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JP2586671B2 - Semiconductor multilayer film - Google Patents
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JP2586671B2 - Semiconductor multilayer film - Google Patents

Semiconductor multilayer film

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Publication number
JP2586671B2
JP2586671B2 JP2021274A JP2127490A JP2586671B2 JP 2586671 B2 JP2586671 B2 JP 2586671B2 JP 2021274 A JP2021274 A JP 2021274A JP 2127490 A JP2127490 A JP 2127490A JP 2586671 B2 JP2586671 B2 JP 2586671B2
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Japan
Prior art keywords
thickness
multilayer film
semiconductor
semiconductor multilayer
light
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JP2021274A
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Japanese (ja)
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JPH03225885A (en
Inventor
健一 笠原
英男 小坂
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NEC Corp
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Nippon Electric Co Ltd
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Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は面発光半導体レーザや半導体機能素子に必要
な半導体多層膜に関する。
Description: TECHNICAL FIELD The present invention relates to a semiconductor multilayer film required for a surface emitting semiconductor laser or a semiconductor functional element.

(従来の技術) 面発光半導体レーザは半導体基板と垂直に発振光が得
られ、超並列な光通信システムや、光を使った2次元情
報処理を実現する上で不可欠なキー・デバイスである。
(Prior Art) A surface emitting semiconductor laser is capable of generating oscillation light perpendicular to a semiconductor substrate, and is an indispensable key device for realizing a super-parallel optical communication system and two-dimensional information processing using light.

第4図は1989年に日本で開催された第7回Integrated
Optics and Optical Fiber Communication(IOC'89)
のポストデッドラインの論文集(18B2−6,PD)でAT&TB
ell研のJ.L.Jewellより発表された、面発光半導体レー
ザの断面構造図を示してある。P型半導体多層膜42とn
型半導体多層膜41がInを添加しGaAsよりもバンド・ギャ
ップ波長を長波側にずらしたInGaAs活性層43の上下に形
成されており、それぞれが反射鏡として働く。
Figure 4 shows the 7th Integrated Conference held in Japan in 1989.
Optics and Optical Fiber Communication (IOC'89)
AT & TB in the Post Deadline Papers (18B2-6, PD)
1 shows a cross-sectional structure diagram of a surface emitting semiconductor laser published by JLJewell of ell Lab. P-type semiconductor multilayer film 42 and n
The type semiconductor multilayer film 41 is formed above and below the InGaAs active layer 43 in which In is added and the band gap wavelength is shifted to the longer wavelength side than GaAs, and each functions as a reflector.

面発光レーザの共振器長Lは通常μmオーダである。
Lを短くした時、反射率Rを通常の横方向で発振するレ
ーザ(L300μm)と同じ様なレベルのR〜0.3では閾
値電流密度Jth(A/cm2)が増大してしまう。そのために
面発光レーザではRを極めて高い値にする必要があり、
又、その様に高反射率の反射鏡を形成しなければらな
い。第4図の従来例ではRを99%以上の反射鏡がλ/4の
膜厚の半導体多層膜によって作られている。ここでλは
半導体多層膜中での波長である。
The cavity length L of a surface emitting laser is usually on the order of μm.
When L is shortened, the threshold current density J th (A / cm 2 ) increases when the reflectivity R is the same level as that of a laser (L 300 μm) that oscillates in the normal lateral direction (L = 0.3 μm). Therefore, in a surface emitting laser, it is necessary to set R to an extremely high value.
Further, a reflecting mirror having such a high reflectance must be formed. In the conventional example shown in FIG. 4, a reflecting mirror having an R of 99% or more is made of a semiconductor multilayer film having a thickness of λ / 4. Here, λ is the wavelength in the semiconductor multilayer film.

一方、面発光半導体レーザの微分量子効率ηで与えられる。ここで ηi:内部微分量子効率 d:活性層厚 L:共振器長 αac:活性層での光損失(cm-1) αex:活性層以外での光損失(cm-1) αs:光学的散乱損失(cm-1) である。On the other hand, the differential quantum efficiency η d of the surface emitting semiconductor laser is Given by Where η i : internal differential quantum efficiency d: Active layer thickness L: Resonator length α ac : Light loss in active layer (cm −1 ) α ex : Light loss in other than active layer (cm −1 ) α s : Optical scattering loss (cm −1) ).

ηが高いことが、応用上、重要であるが、そのため
には、(1)式で dαac+(L−d)αex+Lα ……(2) を小さくしなければならない。第4図の従来例では、活
性層厚dを100ÅとしたSQW構造でmAオーダの低閾値での
発振特性が得られている。Lは5〜6μmでdに比べる
と大きい。光学的散乱損失αを小さくできたとする
と、(2)式の値を小さくするためには活性層以外での
光損失αexを小さくする必要がある。(L−d)αex
更に (L−d)αexLαex =L1αex (1)+L2αex (2)+L3αex (3)+L
4αex (4) ……(3) と書き表わせる。ここで L1ex (1):n型半導体多層膜の厚さと光吸収損失 L2ex (2):n型クラッド層の厚さと光吸収損失 L3ex (3):P型クラッド層の厚さと光吸収損失 L4ex (4):P型半導体多層膜の厚さと光吸収損失 である。第4図の従来例ではn型半導体多層膜41はλ/4
厚のAlAsとGaAs23・1/2周期連続成長して作られてい
る。AlAsとGaAsの屈折率nは、波長λ=980nmの光に
対しそれぞれn3.18,3.62位と推定されるので、n型
半導体多層膜の厚さは〜3.4μmと思われる。又、p型
半導体多層膜としては15周期、形成されているので、厚
さとしては、〜2.2μmと思われる。n型多層膜とp型
多層膜の距離は一波長に設定されているのでL2+L3=λ
0/n0.29μmになっているものと思われる。
It is important in application that η d is high. For this purpose, dα ac + (L−d) α ex + Lα s (2) must be reduced in equation (1). In the conventional example shown in FIG. 4, an oscillation characteristic at a low threshold of the order of mA is obtained in the SQW structure in which the thickness d of the active layer is 100 °. L is 5 to 6 μm, which is larger than d. Assuming that the optical scattering loss α s can be reduced, it is necessary to reduce the light loss α ex in areas other than the active layer in order to reduce the value of equation (2). (L-d) α ex further (L-d) α ex Lα ex = L 1 α ex (1) + L 2 α ex (2) + L 3 α ex (3) + L
4 α ex (4) …… (3) Here, L 1 , α ex (1) : n-type semiconductor multilayer film thickness and light absorption loss L 2 , α ex (2) : n-type cladding layer thickness and light absorption loss L 3 , α ex (3) : P-type cladding layer thickness and light absorption loss L 4 , α ex (4) : Thickness and light absorption loss of P-type semiconductor multilayer film. In the conventional example of FIG. 4, the n-type semiconductor multilayer film 41 has a wavelength of λ / 4.
It is made by continuous growth of thick AlAs and GaAs for 231/2 cycles. Since the refractive indices n of AlAs and GaAs are estimated to be about n3.18 and 3.62, respectively, for light having a wavelength of λ 0 = 980 nm, the thickness of the n-type semiconductor multilayer film is considered to be up to 3.4 μm. Further, since the p-type semiconductor multilayer film is formed for 15 periods, the thickness is considered to be up to 2.2 μm. Since the distance between the n-type multilayer film and the p-type multilayer film is set to one wavelength, L 2 + L 3 = λ
0 / n It seems to be 0.29 μm.

従って、n型及びp型半導体多層膜の厚さが共振器長
に対して大きな割合を占めているので(3)式の値を小
さくするためには半導体多層膜での光吸収損失を、小さ
くすることが非常に重要となる。
Accordingly, since the thickness of the n-type and p-type semiconductor multilayer films occupies a large proportion of the cavity length, the light absorption loss in the semiconductor multilayer film is reduced to reduce the value of the expression (3). It is very important to do.

AlGaAs系ではAlAsが最も屈折率が低く、GaAsが最も、
屈折率が高く、半導体多層膜の反射率を高める組み合せ
としては、これが最も良いということになる。そして、
第4図ではそれらがλ/4厚で交互に積層されているわけ
である。
In the AlGaAs system, AlAs has the lowest refractive index, GaAs has the lowest,
This is the best combination as a combination having a high refractive index and increasing the reflectance of the semiconductor multilayer film. And
In FIG. 4, they are alternately laminated with a thickness of λ / 4.

(発明が解決しようとする課題) 第4図の構造では10%前後の微分量子効率が達成され
ているがレーザ特性の向上のためには、微分量子効率を
高める必要がある。
(Problem to be Solved by the Invention) In the structure of FIG. 4, a differential quantum efficiency of about 10% is achieved, but it is necessary to increase the differential quantum efficiency in order to improve the laser characteristics.

(課題を解決するための手段) 本発明による半導体多層膜は、所定の光に対する光吸
収損失の小さい第1の半導体膜とその所定の光に対する
光吸収損失の大きな第2の半導体膜を交互に積層して形
成した半導体多層膜において、前記半導体多層膜内での
前記所定の光の波長をλとして、前記第1の半導体膜の
厚さをλ/4より厚くし、前記第2の半導体膜の厚さをλ
/4より薄くし、それぞれの膜厚のλ/4からの変化の割合
が同程度であることを特徴とする。ここでいう所定の光
とは、例えば、面発光レーザでは活性層からの発振光で
あり、反射鏡として本発明を使用する場合は外部光であ
る。
(Means for Solving the Problems) In a semiconductor multilayer film according to the present invention, a first semiconductor film having a small light absorption loss for a predetermined light and a second semiconductor film having a large light absorption loss for the predetermined light are alternately arranged. In the semiconductor multilayer film formed by laminating, the wavelength of the predetermined light in the semiconductor multilayer film is λ, the thickness of the first semiconductor film is greater than λ / 4, and the second semiconductor film is The thickness of
/ 4, and the rate of change of each film thickness from λ / 4 is substantially the same. Here, the predetermined light is, for example, oscillation light from an active layer in a surface emitting laser, and is external light when the present invention is used as a reflecting mirror.

(作用) 高屈折率及び低屈折率の半導体膜厚をλ/4厚から、少
しずらしても全体の反射率は急激には減少しない。一方
の半導体膜厚を増やしたとしても、もう一方の半導体膜
厚を同じ割合で減らせば、反射率の減少の仕方を小さく
できる。そこで光吸収損失の多い方の半導体膜厚を、光
吸収損失の少ない半導体膜厚に対して相対的に減らすよ
うにする。そうすれば、高反射率を維持した状態で、半
導体多層膜中での光吸収損失を減少させることができ、
それによって高効率の面発光半導体レーザを実現でき
る。
(Effect) Even if the thickness of the semiconductor layers having a high refractive index and a low refractive index is slightly shifted from the λ / 4 thickness, the overall reflectance does not decrease sharply. Even if the thickness of one semiconductor is increased, the manner of decreasing the reflectance can be reduced by reducing the thickness of the other semiconductor at the same rate. Therefore, the thickness of the semiconductor having a larger light absorption loss is relatively reduced with respect to the thickness of the semiconductor having a smaller light absorption loss. Then, while maintaining high reflectance, light absorption loss in the semiconductor multilayer film can be reduced,
Thereby, a highly efficient surface emitting semiconductor laser can be realized.

第1図にGaAs、AlAsが20周期から成る多層膜でλ/4の
最適な厚さからAlAs厚d1を増やし、GaAs厚d2を同じ割合
で減らしていた時に多層膜の反射率Rがどう変化してい
くか、計算した結果を示している。第1図の中の、変化
の割合(ズレ)をAlAs、GaAsに対しそれぞれ、δd1/d1,
δd2/d2としてδd1/d1=−δd2/d2の場合である。λ/4
厚の時にR=0.99924であったものが、5%、10%の膜
厚変化でそれぞれR=0.99922,0.99916と変化、減少し
ていくが、その変化は緩やかである。第1図にはλ/4の
厚さからの変化の割合(ズレ)を同方向にした時、即ち
GaAsもAlAsも増やした場合(あるいは両方減らした場
合)のRの変化を同時に示しているが、この場合は考え
ている波長に対し急激に反射率Rが低下する。従って本
発明のようにズレを反対方向(一方を増やし他方を減ら
す)にする必要がある。
GaAs in Figure 1, AlAs is increased AlAs thickness d 1 from the optimum thickness of lambda / 4 multilayer film consisting of 20 periods, the reflectivity R of the multilayer film when having reduced GaAs thickness d 2 at the same rate The results of calculations show how they change. In FIG. 1, the rate of change (deviation) is δd 1 / d 1 ,
a case as .delta.d 2 / d 2 of δd 1 / d 1 = -δd 2 / d 2. λ / 4
R = 0.99924 at the time of thickness changes and decreases and decreases to R = 0.99922 and 0.99916 with 5% and 10% film thickness changes, respectively, but the change is gradual. FIG. 1 shows the case where the rate of change (shift) from the thickness of λ / 4 in the same direction, ie,
The change in R when both GaAs and AlAs are increased (or when both are decreased) is shown at the same time. In this case, the reflectance R sharply decreases with respect to the considered wavelength. Therefore, it is necessary to shift the displacement in the opposite direction (increase one and decrease the other) as in the present invention.

一方、半導体膜の光吸収は、第2図で示した様にバ
ンド間吸収、バンド内吸収、価電子帯間吸収から成
る。半導体多層膜は第4図の例では、レーザ光に対して
透明波長域にある様に設定されているので、,の光
吸収損失が問題となる。のバンド内吸収は、自由キャ
リア吸収と呼ばれるものでGaAsでは室温において α(cm-1)3×10-18n+7×10-18p ……(4) となる。但しnとpはcm-3単位で表した。電子ならびに
正孔密度である。p型及びn型多層膜のキャリア濃度を
それぞれ2×1018cm-3とすると、第4図の例ではバンド
内吸収は3×10-3,2×10-3となる。
On the other hand, the light absorption of the semiconductor film consists of inter-band absorption, intra-band absorption, and valence band absorption as shown in FIG. In the example shown in FIG. 4, the semiconductor multilayer film is set so as to be in a transparent wavelength range with respect to the laser light, so that the light absorption loss becomes a problem. Is called free carrier absorption, and in GaAs, α (cm −1 ) 3 × 10 −18 n + 7 × 10 −18 p (4) at room temperature. However, n and p are expressed in cm -3 units. Electron and hole density. Assuming that the carrier concentration of each of the p-type and n-type multilayer films is 2 × 10 18 cm −3 , the absorption in the band is 3 × 10 −3 and 2 × 10 −3 in the example of FIG.

一方、の価電子帯間吸収は、 α(cm-1)=K0N+α ……(5) と表わせる。K0は温度に依存する比例定数、αはNに
よらない損失係数で、主なものとしてはスプリットオフ
帯からアクセプタ準位への遷移によるものが考えられ
る。価電子帯間の吸収損失は価電子帯の構造に依存する
が、一般にはバンドギャップエネルギーの小さいものほ
ど大きいと考えて良く、波長1.5〜1.6μm帯及び1.3μ
m帯のGaInAsP系レーザではそれぞれ100cm-1程度、数〜
数10cm-1程度となる。又、GaAs/GaAlAs系レーザでは数
〜数10cm-1となることが知られている。(5)式はあら
わには価電子帯の正孔密度が入っていないが勿論、その
大きさに影響される。第4図の構造を考え仮に10cm-1
すると価電子帯吸収による光吸収は、バンド内吸収のそ
れと同程度になる。又、InGaAsP系では価電子帯吸収に
よる光吸収が更に大きくなるものと予想される。
On the other hand, the valence band absorption can be expressed as α (cm −1 ) = K 0 N + α 2 (5). K 0 is a proportionality constant that depends on temperature, and α 2 is a loss coefficient that does not depend on N. The main factor is considered to be a transition from the split-off band to the acceptor level. The absorption loss between the valence bands depends on the structure of the valence band. Generally, it can be considered that the smaller the band gap energy is, the larger the band gap energy is.
For m-band GaInAsP-based lasers, about 100 cm -1
It is about several tens cm- 1 . In the case of a GaAs / GaAlAs-based laser, it is known to be several to several tens cm- 1 . The expression (5) does not clearly include the hole density of the valence band, but is obviously influenced by the size. Considering the structure of FIG. 4, if it is assumed to be 10 cm −1 , the light absorption due to the valence band absorption is almost equal to that in the band. Further, it is expected that light absorption due to valence band absorption will be further increased in the InGaAsP system.

従って半導体多層膜の反射率が大きく劣化しない範囲
で、λ/4厚からずらす。そして、価電子帯吸収が多い半
導体膜の厚さを減らし、それと同時に相対的に価電子帯
吸収が少ない半導体膜の方の厚さを増やす。それによっ
て光吸収の少ない多層膜を形成することが可能となる。
Therefore, the thickness is shifted from the λ / 4 thickness as long as the reflectivity of the semiconductor multilayer film does not significantly deteriorate. Then, the thickness of the semiconductor film having a high valence band absorption is reduced, and at the same time, the thickness of the semiconductor film having a relatively low valence band absorption is increased. This makes it possible to form a multilayer film with low light absorption.

(実施例) 第3図は本発明の一実施例で本発明の半導体多層膜を
反射膜とする面発光半導体レーザの構造断面図である。
基本的な構造は第4図の従来例と同じである。AlAs,GaA
sからなる半導体多層膜の部分のみをλ/4厚からずらし
てある。AlAsの方をλ/4厚から10%増やし、GaAsの方を
λ/4厚から10%減らしてある。P型半導体多層膜32の方
はBeを、又、n型半導体多層膜31の方はSiをドーピング
して作製してある。半導体多層膜を含めて全体をMBE法
で作製してある。活性層33には第4図と同様にInを添加
してあり組成はIn0.2Ga0.8Asとなっている。p型半導体
多層膜32とn型半導体多層膜31の周期はそれぞれ15周
期、23 1/2周期である。その他のクラッド層の層厚等は
第4図と同じである。(3)式は本実施例では (L−d)αexL1{(バンド内吸収)+(価電子帯吸
収)} +L2{(バンド内吸収)+(価電子帯吸収)} ……
(6) となる。バンド内吸収の値としては、n=p=2×1018
cm-3として(4)式を使う。GaAsとAlAsの価電子帯吸収
の大きさを、それぞれα(cm-1)、α(cm-1)とす
ると、(6)式の値はλ/4厚に設定した時は、 (L−d)αex2×10-3+1.8×10-4α+1.6 ×10-4α+3×10-3+1.2×10-4α+1.0×10-4α
……(7) となる。それに対して、本実施例の様にAlAs厚をλ/4厚
より10%増やし、GaAs厚を10%減らした時には、(6)
式の値は (L−d)αex2×10-3+2.0×10-4α+1.4 ×10-4α+3×10-3+1.3×10-4α+0.9×10-4α
……(8) となる。αとαの大きさは、はっきりとした値は報
告されていないが数〜数10cm-1の違いはあるものと推定
され、その結果として(L−d)αexの低減が可能とな
る。そして、それによって微分量子効率ηの数十%改
善が見られた。
(Example) FIG. 3 is a structural sectional view of a surface emitting semiconductor laser using a semiconductor multilayer film of the present invention as a reflection film in one embodiment of the present invention.
The basic structure is the same as the conventional example shown in FIG. AlAs, GaA
Only the portion of the semiconductor multilayer film made of s is shifted from the λ / 4 thickness. AlAs is increased by 10% from λ / 4 thickness, and GaAs is reduced by 10% from λ / 4 thickness. The P-type semiconductor multilayer film 32 is manufactured by doping Be, and the n-type semiconductor multilayer film 31 is manufactured by doping Si. The whole including the semiconductor multilayer film is manufactured by the MBE method. As in FIG. 4, In is added to the active layer 33, and the composition is In 0.2 Ga 0.8 As. The periods of the p-type semiconductor multilayer film 32 and the n-type semiconductor multilayer film 31 are 15 periods and 231/2 periods, respectively. The other thicknesses of the cladding layers are the same as in FIG. In this embodiment, the expression (3) is (Ld) α ex L 1 {(in-band absorption) + (valence band absorption)} + L 2 {(in-band absorption) + (valence band absorption)}.
(6) As the value of the absorption in the band, n = p = 2 × 10 18
Equation (4) is used as cm -3 . If the magnitudes of valence band absorption of GaAs and AlAs are α G (cm −1 ) and α A (cm −1 ), respectively, the value of equation (6) becomes: L-d) α ex 2 × 10 −3 + 1.8 × 10 −4 α A + 1.6 × 10 −4 α G + 3 × 10 −3 + 1.2 × 10 −4 α A + 1.0 × 10 −4 α G
(7) On the other hand, when the AlAs thickness is increased by 10% from the λ / 4 thickness and the GaAs thickness is reduced by 10% as in this embodiment, (6)
The value of the equation is (Ld) α ex 2 × 10 −3 + 2.0 × 10 −4 α A + 1.4 × 10 −4 α G + 3 × 10 −3 + 1.3 × 10 −4 α A +0. 9 × 10 -4 α G
(8) The size of the alpha A and alpha G is distinct values are presumed but not reported in the difference between the number to several 10 cm -1, and can be reduced as a result (L-d) α ex Become. As a result, several tens% improvement in the differential quantum efficiency η d was observed.

本実施例ではAlGaAs/GaAs系での面発光半導体レーザ
に適用した例について説明したがInGaAsP/InP系では価
電子帯吸収による光吸収が大きく、更に有効に働く。本
実施例では半導体多層膜を面発光レーザに適用した例を
示したがこれに限らず反射膜をもつデバイスに適用でき
る。
In this embodiment, an example in which the present invention is applied to a surface emitting semiconductor laser of the AlGaAs / GaAs type has been described. However, in the InGaAsP / InP type, light absorption due to valence band absorption is large and works more effectively. In this embodiment, an example in which a semiconductor multilayer film is applied to a surface emitting laser is shown, but the present invention is not limited to this, and can be applied to a device having a reflection film.

(発明の効果) 本発明によれば、高反射率を維持したままで、そこで
の光吸収損失の低減が可能となる半導体多層膜が実現で
きる。これは面発光レーザや光機能素子の反射膜あるい
は半導体ミラーとして応用できる。
(Effects of the Invention) According to the present invention, it is possible to realize a semiconductor multilayer film capable of reducing a light absorption loss while maintaining a high reflectance. This can be applied as a surface emitting laser, a reflection film of an optical function element, or a semiconductor mirror.

【図面の簡単な説明】[Brief description of the drawings]

第1図はλ/4厚から同じ割合で厚さを変化させていった
時の半導体多層膜の反射率を示す図。第2図はIII−V
族半導体中での光吸収のメカニズムを示すバンド図。第
3図は本発明の一実施例の発光素子の構造断面図。第4
図は従来例の構造断面図である。図において31と41はn
型半導体多層膜、33と43は活性層32と42はp型半導体多
層膜である。
FIG. 1 is a view showing the reflectivity of a semiconductor multilayer film when the thickness is changed at the same ratio from λ / 4 thickness. Fig. 2 is III-V
FIG. 2 is a band diagram showing a mechanism of light absorption in a group III semiconductor. FIG. 3 is a structural sectional view of a light emitting device according to one embodiment of the present invention. 4th
The figure is a structural cross-sectional view of a conventional example. In the figure, 31 and 41 are n
Active semiconductor layers 33 and 43 are active layers 32 and 42 are p-type semiconductor multilayer films.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】所定の光に対する光吸収損失の小さい第1
の半導体膜と、前記所定の光に対する光吸収損失の大き
な第2の半導体膜を、交互に積層して形成した半導体多
層膜に於て、前記半導体多層膜内での前記所定の光の波
長をλとして前記第1の半導体膜の厚さをλ/4より厚く
し、前記第2の半導体膜の厚さをλ/4より薄くし、それ
ぞれの膜厚のλ/4厚からの変化の割合が同程度であるこ
とを特徴とする半導体多層膜。
A first light-absorptive first light having a small light absorption loss;
In a semiconductor multilayer film formed by alternately laminating a semiconductor film of the type and a second semiconductor film having a large light absorption loss for the predetermined light, the wavelength of the predetermined light in the semiconductor multilayer film is As λ, the thickness of the first semiconductor film is set to be larger than λ / 4, and the thickness of the second semiconductor film is set to be smaller than λ / 4. Are the same level.
JP2021274A 1990-01-30 1990-01-30 Semiconductor multilayer film Expired - Lifetime JP2586671B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021274A JP2586671B2 (en) 1990-01-30 1990-01-30 Semiconductor multilayer film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021274A JP2586671B2 (en) 1990-01-30 1990-01-30 Semiconductor multilayer film

Publications (2)

Publication Number Publication Date
JPH03225885A JPH03225885A (en) 1991-10-04
JP2586671B2 true JP2586671B2 (en) 1997-03-05

Family

ID=12050544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021274A Expired - Lifetime JP2586671B2 (en) 1990-01-30 1990-01-30 Semiconductor multilayer film

Country Status (1)

Country Link
JP (1) JP2586671B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0483868B1 (en) * 1990-11-02 1997-01-22 Norikatsu Yamauchi Semiconductor device having reflecting layer
US5264715A (en) * 1992-07-06 1993-11-23 Honeywell Inc. Emitting with structures located at positions which prevent certain disadvantageous modes and enhance generation of light in advantageous modes
US5244749A (en) * 1992-08-03 1993-09-14 At&T Bell Laboratories Article comprising an epitaxial multilayer mirror
JP6039324B2 (en) * 2012-09-10 2016-12-07 キヤノン株式会社 Laser cavity and vertical cavity surface emitting laser
JP2021114594A (en) * 2019-08-27 2021-08-05 株式会社東芝 Optical semiconductor element

Also Published As

Publication number Publication date
JPH03225885A (en) 1991-10-04

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