JP2594732B2 - Die for printed circuit board punching - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die for punching a printed circuit board, and more particularly to a die for punching a printed circuit board which prevents cracks on the printed circuit board.

2. Description of the Related Art Conventionally, through holes, outlines, insertion reference holes, etc. of a mass-produced printed circuit board having a pattern formed thereon are used for punching a printed circuit board mounted on a printed circuit board press machine. One-shot punching using a mold. There are a pushback method and a knockout method as such a die for printing a printed circuit board. As shown in FIG. 5, the upper die of the pushback type is a top holder 10 for attaching the upper die to a printed board punching press machine.
1 and a spacer 102 for adjusting the thickness of the upper mold
A backing plate 103 for holding down a punching punch (not shown) for punching a hole in a printed circuit board and receiving the punching resistance of the punching punch; a punching plate 104 for inserting and holding the punching punch; A blanking punch plate 105 for punching the outer shape of the printed circuit board,
And a shedder 106 for removing the printed circuit board. In the spacer 102, there is provided a pushback plate 107A which is urged downward by an elastic body 109 which is engaged with a screw plug 108 screwed to the top holder 101. This pushback plate 107A is
3 and the shedder 106 is urged downward through a knockout pin 110 inserted through the punch plate 104. However, when punching a printed board with such a push-back type printed board punching die, lowering the upper die, pressing the printed board fixed to the lower die, and then raising the upper die, The punching punch penetrating the board and the blanking punch plate 105 fitted with the printed board are simultaneously pulled out of the printed board by the shedder 106 urged downward. That is, since the printed circuit board is knocked out from the punching punch and the blanking punch plate 105 at the same time, there is a possibility that a crack may occur in the hole formed by the punching punch. As shown in FIG. 6, the knockout type upper die is not an elastic body for urging the shedder 106 downward, but a knockout pin 120 for pressing down the knockout plate 107B with a press pressure pad of a printed board punching press machine. It is provided for the upper mold. However, even in such a knockout method, the printed circuit board is knocked out from the punching punch and the blanking punch plate 105 at the same time, so that there is a possibility that cracks may also occur in the holes drilled by the punching punch. The precision of through-holes of printed circuit boards formed by punching punches is required as cracks are inspected with a microscope, and a die for punching out printed circuit boards of the push-back method or the knock-out method increases the production cost of the printed circuit board. It is the current situation.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and there is provided a printed board punching die for preventing cracks around a punch for punching a printed board when knocking out the printed board. The purpose is to provide.

According to the present invention, there is provided a die for punching a printed board, which comprises an upper die and a lower die, and presses a printed board before electronic components are mounted. In order to make the upper die move up and down, the upper die is fixed to the upper die and the punch punches out holes such as through holes in the printed board, and the punch is guided to the printed board And a blanking punch plate that punches out the outer shape of the printed circuit board when the shedder is slidably fitted in the vertical direction and the upper die is moved down by the lower die, and is fixed to the shedder. A print that is engaged with the first knockout pin, punches out the outer shape of the printed circuit board with a blanking punch plate, and then punches out the shedder when the upper die is raised. And pushed back plate plates be pressed via the first knockout pins to a minimum position which does not fall from the blanking punch plate, and an elastic member for biasing the push back plate always downward,
The shedder engaged with the second knockout pin fixed to the shedder and pushed down to the position by the pushback plate is pushed down through the second knockout pin to a position where the printed circuit board punched out of the blanking punch plate is pulled down. And a punch-out punch having a length that allows the punch-out punch to be pulled out of the punched-out printed circuit board when pressed by the push-back plate.

[Function] When the upper die is lifted after punching the printed circuit board, the printed circuit board punched out of the shedder is a blanking pan.
The punch is pulled out of the printed circuit board by pushing it down to the minimum position where it will not fall from the inside of the chip plate, and after the hole punch is pulled out, the shedder is further pushed down below the blanking punch plate's press-contact surface of the printed circuit board and printed. The substrate is removed from the upper mold. As described above, the separation of the punching punch and the removal of the printed board are divided into two stages, so that cracks around the punching punch of the printed board can be reliably prevented.

An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the structure of the printed board punching die of the present invention is a top holder 1 for mounting the upper die on a printed board punching press machine.
A spacer 2 for adjusting the thickness of the upper die, and punching punches 11 and 12 for punching holes such as through holes in the printed circuit board R,
Backing plate 3 to receive 12 punching resistance
A punch plate 4 for inserting and holding punches 11, 12; a blanking punch plate 5 for punching the outer shape of the printed circuit board R;
Shedder 6 that guides 2 and removes printed circuit board R
It is composed of A push-back plate 7 and a knock-out plate 8 are provided in the spacer 2, and the push-back plate 7 is urged downward by the elastic force of a push-back plate elastic body 13 made of urethane rubber. 8 is urged upward by the elastic force of the knockout plate elastic body 14. Further, a knockout pin 1 for moving the knockout plate 8 downward is provided on the knockout plate 8.
After the upper die is raised to a predetermined position, the knockout pin 15 is pressed down by a press pressure pad provided in a printed board punching press machine. When the press pressure pad is returned upward after being pressed by the press pressure pad, the knockout plate 8 is returned to a predetermined position by the elastic force of the elastic body 14 for the knockout plate. A push-back plate knockout pin 9 is provided on the shedder 6 so that the shedder 6 is slid vertically in the blanking punch plate 5 by an amount corresponding to punching the outer shape of the printed circuit board R.
The knockout pin 10 for the knockout plate is fixed. The push-back plate knockout pin 9 is formed by blanking the printed board R punched out of the shedder 6 by the push-back plate 7 urged downward by the elastic force of the push-back plate elastic body 13.
It is pressed down to the minimum position where it does not fall from the inside of the punch plate 5 . Further, the knockout pin 10 for the knockout plate is formed by pressing the shedder 6 by the knockout plate 8 which is pressed through the knockout pin 15 by a press pressure pad provided in the printed board punching press machine from the printed circuit board pressing surface 5 a of the blanking punch plate 5. Press down. Large number of piercing punch 11 is inserted into the punch plate 4 is held, the shedder 6 stamped
Printed board R in blanking punch plate 5
The length is set so as to be pulled out of the printed circuit board R in a state where it is pressed down to a minimum position where it does not fall from the printed circuit board R and stopped. Further, the small number of hole punches 12 inserted and held in the punch plate 4 are removed from the printed circuit board R in a state where the shedder 6 is pressed down below the printed circuit board pressing surface 5a of the blanking punch plate 5 and stopped. Length is set as follows. As a result, the pushback plate 7 does not drop from the blanking punch plate 5
The printed circuit board R pressed down to the minimum position is securely fixed to the shedder 6 in a state of being inserted into the hole punch 12, and the printed circuit board R securely fixed to the shedder 6.
Is pushed down below the press-contact surface 5a of the blanking punch plate 5 by the knockout plate 8, so that it can be dropped from the upper die. The operation of the printed circuit board punching die configured as described above will be described. As shown in FIG. 1, the mold fixed to the printed board punching press machine is opened. As shown in FIG.
a, and the punches 11 and 12
Is in shedder 6. In this state, when the printed board R cut into a predetermined shape is fixed to the lower mold, and then the upper mold is lowered as shown in FIG. 2, the shedder 6 comes into contact with the printed board R, and the upper mold is further lowered. Hole punches 11 and 12 provided in the upper die are punched in the printed circuit board R to punch predetermined holes such as through holes. At this time, the push-back plate knockout pin 9 fixed to the shedder 6 pushes up the push-back plate 7 to a predetermined position against the elasticity of the push-back plate elastic body 13 and is fixed to the shedder 6. The knockout pin 10 for a knockout plate is brought into contact with a knockout plate 8 locked at a predetermined position by an elastic body 14 for a knockout plate. When the upper die is lifted to remove the punched printed board R from the printed board punching die, as shown in FIG. 3, the shedder 6 causes the pushback plate 7 and the pushback plate 7 to move by the elastic force of the pushback plate elastic body 13. The printed circuit board R punched through the push-back plate knockout pin 9 is blanked.
Minimum position not to fall from inside the punching plate 5
Until is pressed to stop. As a result, the punch 11 is pulled out of the printed board R, but the punch 12 penetrates the printed board R, and the printed board R is partially fitted into the blanking punch plate 5 and the shedder 6 is inserted.
Stops. When the upper die was continuously raised, as shown in FIG. 4, the press pressure pad of the printed board punching press machine was fixed to the shedder 6 by pressing down the knockout pin 15 contacting the knockout plate 8. The shedder 6 is inserted into the blanking punch plate 5 through the knockout pin
Since it is depressed below a, the hole punch 12 can be pulled out of the printed board R, and the printed board R can be dropped from the upper die.

As is apparent from the above embodiments, the die for punching a printed circuit board according to the present invention includes a punch for punching holes such as through holes and a blanking punch plate in which the printed circuit board is fitted. Can be separately performed, so that cracks around the punch for punching the printed circuit board can be reliably prevented. As a result, the production cost of the printed circuit board can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an open state of a mold for punching a printed circuit board according to the present invention.

FIG. 2 is an operation diagram showing a state in which the upper die of the printed circuit board punching die of the present invention is pressed against the printed circuit board.

FIG. 3 is an operation diagram showing a state in which the mold is started to be opened after the printed board is punched by the printed board punching die of the present invention.

FIG. 4 is an operation view showing a state in which the printed circuit board is punched by the printed circuit board punching die of the present invention, and then the die is opened.

FIG. 5 is a configuration diagram showing a conventional printed circuit board punching die.

FIG. 6 is a configuration diagram showing a conventional printed circuit board punching die.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Top holder 2 ... Spacer 3 ... Backing plate 4 ... Punch plate 5 ... Blanking punch plate 6 ... Shedder 7 ... Pushback plate 8 ... Knockout plate 9 ... Knockout pin for pushback plate 10 ... Knockout pin for knockout plate 11, 12: Hole punch 13: Elastic body for pushback plate 14: Elastic body for knockout plate 15: Knockout pin

Claims (1)

(57) [Claims] An electronic component is mounted, comprising an upper die and a lower die.
Press stamping of printed circuit boards before
The upper die is moved up and down to the printed board punching die.
And the upper mold is fixed to the upper mold and attached to the printed circuit board.
A punch for punching holes such as through holes
A shedder to guide the punch to the printed circuit board
The shedder is slidably fitted in the vertical direction and
Lower and move the shedder upward by the lower mold
Blanking to punch out the outline of the printed circuit board
A punch plate and a first knob fixed to the shedder.
The printed circuit board.
After punching with the blanking punch plate, the upper die
The print that was punched out of the shedder when raised
When the board does not fall from inside the blanking punch plate
Push through the first knockout pin to the minimum position
Push back plate to be lowered
An elastic body for constantly urging the plate downward,
Engaged with a second knockout pin fixed to the
Pushed down to the position with the pushback plate
Forward the shedder from the blanking punch plate
Until the position where the printed circuit board is punched out
Knockout to be pushed down via 2 knockout pins
A plate, and the punching punch is provided with the push bar.
The punched pudding when pressed on the
A die for punching a printed circuit board, which is set to a length capable of being pulled out of the printed circuit board.