A) JP-A-59-186334 (JP, A) JP-A 52-108334 8777 (JP, A) JP-B-59-27096 (JP, B2) JP-B 4-59776 (JP, B2) JP-B 5-23919 (JP, B2)

Claims (1)

(57) [Claims] 1. A cut piece formed by cutting a long carrier tape on which a plurality of semiconductor chips are inner-lead bonded into a predetermined length including the semiconductor chips is punched out by a press working device. In a molding device for molding an electronic component, a punching chip generated in the press working device by punching the cut piece in a predetermined area is a pair of suction nozzles for suctioning one end and the other end of the punching chip in a predetermined direction. A molding device for electronic parts, wherein the device is suction-removed by a discharge device provided with the component.