Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP2590741B2 - Equipment for evaluating heat dissipation performance of electronic equipment - Google Patents
[go: Go Back, main page]

JP2590741B2 - Equipment for evaluating heat dissipation performance of electronic equipment - Google Patents

Equipment for evaluating heat dissipation performance of electronic equipment

Info

Publication number
JP2590741B2
JP2590741B2 JP6165110A JP16511094A JP2590741B2 JP 2590741 B2 JP2590741 B2 JP 2590741B2 JP 6165110 A JP6165110 A JP 6165110A JP 16511094 A JP16511094 A JP 16511094A JP 2590741 B2 JP2590741 B2 JP 2590741B2
Authority
JP
Japan
Prior art keywords
air
electronic device
temperature
flow rate
exhaust port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6165110A
Other languages
Japanese (ja)
Other versions
JPH0829210A (en
Inventor
範明 上戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6165110A priority Critical patent/JP2590741B2/en
Publication of JPH0829210A publication Critical patent/JPH0829210A/en
Application granted granted Critical
Publication of JP2590741B2 publication Critical patent/JP2590741B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、ブロアで強制冷却する
電子機器の放熱性能を評価するための放熱性能評価装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation performance evaluation apparatus for evaluating the heat radiation performance of electronic equipment which is forcibly cooled by a blower.

【0002】[0002]

【従来の技術】従来、この種のブロアで強制冷却する電
子機器においては、熱設計条件(発熱量、部品の許容温
度、実装構造および設置環境条件)を検討し、必要風量
および圧力損失を算出して、各種ブロアの流量−圧力損
失特性から最適ブロアの選定を行っていた。
2. Description of the Related Art Conventionally, in electronic equipment that is forcibly cooled by a blower of this type, the necessary air flow and pressure loss are calculated by examining thermal design conditions (heat generation, allowable temperature of parts, mounting structure and installation environment conditions). Then, the optimum blower is selected from the flow rate-pressure loss characteristics of various blowers.

【0003】そして、この熱設計により選定したブロア
を用いたときの放熱性能の評価方法は、電子機器を恒温
槽に入れ、その装置の使用温度範囲の上限まで変温した
後、電子機器が正常に作動することで確認していた。ま
た、温度に敏感な電子部品、あるいは表面積に比べて発
熱量が大きい電子部品を実装する電子機器においては、
放熱条件が厳しいため、製品と類似の実験装置を製作
し、流量を可変可能なブロアを用いて、恒温槽内で空気
を実験装置に送り込み圧力損失等の放熱性能を測定し、
この測定したデータを解析することにより、最適なブロ
アを選定する手法が採られていた。
[0003] A method of evaluating the heat radiation performance when using the blower selected by this thermal design is to put the electronic device in a constant temperature bath, change the temperature to the upper limit of the operating temperature range of the device, and then make the electronic device operate normally. It was confirmed that it would work. Also, in electronic devices that mount temperature-sensitive electronic components or electronic components that generate a large amount of heat compared to the surface area,
Due to severe heat radiation conditions, an experimental device similar to the product was manufactured, and air was sent into the experimental device in a thermostat using a blower with variable flow rate, and the heat radiation performance such as pressure loss was measured.
A method of selecting an optimal blower by analyzing the measured data has been adopted.

【0004】[0004]

【発明が解決しようとする課題】上述した従来の電子機
器の放熱性能評価方式では、冷却する空気の圧力および
流速は、流量可変型のブロアを用いて回転数を制御する
ことによって、可変できたが、装置の使用温度範囲の上
限での放熱性能は、恒温槽に入れないと正確に測定でき
なかった。一方、恒温槽においては、特定のポイントに
温度センサが固定されており、その位置でないと恒温層
での温度コントロールができず、測定位置が限定され
る。また、恒温槽内で電子機器の放熱性能を計測する場
合、電子機器の内部の温度コントロールができず、電子
機器内部に配設した電子部品の正確な温度測定ができな
いという欠点があった。さらに、電子機器の排出口の温
度を測定する場合、周囲温度の影響を受け易く、検出精
度が悪いという欠点もあった。また、検出した温度、圧
力および風速データから流量、圧力損失および放熱量を
算出し適切なブロアを選定するのにかなりの時間と手間
を要するという欠点があった。
In the above-described conventional method for evaluating the heat radiation performance of electronic equipment, the pressure and flow velocity of the air to be cooled could be varied by controlling the number of revolutions using a variable flow type blower. However, the heat radiation performance at the upper limit of the operating temperature range of the device could not be accurately measured unless the device was placed in a thermostat. On the other hand, in the thermostatic bath, a temperature sensor is fixed at a specific point, and unless it is at that position, temperature control in the thermostatic layer cannot be performed, and the measurement position is limited. Further, when measuring the heat radiation performance of the electronic device in the thermostat, there is a disadvantage that the temperature inside the electronic device cannot be controlled, and the temperature of the electronic components disposed inside the electronic device cannot be measured accurately. Further, when measuring the temperature of the outlet of the electronic device, there is a disadvantage that the temperature is easily affected by the ambient temperature and the detection accuracy is poor. Further, there is a drawback that it takes a considerable amount of time and effort to calculate a flow rate, a pressure loss, and a heat radiation amount from the detected temperature, pressure, and wind speed data and select an appropriate blower.

【0005】したがって、本発明は上記した従来の欠点
に鑑みてなされたものであり、その目的とするところ
は、放熱性能の評価を精度よく、短時間で行うように
し、もって最適ブロアの選択を正確に短時間で行うよう
にした電子機器の放熱性能評価装置を提供することにあ
る。
Accordingly, the present invention has been made in view of the above-mentioned conventional drawbacks, and an object of the present invention is to accurately and quickly evaluate heat radiation performance, thereby selecting an optimal blower. An object of the present invention is to provide an apparatus for evaluating heat radiation performance of an electronic device, which is performed accurately and in a short time.

【0006】[0006]

【課題を解決するための手段】この目的を達成するため
に、本発明に係る電子機器の放熱性能評価装置は、電子
機器の吸気口、排気口および電子機器内の電子部品の周
辺に設けた空気の温度・圧力・流速を検知するセンサ
と、前記排気口に接続され電子機器内部の空気を外部に
排気する第1のエアダクトと、前記吸気口に接続され外
部からの空気を電子機器内部に送り込む第2のエアダク
トと、前記センサのうち、選択したセンサが指定温度と
なるように制御した空気を前記第2のエアダクトを介し
て電子機器に送り込む空気調整機と、この空気調整機で
制御した空気の温度・圧力・流速と前記排気口のセンサ
により検知した空気の温度・圧力・流速とを比較し、電
子機器の発熱量,必要流量および電子機器内圧力損失を
演算し、演算の結果とあらかじめ記憶した各種ブロアの
流量−圧力損失データとを比較し、最適なブロアを選択
する演算部とを備えたものである。また、本発明に係る
電子機器の放熱性能評価装置は、第1および第2のエア
ダクトをフレキシブル構造とすると共に、これら第1お
よび第2のエアダクトの排気口および吸気口との接続を
着脱自在なアダプタを介して行ったものである。
In order to achieve this object, an apparatus for evaluating heat dissipation performance of an electronic device according to the present invention is provided around intake and exhaust ports of an electronic device and electronic components in the electronic device. A sensor for detecting temperature, pressure, and flow velocity of air, a first air duct connected to the exhaust port to exhaust air inside the electronic device to the outside, and an external air connected to the intake port to inside the electronic device. A second air duct to be sent in, an air conditioner to send air controlled so that a selected one of the sensors has a designated temperature to the electronic device through the second air duct, and an air conditioner controlled by the air conditioner The temperature, pressure, and flow rate of the air are compared with the temperature, pressure, and flow rate of the air detected by the sensor at the exhaust port, and the calorific value of the electronic device, the required flow rate, and the pressure loss in the electronic device are calculated. The flow rate of previously stored various blower - comparing the pressure drop data is obtained by an arithmetic unit for selecting optimum blower. Further, in the heat radiation performance evaluation device for an electronic device according to the present invention, the first and second air ducts have a flexible structure, and the connection of the first and second air ducts to the exhaust port and the intake port is detachable. This was done via an adapter.

【0007】[0007]

【作用】本発明によれば、電子機器の吸気口あるいは電
子部品の周辺に設けたセンサを適宜選択して、選択され
たセンサが指定温度となるように、空気調整機により空
気が送り出されるように制御され、制御された空気の温
度・圧力・流速と排気口のセンサにより検知した空気の
温度・圧力・流速とを比較し、演算部で電子機器の発熱
量,必要流量および電子機器内圧力損失を演算し、演算
の結果とあらかじめ記憶した各種ブロアの流量−圧力損
失データとを比較し、最適なブロアを選択する。また、
本発明によれば、各種電子機器により、吸気口および排
気口の形状や位置が変わった場合、アダプタを交換し、
エアダクトを自在に変形させることにより対応する。
According to the present invention, a sensor provided around an intake port of an electronic device or an electronic component is appropriately selected, and air is sent out by an air conditioner so that the selected sensor has a designated temperature. The temperature, pressure, and flow rate of the controlled air are compared with the temperature, pressure, and flow rate of the air detected by the exhaust port sensor. The loss is calculated, the result of the calculation is compared with the flow rate-pressure loss data of various blowers stored in advance, and an optimum blower is selected. Also,
According to the present invention, when the shape and position of the intake port and the exhaust port are changed by various electronic devices, the adapter is replaced,
This is dealt with by freely deforming the air duct.

【0008】[0008]

【実施例】以下、本発明の一実施例を図に基づいて説明
する。図1は本発明に係る電子機器の放熱性能評価装置
の斜視図、図2は同じく構成図である。これらの図にお
いて、全体を符号1で示す電子機器は、内部に電子部品
11を実装すると共に、排気口4と吸気口5が設けられ
ている。排気口4と吸気口5とには、着脱自在なアダプ
タである取付金具41および51が着脱自在に取り付け
られ、これら取付金具41、51は排気口4と吸気口5
の形状により各種用意されている。6は一端が取付金具
41を介して排気口4に取り付けられ、他端が後述する
空気調整機2に接続された電子機器1内の空気を外部に
排出する第1のエアダクトであって、フレキシブル構造
を呈している。7は一端が取付金具51を介して吸気口
5に取り付けられ、他端が空気調整機2に接続された電
子機器1内部へ空気を送り込む第2のエアダクトであっ
て、フレキシブル構造を呈している。8a乃至8cは、
空気の温度・圧力・流速を検知するセンサであって、そ
れぞれ電子部品11、排気口4および吸気口5の周辺に
配置されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an apparatus for evaluating heat dissipation performance of electronic equipment according to the present invention, and FIG. In these figures, an electronic device generally denoted by reference numeral 1 has an electronic component 11 mounted therein and an exhaust port 4 and an intake port 5 provided therein. Attachment fittings 41 and 51 which are detachable adapters are detachably attached to the exhaust port 4 and the intake port 5, and these fittings 41 and 51 are attached to the exhaust port 4 and the intake port 5.
Various types are prepared depending on the shape of the device. Reference numeral 6 denotes a first air duct, one end of which is attached to the exhaust port 4 via the mounting bracket 41 and the other end of which is a first air duct for discharging air in the electronic device 1 connected to the air conditioner 2 to be described later to the outside. It has a structure. Reference numeral 7 denotes a second air duct, one end of which is attached to the intake port 5 via the mounting bracket 51 and the other end of which sends air into the electronic device 1 connected to the air conditioner 2 and has a flexible structure. . 8a to 8c are:
Sensors for detecting temperature, pressure, and flow velocity of air, which are arranged around the electronic component 11, the exhaust port 4, and the intake port 5, respectively.

【0009】空気調節機2には、加熱機22、冷凍機2
3および送風機24を制御する温度調節器21と記録器
25とが内蔵されている。温度調節器21には、3箇所
に配設された前記センサ8a乃至8cが接続されてい
る。送風機24には、第1のエアダクト6の終端と第2
のエアダクト7の始端が接続されており、電子機器1内
から第1のエアダクト6に排出された空気は、空気調節
機2内に入り、温度調節器21からの制御信号で作動す
る加熱機22、冷凍機23、送風機24により指定温度
に調節され、第2のエアダクト7より電子機器1内部に
空気が送り込まれる。全体を符号3で示すものは、デー
タ処理部であって、前記温度調節器21とケーブルで接
続された演算部31、処理部32および表示部33が内
蔵されている。
The air conditioner 2 includes a heater 22 and a refrigerator 2
3 and a temperature controller 21 for controlling the blower 24 and a recorder 25 are built in. The sensors 8a to 8c arranged at three places are connected to the temperature controller 21. The blower 24 has the end of the first air duct 6 and the second
The air discharged from the electronic device 1 to the first air duct 6 is connected to the start end of the air duct 7, and enters the air conditioner 2, where the heater 22 is operated by a control signal from the temperature controller 21. The temperature is adjusted to the designated temperature by the refrigerator 23 and the blower 24, and air is sent into the electronic device 1 from the second air duct 7. Reference numeral 3 denotes a data processing unit, which includes a calculation unit 31, a processing unit 32, and a display unit 33 connected to the temperature controller 21 by a cable.

【0010】次に、このような構成の電子機器の放熱性
能評価装置の動作を説明する。まず、電子機器1に実装
した電子部品11の周囲温度をセンサ8aにより温度調
節器21に入力すると共に、吸気口5における空気の指
定温度を温度調節器21に入力する。しかるのち、その
指定温度に安定するまで、加熱機22、冷凍機23およ
び送風機24の制御を行うと同時に、電子機器1の排気
口4、吸気口5および電子部品11の周辺に設置した温
度・圧力・流速のセンサ8aにより空気の状態を検出
し、その信号を温度調節器21に伝達し、センサ8aの
検出結果と前記指定温度とを比較してその結果を記録器
25に記録する。
Next, the operation of the heat radiation performance evaluation apparatus for electronic equipment having such a configuration will be described. First, the ambient temperature of the electronic component 11 mounted on the electronic device 1 is input to the temperature controller 21 by the sensor 8a, and the designated temperature of air at the intake port 5 is input to the temperature controller 21. Thereafter, the control of the heater 22, the refrigerator 23 and the blower 24 is performed until the temperature is stabilized at the specified temperature, and at the same time, the temperature and the temperature set around the exhaust port 4, the intake port 5 and the electronic component 11 of the electronic device 1 are controlled. The air condition is detected by the pressure / flow rate sensor 8a, the signal is transmitted to the temperature controller 21, the detection result of the sensor 8a is compared with the specified temperature, and the result is recorded in the recorder 25.

【0011】さらに、演算部31では、温度調節器21
で制御した空気の温度・圧力・流速と排気口4のセンサ
8bにより検知した空気の温度・圧力・流速との差から
電子機器1の発熱量、流速および電子機器内の圧力損失
を演算すると共に、その結果をあらかじめ記憶した各種
ブロアの流量−圧力損失データと比較し、最適なブロア
を選定してその結果を表示器に33に表示する。
Further, the arithmetic unit 31 includes a temperature controller 21
The calorific value, flow velocity, and pressure loss in the electronic device are calculated from the difference between the temperature, pressure, and flow velocity of the air controlled by the above and the temperature, pressure, and flow velocity of the air detected by the sensor 8b of the exhaust port 4. Then, the result is compared with the flow rate-pressure loss data of various blowers stored in advance, the optimum blower is selected, and the result is displayed on the display 33.

【0012】[0012]

【発明の効果】以上説明したように本発明によれば、電
子機器の吸気口、排気口および電子機器内の電子部品の
周辺に設けた空気の温度・圧力・流速を検知するセンサ
と、前記排気口に接続され電子機器内部の空気を外部に
排気する第1のエアダクトと、前記吸気口に接続され外
部からの空気を電子機器内部に送り込む第2のエアダク
トと、前記センサのうち、選択したセンサが指定温度と
なるように制御した空気を前記第2のエアダクトを介し
て電子機器に送り込む空気調整機と、この空気調整機で
制御した空気の温度・圧力・流速と前記排気口のセンサ
により検知した空気の温度・圧力・流速とを比較し、電
子機器の発熱量,必要流量および電子機器内圧力損失を
演算し、演算の結果とあらかじめ記憶した各種ブロアの
流量−圧力損失データとを比較し、最適なブロアを選択
する演算部とを備えたので、電子機器の放熱性能すなわ
ち発熱量、圧力損失および冷却に必要な流量を自動的に
算出し、最適なブロアを短時間で正確に選定することが
可能となる。また、電子機器内の吸気温度を空気調整機
により任意に設定できるため、従来のように恒温槽に入
れることなく、このため使用温度範囲上限での電子機器
の放熱性能を正確に測定することができる。さらに、セ
ンサが配置された電子機器の排気口には、排気用のエア
ダクトが接続されるので、周囲の温度の影響を受けず正
確に温度が測定できる。
As described above, according to the present invention, a sensor for detecting the temperature, pressure, and flow velocity of air provided around the intake and exhaust ports of an electronic device and electronic components in the electronic device, A first air duct connected to the exhaust port to exhaust air inside the electronic device to the outside, a second air duct connected to the intake port to send air from outside into the electronic device, and a sensor selected from among the sensors. An air conditioner that sends air controlled by a sensor to a designated temperature to an electronic device through the second air duct, and a temperature / pressure / flow rate of air controlled by the air conditioner and a sensor at the exhaust port. Comparing the detected temperature, pressure and flow velocity of the air, calculating the calorific value of the electronic equipment, the required flow rate and the pressure loss in the electronic equipment, and calculating the calculation results and the flow rate-pressure loss data of various blowers stored in advance. And a calculation unit for selecting the optimal blower, automatically calculating the heat dissipation performance of electronic equipment, that is, the calorific value, pressure loss, and the flow rate required for cooling, and determining the optimal blower in a short time. Can be selected accurately. In addition, since the intake air temperature in the electronic device can be set arbitrarily by the air conditioner, it is possible to accurately measure the heat dissipation performance of the electronic device at the upper limit of the operating temperature range without having to put it in a constant temperature chamber as in the past. it can. Furthermore, since an exhaust air duct is connected to the exhaust port of the electronic device in which the sensor is disposed, the temperature can be accurately measured without being affected by the surrounding temperature.

【0013】また、本発明によれば、第1および第2の
エアダクトをフレキシブル構造とすると共に、これら第
1および第2のエアダクトの排気口および吸気口との接
続を着脱自在なアダプタを介して行ったので、吸気口お
よび排気口の形状や位置が変わった場合でも、エアダク
トを排気口の位置に合わせて自在に変形させることによ
り、アダプタを交換するだけで、各種電子機器に対応す
ることができる。
Further, according to the present invention, the first and second air ducts have a flexible structure, and the connection of the first and second air ducts to the exhaust port and the intake port is made via a detachable adapter. Even if the shape and position of the air intake and exhaust ports change, the air duct can be freely deformed according to the position of the air exhaust port, so that it is possible to respond to various electronic devices simply by replacing the adapter. it can.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係る電子機器の放熱性能評価装置の
斜視図である。
FIG. 1 is a perspective view of an apparatus for evaluating heat dissipation performance of an electronic device according to the present invention.

【図2】 本発明に係る電子機器の放熱性能評価装置の
構成図である。
FIG. 2 is a configuration diagram of an apparatus for evaluating heat dissipation performance of electronic equipment according to the present invention.

【符号の説明】[Explanation of symbols]

1…電子機器、2…空気調節機、3…データ処理部、4
…排気口、5…吸気口、6…第1のエアダクト、7…第
2のエアダクト、8a乃至8c…センサ、11…電子部
品、21…温度調節器、31…演算部、33…表示部、
41,51…取付金具。
DESCRIPTION OF SYMBOLS 1 ... Electronic equipment, 2 ... Air conditioner, 3 ... Data processing part, 4
... Exhaust port, 5 ... Intake port, 6 ... First air duct, 7 ... Second air duct, 8a to 8c ... Sensor, 11 ... Electronic component, 21 ... Temperature controller, 31 ... Calculation unit, 33 ... Display unit,
41, 51 ... mounting brackets.

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 電子機器の吸気口、排気口および電子機
器内の電子部品の周辺に設けた空気の温度・圧力・流速
を検知するセンサと、前記排気口に接続され電子機器内
部の空気を外部に排気する第1のエアダクトと、前記吸
気口に接続され外部からの空気を電子機器内部に送り込
む第2のエアダクトと、前記センサのうち、選択したセ
ンサが指定温度となるように制御した空気を前記第2の
エアダクトを介して電子機器に送り込む空気調整機と、
この空気調整機で制御した空気の温度・圧力・流速と前
記排気口のセンサにより検知した空気の温度・圧力・流
速とを比較し、電子機器の発熱量,必要流量および電子
機器内圧力損失を演算し、演算の結果とあらかじめ記憶
した各種ブロアの流量−圧力損失データとを比較し、最
適なブロアを選択する演算部とを備えたことを特徴とす
る電子機器の放熱性能評価装置。
A sensor for detecting the temperature, pressure and flow rate of air provided around an intake port and an exhaust port of an electronic device and electronic components in the electronic device; and a sensor connected to the exhaust port for detecting air inside the electronic device. A first air duct that exhausts air to the outside, a second air duct that is connected to the air intake port and sends air from the outside into the electronic device, and air controlled so that a selected one of the sensors has a designated temperature. An air conditioner that feeds the electronic device through the second air duct to the electronic device;
The temperature, pressure, and flow rate of the air controlled by the air conditioner are compared with the temperature, pressure, and flow rate of the air detected by the sensor at the exhaust port, and the calorific value of the electronic device, the required flow rate, and the pressure loss in the electronic device are determined. A heat radiation performance evaluation device for an electronic device, comprising: a calculation unit that calculates, compares a calculation result with flow rate-pressure loss data of various blowers stored in advance, and selects an optimal blower.
【請求項2】 請求項1記載の電子機器の放熱性能評価
装置において、前記演算部で選択された結果を表示する
表示部を備えたことを特徴とする電子機器の放熱性能評
価装置。
2. The heat radiation performance evaluation device for an electronic device according to claim 1, further comprising a display unit for displaying a result selected by said calculation unit.
【請求項3】 請求項1記載の電子機器の放熱性能評価
装置において、前記第1および第2のエアダクトをフレ
キシブル構造とすると共に、これら第1および第2のエ
アダクトの排気口および吸気口との接続を着脱自在なア
ダプタを介して行ったことを特徴とする電子機器の放熱
性能評価装置。
3. An apparatus for evaluating heat radiation performance of an electronic device according to claim 1, wherein said first and second air ducts have a flexible structure, and the first and second air ducts have an exhaust port and an intake port. An apparatus for evaluating heat dissipation performance of electronic equipment, wherein connection is made via a detachable adapter.
JP6165110A 1994-07-18 1994-07-18 Equipment for evaluating heat dissipation performance of electronic equipment Expired - Lifetime JP2590741B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6165110A JP2590741B2 (en) 1994-07-18 1994-07-18 Equipment for evaluating heat dissipation performance of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6165110A JP2590741B2 (en) 1994-07-18 1994-07-18 Equipment for evaluating heat dissipation performance of electronic equipment

Publications (2)

Publication Number Publication Date
JPH0829210A JPH0829210A (en) 1996-02-02
JP2590741B2 true JP2590741B2 (en) 1997-03-12

Family

ID=15806099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6165110A Expired - Lifetime JP2590741B2 (en) 1994-07-18 1994-07-18 Equipment for evaluating heat dissipation performance of electronic equipment

Country Status (1)

Country Link
JP (1) JP2590741B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102937490A (en) * 2012-10-18 2013-02-20 浙江省检验检疫科学技术研究院 Air conditioner refrigerating capacity and heating capacity testing method and air pipe box heat meter

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6051886B2 (en) 2013-01-22 2016-12-27 富士通株式会社 Container type data center and control method of container type data center
CN105784759A (en) * 2016-03-22 2016-07-20 青岛海尔股份有限公司 Heat leakage detection device and refrigerator heat leakage detection method
CN116273421B (en) * 2023-02-24 2025-07-25 山东电力工程咨询院有限公司 Coal mill inlet air duct device, primary air quantity uniform temperature regulation and control system and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102937490A (en) * 2012-10-18 2013-02-20 浙江省检验检疫科学技术研究院 Air conditioner refrigerating capacity and heating capacity testing method and air pipe box heat meter

Also Published As

Publication number Publication date
JPH0829210A (en) 1996-02-02

Similar Documents

Publication Publication Date Title
US8302527B2 (en) Method for determining the variation with time of the amount of steam released from a food product during a cooking process in a cooking chamber of a baking oven
US4552059A (en) Flow measurement for exhaust-type canopy and ventilating hood
US9055697B2 (en) Air conditioning system control
US5152309A (en) Valve control apparatus
KR910000257B1 (en) How to measure and control moisture content of hair and hair drying hood used in these methods
US7548170B1 (en) Rear door heat exchanger instrumentation for heat quantity measurement
US6430985B1 (en) Multiple point calibrated HVAC flow rate controller
WO2001069184A9 (en) Fluid flow sensing and control method and apparatus
JP2590741B2 (en) Equipment for evaluating heat dissipation performance of electronic equipment
US7051599B2 (en) Thermal transient anemometer having sensing cell assembly
CN111953137B (en) Motor heat dissipation device and method and electrical equipment
JP2002357485A (en) Thermal energy measuring device and air conditioning equipment using the same
US20210284940A1 (en) Environmental detection device
US7168851B2 (en) Apparatus and method for measuring heat dissipation
KR0153336B1 (en) Fluid Clutch Fan Tester
KR100392587B1 (en) A Digital Testing Device For An Air-Valve
JPH05142238A (en) Multiple-measuring-point type average wind-speed measuring apparatus
JP2661299B2 (en) Air conditioner
CN112055523A (en) Heat dissipation system, heat dissipation method and demonstrator
JP2571615B2 (en) Abnormality detection device for temperature and humidity measurement means
KR100878560B1 (en) Duct Sensor Structure for High Speed Airflow Detection
JP2994213B2 (en) Abnormal state judging device and abnormal state judging method for air-cooled system
JP2749637B2 (en) External air supply device in reliability test equipment
JP7854437B2 (en) High-resolution and wide-range pressure sensor
CN215581990U (en) Electronic equipment