JP2597928B2 - Underfloor wiring drawing method and wiring floor material structure - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an underfloor wiring lead-in method and a wiring floor material apparatus. More specifically, the present invention relates to a method of drawing in under-floor wiring and a wiring floor material apparatus in which wiring pits are not greatly opened on the upper surface of the flooring material and wiring pits need not be closed with a rigid plate or the like.

(Prior Art) Conventionally, as a floor material for underfloor wiring used for forming a so-called OA floor, the present applicant has already disclosed in Japanese Patent Laid-Open No.
As disclosed in Japanese Patent Application No. 177813 (Japanese Patent Application No. 63-1747), there has been proposed a device in which a wiring pit portion having a base shape for accommodating wiring is formed with an opening at an upper portion.

(Problems to be Solved by the Invention) However, in the above-mentioned conventional floor material for underfloor wiring, a grid-like wiring pit portion for storing the wiring has a considerable width necessary for wiring.

A carpet, which is a finishing material, is laid on the flooring material.Since the carpet is soft, simply laying the carpet on the flooring material makes the wiring pit open at the top when walking on it. The part of the part sinks. For this reason, conventionally, it is necessary to cover all the openings of the wiring pit portion with a rigid plate or the like, which is very troublesome.

The installation of such a rigid plate increases the cost because the number of parts increases. Also, when walking on the carpet, there is a problem that the sound of collision between the rigid plate and the flooring is apt to be generated, which may cause discomfort to pedestrians. The pedestrian may trip over due to dents,
There was a problem that the desk or chair could be inclined.

The present invention has been made in view of such problems, and a problem to be solved is to provide an underfloor wiring lead-in method and wiring that can form an OA floor without requiring a rigid plate covering a wiring pit portion. It is an object of the present invention to provide a flooring device for use.

(Means for Achieving the Object) In order to achieve the above object, the invention described in claim 1 is
`` A wiring pit portion which is closed by an upper plate portion that forms a floor surface is provided, and a narrow opening communicating the wiring pit portion and the floor above the upper plate portion is continuous in the longitudinal direction of the wiring pit portion. In the formed wiring floor material, the end of the wiring holder is connected to a cable or the like, and the wiring holder is moved along the narrow opening by an operation from above the floor, and the cable or the like is moved into the wiring pit portion. An underfloor wiring lead-in method characterized by drawing in. ] As its gist.

In addition, the invention according to claim 2 is characterized in that a wiring pit portion is provided in which an upper portion is closed by an upper plate portion forming a floor surface and accommodates a cable and the like therein, and the upper plate portion has a wiring pit portion and a floor pit. A wiring floor member having a narrow opening formed continuously in the longitudinal direction of the wiring pit portion, and a wiring holder connected to a cable or the like and moved along the narrow opening by an operation from above the floor. A flooring device for wiring, comprising: ] As its gist.

Furthermore, the invention according to claim 3 is characterized in that a wiring pit portion is provided in which an upper portion is closed by an upper plate portion constituting a floor surface and accommodates a cable or the like therein, and the upper plate portion has a wiring pit portion and a floor pit. A wiring floor formed continuously in the longitudinal direction of the wiring pit portion, and a narrow opening for communicating with the wiring pit portion, the wiring floor material being disposed at a side opening end of the wiring pit portion; A flat upper surface that is flush with the upper portion of the wiring board, and a floor plate material that forms a wiring space for wiring routing that communicates with the wiring pit portion below the flat upper surface, and is connected to cables and the like to be operated from above the floor. A wiring flooring device, comprising: a wiring holder that moves along the narrow opening. 』
Is the gist.

(Operation) According to the first and second aspects of the invention, in order to insert the wiring into the wiring pit portion of the flooring material, the leading end of the wiring is fixed to a thin plate-shaped metal fitting or the like, and the outside of the opening is provided. Then, the user may operate and pull the fitting or the like. As a result, the upper portion of the wiring pit can be closed in advance and a narrow opening can be formed in the upper portion of the wiring pit. Can be configured.

According to the third aspect of the present invention, in order to insert the wiring into the wiring pit portion of the floor material, the leading end of the wiring is fixed to a thin plate-shaped metal fitting or the like, and the metal fitting or the like is operated from outside the opening. Just pull it. As a result, it is possible to form a narrow opening in the upper part of the wiring pit part which is previously closed at the upper part of the wiring pit part. Can be configured.

In particular, according to the present invention, a flat floor surface is formed together with the wiring floor material by arranging a floor plate material at an opening end of the wiring pit portion of the wiring floor material, and the pit portion of the wiring floor material is provided. And the wiring space of the floorboard material. And, by this, the wiring drawn from the pit portion of the wiring floor material to the wiring space of the floor plate material is routed in a direction orthogonal to the wiring pit portion, and from the wiring space to the wiring pit portion of another wiring floor material. The wiring can be inserted again to guide the wiring to an arbitrary position on the floor surface, and an outlet or the like can be installed.

(Example) Hereinafter, the first embodiment of the present invention will be described with reference to the first embodiment.
This will be described with reference to FIGS.

In the figure, a floor structure (50) is composed of a wiring floor material (10) and a floor material (20) as shown in FIG.

The wiring floor material (10) is a rectangular long floor material extruded from a metal such as aluminum, in addition to a synthetic resin such as polyethylene, polypropylene, PVC or ABS, and is provided on the floor surface (F). Many are to be laid. The wiring floor material (10) has a wiring pit portion (11) having a substantially U-shaped cross section and a width of about 30 mm to about 60 mm as shown in FIGS. A flat upper plate portion (13) for closing the upper portion of the wiring pit portion (11) is provided with a narrow opening (12) continuous in the longitudinal direction provided above the pit portion (11). The width of the narrow opening (12) is 6 mm or less so that objects on the floor such as heels of high heels do not enter.

Wiring (W) for supplying electric power from the distribution board (A) to the OA equipment is inserted into the wiring pit portion (11).
The wiring floor material (10) has a step (14) on the upper surface of the end of the upper plate (13) as shown in FIG. These wiring pits (11), openings (12) and upper plate (13)
Since the wiring floor material (10) made of is integrally formed by extrusion, it can be manufactured in large quantities and at low cost. Note that the wiring floor material (1.
Of course, it is also possible to form (0).

Further, as shown in FIG. 2, the wiring floor material (10) may have a configuration in which slits (18) are provided at regular intervals in a direction orthogonal to the wiring pit portions (11). By providing the slits (18) in this manner, the wiring flooring (10) becomes very flexible in the longitudinal direction, can cope with unevenness of the floor surface, and can absorb the unevenness. it can.
The slit (18) may be provided at a lower portion of the floor material (10) (that is, around the wiring pit portion (11)).
0) upper part (that is, upper plate part (13) and wiring pit part (11))
On both side walls). Also, the wiring flooring (10)
Since they are connected to each other only at the upper part of the pit portion (11), they are flexible in the width direction and can absorb irregularities on the floor surface well.

On the other hand, as shown in FIGS. 1 and 3, the floor plate material (20) is disposed at a side opening end of the wiring pit portion (11) and is flush with the upper plate portion (13). Wiring space (S) for wiring around
Is composed. This floorboard (20) is used for wiring flooring (1
It is placed between the ends of the flooring (10) by being placed on the step (14) at the end of (0).

As shown in FIG. 5, a rubber sheet (31) is provided on the upper surface of the flat underfloor wiring floor structure (50) of the present invention comprising the wiring floor material (10) and the floor plate material (20). A finishing material (30) such as a carpet, which is flexibly formed by implanting a chemical fiber (32) thereon, is placed.

Hereinafter, a method of using the floor structure (50) for underfloor wiring according to the present embodiment will be described.

First, as shown in FIG. 1, a large number of wiring floor members (10) are laid side by side on a floor surface (F). When the wiring floor members (10) are connected to each other in the lateral direction, as shown in FIGS. 6 to 9, the engaging recesses formed in the side surfaces of the upper plate (13) of the floor member (10). Fit the tie plate (16) to (15). And. If a connecting board (16) is laid over two flooring materials (10), the upper surfaces of the flooring materials (10) coincide, and there is no step at the connecting part of both flooring materials (10), and the adjacent floors Lumber (10)
Are firmly connected to each other in the lateral direction. Note that the connecting plate (16) may be omitted.

Then, at a predetermined distance from the end of the wiring floor material (10), the wiring floor material (10) is further arranged and laid on the floor surface (F). Place the floor panel (20) between the ends of the bracket. Then, flooring for wiring (10)
A flat floor surface is easily formed by the floor board and the floor plate (20).

The above work is repeated according to the size of the floor surface. However, as shown in FIG. 11, the structure in which the wiring floor material (10) is directly connected to the end of the wiring floor material (10) is partially used. May be provided. When connecting the wiring floor members (10) in the wiring direction (longitudinal direction), as shown in FIG. 11, the wiring floor members (10) are connected to engagement recesses (15) recessed at the ends of the upper plate (13). Fit the plate (16). Then, if the connecting board (16) is laid over the two flooring materials (10), the upper surfaces of the flooring materials can be correctly aligned. At this time, the adjacent floor members (10) are firmly connected to each other in the wiring direction, and the wiring pits (11) are also connected in the wiring direction. In addition, this connecting board (16)
It may be omitted.

After that, finishing material (30) is replaced with flooring (10) and floorboard (20)
Place on top of

Then, while peeling off the finishing material (30), various wirings (W) such as a power cable are inserted into the wiring pits (11) in accordance with the arrangement of the OA equipment, and the wirings are placed at predetermined positions in the wiring pits (11). Pit (11) upper plate (13) and finishing material (3
The wiring (W) in the wiring pit portion (11) is pulled out from the outlet provided in (0) to the upper surface side of the finishing material (30) and connected to a floor outlet or the like.

When inserting the wiring (W) into the wiring pit (11), as shown in FIG.
A wire holder (60) made of a thin plate-shaped metal fitting having the above is inserted into the opening (12). And the wiring holder (60)
It is preferable and easy to pierce and fix the tip of the wiring (W) and pull the metal fitting from outside the opening (12). In addition, a string or the like is further tied to the wiring holder (60) and pulled to pull the wiring pit (11).
May be inserted through the wiring (W).

Further, in the floor structure (50) for underfloor wiring according to the present invention, since the wiring floor material (10) and the floor plate material (20) are combined, the wiring pits of the wiring floor material (10) are provided. The part (11) communicates with the wiring space (S) of the floor plate (20). Therefore, the wiring (W) drawn out from the wiring floor material (10) into the wiring space (S) is connected to the wiring pit portion (11).
The wiring (W) can be freely routed even in the direction perpendicular to the wiring space (S), and the wiring (W) is inserted again into the wiring pit portion (11) of the other wiring floor material (10) and the floor surface is removed. The outlet (W) can be installed by guiding the wiring (W) to an arbitrary position.

When the wiring (W) drawn from the wiring pit portion (11) to the wiring space (S) is routed in a direction orthogonal to the wiring pit portion (11), in the case of a hazy wiring (W), , May require power. Therefore, even in such a case, a separate roller (not shown) is provided at the entrance of the wiring pit (11) in order to easily pull out the wiring (W) from the wiring pit (11). May be adopted.

With the above operation, the floor structure for underfloor wiring according to this embodiment (5
0) is completed, and floor wiring is completed by arranging each OA device on this and connecting various wirings (W).

In some cases, new OA equipment is additionally placed on the completed floor wiring. In this case, the finishing material (3
0) is peeled off and the upper plate (13)
Also, by forming the outlet in the finishing material (30), the wiring (W) in the wiring pit portion (11) can be drawn. Note that an outlet may be formed in the floor plate material (20) and the wiring (W) may be drawn therefrom.

Therefore, the floor structure (50) for underfloor wiring of the present embodiment has a structure in which the wiring floor material (10) is laid on the floor surface (F), and the wiring pit portion (11) is not separately covered with a rigid plate. By placing the finishing material (30) directly on the upper surface of the wiring floor material (10), the unevenness of the floor surface (F) can be absorbed and a flat floor structure can be obtained. The wiring (W) can be routed and inserted into an arbitrary wiring pit portion (11) by utilizing the wiring space (S) according to (20).

Next, a second embodiment of the present invention will be described with reference to FIGS. Note that members having the same configurations as those of the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The wiring floor material (110) of the present embodiment has a state in which a plurality of the wiring pit portions (11) are arranged at predetermined intervals as shown in FIGS. 13 to 15 and the like. 1
It has a flat upper plate (13) for closing the upper part of (1).

On the other hand, the floorboard (20) supports the flooring (20) at a position flush with the upper surface of the wiring flooring (110) as shown in FIG. 12 and FIG. A support (21) forming (S) is provided. And this floor board material (20)
Are arranged so as to be connected between the ends of the wiring pits (11) of the wiring floor material (110) laid side by side at predetermined intervals in the vertical direction.

Further, as shown in FIG. 12, floor boards (20) having the same configuration may be arranged beside the wall and used as a main duct from the distribution board (A) or the like.

Therefore, in this embodiment, a large number of wiring floor materials (11
0) are arranged side by side in the horizontal direction, laid on the floor (F), and the floorboard (20) is arranged so as to abut the end of the wiring floor (110). Then, another wiring floor member (110) is arranged so as to be in contact with the end of the floor plate member (20). Then, a flat floor surface is easily formed by the wiring floor material (110) and the floor plate material (20).

The present invention is not limited to the above embodiment,
Flooring materials for wiring (10) (10), floorboard materials (20) and finishing materials (3
0) shape, size, material, etc., for example, wiring pit (11)
May be arbitrarily changed without departing from the spirit of the present invention, such as changing the shape of the floor material or making the material of the floor material nonflammable instead of flame-retardant synthetic resin. In addition, the floor material (10) can be implemented by using only the floor materials (10) and (110) arranged in a line and the floor plate material (20) arranged in a line according to the size of the floor surface (F).
The arrangement of the (110) and the floorboard (20) may be changed as appropriate.

(Effects of the Invention) As described in detail above, according to the first and second aspects of the present invention, a thin plate-shaped metal fitting or the like is attached to the wiring at the tip end in order to insert the wiring into the wiring pit portion of the floor material. The wiring can be easily inserted by pulling it from the outside of the narrow opening continuous in the longitudinal direction of the wiring pit portion by operating the metal fitting or the like. Since only a narrow opening is formed above the wiring pit portion laid on the floor surface, a flat floor surface can be easily formed without requiring a rigid plate covering the wiring pit portion. It has an excellent effect. Therefore, the number of parts is reduced, and an inexpensive wiring flooring material can be provided. Further, the floor material itself can easily and integrally form the wiring pit portion by extrusion molding or the like, and can be provided in large quantities and at low cost.

According to the third aspect of the present invention, in order to insert the wiring into the wiring pit portion of the wiring floor material, similarly to the first and second aspects of the present invention, a thin plate-shaped metal fitting is provided. Etc. may be used. Further, since a rigid plate for covering the wiring pit portion is not required and the number of components can be reduced, an excellent effect is obtained that an easy-to-install and inexpensive OA floor can be formed. Further, it is possible to provide a floor structure for underfloor wiring, which does not generate a collision sound between the rigid plate and the floor plate when walking.

In particular, according to the invention of claim 3, the wiring pit portion of the wiring floor material and the wiring space of the floor material communicate with each other,
The wiring drawn from the wiring pit to the wiring space is routed in the direction perpendicular to the wiring pit, and the wiring is inserted again from the wiring space to the wiring pit of another floor material for wiring, and any position on the floor surface This leads to an excellent effect that an outlet or the like can be installed by guiding the wiring to the cable. Further, by arranging the floor plate material between the wiring floor materials, a flat floor surface can be easily formed together with the wiring floor material.

[Brief description of the drawings]

1 to 11 show an embodiment of a floor structure for underfloor wiring according to the present invention, FIG. 1 is a perspective view of a floor structure for underfloor wiring, and FIGS. 2 and 3 are wiring floors. FIG. 4 and FIG. 5 are front views of wiring floor materials, respectively, and FIGS. 6, 7, and 8 are front views of wiring floor materials, respectively, and FIG. Is an enlarged perspective view of a part of the wiring flooring,
FIG. 10 is an enlarged sectional view of a wiring floor material showing a state where wiring is inserted into the wiring pit portion, FIG. 11 is a plan view of a floor structure for underfloor wiring, and FIGS. 12 to 16 are floor structures. Fig. 12 is a perspective view of a floor structure for underfloor wiring, Fig. 13 is a partially enlarged perspective view of a wiring floor material, and Figs. 14 and 15 are wiring floors, respectively. FIG. 16 is an overall perspective view of the floorboard material. Description of reference numerals 10,110: wiring floor material, 11: wiring pit, 12: opening, 13
... top plate part, 20 ... floor board material, 21 ... post, 30 ... finishing material, 50 ... floor structure for underfloor wiring, F ... floor surface, S ... wiring space.

Claims (3)

(57) [Claims] 1. A wiring pit portion having an upper portion closed by an upper plate portion constituting a floor surface, and a narrow opening communicating the wiring pit portion and the floor is formed in the upper plate portion in a longitudinal direction of the wiring pit portion. In the wiring floor material formed continuously, the end of the wiring holder is connected to a cable or the like, and the wiring holder is moved along the narrow opening by an operation from above the floor, so that the inside of the wiring pit portion is formed. A method of drawing in under-floor wiring, wherein a cable or the like is drawn into the floor. 2. A wiring pit portion which is closed by an upper plate portion constituting a floor surface and accommodates a cable and the like therein.
In the upper plate portion, a narrow opening for communicating the wiring pit portion and the floor is connected to a wiring floor material formed continuously in the longitudinal direction of the wiring pit portion. And a wiring holder that moves along the narrow opening. 3. A wiring pit part which is closed by an upper plate part constituting a floor surface and accommodates a cable and the like therein.
A wiring floor in which a narrow opening communicating the wiring pit with the floor is formed continuously in the longitudinal direction of the wiring pit; A floor plate material that is arranged at the opening end of the wiring board and forms a flat upper surface that is flush with the upper portion of the wiring floor material, and that forms a wiring space for wiring routing that communicates with the wiring pit portion below the floor board material. And a wiring holder which is connected to a cable or the like and moves along the narrow opening by an operation from above the floor.