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JP2584702B2 - Flow sensor - Google Patents
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JP2584702B2 - Flow sensor - Google Patents

Flow sensor

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Publication number
JP2584702B2
JP2584702B2 JP4091599A JP9159992A JP2584702B2 JP 2584702 B2 JP2584702 B2 JP 2584702B2 JP 4091599 A JP4091599 A JP 4091599A JP 9159992 A JP9159992 A JP 9159992A JP 2584702 B2 JP2584702 B2 JP 2584702B2
Authority
JP
Japan
Prior art keywords
temperature
film heater
flow
thin
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4091599A
Other languages
Japanese (ja)
Other versions
JPH05264565A (en
Inventor
光照 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Seiki Co Ltd
Original Assignee
Ricoh Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Seiki Co Ltd filed Critical Ricoh Seiki Co Ltd
Priority to JP4091599A priority Critical patent/JP2584702B2/en
Priority to US08/033,783 priority patent/US5406841A/en
Publication of JPH05264565A publication Critical patent/JPH05264565A/en
Application granted granted Critical
Publication of JP2584702B2 publication Critical patent/JP2584702B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】この発明は、微細な気体の流速を
検出するためのフローセンサに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flow sensor for detecting a flow rate of a fine gas.

【0002】[0002]

【従来の技術】気体の流れの中にヒータを置くと、ヒー
タの上流側は気体流で冷やされ、下流側は気体流で運ば
れる熱で暖められる。そこで、ヒータの上流側と下流側
の温度差を測れば、気体の流速を検出することができ
る。このような原理に基づき、マイクロヒータの上流側
と下流側に温度センサを配置したフローセンサが提案さ
れている(例えば、特開平2−193019号公報参
照)。
2. Description of the Related Art When a heater is placed in a gas flow, an upstream side of the heater is cooled by a gas flow and a downstream side is heated by heat carried by the gas flow. Therefore, by measuring the temperature difference between the upstream side and the downstream side of the heater, the flow velocity of the gas can be detected. Based on such a principle, there has been proposed a flow sensor in which a temperature sensor is disposed on the upstream side and the downstream side of a micro heater (for example, see Japanese Patent Application Laid-Open No. 2-193017).

【0003】[0003]

【発明が解決しようとする課題】この発明は、ヒータの
上流と下流とで大きな温度差を得ることによって、フロ
ーセンサの感度を向上することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to improve the sensitivity of a flow sensor by obtaining a large temperature difference between upstream and downstream of a heater.

【0004】[0004]

【課題を解決するための手段】この発明のフローセンサ
は、気体の流れに薄膜ヒータをさらし、該薄膜ヒータの
上流側と下流側の温度をそれぞれ温度センサで測定し、
それらの温度差から気体の流速を検出するようにした点
は従来通りである。しかし、ヒータの抵抗温度係数が正
か負によって、薄膜ヒータに流れる電流の方向が異な
る。
According to a flow sensor of the present invention, a thin film heater is exposed to a gas flow, and the temperatures of an upstream side and a downstream side of the thin film heater are measured by a temperature sensor.
The point at which the flow velocity of the gas is detected from the temperature difference is conventional. However, the direction of the current flowing through the thin-film heater differs depending on whether the temperature coefficient of resistance of the heater is positive or negative.

【0005】該薄膜ヒータが正の電気抵抗温度係数を有
する場合は、該薄膜ヒータは、気体の流れに沿った方向
に電流が流れるように配置する。該薄膜ヒータが負の温
度係数を有している場合は、薄膜ヒータは、気体の流れ
に直角な方向に電流が流れるように配置する。
When the thin-film heater has a positive temperature coefficient of electric resistance, the thin-film heater is arranged so that a current flows in a direction along a gas flow. If the thin-film heater has a negative temperature coefficient, the thin-film heater is arranged so that current flows in a direction perpendicular to the gas flow.

【0006】[0006]

【作用】薄膜ヒータの電気抵抗の温度係数が正(すなわ
ち、温度が高くなるにしたがって電気抵抗が大きくな
る)場合を考えてみる。この場合、この発明では、薄膜
ヒータは、気体の流れに沿って電流が流れるように配置
される。
Consider a case where the temperature coefficient of the electric resistance of the thin film heater is positive (that is, the electric resistance increases as the temperature increases). In this case, in the present invention, the thin-film heater is arranged so that the current flows along the flow of the gas.

【0007】薄膜ヒータの上流側は気体の流れで冷やさ
れるので温度が下がり、逆に、下流側は、上流側から運
ばれた熱で温度が上がる。このため、気体流に沿った電
流の通り道は、上流側で分布抵抗が小さくなり、下流側
で分布抵抗が大きくなる。この結果、上流側は発熱量が
減って一層温度が下がり、下流側は発熱量が増して、一
層温度が上がる。こうして、上流側と下流側に大きな温
度差が生ずる。このことは、フローセンサの感度が上が
り、小さな流速をも検出できることを意味する。
The temperature on the upstream side of the thin film heater is lowered because it is cooled by the gas flow, and the temperature on the downstream side is raised by heat transferred from the upstream side. For this reason, in the path of the current along the gas flow, the distribution resistance decreases on the upstream side and increases on the downstream side. As a result, the calorific value decreases on the upstream side and the temperature further decreases, and the calorific value increases on the downstream side and the temperature further increases. Thus, a large temperature difference occurs between the upstream side and the downstream side. This means that the sensitivity of the flow sensor is increased and a small flow velocity can be detected.

【0008】次に、薄膜ヒータの電気抵抗の温度係数が
負の場合であるが、この場合、この発明では、薄膜ヒー
タは、気体の流れに直角な方向に電流が流れるように配
置されている。
Next, in the case where the temperature coefficient of the electric resistance of the thin film heater is negative, in this case, in the present invention, the thin film heater is arranged so that current flows in a direction perpendicular to the gas flow. .

【0009】この場合も、薄膜ヒータの上流側は、気体
の流れで冷やされるので温度が下がってヒータの分布抵
抗が大きくなり、逆に、下流側は、上流側から運ばれた
熱で温度が上がるので分布抵抗は小さくなる。このた
め、ヒータの電流は、上流側を流れにくく、下流側を流
れやすくなる。この結果、上流側は発熱量が減って一層
温度が下がり、下流側は発熱量が増して、一層温度が上
がる。こうして、上流側と下流側に大きな温度差が生ず
る。
In this case, too, the upstream side of the thin-film heater is cooled by the flow of gas, so that the temperature decreases and the distribution resistance of the heater increases, and conversely, on the downstream side, the temperature is increased by the heat transferred from the upstream side. As the resistance increases, the distributed resistance decreases. Therefore, the current of the heater hardly flows on the upstream side and easily flows on the downstream side. As a result, the calorific value decreases on the upstream side and the temperature further decreases, and the calorific value increases on the downstream side and the temperature further increases. Thus, a large temperature difference occurs between the upstream side and the downstream side.

【0010】[0010]

【実施例】図1において、n形シリコン基板1の表面に
塗布拡散剤を用いてホウ素を高濃度に、たとえば、約1
×1020cm-3程度添加、熱拡散し、高濃度ホウ素添加単
結晶シリコン層2を形成する。この層は、電気抵抗が小
さいので、ヒータとして利用できる。また、この層は、
P++-Si(特に高濃度のP形シリコンの意味)となり、数
百℃以下の温度では金属的で、正の抵抗温度係数をも
つ。なお、ホウ素はn形シリコン基板の全面に添加する
のではなく、ホウ素を添加しない部分を四角形の枠状に
残す(この部分は後で溝3になる)。
In FIG. 1, boron is applied to the surface of an n-type silicon substrate 1 at a high concentration using a spreading agent, for example, about 1%.
Add about × 10 20 cm -3 and thermally diffuse to form a high-concentration boron-added single-crystal silicon layer 2. This layer can be used as a heater because of its low electric resistance. This layer also
It becomes P ++ -Si (especially a high concentration of P-type silicon), and is metallic at a temperature of several hundred degrees Celsius or less and has a positive temperature coefficient of resistance. Note that boron is not added to the entire surface of the n-type silicon substrate, but a portion to which boron is not added is left in a square frame shape (this portion will be a groove 3 later).

【0011】この基板の両面にSiO2膜4、5を熱酸化の
手法で形成し、裏面のSiO2膜5に窓をあける。こうして
基板1を異方性エッチングすると、n形シリコン基板1
に空洞15ができ、高濃度ホウ素添加単結晶シリコン層
2は異方性エッチャントに侵されず、空洞15の上にダ
イヤフラム状に残る。これを薄膜ヒータ6として利用す
る。ホウ素を添加しなかった部分はエッチされて溝3に
なり、薄膜ヒータ6と周囲の高濃度ホウ素添加単結晶シ
リコン層2を分離する。
[0011] SiO 2 films 4 and 5 are formed on both surfaces of the substrate by thermal oxidation, and windows are formed in the SiO 2 film 5 on the back surface. When the substrate 1 is anisotropically etched in this manner, the n-type silicon substrate 1
A cavity 15 is formed, and the high-concentration boron-doped single-crystal silicon layer 2 is not affected by the anisotropic etchant and remains on the cavity 15 in a diaphragm shape. This is used as the thin film heater 6. The portion where boron has not been added is etched to form the groove 3 and separates the thin-film heater 6 and the surrounding high-concentration boron-doped single-crystal silicon layer 2.

【0012】次いで、SiO2膜4にあけた小窓から薄膜ヒ
ータ6に一対の電極7、7を形成する。薄膜ヒータ6に
は気体の流れに沿って電流が流れるように、電極7,7
は上流側と下流側に設ける。
Next, a pair of electrodes 7 is formed on the thin film heater 6 through the small window opened in the SiO 2 film 4. The electrodes 7, 7 are applied to the thin-film heater 6 so that current flows along the flow of gas.
Are provided on the upstream and downstream sides.

【0013】薄膜ヒータ6の上流側と下流側において、
溝3の上のSiO2膜4にスリット8を形成し、薄膜ヒータ
6と基板1を熱的および電気的に分離する。スリット8
は太すぎると、薄膜ヒータに沿って流れる気体に渦がで
き、気体によって奪われる熱量を簡単な式から求めるこ
とができなくなる。そこで、スリットの幅は20μmほ
どの小さなものにしている。なお、スリット8はこの発
明に不可欠のものではなく、設けなくてもよい。
On the upstream and downstream sides of the thin film heater 6,
A slit 8 is formed in the SiO 2 film 4 on the groove 3 to thermally and electrically separate the thin film heater 6 from the substrate 1. Slit 8
If is too thick, the gas flowing along the thin-film heater will have a vortex, and the amount of heat taken by the gas cannot be determined from a simple equation. Therefore, the width of the slit is made as small as about 20 μm. Note that the slit 8 is not indispensable to the present invention, and may not be provided.

【0014】薄膜ヒータ上には、気体の流れに沿って、
上流側、中央部、下流側にそれぞれ温度センサ9a,
b,cを設ける。各温度センサは熱伝対をはじめ様々な
タイプのものが使えるが、この実施例ではpn接合ダイ
オードで構成されている。これをつくるには、薄膜ヒー
タ上のSiO2膜4に窓をあけて薄膜ヒータ6である高濃度
ホウ素添加単結晶シリコン層2を露出させ、この部分に
n形シリコン層10をエピタキシャル成長させる。薄膜
ヒータである高濃度ホウ素添加単結晶シリコン層2はp
形であるので、n形シリコン層10と高濃度ホウ素添加
単結晶シリコン層2のそれぞれに電極11,12を付け
ればpn接合ダイオードとなる。pn接合ダイオード
は、150℃以上であると、逆方向飽和電流の温度依存
性から温度を知ることができ、感度も非常に高い。ま
た、100℃以下で使用するときは、順方向電流の立上
がり電圧の変化から、その接合部の温度を知ることがで
きる。
On the thin film heater, along the flow of gas,
Temperature sensors 9a, 9a,
b and c are provided. Various types of temperature sensors including a thermocouple can be used for each temperature sensor. In this embodiment, the temperature sensors are constituted by pn junction diodes. To make this, a window is opened in the SiO 2 film 4 on the thin film heater to expose the high-concentration boron-added single crystal silicon layer 2 which is the thin film heater 6, and an n-type silicon layer 10 is epitaxially grown on this portion. The high-concentration boron-doped single-crystal silicon layer 2, which is a thin-film heater, has p
Since the electrodes 11 and 12 are attached to the n-type silicon layer 10 and the high-concentration boron-doped single-crystal silicon layer 2 respectively, a pn junction diode is obtained. When the temperature of the pn junction diode is 150 ° C. or higher, the temperature can be known from the temperature dependence of the reverse saturation current, and the sensitivity is very high. When used at a temperature of 100 ° C. or lower, the temperature of the junction can be known from the change in the rising voltage of the forward current.

【0015】中央部の温度センサ9bは、これで薄膜ヒ
ータ6の中央部の温度をモニタし、該温度が一定になる
ように該薄膜ヒータに流れる電流を制御する。こうして
おいて、温度センサ9a,9cで薄膜センサ6の上流側
と下流側の温度を計測し、その温度差から気体の流速を
求める。
The temperature sensor 9b at the center monitors the temperature at the center of the thin film heater 6 with this, and controls the current flowing through the thin film heater so that the temperature becomes constant. In this manner, the temperatures on the upstream side and the downstream side of the thin film sensor 6 are measured by the temperature sensors 9a and 9c, and the gas flow velocity is obtained from the temperature difference.

【0016】ところで、この薄膜ヒータの温度係数は正
であるので、温度が低いほど電気抵抗が小さく、同一の
電流のときは、消費電力が小さく、発熱が少ない。図1
において、薄膜ヒータの上流側は気体の流れで冷やされ
るので発熱が少ない。逆に、下流側は、同一電流に対し
て、上流側に比べて暖まるので、ヒータの電気抵抗が大
きくなり、一層発熱することになる。したがって、上流
側は気体流によって冷やされると、ヒータ加熱も小さく
なり、さらに低い温度になる傾向になり、下流側は、そ
の逆になり、上流側と下流側に大きな温度差が発生す
る。したがって、気体の流れを高感度に検知することが
できる。
Since the temperature coefficient of this thin-film heater is positive, the lower the temperature, the lower the electric resistance. At the same current, the power consumption is small and the heat generation is small. FIG.
In the above, since the upstream side of the thin film heater is cooled by the gas flow, the heat generation is small. Conversely, the downstream side is warmed up with respect to the same current as compared to the upstream side, so that the electric resistance of the heater is increased and the heat is further generated. Therefore, when the upstream side is cooled by the gas flow, the heater heating becomes smaller and the temperature tends to be lower, and the downstream side becomes the opposite, and a large temperature difference occurs between the upstream side and the downstream side. Therefore, the gas flow can be detected with high sensitivity.

【0017】図2は、薄膜ヒータの抵抗温度係数が負の
場合の実施例である。p形シリコン基板21の上にn形
シリコン層(厚みは3μm程度)22をエピタキシャル
形成する。次いで、n形シリコン層22にホウ素を熱拡
散して矩形枠状のp形シリコン領域(この部分は後で溝
23になる)をつくる。この基板の両面にSiO2膜24,
25を熱酸化の手法で形成し、裏面25に窓をあける。
こうして、60℃、50%程度の苛性ソーダ水溶液中
で、n形エピタキシャル層22を正になるようにして電
解エッチングすると、p形シリコン基板21が異方性エ
ッチされて空洞35ができ、その空洞の上にn形シリコ
ン層22がダイヤフラム状に残る。このダイヤフラム部
分を薄膜ヒータ26として利用する。この薄膜ヒータの
温度係数は負となる。
FIG. 2 shows an embodiment in which the thin-film heater has a negative temperature coefficient of resistance. An n-type silicon layer (having a thickness of about 3 μm) 22 is epitaxially formed on a p-type silicon substrate 21. Next, boron is thermally diffused into the n-type silicon layer 22 to form a rectangular frame-shaped p-type silicon region (this portion will be a groove 23 later). SiO 2 films 24 on both sides of this substrate,
25 is formed by thermal oxidation, and a window is opened in the back surface 25.
Thus, when the n-type epitaxial layer 22 is subjected to electrolytic etching in a caustic soda aqueous solution at 60 ° C. and about 50%, the p-type silicon substrate 21 is anisotropically etched to form a cavity 35. The n-type silicon layer 22 remains in a diaphragm shape on the upper surface. This diaphragm portion is used as the thin film heater 26. The temperature coefficient of this thin film heater is negative.

【0018】なお、ホウ素拡散領域はエッチされて溝2
3になり、薄膜ヒータと周囲のn形エピタキシャル層2
2を分離する。薄膜ヒータには流体の流れに直角な方向
に電流が流れるように、電極27は流れを挟んで対向位
置に設ける。スリット28は図1と同様に形成する。
The boron diffusion region is etched to form the trench 2
3 and the thin film heater and the surrounding n-type epitaxial layer 2
Separate 2. The electrodes 27 are provided at opposite positions across the flow so that a current flows in the thin film heater in a direction perpendicular to the flow of the fluid. The slit 28 is formed in the same manner as in FIG.

【0019】薄膜ヒータ26の上に形成される温度セン
サ9a,b,cはどんな種類のものでもよいが、ここで
は半導体サーミスタが使われている。これは、0.2μ
m程度の厚みにスパッタリングし、400℃、N2 中で熱
処理したゲルマニーム層30に電極31,32を取り付
けたもので、100℃以下の温度で使用するのに適す
る。
The temperature sensors 9a, 9b and 9c formed on the thin film heater 26 may be of any type, but here, a semiconductor thermistor is used. This is 0.2μ
The electrodes 31 and 32 are attached to a germanium layer 30 sputtered to a thickness of about m and heat-treated in N 2 at 400 ° C., which is suitable for use at a temperature of 100 ° C. or less.

【0020】この薄膜ヒータ26の温度係数は負である
ので、温度が下がると電気抵抗が大きくなる。そして、
薄膜ヒータを流れる電流の方向が気体の流れに直角であ
るので、流れの上流側は冷えて、ヒータの分布抵抗が大
きくなり、電流は上流側を流れにくくなる。このため、
薄膜ヒータの上流側では、発熱が押えられる。一方、下
流側では、気体の流れによる熱の移動で暖められるの
で、抵抗が小さくなり、電流が余計流れるようになり、
その分、余分に発熱する。
Since the temperature coefficient of the thin film heater 26 is negative, the electric resistance increases as the temperature decreases. And
Since the direction of the current flowing through the thin-film heater is perpendicular to the gas flow, the upstream side of the flow cools, the distributed resistance of the heater increases, and the current hardly flows on the upstream side. For this reason,
On the upstream side of the thin film heater, heat generation is suppressed. On the other hand, on the downstream side, it is heated by the movement of heat due to the flow of gas, so the resistance is reduced and the current flows more,
It generates extra heat.

【0021】このように、上流側の温度センサ29aの
ところでは一層冷えるようになり、下流側センサ29c
のところでは一層熱せられ、2つの温度センサの温度差
が大きくなり、感度が増大する。中央部の温度センサ2
9bは前と同じように、薄膜ヒータの中央部の温度をモ
ニタする。
As described above, the temperature is further cooled at the temperature sensor 29a on the upstream side, and the temperature of the downstream sensor 29c is further reduced.
Is heated further, the temperature difference between the two temperature sensors increases, and the sensitivity increases. Temperature sensor 2 at the center
9b monitors the temperature at the center of the thin film heater as before.

【0022】[0022]

【発明の効果】以上説明したように、この発明は、薄膜
ヒータの抵抗温度係数が正のときは、気体の流れに沿っ
て電流が流れるように薄膜ヒータを配置し、抵抗温度係
数が負のときは、気体流に直角に電流が流れるように配
置したものであり、いずれの場合も、薄膜ヒータの下流
側の発熱量が上流側より大きくなり、薄膜ヒータの上流
と下流とで大きな温度差が得られ、高い感度が得られ
る。
As described above, according to the present invention, when the resistance temperature coefficient of the thin film heater is positive, the thin film heater is arranged so that the current flows along the flow of the gas, and the resistance temperature coefficient is negative. In some cases, the heater is arranged so that the current flows at right angles to the gas flow. And high sensitivity is obtained.

【0023】なお、上流側と下流側温度センサの間に第
3の温度センサを置き、これで薄膜センサの中央部の温
度をモニタし、該中央部温度がほぼ一定になるように該
薄膜ヒータに流れる電流を制御するようにすれば、放熱
条件が変化しないので、校正が容易になる。
A third temperature sensor is placed between the upstream and downstream temperature sensors to monitor the temperature at the center of the thin film sensor, and to control the temperature at the center of the thin film sensor to be substantially constant. By controlling the current flowing through the circuit, the heat radiation condition does not change, so that the calibration is facilitated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】フローセンサの第1の実施例であり、(a)は
平面図、(b)は断面図である。
FIG. 1 is a first embodiment of a flow sensor, in which (a) is a plan view and (b) is a cross-sectional view.

【図2】フローセンサの第2の実施例であり、同じく、
(a)は平面図、(b)は断面図である。
FIG. 2 is a second embodiment of the flow sensor,
(A) is a plan view and (b) is a cross-sectional view.

【符号の説明】[Explanation of symbols]

6,26 薄膜ヒータ 9 温度センサ 6,26 Thin film heater 9 Temperature sensor

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 気体の流れにさらされる薄膜ヒータの上
流側と下流側の温度をそれぞれ温度センサで測定し、そ
れらの温度差から気体の流速を検出するようにしたフロ
ーセンサにおいて、該薄膜ヒータが正の抵抗温度係数を
有しており、該薄膜ヒータが気体の流れに沿った方向に
電流が流れるように配置されていることを特徴とするフ
ローセンサ。
1. A flow sensor in which the temperature of an upstream side and the downstream side of a thin film heater exposed to a gas flow is measured by a temperature sensor, and a flow rate of the gas is detected from a difference between the temperatures. Has a positive temperature coefficient of resistance, and the thin-film heater is arranged so that a current flows in a direction along a gas flow.
【請求項2】 気体の流れにさらされる薄膜ヒータの上
流側と下流側の温度をそれぞれ温度センサで測定し、そ
れらの温度差から気体の流速を検出するようにしたフロ
ーセンサにおいて、該薄膜ヒータが負の抵抗温度係数を
有しており、該薄膜ヒータが気体の流れに直角の方向に
電流が流れるように配置されていることを特徴とするフ
ローセンサ。
2. A flow sensor according to claim 1, wherein a temperature of an upstream side and a downstream side of the thin film heater exposed to the gas flow are measured by a temperature sensor, and a flow rate of the gas is detected from a difference between the temperatures. Has a negative temperature coefficient of resistance, and the thin-film heater is arranged so that current flows in a direction perpendicular to the gas flow.
【請求項3】 上流側と下流側温度センサの間にもう一
つの温度センサを置き、これで薄膜センサの中央部の温
度を測定し、該中央部温度がほぼ一定になるように該薄
膜ヒータに流れる電流を制御するようにした請求項1ま
たは2に記載のフローセンサ。
3. A thin-film heater comprising: a second temperature sensor disposed between an upstream temperature sensor and a downstream temperature sensor for measuring a temperature of a central portion of the thin-film sensor; 3. The flow sensor according to claim 1, wherein a current flowing through the flow sensor is controlled.
JP4091599A 1992-03-17 1992-03-17 Flow sensor Expired - Fee Related JP2584702B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP4091599A JP2584702B2 (en) 1992-03-17 1992-03-17 Flow sensor
US08/033,783 US5406841A (en) 1992-03-17 1993-03-17 Flow sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4091599A JP2584702B2 (en) 1992-03-17 1992-03-17 Flow sensor

Publications (2)

Publication Number Publication Date
JPH05264565A JPH05264565A (en) 1993-10-12
JP2584702B2 true JP2584702B2 (en) 1997-02-26

Family

ID=14031026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4091599A Expired - Fee Related JP2584702B2 (en) 1992-03-17 1992-03-17 Flow sensor

Country Status (1)

Country Link
JP (1) JP2584702B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020517931A (en) * 2017-04-18 2020-06-18 サントル ナシオナル ドゥ ラ ルシェルシェ シアンティフィクCentre National De La Recherche Scientifique Device for measuring gas velocity or flow rate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020517931A (en) * 2017-04-18 2020-06-18 サントル ナシオナル ドゥ ラ ルシェルシェ シアンティフィクCentre National De La Recherche Scientifique Device for measuring gas velocity or flow rate
JP7046099B2 (en) 2017-04-18 2022-04-01 サントル ナシオナル ドゥ ラ ルシェルシェ シアンティフィク A device for measuring the velocity or flow rate of gas

Also Published As

Publication number Publication date
JPH05264565A (en) 1993-10-12

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