JP2598376B2 - Electronic component measuring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a transistor, an IC,
The present invention relates to a measuring device for an electronic component used for an automatic inspection and a sorting device of a molded electronic component having parallel leads such as a discrete device.

[0002]

2. Description of the Related Art Conventionally, when measuring the electrical characteristics of a molded electronic component having a high frequency characteristic such as a transistor, an IC or a discrete device (hereinafter collectively referred to as an electronic component), the electronic component is usually located at a measurement position. And set
A probe is brought into contact with the lead, a current or a voltage is applied from a measuring device, and electrical characteristics such as resistance of the electronic component are measured, and classified and stored in each category according to the measurement result.

[0003] There are two methods for measuring electrical characteristics: a single contact method in which application and measurement are performed by one probe, and a Kelvin contact method in which application and measurement are performed by separate probes.
The former is usually used when high measurement accuracy is not required, and the latter is used when high measurement accuracy is required.

FIG. 2 is a view showing a leaf spring type (single contact) probe. The leaf spring type measuring element 1 includes a measuring element 2 composed of a plurality of strip-shaped metal pieces arranged side by side in a direction perpendicular to the paper surface, a holding body 3 for holding a base of the measuring element 2 in common, and a pusher 4. The probe 2 is pressed by the pusher 4 and elastically deformed during the characteristic measurement,
The tip 2a is pressed against the lead 6 of the electronic component 5 at a predetermined pressure.

FIG. 3 shows a socket type (single contact).
FIG. 4 is a view showing a tracing stylus. The socket type tracing stylus 10 includes a socket body 11, a plurality of tracing stylus groups 2 arranged opposite to each other at the center of the upper surface of the socket body 11, and an openable and closable one end of the socket body 11 via a shaft 12. A pressing member 13 which is provided and presses each lead 6 of the electronic component 5 against the corresponding probe 2 at a predetermined pressure by being closed at the time of characteristic measurement; a lock lever 14 for locking the pressing member 13 to a closed position; A spring 15 for imparting a rotation behavior to a direction in which the socket body 11 is engaged with the socket body 11
And so on.

[0006]

However, when measuring the characteristics of an electronic component having high frequency characteristics using the conventional leaf spring type measuring element 1 shown in FIG. 2, the longer the length of the measuring element 2, the more the input and output. However, there is a problem that a measurement error increases due to the occurrence of a loss in the high-frequency signal, and a highly accurate measurement result cannot be obtained.

As a method for solving such a problem, FIG.
Has been developed. However, the above-described problem cannot be completely solved because the measuring element 10 also uses the measuring element 2 made of a strip-shaped metal piece.
It was not enough. Also, if the contact resistance of both the leaf spring type probe 1 and the socket type probe 10 is large, the measurement error increases, and if the lead 6 contacts the probe 2 suddenly, the lead 6 or the probe 2 bends. In particular, when the bending amount of the probe 2 is large, there is a problem that the life of the probe 2 is shortened due to bending fatigue. Further, the probe 2 is a consumable item, and if it is difficult to replace the probe, there is a problem that the operation rate of the automatic inspection and sorting device is reduced.

Therefore, as a method for solving such a problem, as shown in FIG. 4, a lead 6 of the electronic component 5 is directly pressed by a presser 21 onto a measuring circuit formed on a substrate 22 without using a probe. A measuring device has been proposed. Such a measuring method has an advantage that the measurement accuracy can be improved because there is no measurement error due to the probe. It is not necessary to replace the probe. However, the method of directly pressing the leads is one pressing (contact) for each lead, and a pressing mechanism for the number of leads is required, which has a problem that the structure is difficult.

The present invention has been made in view of the above-mentioned conventional problems, and has as its object to simplify the structure of a lead pressing mechanism and prevent abnormal deformation of a lead during characteristic measurement. An object of the present invention is to provide an electronic component measuring device capable of performing characteristic measurement with high accuracy.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and has an electronic component housing which is disposed so as to be able to approach and separate from a substrate so as to be able to freely move away from the substrate. A housing driving means for moving a housing and pressing a lead of the electronic component against a measurement circuit of the substrate, wherein the electronic component housing is closely opposed to the substrate at the time of characteristic measurement to restrict deformation of the lead; It is characterized in that a deformation preventing portion for preventing deformation is provided.

[0011]

In the present invention, the housing driving means moves the electronic component housing toward the board and presses all the leads of the electronic component against the measuring circuit of the board. The deformation preventing portion is closely opposed to the substrate with the lead interposed therebetween, and prevents the deformation of the lead when the lead is strongly pressed against the substrate.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIG. 1 is a sectional view showing an embodiment of an electronic component measuring apparatus according to the present invention. In the figure, a measuring device indicated by reference numeral 30 is provided with a chute 31 for guiding an electronic component 5 having parallel leads to a characteristic measuring section. A container). The electronic component housing 31 is vertically movable, and the electronic component 5
Is formed over the entire length in the longitudinal direction (the direction orthogonal to the paper surface). The shallow groove portion 34 has a groove width capable of accommodating the resin portion 5A of the electronic component 5, and the lead 6 projects above the electronic component housing 31 from the shallow groove portion 34. Also, the electronic component housing 3
On both sides of the shallow groove portion 34 on the upper surface of the lead 1, a deformation preventing portion 35 for preventing abnormal deformation of the lead 6 at the time of characteristic measurement is also integrally formed so as to protrude over the entire length in the longitudinal direction. And is closely opposed to the lower surface of the bent front end portion at a required interval. A sliding shaft 36 is integrally formed at the center of the lower surface width direction of the electronic component housing 31 so as to project therefrom. The sliding shaft 36 is provided with a mounting hole of a housing mounting portion 38 </ b> A provided integrally with the guide shaft 38. 39 is inserted through a bearing 40 so as to be movable up and down.
1 elastically supported. The electronic component housing 31 is formed of ceramic or the like.

The guide shaft 38 includes a guide member 4.
2, a pressing portion 38A for integrally pressing the resin portion 5A of the electronic component 5 from above is provided at the upper end. The upper end of the guide shaft 38 is inserted into a hole 43 provided in the substrate 22 and slightly projects above the substrate 22. The pressing portion 38A is formed in an inverted L shape, a base portion is joined to an upper end of the guide shaft 38, and a front end portion is bent downward at a right angle and inserted into another hole 44 provided in the substrate 22. , Is located above the electronic component 5. The guide member 42 is provided with a bearing 45 that slidably supports the guide shaft 38.

The substrate 22 is formed of ceramics or the like and is located above the electronic component housing 31. On the lower surface, a measurement circuit (not shown) for measuring the characteristics of the electronic component 5 is formed by printing. Have been.

Reference numeral 47 denotes a cylinder serving as a housing driving means for moving the guide shaft 38 and the electronic component housing 31 up and down.
And the upper end of the rod 48 is in contact with the lower surface of the guide shaft 38. The guide shaft 38 is urged downward by a spring 49 and pressed against the rod 48.

Next, measurement of characteristics of an electronic component by the measuring device having the above-described configuration will be described. Before the measurement, the leads 6 of the electronic component 5 are separated from the back surface of the substrate 22. The electronic component housing 31 is urged upward by a spring 41, so that the resin portion 5A of the electronic component 5 is formed.
Is pressed against the lower surface of the pressing portion 38A. In this state, when the cylinder 47 is driven to move the rod 48 upward by a predetermined stroke, the guide shaft 38 is pushed up against the spring 49 and compresses the spring 41. For this reason, the electronic component housing 31 also moves upward integrally with the guide shaft 38, thereby pressing the tip of the lead 6 of the electronic component 5 against the measurement circuit formed on the back side of the substrate 22. When the lead 6 is strongly pressed against the measurement circuit of the substrate 22, the lead 6 tends to abnormally deform downward. However, when the lead 6 is deformed by a certain amount, the lead 6 comes into contact with the deformation preventing portion 35 located immediately below the lead 6, thereby preventing abnormal deformation. In this case, if the gap D between the lead 6 and the deformation preventing portion 35 is set to a value within the elastic limit of the lead 6, for example, about 0.05 mm, the lead 6 is set to 0.05 mm during the measurement.
Even if it is deformed within the range described above, it returns to the original shape by the elastic force after the measurement is completed, so that the generation of the vent lead can be reliably prevented.

After the characteristic measurement, when the driving of the cylinder 47 is stopped, the rod 48 returns to the lower position, and the pressing state against the guide shaft 38 is released. Therefore, the guide shaft 38 returns to the initial position by the force of the spring 49. When the guide shaft 38 is lowered, the electronic component housing 31 is also lowered integrally with the guide shaft 38, and the pressed state of the electronic component 5 is released. Therefore, the electronic component 5 descends together with the electronic component housing 31, and then slides down the electronic component housing 31 to reach the sorting position, whereupon the electronic component 5 is dropped and stored in a predetermined sorting unit according to the measurement result.

As described above, in the present invention, since the electronic component housing 31 is provided with the deformation preventing portion 35 for preventing the deformation of the lead 6, the lead 6 is connected to the substrate in order to reduce the contact resistance with the measuring circuit during the characteristic measurement. Even if it is strongly pressed against the measurement circuit of No. 22, no abnormal deformation remains after the measurement, so that high-precision measurement can be performed, and at the same time, it is possible to prevent the lifting of the lead and the connection failure when the surface is mounted on the printed circuit board. Can be.

Although the above embodiment has been described with reference to the case where the cylinder 47 is used as the housing driving means, the present invention is not limited to this, and a driving motor is used and its rotation is controlled by a link or the like. Electronic component housing 31
May be transmitted to the user.

[0020]

As described above, the electronic component measuring device according to the present invention comprises an electronic component housing which is disposed so as to be able to approach and separate from the substrate and accommodates the electronic component, and an electronic component housing which accommodates the electronic component. A housing driving means for moving and pressing the leads of the electronic component against a measurement circuit of the substrate, wherein the electronic component housing is closely opposed to the substrate during characteristic measurement,
Since the deformation preventing section for preventing the deformation of the lead is provided, the lead can be prevented from being abnormally deformed even if the lead is strongly pressed against the measuring circuit of the substrate in order to reduce the contact resistance. For this reason, characteristic measurement can be performed with high accuracy, and it is particularly suitable for use in measuring characteristics of electronic components having high-frequency characteristics. In addition, if it is not abnormally deformed, it is possible to prevent bonding failure when the surface is mounted on a printed circuit board after measurement. Further, since the probe is not used, the replacement work is not required, and the effect is very large, for example, the operation rate of the inspection and sorting device can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of an electronic component measuring apparatus according to the present invention.

FIG. 2 is a view showing a conventional example of a leaf spring type tracing stylus.

FIG. 3 is a diagram showing a conventional example of a socket type tracing stylus.

FIG. 4 is a diagram illustrating a measuring method in which a lead of an electronic component is brought into direct contact with a measuring circuit of a substrate.

[Explanation of symbols]

2 ... Sensor, 5 ... Electronic component, 6 ... Lead, 22 ... Substrate, 3
DESCRIPTION OF SYMBOLS 1 ... Electronic component housing, 34 ... Shallow groove part, 35 ... Deformation prevention part, 38 ... Guide shaft, 38A ... Pressing part, 41 ... Spring, 47 ... Cylinder.

Claims (1)

(57) [Claims] 1. An electronic component housing, which is disposed so as to be able to approach and separate from a substrate and accommodates electronic components, and moves the electronic component housing, and presses a lead of the electronic component against a measurement circuit of the substrate. A housing driving means, wherein the electronic component housing is provided with a deformation preventing portion which is close to and opposed to the substrate at the time of property measurement and which prevents deformation of the lead. apparatus.