JP2596995B2 - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor deviceInfo
- Publication number
- JP2596995B2 JP2596995B2 JP63324280A JP32428088A JP2596995B2 JP 2596995 B2 JP2596995 B2 JP 2596995B2 JP 63324280 A JP63324280 A JP 63324280A JP 32428088 A JP32428088 A JP 32428088A JP 2596995 B2 JP2596995 B2 JP 2596995B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting piece
- sealing resin
- semiconductor device
- sealing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は、リードフレームを樹脂封止して成る電力用
等の半導体装置の製造方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device for electric power or the like formed by sealing a lead frame with a resin.
＜従来技術＞ 従来の樹脂封止型の電力用半導体装置の製造方法につ
いて説明する。<Prior Art> A method of manufacturing a conventional resin-sealed power semiconductor device will be described.
まず、第８図の如く、横枠１と、該横枠１に一端が支
持された複数のリード端子2,3,4と、該複数のリード端
子2,3,4のうち載置片吊りリード端子４に設けられた半
導体素子載置片５と、該載置片５を連結支持する載置片
吊りタイバー６と、前記各リード端子2,3,4を連結する
リード吊りタイバー７とから成るリードフレーム８に、
半導体素子９をダイボンドし、ボンデイングワイヤー10
により内部結線を施して回路形成する。First, as shown in FIG. 8, a horizontal frame 1, a plurality of lead terminals 2, 3, 4 each having one end supported by the horizontal frame 1, and a mounting piece suspension of the plurality of lead terminals 2, 3, 4. A semiconductor element mounting piece 5 provided on the lead terminal 4, a mounting piece hanging tie bar 6 for connecting and supporting the mounting piece 5, and a lead hanging tie bar 7 for connecting the lead terminals 2, 3, 4. Lead frame 8
The semiconductor element 9 is die-bonded and a bonding wire 10
And the circuit is formed.
そして、第９図の如く、リードフレーム８をモールド
金型11,12にセツトアツプ後、横枠１とタイバー6,7とを
支持し、封止樹脂13を用いてトランスフアーモールド法
により樹脂封止する。この樹脂封止後の状態を第10図に
示す。Then, as shown in FIG. 9, after the lead frame 8 is set up in the molds 11 and 12, the horizontal frame 1 and the tie bars 6 and 7 are supported, and resin sealing is performed by a transfer molding method using a sealing resin 13. I do. FIG. 10 shows the state after the resin sealing.
その後、タイバー6,7を切断して第11図の如き半導体
装置が完成する。Thereafter, the tie bars 6 and 7 are cut to complete a semiconductor device as shown in FIG.
なお、第10図中14は封止樹脂13により形成された外
装、15は放熱板取付用ビス孔である。In FIG. 10, reference numeral 14 denotes an exterior formed of the sealing resin 13, and reference numeral 15 denotes a heat sink mounting screw hole.
＜発明が解決しようとする問題点＞ しかし、従来の樹脂封止型の電力用半導体装置の製造
方法では、第８図の如く、リードフレーム８に載置片吊
りタイバー６が設けられているので、リードフレーム８
を樹脂封止した後にタイバー６を切断しても、第11図の
如く、タイバー６の切断片6aが露出する。<Problems to be Solved by the Invention> However, in the conventional method of manufacturing a resin-encapsulated power semiconductor device, the mounting piece hanging tie bar 6 is provided on the lead frame 8 as shown in FIG. , Lead frame 8
Even if the tie bar 6 is cut after resin sealing, the cut piece 6a of the tie bar 6 is exposed as shown in FIG.
このため、半導体装置に放熱板を取付けたとき、タイ
バー６の切断片6aと放熱板との絶縁耐圧に制約が生じ、
絶縁シートが必要となる。For this reason, when the heat sink is attached to the semiconductor device, there is a restriction on the dielectric strength between the cut piece 6a of the tie bar 6 and the heat sink.
An insulating sheet is required.
そこで、本発明は、上記問題点に鑑み、放熱板の取付
時に絶縁シートを必要とせず、かつ放熱板と高絶縁耐圧
を有する半導体装置の提供を目的とする。In view of the above problems, an object of the present invention is to provide a semiconductor device which does not require an insulating sheet when attaching a heat sink and has a high withstand voltage with respect to the heat sink.
＜問題点を解決するための手段＞ 本発明による問題点を解決するための半導体装置の製
造方法は、第１〜５図の如く、載置片吊りリード端子29
のみに支持された半導体素子載置片30を有するリードフ
レーム21に半導体素子20を搭載する工程と、前記半導体
素子載置片30をモールド金型34,35内に配置し、該半導
体素子載置片30を前記モールド金型34,、35内に突出す
る位置決めピン36,37により支持するとともに前記載置
片吊りリード端子29を前記モールド金型34,35により支
持する工程と、前記モールド金型34,35内に封止樹脂22
を射出する工程と、射出された該封止樹脂22が半硬化で
且つ流動性を有する状態において前記位置決めピン36,3
7を成形品の表面まで持ち上げるとともに前記位置決め
ピン36,37の抜け跡を前記半硬化で且つ流動性を有する
封止樹脂22によって封止する工程とを備えてなるもので
ある。<Means for Solving the Problems> A method for manufacturing a semiconductor device for solving the problems according to the present invention is shown in FIGS.
Mounting the semiconductor element 20 on the lead frame 21 having the semiconductor element mounting piece 30 supported only by the semiconductor element mounting piece 30; disposing the semiconductor element mounting piece 30 in the mold dies 34 and 35; A step of supporting the piece 30 by the positioning pins 36, 37 projecting into the mold dies 34, 35 and supporting the mounting piece hanging lead terminal 29 by the mold dies 34, 35; and 34, 35 sealing resin 22
And positioning the positioning pins 36, 3 in a state where the injected sealing resin 22 is semi-cured and has fluidity.
Lifting the 7 to the surface of the molded product and sealing the traces of the positioning pins 36 and 37 with the semi-hardened and fluid sealing resin 22.
＜作用＞ 上記問題点解決手段において、成形時に位置決めピン
36,37により載置片30を支持しているので、従来のよう
にリードフレーム21に載置片30を連結する載置片吊りタ
イバーを設けなくても、金型34,35内で載置片30を移動
させることなく位置決めできる。そして、位置決めピン
36,37は射出後しばらくして封止樹脂22が半硬化で且つ
流動性を有する状態になったときに成形品の表面まで持
ち上げられ、前記位置決めピン36,37の抜け跡は前記半
硬化で且つ流動性を有する封止樹脂22によって封止され
るので、半導体素子載置片30が封止樹脂22により支持さ
れ、半導体素子載置片30を完全に樹脂封止した半導体装
置が完成する。<Operation> In the means for solving the above problems, the positioning pin is used during molding.
Since the mounting piece 30 is supported by 36 and 37, the mounting piece 30 can be mounted in the molds 34 and 35 without providing a mounting piece hanging tie bar connecting the mounting piece 30 to the lead frame 21 as in the conventional case. Positioning can be performed without moving the piece 30. And positioning pin
When the sealing resin 22 is semi-cured and has fluidity shortly after injection, it is lifted to the surface of the molded product, and the traces of the positioning pins 36, 37 are partially cured by the semi-curing. Since the semiconductor element mounting piece 30 is sealed by the sealing resin 22 having the fluidity, the semiconductor device mounting piece 30 is supported by the sealing resin 22, and the semiconductor device in which the semiconductor element mounting piece 30 is completely resin-sealed is completed.
したがつて、リードフレームの出力部を除きその他の
部分が露出することがなく、半導体装置に放熱板を取付
ける際に絶縁シートが不要となり、かつ放熱板と高絶縁
耐圧を有する半導体装置を得ることができる。Therefore, there is no need to expose the other parts except the output part of the lead frame, and to obtain a semiconductor device which does not require an insulating sheet when attaching a heat sink to the semiconductor device and which has a high dielectric strength with the heat sink. Can be.
＜実施例＞ 以下、本発明の一実施例について図面により説明す
る。第１図は本発明の一実施例を示す半導体装置の製造
方法における樹脂封止前のリードフレームの状態を示す
平面図、第２図は同じくモールド金型内に封止樹脂を射
出した状態を示す断面図、 第３図は同じくモールド金型内で封止樹脂が半硬化した
状態を示す断面図、第４図は同じくモールド金型内で封
止樹脂が硬化した状態を示す断面図、第５図は封止樹脂
の粘度と成形時間の関係を示す図、第６図は同じくその
製造方法において樹脂封止後の状態を示す平面図、第７
図（ａ）は同じくその半導体装置の完成品を示す側面
図、第７図（ｂ）は同じくその断面図である。Example An example of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a state of a lead frame before resin sealing in a method of manufacturing a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a view showing a state in which sealing resin is injected into a mold. FIG. 3 is a cross-sectional view showing a state in which the sealing resin is semi-cured in the mold, FIG. 4 is a cross-sectional view showing a state in which the sealing resin is cured in the mold, and FIG. FIG. 5 is a diagram showing the relationship between the viscosity of the sealing resin and the molding time, FIG. 6 is a plan view showing the state after resin sealing in the same manufacturing method, and FIG.
FIG. 7A is a side view showing a completed product of the semiconductor device, and FIG. 7B is a sectional view of the same.
まず、本発明の樹脂封止型の電力用半導体装置の構造
について説明する。First, the structure of the resin-sealed power semiconductor device of the present invention will be described.
第７図（ａ）（ｂ）の如く、半導体素子20と、該半導
体素子20が搭載されるリードフレーム21と、該リードフ
レーム21を封止樹脂22により樹脂封止されて成る外装23
とから構成され、前記リードフレーム21がその出力部21
aを除いて外装23により完全に覆われている。As shown in FIGS. 7A and 7B, a semiconductor element 20, a lead frame 21 on which the semiconductor element 20 is mounted, and an exterior 23 formed by sealing the lead frame 21 with a sealing resin 22.
The lead frame 21 has an output section 21
Except for a, it is completely covered by the exterior 23.
なお、第７図（ａ）（ｂ）中、24は放熱板取付用ビス
孔、25は半導体素子20とリードフレーム21とを内部結線
するボンデイングワイヤーである。In FIGS. 7 (a) and 7 (b), reference numeral 24 denotes a heat sink mounting screw hole, and reference numeral 25 denotes a bonding wire for internally connecting the semiconductor element 20 and the lead frame 21.
前記リードフレーム21は、第１図の如く、前記横枠26
と、該横枠26に一端が支持されたリード端子27,28,29
と、該リード端子27,28,29のうち載置片吊りリード端子
29のみに支持された半導体素子20が搭載される載置片30
と、前記各リード端子27,28,29のみを連結支持するリー
ド吊りタイバー31とから回路パターンを形成している。As shown in FIG. 1, the lead frame 21 is
And lead terminals 27, 28, 29 one end of which is supported by the horizontal frame 26.
And the mounting piece hanging lead terminal of the lead terminals 27, 28, 29
A mounting piece 30 on which a semiconductor element 20 supported only by 29 is mounted
And a lead suspension tie bar 31 for connecting and supporting only the respective lead terminals 27, 28, 29 to form a circuit pattern.
前記リード端子27,28は、前記載置片吊りリード端子2
9を挟んで対向配置されるとともに、前記半導体素子20
とボンデイングワイヤー25により内部結線されている。The lead terminals 27 and 28 are the hanging member lead terminals 2 described above.
9 and the semiconductor element 20
And a bonding wire 25 for internal connection.
該載置片吊りリード端子29の先端には、前記載置片30
が一体形成され、該載置片30は、第１〜４図の如く、放
熱効果が向上するように肉厚に形成された載置片本体32
と、該本体32の略中央に形成されたモールド金型挿入用
孔33とから成る。At the tip of the mounting piece hanging lead terminal 29, the mounting piece 30 described above is attached.
The mounting piece 30 is formed integrally with the mounting piece main body 32, as shown in FIGS.
And a molding die insertion hole 33 formed substantially at the center of the main body 32.
次に、本発明半導体装置の製造方法について説明す
る。Next, a method for manufacturing the semiconductor device of the present invention will be described.
まず、第１図の如く、半導体素子20をリード端子29の
載置片30にダイボンドし、半導体素子20とリード端子2
7,28とをボンデイングワイヤー25により内部結線を施し
回路形成する。First, as shown in FIG. 1, the semiconductor element 20 is die-bonded to the mounting piece 30 of the lead terminal 29, and the semiconductor element 20 and the lead terminal 2 are bonded.
Circuits 7 and 28 are internally connected by a bonding wire 25 to form a circuit.
そして、リードフレーム21を、第２図の如く、下面モ
ールド金型34にセツトアツプ後、上面モールド金型35の
凸部35aを金型挿入用孔33に挿入して横枠26およびリー
ド端子27,28,29を支持し、さらにモールド金型34,35内
から突出した位置決めピン36,37で載置片30の一端部30
a,30bを支持し、モールド金型34,35内に封止樹脂22をト
ランスフアーモールド法により射出する。After setting up the lead frame 21 in the lower mold 34 as shown in FIG. One end 30 of the mounting piece 30 is supported by positioning pins 36, 37 that support
a, 30b are supported, and the sealing resin 22 is injected into the mold dies 34, 35 by a transfer molding method.
このように、位置決めピン36,37によりリード端子29
のみに支持された載置片30を支持しているので、従来の
ようにリードフレーム21に載置片30を連結する載置片吊
りタイバーを設けなくても、モールド金型34,35内で載
置片30を移動させることなく位置決めできる。In this way, the lead terminals 29 are
Since the mounting piece 30 supported only by the mounting piece 30 is supported, the mounting piece hanging tie bar for connecting the mounting piece 30 to the lead frame 21 is not provided as in the related art. Positioning can be performed without moving the mounting piece 30.
その後、樹脂封止22の硬化前に位置決めピン36,37
を、第３図の如く、成形品の表面まで持ち上げる。Thereafter, before the resin sealing 22 is cured, the positioning pins 36, 37
Is lifted to the surface of the molded article as shown in FIG.
この位置決めピン36,37を持ち上げるタイミングは、
封止樹脂の粘度と成形時間とに依存する。すなわち、第
５図の如く、封止樹脂22を射出して成形時間Ａの範囲ま
では、封止樹脂22の粘度が低いため、第２図の如く、位
置決めピン36,37で載置片30を支持する。そして、封止
樹脂22が半硬化で且つ流動性を有する状態となる成形時
間Ｂの範囲になったときに、第３図の如く、位置決めピ
ン36,37を成形品の表面まで持ち上げるとともに前記位
置決めピン36,37の抜け跡を前記半硬化で且つ流動性を
有する封止樹脂22によって封止する。このとき、位置決
めピン36,37を持ち上げても封止樹脂22の粘度がある程
度高くなつている（半硬化状態）ため載置片30は動かな
い。そして、成形時間Ｃの範囲になると、第４図の如
く、封止樹脂22は硬化する。The timing for lifting the positioning pins 36 and 37 is
It depends on the viscosity of the sealing resin and the molding time. That is, as shown in FIG. 5, the viscosity of the sealing resin 22 is low up to the range of the molding time A after the injection of the sealing resin 22, and therefore, as shown in FIG. I support. Then, when the molding resin B enters the range of the molding time B in which the sealing resin 22 is in a semi-cured state and has fluidity, as shown in FIG. The traces of the pins 36 and 37 are sealed with the semi-cured and fluid sealing resin 22. At this time, even if the positioning pins 36 and 37 are lifted, the mounting piece 30 does not move because the viscosity of the sealing resin 22 has increased to some extent (semi-cured state). Then, in the range of the molding time C, the sealing resin 22 is cured as shown in FIG.
そして、樹脂封止後、タイバー31を切断して第７図
（ａ）（ｂ）の如き半導体装置が完成する。After resin sealing, the tie bar 31 is cut to complete a semiconductor device as shown in FIGS. 7 (a) and 7 (b).
このように、封止樹脂22を射出後、位置決めピン36,3
7を封止樹脂22が半硬化で且つ流動性を有する状態のと
きに成形品表面まで持ち上げるとともに前記位置決めピ
ン36,37の抜け跡を前記半硬化で且つ流動性を有する封
止樹脂22によって封止することにより、載置片30お封止
樹脂22により支持され、第７図（ａ）の如く、リードフ
レーム21の出力部21aを除いて完全に樹脂封止できる。Thus, after injecting the sealing resin 22, the positioning pins 36, 3
7 is raised to the surface of the molded product when the sealing resin 22 is in a semi-cured and fluid state, and the traces of the positioning pins 36 and 37 are sealed by the semi-cured and fluid sealing resin 22. By stopping, the mounting piece 30 is supported by the sealing resin 22, and the resin can be completely sealed except for the output portion 21a of the lead frame 21, as shown in FIG. 7A.
したがつて、半導体装置に放熱板を取付ける際に絶縁
シートが不要となり、かつ放熱板と高絶縁耐圧を有する
半導体装置を得ることができる。Therefore, an insulating sheet is not required when attaching a heat sink to the semiconductor device, and a semiconductor device having a high withstand voltage with respect to the heat sink can be obtained.
なお、本発明は、上記実施例に限定されるものではな
く、本発明の範囲内で上記実施例に多くの修正および変
更を加え得ることは勿論である。It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.
＜発明の効果＞ 以上の説明から明らかな通り、本発明によると、成形
時に位置決めピンにより半導体素子載置片を支持してい
るので、従来のようにリードフレームに半導体素子載置
片を連結する載置片吊りタイバーを設けなくても、モー
ルド金型内で半導体素子載置片を移動させることなく位
置決めできる。<Effects of the Invention> As is clear from the above description, according to the present invention, since the semiconductor element mounting pieces are supported by the positioning pins during molding, the semiconductor element mounting pieces are connected to the lead frame as in the related art. Even without providing a mounting piece hanging tie bar, positioning can be performed without moving the semiconductor element mounting piece in the mold.
そして、位置決めピンは射出後しばらくして封止樹脂
が半硬化で且つ流動性を有する状態になったときに成形
品の表面まで持ち上げられ、前記位置決めピンの抜け跡
は前記半硬化で且つ流動性を有する前記封止樹脂によっ
て封止されるので、半導体素子載置片は位置決めピンを
抜いても半硬化状態の封止樹脂により支持されることに
なり、動くことなく正確な位置決め状態を維持できる。The positioning pin is lifted up to the surface of the molded product when the sealing resin becomes semi-cured and has fluidity shortly after injection, and the trace of the positioning pin is semi-cured and has fluidity. Since the semiconductor device mounting piece is sealed by the sealing resin in a semi-cured state even when the positioning pin is pulled out, the accurate positioning state can be maintained without moving. .
これによって、位置決めピンが抜けた跡を残すことな
く半導体素子載置片を完全に樹脂封止して精度よく位置
決めされた半導体装置を効率よく完成させることができ
る。As a result, the semiconductor device mounting piece can be completely sealed with a resin without leaving traces from which the positioning pins have come off, and a semiconductor device accurately positioned can be efficiently completed.
したがつて、リードフレームの出力部を除きその他の
部分が露出することがなく、半導体装置に放熱板を取付
ける際に絶縁シートが不要となり、かつ放熱板と高絶縁
耐圧を有する半導体装置を得ることができるといつた優
れた効果がある。Therefore, there is no need to expose the other parts except the output part of the lead frame, and to obtain a semiconductor device which does not require an insulating sheet when attaching a heat sink to the semiconductor device and which has a high dielectric strength with the heat sink. When it can be done, it has an excellent effect.
第１図は本発明の一実施例を示す半導体装置の製造方法
における樹脂封止前のリードフレームの状態を示す平面
図、第２図は同じくモールド金型内に封止樹脂を射出し
た状態を示す断面図、第３図は同じくモールド金型内で
封止樹脂が半硬化した状態を示す断面図、第４図は同じ
くモールド金型内で封止樹脂が硬化した状態を示す断面
図、第５図は封止樹脂の粘度と成形時間の関係を示す
図、第６図は同じくその製造方法において樹脂封止後の
状態を示す平面図、第７図（ａ）は同じくその半導体装
置の完成品を示す側面図、第７図（ｂ）は同じくその断
面図、第８図は従来の半導体装置の製造方法における樹
脂封止前のリードフレームの状態を示す平面図、第９図
は同じくリードフレームをモールド金型に固定した状態
を示す断面図、第10図は同じく樹脂封止後の状態を示す
平面図、第11図は同じくその半導体装置の完成品を示す
側面図である。 20:半導体素子、21:リードフレーム、22:封止樹脂、26:
横枠、27,28,29:リード端子、30:載置片、31:タイバ
ー、34,35:モールド金型、36,37:位置決めピン。FIG. 1 is a plan view showing a state of a lead frame before resin sealing in a method of manufacturing a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a view showing a state in which sealing resin is injected into a mold. FIG. 3 is a cross-sectional view showing a state where the sealing resin is semi-cured in the mold, FIG. 4 is a cross-sectional view showing a state where the sealing resin is cured in the mold, and FIG. FIG. 5 is a diagram showing the relationship between the viscosity of the sealing resin and the molding time, FIG. 6 is a plan view showing a state after resin sealing in the same manufacturing method, and FIG. FIG. 7B is a cross-sectional view of the same, FIG. 8 is a plan view showing a state of a lead frame before resin sealing in a conventional method of manufacturing a semiconductor device, and FIG. Sectional view showing the state where the frame is fixed to the mold, FIG. Plan view similarly showing the state after resin sealing, FIG. 11 is a same side view showing the finished product of the semiconductor device. 20: semiconductor element, 21: lead frame, 22: sealing resin, 26:
Horizontal frame, 27, 28, 29: lead terminal, 30: mounting piece, 31: tie bar, 34, 35: mold, 36, 37: positioning pin.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 細木 満 大阪府大阪市阿倍野区長池町22番22号 シャープ株式会社内 (56)参考文献 特開 昭60−130129（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Mitsuru Hosoki 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Inside Sharp Corporation (56) References JP-A-60-130129 (JP, A)
Claims (1)
導体素子載置片を有するリードフレームに半導体素子を
搭載する工程と、 前記半導体素子載置片をモールド金型内に配置し、該半
導体素子載置片を前記モールド金型内に突出する位置決
めピンにより支持するとともに前記載置片吊りモード端
子を前記モールド金型により支持する工程と、 前記モールド金型内に封止樹脂を射出する工程と、 射出された該封止樹脂が半硬化で且つ流動性を有する状
態において前記位置決めピンを成形品の表面まで持ち上
げるとともに、前記位置決めピンの抜け跡を前記半硬化
で且つ流動性を有する封止樹脂によって封止する工程
と、を備えてなることを特徴とする半導体装置の製造方
法。A step of mounting a semiconductor element on a lead frame having a semiconductor element mounting piece supported only by a mounting piece hanging lead terminal; and disposing the semiconductor element mounting piece in a mold. A step of supporting the semiconductor element mounting piece by a positioning pin projecting into the mold and supporting the mounting mode hanging terminal by the mold; and injecting a sealing resin into the mold. In the state where the injected sealing resin is semi-cured and has fluidity, the positioning pin is lifted up to the surface of the molded article, and the trace of the positioning pin is removed by the semi-cured and fluid sealing. And a step of sealing with a sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63324280A JP2596995B2 (en) | 1988-12-21 | 1988-12-21 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63324280A JP2596995B2 (en) | 1988-12-21 | 1988-12-21 | Method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02168637A JPH02168637A (en) | 1990-06-28 |
| JP2596995B2 true JP2596995B2 (en) | 1997-04-02 |
Family
ID=18164041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63324280A Expired - Fee Related JP2596995B2 (en) | 1988-12-21 | 1988-12-21 | Method for manufacturing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2596995B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5996986B2 (en) * | 2012-09-25 | 2016-09-21 | 有限会社吉井電子工業 | Manufacturing method of insert molded product |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130129A (en) * | 1983-12-16 | 1985-07-11 | Nec Corp | Method for sealing isolation-type semiconductor element with resin |
| IT1215023B (en) * | 1986-08-27 | 1990-01-31 | Sgs Microelettronica Spa | RESIN AND ELECTRONICALLY ISOLATED ENCAPSULATED DEVICE AND SEMICONDUCTOR AND PROCESS FOR LASUA MANUFACTURE |
| JPH0676474B2 (en) * | 1986-12-23 | 1994-09-28 | 住友ベークライト株式会社 | Insulating resin paste for semiconductors |
-
1988
- 1988-12-21 JP JP63324280A patent/JP2596995B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02168637A (en) | 1990-06-28 |
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