JP2587540B2 - Separation method of resin sealing body from lead frame - Google Patents
Separation method of resin sealing body from lead frameInfo
- Publication number
- JP2587540B2 JP2587540B2 JP3017858A JP1785891A JP2587540B2 JP 2587540 B2 JP2587540 B2 JP 2587540B2 JP 3017858 A JP3017858 A JP 3017858A JP 1785891 A JP1785891 A JP 1785891A JP 2587540 B2 JP2587540 B2 JP 2587540B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- sealing body
- resin sealing
- resin
- separating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リードフレームに搭載
され、樹脂封止された半導体等の樹脂封止体を前記リー
ドフレームより切離すリードフレームより樹脂封止体の
切離し法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a resin sealing body from a lead frame, which is mounted on a lead frame and separates a resin sealing body such as a resin-sealed semiconductor from the lead frame.
【０００２】[0002]
【従来の技術】図２（ａ）及び（ｂ）は従来のリードフ
レームより樹脂封止体の切離し法の一例を説明するため
のリードフレームを示す平面図である。従来、この種の
リードフレームより樹脂封止体の切離し法は、例えば、
図２に示すように、まず、図２（ａ）で、リードフレー
ム１の中央にある半導体素子を樹脂封止して吊りピン２
を切断する。次に、図２（ｂ）に示すタイバ５とリード
６の先端と接続する部分を切断し、樹脂外郭体３をリー
ドフレーム１より切離していた。2. Description of the Related Art FIGS. 2A and 2B are plan views showing a lead frame for explaining an example of a method of separating a resin sealing body from a conventional lead frame. Conventionally, the method of separating the resin sealing body from this type of lead frame is, for example,
As shown in FIG. 2, first, in FIG. 2A, the semiconductor element at the center of the
Disconnect. Next, the portion connecting the tie bar 5 and the tip of the lead 6 shown in FIG.
【０００３】また、この樹脂外郭体３を切離す際に、樹
脂封止した際に付着する樹脂ばりも取れる利点がある。Further, when the resin outer body 3 is separated, there is an advantage that a resin flash attached when the resin is sealed is removed.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来のリード
フレームより樹脂封止体の切離し法では、吊りピンを切
取る工程で、金型のポンチの先端部に付着したはんだか
すや樹脂ばりがリード表面に乗り、その後のリード切断
及びタイバ切取り工程で、金型のストリッパプレートで
前記はんだかすや前記樹脂ばりを押しつぶし、リード間
の短絡や、リードの破断を引き起すという問題がある。In the above-described method of separating the resin sealing body from the lead frame, in the step of cutting the hanging pins, the solder residue or the resin burrs attached to the tip of the punch of the mold is used as the lead. There is a problem that the solder residue and the resin burr are crushed by a stripper plate of a mold in a subsequent step of cutting the lead and cutting off the tie bar on the surface, thereby causing a short circuit between the leads and a breakage of the leads.
【０００５】本発明の目的は、かかる問題を解消するリ
ードフレームより樹脂封止体の切離し法を提供すること
である。An object of the present invention is to provide a method for separating a resin sealing body from a lead frame, which solves such a problem.
【０００６】[0006]
【課題を解決するための手段】本発明のリードフレーム
より樹脂封止体の切離し法は、リードフレームに搭載さ
れた半導体素子を樹脂封止し、この樹脂封止体を前記リ
ードフレームより切離すリードフレームより樹脂封止体
の切離し法において、前記樹脂封止体を支える吊りピン
とこの吊りピンと連結する前記リードフレーム本体側と
を含む領域を切り取ることを特徴としている。According to the method of separating a resin sealing body from a lead frame according to the present invention, a semiconductor element mounted on a lead frame is sealed with a resin, and the resin sealing body is separated from the lead frame. In the method for separating a resin sealing body from a lead frame, a region including a suspending pin for supporting the resin sealing body and the lead frame body side connected to the suspending pin is cut out.
【０００７】[0007]
【実施例】次に、本発明について図面を参照して説明す
る。図１（ａ）及び（ｂ）は本発明のリードフレームよ
り樹脂封止体の切離し法の一実施例を説明するためのリ
ードフレームの平面図である。このリードフレームより
樹脂封止体の切離し法は、まず、図１（ａ）に示すリー
ドフレーム１に樹脂封止された樹脂外郭体３を金型の下
型に位置決めする。次に、図１（ｂ）に示すように、吊
りピン２を連結するリードフレーム１の領域である外側
に伸びる領域の切欠き部７をポンチで切取る。Next, the present invention will be described with reference to the drawings. FIGS. 1A and 1B are plan views of a lead frame for explaining one embodiment of a method of separating a resin sealing body from a lead frame of the present invention. In the method of separating the resin sealing body from the lead frame, first, the resin outer body 3 resin-sealed to the lead frame 1 shown in FIG. Next, as shown in FIG. 1B, a notch 7 in a region extending outward which is a region of the lead frame 1 to which the hanging pins 2 are connected is cut out with a punch.
【０００８】このように、吊りピン２を含む広い領域を
切り取ることによって、ポンチに付着するはんだかすや
樹脂ばりは、この切込み部７より下に落ち、リード６上
に乗ることがなくなる。次の工程であるタイバ５及びリ
ード６の切断は、従来と同じように行う。As described above, by cutting out a wide area including the hanging pins 2, the solder residue and the resin flash adhering to the punch fall below the cut portion 7 and do not ride on the lead 6. The next step, cutting of the tie bar 5 and the lead 6, is performed in the same manner as in the related art.
【０００９】[0009]
【発明の効果】以上説明したように本発明は、吊りピン
を取去る工程で、吊りピンと吊りピンと連結するリード
フレームの領域とを含む広い領域部分を打抜くことによ
り、ポンチに付着するはんだかすや樹脂ばりがこの切取
り部分である穴に落ち込むので、リードにはんだかすや
樹脂ばりが乗ることなく、リードの短絡及び切断を起す
ことなくリードフレームより樹脂封止体を切離すことの
出来るリードフレームより樹脂封止体の切離し法が得ら
れるという効果がある。As described above, according to the present invention, in the step of removing the suspension pin, a large area including the suspension pin and the area of the lead frame connected to the suspension pin is punched, so that the solder residue adhering to the punch is removed. The lead frame allows the resin sealing body to be separated from the lead frame without causing solder residue or resin burrs on the leads and causing short-circuiting and cutting of the leads, as the resin burrs fall into the holes that are the cutouts. There is an effect that a method for separating the resin sealing body can be obtained.
【図１】本発明のリードフレームより樹脂封止体の切離
し法の一実施例を説明するためのリードフレームの平面
図である。FIG. 1 is a plan view of a lead frame for explaining an embodiment of a method of separating a resin sealing body from a lead frame of the present invention.
【図２】従来のリードフレームより樹脂封止体の切離し
法の一例を説明するためのリードフレームの平面図であ
る。FIG. 2 is a plan view of a lead frame for explaining an example of a method of separating a resin sealing body from a conventional lead frame.
１ リードフレーム ２ 吊りピン ３ 樹脂外郭体 ４ 樹脂ばり ５ タイバ ６ リード ７ 切欠き部 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Hanging pin 3 Resin outer body 4 Resin beam 5 Tiba 6 Lead 7 Notch
Claims (1)
を樹脂封止し、この樹脂封止体を前記リードフレームよ
り切離すリードフレームより樹脂封止体の切離し法にお
いて、前記樹脂封止体を支える吊りピンとこの吊りピン
と連結する前記リードフレーム本体側とを含む領域を切
り取ることを特徴とするリードフレームより樹脂封止体
の切離し法。A semiconductor device mounted on a lead frame is sealed with a resin, and the resin sealing body is supported by a method of separating the resin sealing body from the lead frame. A method for separating a resin sealing body from a lead frame, wherein a region including a hanging pin and a side of the lead frame main body connected to the hanging pin is cut out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3017858A JP2587540B2 (en) | 1991-02-08 | 1991-02-08 | Separation method of resin sealing body from lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3017858A JP2587540B2 (en) | 1991-02-08 | 1991-02-08 | Separation method of resin sealing body from lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04256326A JPH04256326A (en) | 1992-09-11 |
| JP2587540B2 true JP2587540B2 (en) | 1997-03-05 |
Family
ID=11955359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3017858A Expired - Fee Related JP2587540B2 (en) | 1991-02-08 | 1991-02-08 | Separation method of resin sealing body from lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2587540B2 (en) |
-
1991
- 1991-02-08 JP JP3017858A patent/JP2587540B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04256326A (en) | 1992-09-11 |
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