JP2583567B2 - Method for manufacturing stem for semiconductor laser device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a stem for a semiconductor laser device.

(Prior Art) A stem for a semiconductor laser element is required to have high dimensional accuracy as a precision component, and the dimensional tolerance of each part such as a radiator of a stem substrate is strictly set.

In addition, the stem for the semiconductor laser element is positioned at a predetermined position on the outer peripheral surface of the substrate of the stem so that the semiconductor laser element is accurately bonded on the radiator and can be accurately positioned when mounted on various electronic devices. Notch is provided.

(Problems to be Solved by the Invention) As described above, a high dimensional accuracy is required for the stem for a semiconductor laser element. The substrate is roughly punched and then subjected to a finishing process by shaving to determine the outer diameter of the substrate.

However, it is extremely difficult to form the notch for positioning with steps like shaving, so the notch must be formed by one press punching. As a result, it is unavoidable that burrs appear in the cutout on the surface of the stem substrate opposite to the surface that the punching abuts.

This burr must be removed because it has adverse effects such as mounting the stem with a slant or hindering accurate positioning. Conventionally, the deburring operation of the stem is manually performed, and the deburring is performed one by one so that the substrate surface becomes a flat surface. For this reason, conventionally, there has been a problem that the deburring work requires much labor and the working efficiency is poor.

In the deburring work, for example, it is conceivable to use a barrel or the like instead of manual operation, but in this case, the originally sharp edge portion as a result of the deburring will be lost,
There is a problem that a portion requiring sharpness of an edge portion for fixing a semiconductor laser element such as a radiator is also cut off. For this reason, the deburring of the stem cannot be performed by a mechanical deburring method, and the present situation is that the deburring is mainly performed manually.

Therefore, the present invention has been made to solve the above-mentioned problems, and aims to eliminate the manual deburring work and to prevent the positioning from being performed due to the burrs at the time of mounting and at the time of bonding a semiconductor laser element. It is an object of the present invention to provide a method for manufacturing a stem for a semiconductor laser device, which can manufacture a stem that cannot be used.

(Means for Solving the Problems) The present invention has the following configuration to achieve the above object.

That is, in a method of manufacturing a stem for a semiconductor laser device in which a notch for positioning is formed by punching on an outer peripheral surface of a substrate of a stem, the notch is formed on a surface of the substrate on a side opposite to a surface to which a punch punch contacts. It is characterized in that a recess having a step that is deeper than the projection of a beam generated when forming the notch is provided over at least the edge portion of the notch, and punching is performed.

Further, the recess is provided in an annular shape on the surface of the substrate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a bottom view of a stem for a semiconductor laser device obtained by the method of manufacturing a stem for a semiconductor laser device of the present invention, and FIG. 2 is a front view.

In the figure, reference numeral 10 denotes a stem substrate, and reference numeral 12 denotes lead pins which are hermetically welded to the substrate 10 by glass and stand upright. The stem of this embodiment has a notch 14 cut in a V shape when viewed from the bottom at a symmetrical position with respect to the center of the substrate 10 and a U-shaped notch provided at a position orthogonal to the direction of the two notches 14. With 16.

Reference numeral 20 denotes a concave portion provided at the edge of the cutouts 14, 16. The recess 20 is provided in advance so as to be depressed by pressing or the like on the lower surface of the substrate 10 before forming the cutouts 14, 14, 16. Figure 2 shows notch 1
4 is a cross-sectional view taken along a line passing through 14
Is provided.

When manufacturing the stem for this semiconductor laser device,
Before forming 14, 14, 16, pre-cut 14, 14,
The concave portion 20 is provided at the position where the substrate 16 is to be formed. After the concave portion 20 is formed, the cutouts 14, 14, 16 are provided from the upper surface side of the substrate 10 toward the lower surface by press punching.

FIG. 3 shows a cross section taken along the line HH 'of FIG. 1, and shows the relationship between the burrs generated by press punching and the recess 20. In the figure, reference numeral 22 denotes burrs generated by press stamping.

The recesses 20 are burrs 22 generated during press punching.
Is formed in advance so as to have a step B that is deeper than the protrusion amount A, so that the tip of the burr 22 generated by press punching does not protrude beyond the substrate surface beyond the step. is there.

Since the projection amount of the burrs 22 actually generated by press punching is about 0.1 mm, the step B of the concave portion 20 is 0.2 to 0.
It may be about 3mm.

As shown in FIG. 1, in this embodiment, the concave portion 20 has an edge portion of the notches 14, 14, and 16, the V-shaped notch 14 has a V-shaped tip portion, and the U-shaped notch has a corner portion bent at a right angle. (Two places). This is due to the fact that the strongest shearing force is applied to the edge portion at the notch during press working, and much burrs are generated at the edge portion.

Therefore, the concave portion 20 needs to be provided so as to straddle at least the edge portion of the cutout where the cutout is formed. Of course, the substrate 10 including the cutouts 14, 14, 16 as shown in FIG.
The lower surface may be provided with the concave portion 20a in an annular shape.

Note that the concave portion 20 is provided on the substrate surface opposite to the surface to which the punch punch contacts, and the position and size of the concave portion 20 may be appropriately selected depending on the processing mode.

As described above, the present invention has been described variously with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. That is.

(Effect of the Invention) According to the manufacturing method of the present invention, as described above, the burrs do not protrude from the substrate surface by forming the concave portions in advance in the portions where the cutouts are formed in the substrate. As a result, when the stem is mounted, the mounting surface is not affected at all, and normal mounting and positioning can be performed without tilting.

In addition, according to this manufacturing method, a high-precision stem can be manufactured because it has no influence on the dimensional accuracy of the conventional substrate outer diameter and no influence on other parts of the substrate. can do.

Further, according to the method of the present invention, there is no need for manual deburring work, which leads to significant effects such as reduction of labor and reduction of production cost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a bottom view showing a stem for a semiconductor laser device obtained by a manufacturing method according to the present invention, FIG. 2 is a sectional view, and FIG. FIG. 4 is a bottom view showing another stem for a semiconductor laser device. 10 ... board, 12 ... lead pin, 14, 16 ... notch, 20 ...
... recess, 22 ... burrs.

Claims (2)

(57) [Claims] 1. A method of manufacturing a stem for a semiconductor laser device, wherein a notch for positioning is formed by punching on an outer peripheral surface of a substrate of a stem, wherein: A recess having a step deeper than an amount of projection of a burr generated at the time of forming the notch, straddling at least an edge portion of the notch to be formed, and performing punching. Production method. 2. The method according to claim 1, wherein the concave portion is provided in an annular shape on the surface of the substrate.