JP2596306B2 - Manufacturing method of thermistor - Google Patents
Manufacturing method of thermistorInfo
- Publication number
- JP2596306B2 JP2596306B2 JP6162493A JP6162493A JP2596306B2 JP 2596306 B2 JP2596306 B2 JP 2596306B2 JP 6162493 A JP6162493 A JP 6162493A JP 6162493 A JP6162493 A JP 6162493A JP 2596306 B2 JP2596306 B2 JP 2596306B2
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- thermistor element
- firing
- crystallized glass
- glass frit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、たとえばアルコール、
あるいはアルコールとガソリンの混合液などの導電性燃
料の液面を検出するのに適したサーミスタの製造方法に
関するものである。The present invention relates to, for example, alcohols,
Alternatively, the present invention relates to a method for manufacturing a thermistor suitable for detecting the level of a conductive fuel such as a mixture of alcohol and gasoline.
【０００２】[0002]
【従来の技術】従来、この種のサーミスタは、図２に示
すような構成であった。図２において、１はサーミスタ
素子、２はステンレス鋼製のキャップ、３はステンレス
製のリード線である。４は外装体で、結晶化ガラスフリ
ットに有機バインダーを混合したフリットスラリーをサ
ーミスタ素子１及びキャップ２の表面に塗装し、焼成す
ることにより形成したものであった。2. Description of the Related Art Conventionally, this type of thermistor has a configuration as shown in FIG. In FIG. 2, 1 is a thermistor element, 2 is a cap made of stainless steel, and 3 is a lead wire made of stainless steel. Reference numeral 4 denotes an exterior body, which was formed by coating a surface of the thermistor element 1 and the cap 2 with a frit slurry obtained by mixing an organic binder with crystallized glass frit, followed by firing.
【０００３】[0003]
【発明が解決しようとする課題】このような従来の構成
では、結晶化ガラスフリットに有機バインダーを混合し
たフリットスラリーが粘度を有するものとなるので、均
一な塗装がしにくく、偏肉が生じるなどして、外装体４
の膜厚のバラツキが大きくなる。また焼成により有機バ
インダーが発泡し、外装体４にピンホールが発生すると
いう問題があった。In such a conventional structure, the frit slurry obtained by mixing the organic binder with the crystallized glass frit has a viscosity, so that it is difficult to perform uniform coating and uneven thickness occurs. And the exterior body 4
The variation in the film thickness becomes large. Further, there is a problem that the organic binder is foamed by firing, and pinholes are generated in the exterior body 4.
【０００４】そこで本発明はこのような問題点を解決す
るもので、外装体の膜厚のバラツキを小さくすること、
さらにピンホール不良の低減を図ることを目的とするも
のである。Accordingly, the present invention is to solve such a problem, and to reduce the variation in the film thickness of the exterior body.
It is another object of the present invention to reduce pinhole defects.
【０００５】[0005]
【課題を解決するための手段】そしてこの目的を達成す
るために本発明はサーミスタ素子の少なくとも表面を溶
剤で湿らせた後、このサーミスタ素子の表面に結晶化ガ
ラスフリットを付着させ、焼成して外装体を形成するも
のである。According to the present invention , at least the surface of the thermistor element is melted.
After moistening with an agent, a crystallized glass frit is attached to the surface of the thermistor element and fired to form an exterior body.
【０００６】[0006]
【作用】以上の構成とすればサーミスタ素子の表面に結
晶化ガラスフリットが溶剤等で付着する分だけ塗される
こととなるので、焼成後には略均一な膜厚の外装体が得
られる。この結果従来のごとく外装体の膜厚に偏肉バラ
ツキが生じ、それにより熱膨張、収縮時に大きな熱応力
が加わってサーミスタ素子が破損するという問題が発生
しないものとなる。According to the above construction, since the crystallized glass frit is applied to the surface of the thermistor element as much as the solvent or the like adheres, an outer package having a substantially uniform film thickness after firing is obtained. As a result, uneven thickness occurs in the thickness of the exterior body as in the conventional case, and thereby, there is no problem that a large thermal stress is applied during thermal expansion and contraction to damage the thermistor element.
【０００７】また従来のごとく有機バインダーを混練し
ないので、焼成時の有機バインダー発泡によるピンホー
ルが外装体に発生せず、よってピンホールを介しての被
温度検出用液体等が流入して起きるサーミスタ素子の劣
化もおきないものとなる。Further, since the organic binder is not kneaded as in the prior art, pinholes due to the foaming of the organic binder at the time of firing do not occur in the outer package. Element degradation does not occur.
【０００８】[0008]
【実施例】図１は本発明の一実施例によるサーミスタの
断面図であり、図１において、５はサーミスタ素子であ
り、その両端にステンレス鋼製のキャップ６が圧入され
ている。なおキャップ６にはステンレス鋼製のリード線
７が溶接されている。８は外装体で、サーミスタ５及び
キャップ６の表面を溶剤で湿らせておき、結晶化ガラス
フリットをまぶすようにして均一に付着させ、その後焼
成を行って形成したものである。FIG. 1 is a sectional view of a thermistor according to an embodiment of the present invention. In FIG. 1, reference numeral 5 denotes a thermistor element, and stainless steel caps 6 are press-fitted at both ends thereof. A lead wire 7 made of stainless steel is welded to the cap 6. Reference numeral 8 denotes an exterior body, which is formed by moistening the surfaces of the thermistor 5 and the cap 6 with a solvent, applying a crystallized glass frit to the surface uniformly, and then firing.
【０００９】本実施例による結晶化ガラスフリットの付
着，焼成では、従来の有機バインダーとの混合によるフ
リットスラリーでの塗装，焼成よりも、外装体８の膜厚
バラツキ，外観不良（ピンホールの発生）ともに大幅な
低減が可能であることが確認された。In the attachment and firing of the crystallized glass frit according to the present embodiment, the thickness variation and poor appearance (the occurrence of pinholes) of the outer package 8 are greater than those in the conventional coating and firing with a frit slurry mixed with an organic binder. ) It was confirmed that both can be significantly reduced.
【００１０】[0010]
【発明の効果】以上のように本発明は、サーミスタ素子
の少なくとも表面を溶剤で湿らせた後、このサーミスタ
素子表面に結晶化ガラスフリットを付着させ、焼成した
ものである。As described above, the present invention provides a thermistor element
After wetting at least the surface of the thermistor with a solvent,
A crystallized glass frit is attached to the surface of the element and fired.
【００１１】そして以上の構成とすればサーミスタ素子
の表面に結晶化ガラスフリットが溶剤等で付着する分だ
けが塗されるので略均一な膜厚の外装体が形成されるこ
ととなる。この結果従来のごとく膜厚に偏肉のバラツキ
が生じ、それにより熱膨張、収縮時に大きな熱応力が加
わってサーミスタ素子が破損するという問題が発生しな
いものとなる。With the above-described structure, only the amount of the crystallized glass frit that adheres to the surface of the thermistor element with a solvent or the like is applied, so that an outer package having a substantially uniform film thickness is formed. As a result, uneven thickness of the film thickness occurs as in the prior art, so that there is no problem that a large thermal stress is applied during thermal expansion and contraction and the thermistor element is damaged.
【００１２】また従来のごとく有機バインダーを混練し
ないので、焼成時の有機バインダー発泡によるピンホー
ルが発生せず、よってピンホールを介しての被温度検出
用液体等が流入して起きるサーミスタ素子の劣化もおき
ないものとなる。Further, since the organic binder is not kneaded as in the prior art, pinholes do not occur due to the foaming of the organic binder at the time of firing. Will not occur.
【図１】本発明の一実施例により製造されたサーミスタ
の断面図FIG. 1 is a cross-sectional view of a thermistor manufactured according to an embodiment of the present invention.
【図２】従来のサーミスタの断面図FIG. 2 is a cross-sectional view of a conventional thermistor.
５ サーミスタ素子 ８ 外装体 5 Thermistor element 8 Exterior body
Claims (1)
で湿らせた後、このサーミスタ素子の表面に結晶化ガラ
スフリットを付着させ、焼成してなるサーミスタの製造
方法。1. A method for forming a thermistor element comprising :
And then applying a crystallized glass frit to the surface of the thermistor element, followed by firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6162493A JP2596306B2 (en) | 1993-03-22 | 1993-03-22 | Manufacturing method of thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6162493A JP2596306B2 (en) | 1993-03-22 | 1993-03-22 | Manufacturing method of thermistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0629105A JPH0629105A (en) | 1994-02-04 |
| JP2596306B2 true JP2596306B2 (en) | 1997-04-02 |
Family
ID=13176526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6162493A Expired - Lifetime JP2596306B2 (en) | 1993-03-22 | 1993-03-22 | Manufacturing method of thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2596306B2 (en) |
-
1993
- 1993-03-22 JP JP6162493A patent/JP2596306B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0629105A (en) | 1994-02-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |