JP2598640B2 - Glow discharge decomposition equipment - Google Patents
Glow discharge decomposition equipmentInfo
- Publication number
- JP2598640B2 JP2598640B2 JP62075000A JP7500087A JP2598640B2 JP 2598640 B2 JP2598640 B2 JP 2598640B2 JP 62075000 A JP62075000 A JP 62075000A JP 7500087 A JP7500087 A JP 7500087A JP 2598640 B2 JP2598640 B2 JP 2598640B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- glow discharge
- film
- electrode plate
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording-members for original recording by exposure, e.g. to light, to heat or to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/02—Charge-receiving layers
- G03G5/04—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
- G03G5/08—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photoreceptors In Electrophotography (AREA)
- Chemical Vapour Deposition (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばアモルファスシリコンから成る電子
写真感光体ドラムを製造するためのグロー放電分解装置
に関し、詳細にはこのドラムの周面に亘って均質に成膜
することができるグロー放電分解装置に関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glow discharge decomposition apparatus for manufacturing an electrophotographic photosensitive drum made of, for example, amorphous silicon, and more particularly, to a glow discharge decomposition apparatus over the peripheral surface of the drum. The present invention relates to a glow discharge decomposition apparatus capable of forming a uniform film.
今日、アモルファスシリコンを光導電層とした電子写
真感光体が実用化されており、その優れた耐摩耗性、耐
熱性及び光感度特性並びに無公害性等々によって急速に
市場に浸透しつつある。Today, electrophotographic photoreceptors using amorphous silicon as a photoconductive layer have been put to practical use, and are rapidly penetrating the market due to their excellent abrasion resistance, heat resistance, photosensitivity characteristics, and pollution-free properties.
この電子写真感光体はグロー放電分解法によって形成
されるが、その形状はドラム状であり、そのためにドラ
ム周面全体に亘って均質なアモルファスシリコン層(以
下、アモルファスシリコンをa−Siと略す)を形成する
のが難しく、これにより、感光体ドラムの周面全体に亘
って電子写真特性が均等にならず、画像形成して得られ
た画面には品質上ムラが生じるという問題がある。The electrophotographic photosensitive member is formed by a glow discharge decomposition method, and has a drum shape. Therefore, a uniform amorphous silicon layer (hereinafter, amorphous silicon is abbreviated as a-Si) over the entire peripheral surface of the drum. It is difficult to form the image, and thus, the electrophotographic characteristics are not uniform over the entire peripheral surface of the photosensitive drum, and there is a problem that a screen obtained by forming an image has uneven quality.
この問題を第2図に示したグロー放電分解装置で説明
すると、以下の通りである。This problem will be described below with reference to the glow discharge decomposition apparatus shown in FIG.
即ち、1は円筒形状の反応容器、1aはその蓋体、1bは
その周壁であり、2は円筒形状のグロー放電用電極板で
あり、3は筒状の導電性基板支持体、4は成膜用筒状基
板であってこの基板4は基板支持体3の鍔部3aに載置さ
れ、両者の周面は相互にゆるやかに接触して電気的に導
通しており、そして、蓋体1aの上に付設されたモーター
5により回転軸6を介して基板支持体3が回転駆動さ
れ、これに伴って筒状基板4も回転可能となる。また、
基板支持体3、回転軸6、基体1a及び周壁1bは電気的に
導通しており、周壁1bに付設された電力入力用端子7と
グロー放電用電極板に付設された電力入力用端子8は高
周波電源9に接続され、このような電力印加系のもとで
グロー放電用電極板2と基板4の間でグロー放電が発生
する。尚、10、11は電極板2と反応容器1を電気的に絶
縁するリング体である。That is, 1 is a cylindrical reaction vessel, 1a is its lid, 1b is its peripheral wall, 2 is a cylindrical glow discharge electrode plate, 3 is a cylindrical conductive substrate support, and 4 is The substrate 4 is a cylindrical substrate for a film, and the substrate 4 is placed on the flange 3a of the substrate support 3, and the peripheral surfaces of both are loosely in contact with each other and are electrically connected to each other. The substrate support 3 is rotationally driven via a rotation shaft 6 by a motor 5 mounted on the substrate, and accordingly, the cylindrical substrate 4 is also rotatable. Also,
The substrate support 3, the rotating shaft 6, the base 1a and the peripheral wall 1b are electrically conductive, and the power input terminal 7 attached to the peripheral wall 1b and the power input terminal 8 attached to the glow discharge electrode plate are The glow discharge is generated between the glow discharge electrode plate 2 and the substrate 4 under such a power application system. Reference numerals 10 and 11 denote ring bodies for electrically insulating the electrode plate 2 and the reaction vessel 1 from each other.
12はガス導入口、13はガス排出口であり、a−Si成膜
用ガスがガス導入口12を介して反応容器1の内部へ導入
され、次いで電極板2に貫設された複数個のガス噴出口
14を介して基板4に向けて噴き出される。Reference numeral 12 denotes a gas inlet, and 13 denotes a gas outlet. A gas for forming an a-Si film is introduced into the reaction vessel 1 through the gas inlet 12, and then a plurality of gas formed through the electrode plate 2. Gas spout
It is blown out toward the substrate 4 through 14.
a−Si感光体ドラムを製作する場合、上記のような電
力印加系及びガス流系の下で基板4が回転駆動され、更
に基板支持体3の内部に形成されたヒータ15によって基
板4を所定の温度に設定し、グロー放電分解によって基
板4上にa−Si膜が気相成長する。そして、この気相成
長に伴って生じるガス分解残余ガスはガス排出口13を介
して排出される。尚、図中の矢印はガス流の方向を表わ
す。When an a-Si photosensitive drum is manufactured, the substrate 4 is driven to rotate under the above-described power application system and gas flow system, and the substrate 4 is further fixed by a heater 15 formed inside the substrate support 3. And an a-Si film is vapor-phase grown on the substrate 4 by glow discharge decomposition. Then, the gas decomposition residual gas generated by the vapor phase growth is discharged through the gas discharge port 13. The arrows in the figure indicate the direction of the gas flow.
しかし乍ら、上記のようなグロー放電分解装置によれ
ば、基板4と蓋体1aの間の空間領域16で異常放電が発生
し、この放電が基板4の成膜中上部領域4aにおけるa−
Siの成膜に影響し、これにより、基板の成膜面全体に亘
って均質なa−Si膜が形成されず、その面全体に亘って
均等な電子写真特性が得られないという問題がある。However, according to the glow discharge decomposition apparatus as described above, an abnormal discharge occurs in the space region 16 between the substrate 4 and the lid 1a, and this discharge is caused by a discharge in the upper region 4a of the substrate 4 during film formation.
There is a problem that it affects the film formation of Si, whereby a uniform a-Si film is not formed over the entire film formation surface of the substrate, and uniform electrophotographic characteristics cannot be obtained over the entire surface. .
また、このグロー放電分解装置によれば、蓋体1aの下
側面などにグロー放電に伴って生じる汚染物質が膜状又
は粉体となって付着し、a−Si膜の形成に際してこの汚
染物質が脱落して膜中に入り、これがa−Si膜を異常成
長させたり或いはピンホールを発生させる原因となる。Further, according to the glow discharge decomposition device, the contaminants generated by the glow discharge adhere to the lower surface of the lid 1a or the like as a film or powder, and the contaminants are formed during the formation of the a-Si film. It falls off and enters the film, which causes abnormal growth of the a-Si film or generation of pinholes.
従って本発明の目的は叙上の問題点を解決し、基板面
に均質な成膜形成を行い、更に成膜中に異物混入を防止
し、これによって高性能且つ高信頼性の成膜形成ができ
るようになったグロー放電分解装置を提供することにあ
る。Therefore, an object of the present invention is to solve the above-mentioned problems, to form a uniform film on a substrate surface, and to prevent foreign matter from being mixed during the film formation, whereby a high-performance and highly reliable film formation can be achieved. It is an object of the present invention to provide a glow discharge decomposition device which can be used.
本発明によれば、成膜用ガスが導入される反応室内に
筒状基板が立設され、該筒状基板を内包するように円包
形状のグロー放電用電極板が同心状に配置されており、
該包状基板と電極板の間に発生させたグロー放電によっ
て筒状基板の外表面に成膜するグロー放電分解装置にお
いて、前記筒状基板の上端部に、長さ5mm以上で上記筒
状基板と略同径の筒状をした補助基体を載置し、更に該
補助基体の上方に面積S2の絶縁性円板を、電極板の内径
における断面積S1に対する比率S2/S1が90%以下となる
ように設置したことを特徴とするグロー放電分解装置が
提供される。According to the present invention, a cylindrical substrate is erected in a reaction chamber into which a film-forming gas is introduced, and a circular glow discharge electrode plate is concentrically arranged so as to include the cylindrical substrate. Yes,
In a glow discharge decomposition apparatus for forming a film on the outer surface of a cylindrical substrate by a glow discharge generated between the envelope substrate and the electrode plate, the upper end of the cylindrical substrate has a length of 5 mm or more and is substantially the same as the cylindrical substrate. placing the auxiliary substrate has a cylindrical with the same diameter, further an insulating disc area S 2 above the auxiliary substrate, the ratio S 2 / S 1 to the cross-sectional area S 1 of the inner diameter of the electrode plate 90% A glow discharge decomposition device is provided, which is installed as follows.
以下、本発明をa−Si感光体ドラムを製作することが
できるグロー放電分解装置を例にとって詳細に説明す
る。Hereinafter, the present invention will be described in detail by taking a glow discharge decomposition apparatus capable of manufacturing an a-Si photosensitive drum as an example.
第1図は本発明グロー放電分解装置であり、第2図と
同一個所には同一符号が付してある。FIG. 1 shows a glow discharge decomposition apparatus according to the present invention, and the same parts as those in FIG.
第1図に示すグロー放電分解装置は第2図に示す装置
に対して基板と概ね同一の内径を有する筒状の補助基体
17を、立設された筒状の基板4の上端部に載置し、更に
この補助基体17の上方に円板状の絶縁部材(絶縁性円
板)18を設置しており、本発明者等はこのように補助基
体17と絶縁部材18を組合せて設置し、更に絶縁部材18と
電極板2に適当な間隔があれば基板4の外表面全体に亘
って均質な成膜形成を行うことができることを見い出し
た。The glow discharge decomposition apparatus shown in FIG. 1 is a cylindrical auxiliary base having an inner diameter substantially the same as that of the substrate as compared with the apparatus shown in FIG.
17 is placed on the upper end of the upright cylindrical substrate 4, and a disc-shaped insulating member (insulating disc) 18 is provided above the auxiliary base 17. In this way, the auxiliary base 17 and the insulating member 18 are installed in combination as described above, and if there is a proper interval between the insulating member 18 and the electrode plate 2, a uniform film formation is performed over the entire outer surface of the substrate 4. I found that I could do it.
即ち、絶縁部材18を基板4と反応室上蓋1aの間に介在
させている場合、第2図に示したグロー放電分解装置と
同じ電力印加系のもとでグロー放電用電極板2と基板4
の間でグロー放電を発生させたときに、基板4と上面1a
の間で異常放電が発生しなくなり、そのために基板4の
周面付近の成膜用放電領域が上記異常放電によって影響
を受けなくなる。しかし乍ら、この絶縁部材18を介在さ
せただけであれば、基板上部付近の放電空間に歪みが生
じて基板4の上部領域4aとそれ以外の成膜領域とで同じ
放電空間が形成されないという問題が生じる。従って、
補助基体17を基板4上に載置すると基板4と絶縁部材18
を適当な間隔で離すことができ、これによって上部領域
4aとそれ以外の成膜領域がそれぞれ同じ放電空間と成り
得る。That is, when the insulating member 18 is interposed between the substrate 4 and the reaction chamber upper lid 1a, the glow discharge electrode plate 2 and the substrate 4 are placed under the same power application system as the glow discharge decomposition device shown in FIG.
When a glow discharge is generated between the substrate 4 and the upper surface 1a
No abnormal discharge is generated between them, so that the film forming discharge area near the peripheral surface of the substrate 4 is not affected by the abnormal discharge. However, if only the insulating member 18 is interposed, distortion occurs in the discharge space near the upper part of the substrate, and the same discharge space is not formed between the upper region 4a of the substrate 4 and the other film forming regions. Problems arise. Therefore,
When the auxiliary base 17 is placed on the substrate 4, the substrate 4 and the insulating member 18
Can be separated at appropriate intervals, which allows the upper area
4a and the other film formation areas can be the same discharge space.
本発明者等は上記補助基体17の長さについて実験を繰
り返し行ってその適当な大きさを求めたところ、少なく
とも5mm以上必要で、望ましくは10mm以上がよいことを
見い出した。The present inventors have repeatedly conducted experiments on the length of the auxiliary base 17 and obtained an appropriate size. As a result, they have found that at least 5 mm or more is required, and preferably 10 mm or more.
更に上記のように補助基体17と絶縁部材18を設置する
に当たって、電極板2の内径と実質上同じ径を有する円
板状絶縁部材18を用いて両者間を接触させた場合には基
板上部領域4aがそれ以外の成膜領域に比べ成膜速度が大
きくなることが判明した。Further, when the auxiliary base member 17 and the insulating member 18 are provided as described above, when the disk-shaped insulating member 18 having substantially the same diameter as the inner diameter of the electrode plate 2 is brought into contact with each other, the upper region of the substrate It was found that 4a had a higher deposition rate than the other deposition areas.
この点について詳述するならば、本発明者等の実験に
よると、第3図に示すように、基板4を内包し同心状に
配置された円包形状の電極板2の内径における断面積S1
に対する絶縁部材18における面積S2の比率、即ちS2/S1
を幾通りにも変えて上部領域4aと中心領域4bのそれぞれ
のa−Si成膜速度を測定したところ、第4図に示す通り
の結果が得られた。To explain this point in detail, according to experiments by the present inventors, as shown in FIG. 3, the cross-sectional area S at the inner diameter of the circular electrode plate 2 that encloses the substrate 4 and is arranged concentrically is shown in FIG. 1
The ratio of the area S 2 in the insulating member 18 to S, ie, S 2 / S 1
When the a-Si film forming speed of each of the upper region 4a and the central region 4b was measured by changing the number of times, the results shown in FIG. 4 were obtained.
第4図は全長358mm、外径108mmの基板4を内径190mm
の電極板2の内部に載置し、更に基板4上に長さ60mmの
補助基体17を載置した場合の測定結果を示しており、図
中、横軸はS2/S1比率、縦軸は基板各部位のa−Si膜成
長速度であって○印は基板上部領域4a(測定個所:基板
の上端より下方50mmの個所)における成膜速度プロット
であり、一方の●印は基板中心領域4b及び下部領域4c
(測定個所:中心領域4bは基板全長の中心部であり、下
部領域4cは基板の下端より上方50mm)における成膜速度
のプロットであって両者4bと4cのプロットは実質上同一
である。また、A、Bはそれぞれの特性曲線である。FIG. 4 shows a substrate 4 having a total length of 358 mm and an outer diameter of 108 mm and an inner diameter of 190 mm.
Placed in the interior of the electrode plates 2, further shows the measurement results when placing the auxiliary base 17 of length 60mm on the substrate 4, in the figure, the horizontal axis represents the S 2 / S 1 ratio, vertical The axis is the growth rate of the a-Si film at each part of the substrate, and the circles are plots of the film formation rate in the upper region 4a of the substrate (measurement points: 50 mm below the upper end of the substrate). Area 4b and lower area 4c
(Measurement location: the central region 4b is the center of the entire length of the substrate, and the lower region 4c is 50 mm above the lower end of the substrate). The plots of the film formation rates are substantially the same for both 4b and 4c. A and B are respective characteristic curves.
この結果より明らかな通り、S2/S1が90%を超えると
各々の基板領域における成長速度に顕著な差が生じるこ
とが判る。As is clear from the results, it is found that when S 2 / S 1 exceeds 90%, a remarkable difference occurs in the growth rate in each substrate region.
本発明者等が繰り返し行った実験によれば、基板や電
極板の大きさにもよるが、S2/S1が60乃至90%、好適に
は70乃至85%の範囲内に設定すれば均質成膜に有利であ
ることを見い出した。According to experiments repeatedly performed by the present inventors, depending on the size of the substrate or the electrode plate, if S 2 / S 1 is set in the range of 60 to 90%, preferably 70 to 85%, It has been found that it is advantageous for uniform film formation.
また本発明においては、上記絶縁部材18の材質として
セラミックス、耐熱性プラスチックス、ガラス等々があ
るが、就中、セラミックスが耐熱性、耐摩耗性、耐食
性、高周波電流に対する耐絶縁性等々に優れているとい
う点で望ましい。In the present invention, as the material of the insulating member 18, there are ceramics, heat-resistant plastics, glass, and the like. Among them, ceramics are excellent in heat resistance, abrasion resistance, corrosion resistance, insulation resistance against high-frequency current, and the like. Is desirable.
この絶縁部材18を設置した場合、その下面18aにはグ
ロー放電に伴って反応種が堆積し易くなっており、前述
したような成膜欠陥が生じることになるが、この絶縁部
材18を所定の温度範囲内に加熱すれば、この問題を解決
することができる。When the insulating member 18 is provided, reactive species are easily deposited on the lower surface 18a of the insulating member 18 due to the glow discharge, and the above-described film formation defect occurs. This problem can be solved by heating within the temperature range.
即ち、本発明の装置であれば、絶縁部材18を基板支持
体3の内部に配設したヒータ15に近接もしくは接触させ
ることができ、これにより、絶縁部材18が適当な温度に
まで高められ、その結果、下面18a上の成膜体が剥離し
なくなる。That is, in the apparatus of the present invention, the insulating member 18 can be brought close to or in contact with the heater 15 disposed inside the substrate support 3, whereby the insulating member 18 can be heated to an appropriate temperature. As a result, the film on the lower surface 18a does not peel off.
本発明者等の実験によれば、この絶縁部材18の温度を
140乃至400℃、好適には200乃至300℃の範囲内に設定す
れば、上記目的を有利に達成できることを見い出した。According to experiments performed by the present inventors, the temperature of the insulating member 18 was reduced.
It has been found that the above object can be advantageously achieved by setting the temperature within the range of 140 to 400 ° C., preferably 200 to 300 ° C.
以上の通り、本発明のグロー放電分解装置によれば、
基板面全体に亘って均質に成膜できるように補助基体と
絶縁部材を設置しており、更に絶縁部材を加熱すること
によって成膜中の異物混入を防止しており、これによっ
て高性能且つ高信頼の成膜形成ができるグロー放電分解
装置が提供される。As described above, according to the glow discharge decomposition device of the present invention,
An auxiliary substrate and an insulating member are provided so that a uniform film can be formed over the entire surface of the substrate, and foreign matter is prevented from being mixed during the film formation by heating the insulating member. A glow discharge decomposition apparatus capable of forming a reliable film is provided.
尚、本発明は上記実施例に限定されるものではなく、
本発明の要旨を逸脱しない範囲において種々の変更、改
良等々は何等差支えない。The present invention is not limited to the above embodiment,
Various changes, improvements, etc. may be made without departing from the scope of the present invention.
第1図は本発明のグロー放電分解装置の概略図、第2図
は従来のグロー放電分解装置の概略図、第3図はグロー
放電分解用電極板の内部断面の面積と円板状絶縁部材の
面積との関係を表わす説明図、第4図は第3図にて示す
関係の比率に対する基板各部位の成膜速度を表わす線図
である。 1……反応容器、2……グロー放電用電極板 3……導電性基板支持体 4……成膜用筒状基板 17……補助基体 18……絶縁部材FIG. 1 is a schematic view of a glow discharge decomposition apparatus of the present invention, FIG. 2 is a schematic view of a conventional glow discharge decomposition apparatus, and FIG. 3 is an internal sectional area of a glow discharge decomposition electrode plate and a disc-shaped insulating member. FIG. 4 is a diagram showing the film formation rate of each part of the substrate with respect to the ratio of the relationship shown in FIG. DESCRIPTION OF SYMBOLS 1 ... Reaction container 2 ... Glow discharge electrode plate 3 ... Conductive substrate support 4 ... Film forming cylindrical substrate 17 ... Auxiliary base 18 ... Insulating member
Claims (1)
板が立設され、該筒状基板を内包するように円筒形状の
グロー放電用電極板が同心状に配置されており、該筒状
基板と電極板の間に発生させたグロー放電によって筒状
基板の外表面に成膜するグロー放電分解装置において、
前記筒状基板の上端部に、長さ5mm以上で上記筒状基板
と略同径の筒状をした補助基体を載置し、更に該補助基
体の上方に面積S2の絶縁性円板を、電極板の内径におけ
る断面積S1に対する比率S2/S1が90%以下となるように
設置したことを特徴とするグロー放電分解装置。1. A tubular substrate is erected in a reaction chamber into which a film forming gas is introduced, and a cylindrical glow discharge electrode plate is concentrically arranged so as to include the tubular substrate. In a glow discharge decomposition apparatus that forms a film on the outer surface of the cylindrical substrate by a glow discharge generated between the cylindrical substrate and the electrode plate,
The upper end of the tubular substrate was placed an auxiliary substrate that the tubular substrate and substantially the same diameter of the cylindrical length 5mm or more, a further insulating disc area S 2 above the auxiliary substrate A glow discharge decomposition apparatus, wherein the ratio S 2 / S 1 to the cross-sectional area S 1 at the inner diameter of the electrode plate is set to 90% or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62075000A JP2598640B2 (en) | 1987-03-27 | 1987-03-27 | Glow discharge decomposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62075000A JP2598640B2 (en) | 1987-03-27 | 1987-03-27 | Glow discharge decomposition equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63241184A JPS63241184A (en) | 1988-10-06 |
| JP2598640B2 true JP2598640B2 (en) | 1997-04-09 |
Family
ID=13563505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62075000A Expired - Lifetime JP2598640B2 (en) | 1987-03-27 | 1987-03-27 | Glow discharge decomposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2598640B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998001600A1 (en) * | 1996-07-08 | 1998-01-15 | Citizen Watch Co., Ltd. | Guide bush and method of forming film on guide bush |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6086277A (en) * | 1983-10-18 | 1985-05-15 | Canon Inc | Formation of deposited film by discharge |
| JPS60155676A (en) * | 1984-01-24 | 1985-08-15 | Canon Inc | Plasma CVD equipment |
-
1987
- 1987-03-27 JP JP62075000A patent/JP2598640B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63241184A (en) | 1988-10-06 |
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