JP2603877B2 - Manufacturing method of thermal head - Google Patents
Manufacturing method of thermal headInfo
- Publication number
- JP2603877B2 JP2603877B2 JP1331808A JP33180889A JP2603877B2 JP 2603877 B2 JP2603877 B2 JP 2603877B2 JP 1331808 A JP1331808 A JP 1331808A JP 33180889 A JP33180889 A JP 33180889A JP 2603877 B2 JP2603877 B2 JP 2603877B2
- Authority
- JP
- Japan
- Prior art keywords
- protective layer
- heating element
- thermal head
- forming
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011241 protective layer Substances 0.000 claims description 95
- 238000010438 heat treatment Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000005299 abrasion Methods 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims 2
- 238000007788 roughening Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 230000000873 masking effect Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 metal oxide alkoxide Chemical class 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、発熱体を摩耗等から保護する第１の保護層
と、発熱体周辺部を少なくとも除いたサーマルヘッドの
表面を保護する第２の保護層を備えたサーマルヘッドに
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a first protective layer for protecting a heating element from abrasion and the like, and a second protection layer for protecting a surface of a thermal head except at least a peripheral portion of the heating element. The present invention relates to a thermal head provided with the above protective layer.
本発明は、発熱体と、この発熱体に接続された電極
と、前記発熱体の表面と前記電極の表面の選ばれた部分
を覆い、耐摩耗性や耐酸化性の機能を有した第１の保護
層を備え、少なくとも前記発熱体の周辺を除き、かつ前
記第１の保護層の被覆パターンのエッジの選ばれた部分
と重なって、前記第１の保護層の形成前に低融点ガラス
や耐熱性樹脂等からなる第２の保護層を形成することを
特徴とし、第１の保護層の形成前に第２の保護層が設け
られていることによって、第１の保護層のエッジ部にお
ける電極との密着性や、第１の保護層の形成時における
種々の問題を解決し、よって、信頼性、製造性に優れた
サーマルヘッドを提供するものである。The present invention covers a heating element, an electrode connected to the heating element, a surface of the heating element and a selected portion of the surface of the electrode, and has a first function of abrasion resistance and oxidation resistance. A protective layer of at least excluding the periphery of the heating element, and overlapping with a selected portion of the edge of the coating pattern of the first protective layer, before forming the first protective layer, low melting point glass or A second protective layer made of a heat-resistant resin or the like is formed. By providing the second protective layer before forming the first protective layer, the second protective layer is provided at the edge of the first protective layer. An object of the present invention is to provide a thermal head which is excellent in reliability and manufacturability by solving various problems in the adhesion to electrodes and the formation of the first protective layer.
従来のサーマルヘッドは、第７図に断面図を示すよう
に、発熱体（３）とこの発熱体に接続された電極（４）
を覆う第１の保護層（７）が設けられ、この第１の保護
層のエッジ部と重なってエポキシ樹脂等からなる第２の
保護層（20）が前記第１の保護層の上層に設けられてい
た。As shown in the sectional view of FIG. 7, a conventional thermal head has a heating element (3) and electrodes (4) connected to the heating element.
A first protective layer (7) covering the first protective layer, and a second protective layer (20) made of epoxy resin or the like is provided on the first protective layer so as to overlap the edge of the first protective layer. Had been.
このようなサーマルヘッドの製造において、シリコン
化合物を代表とする絶縁材料を用い、スパッタリングや
CVD等の方法で前記第１の保護層を形成する。このとき
第８図に断面図を示すように、前記第１の保護層（７）
を被覆しない部分を、金属やセラミックから成るマスキ
ング部材（11）で覆って膜形成することが一般的であっ
た。In the production of such a thermal head, using an insulating material represented by a silicon compound, sputtering or
The first protective layer is formed by a method such as CVD. At this time, as shown in the sectional view of FIG. 8, the first protective layer (7)
It is common to form a film by covering a portion not covered with a masking member (11) made of metal or ceramic.
しかしながら、このようにマスキングをした場合、マ
スキング部材（11）とサーマルヘッドの前記電極（４）
がこすれ合ったり、マスキング部材の角で電極を削って
しまったりする不具合が生じ、電極の通電信頼性の低下
や製造歩留まりの低下という問題があった。However, when masking is performed in this manner, the masking member (11) and the electrode (4) of the thermal head are used.
However, there is a problem that the electrodes are rubbed with each other or the electrodes are scraped off at the corners of the masking member.
また、前記第１の保護層（７）のエッジ部は前記マス
キング部材の陰やズレ等の影響によって、薄くかつ着膜
エネルギーの低さから密着力が弱くなる。このような状
態においては、金や銅等電極として特性に優れるが酸化
物等との密着性に劣る金属を電極とした場合、第９図に
断面を示すように上記の第１の保護層エッジ部は極端に
保護層の剥離が起こり易く、たとえ第７図のように前記
エッジ部を含んで第２の保護層（20）を設けたにしても
製品の信頼性や製造上で問題を起こし易い。Further, the edge portion of the first protective layer (7) is thin and has low adhesion energy due to the low deposition energy due to the influence of the shadow or displacement of the masking member. In such a state, when the electrode is made of a metal such as gold or copper which has excellent characteristics but poor adhesion to oxides or the like, the edge of the first protective layer edge is formed as shown in the cross section in FIG. The protection layer is extremely liable to peel off in the portion, and even if the second protection layer (20) including the edge portion is provided as shown in FIG. easy.
本発明は、前記第１の保護層を形成する前に、第２の
保護層を形成することを最大の特徴とし、この第２の保
護層を、低融点ガラス、耐熱樹脂、金属酸化物アルコキ
シド等の前記第１の保護層の形成熱に耐える材料で、ス
クリーン印刷法等の手段で形成しておき、この第２の保
護層に第１の保護層のエッジがかかるようにマスキング
部材を当てるなどして、第１の保護層を形成するもので
ある。The present invention is characterized in that a second protective layer is formed before the first protective layer is formed, and the second protective layer is formed of a low melting point glass, a heat resistant resin, a metal oxide alkoxide. A material that can withstand the heat of forming the first protective layer is formed by means of a screen printing method or the like, and a masking member is applied to the second protective layer so that the edge of the first protective layer covers the second protective layer. Thus, the first protective layer is formed.
第１の保護層の下部に第２の保護層を設けることによ
って、前記第１の保護層は、そのエッジ部が直接電極パ
ターンと接触せず、この部分において電極と第２の保護
層、第２の保護層と第１の保護層という接触構成とな
り、層間密着の改善が図れる。By providing the second protective layer below the first protective layer, the edge of the first protective layer does not directly contact the electrode pattern. Thus, the contact structure of the second protective layer and the first protective layer is obtained, and the interlayer adhesion can be improved.
また、第１の保護層は、最表層部に設けられ、耐摩耗
層としての有効領域を、前記エッジ部近傍まで最大限に
引き出すことができる。Further, the first protective layer is provided on the outermost layer portion, and can maximize the effective area as the wear-resistant layer to the vicinity of the edge portion.
本発明の実施例を以下図面を用いて詳細に説明する。 Embodiments of the present invention will be described below in detail with reference to the drawings.
第１図は、本発明の製造方法によって製造されたサー
マルヘッドの断面図であり、第６図はこのサーマルヘッ
ドの要部拡大断面図である。アルミナセラミック等の基
板（１）上にグレーズ層（２）を設け、発熱抵抗層、導
体層を薄膜形成、パターニングし発熱体（３）、電極
（４）とする。次いで少なくとも上記発熱体（３）の周
辺部と外部回路との接続部（５）等を除いて、第２の保
護層（８）を形成する。その後、前記発熱体（３）の周
辺部表面に、少なくとも被覆のエッジ（６）が上記第２
の保護層（８）にかかるように第１の保護層（７）を形
成する。（９）は前記第２の保護層と同時に形成した発
熱体駆動素子（10）の基板を電極（４）から絶縁するた
めの絶縁コートである。FIG. 1 is a sectional view of a thermal head manufactured by the manufacturing method of the present invention, and FIG. 6 is an enlarged sectional view of a main part of the thermal head. A glaze layer (2) is provided on a substrate (1) of alumina ceramic or the like, and a heating resistor layer and a conductor layer are formed as thin films and patterned to form a heating element (3) and an electrode (4). Next, a second protective layer (8) is formed except for at least a connection portion (5) between the peripheral portion of the heating element (3) and an external circuit. Thereafter, at least a coating edge (6) is provided on the peripheral surface of the heating element (3).
The first protective layer (7) is formed so as to cover the protective layer (8). (9) is an insulating coat for insulating the substrate of the heating element drive element (10) formed simultaneously with the second protective layer from the electrode (4).
前記電極材料には、金、銅、あるいはアルミニウム、
またこれらの金属の合金等が用いられる。耐摩耗性や発
熱体の酸化防止機能を持つ前記第１の保護層材料として
は、Siの酸化物、窒化物、炭化物等が用いられ、スパッ
タリングやCVD等の方法によって形成される。The electrode material, gold, copper, or aluminum,
Also, alloys of these metals and the like are used. As the material of the first protective layer having abrasion resistance and a function of preventing oxidation of the heating element, oxides, nitrides, carbides, and the like of Si are used, and are formed by a method such as sputtering or CVD.
一方、前記第２の保護層（８）、（９）について、発
明者らは、PbOやB2O3等を主成分とした非結晶性の低融
点ガラス、及び結晶性の低融点ガラス、ポリイミド樹
脂、Si酸化物やTa酸化物のアルコキシドの各種の材料を
用い、スクリーン印刷・熱処理の方法、及び、塗布・熱
処理・パターニングの方法によって第２の保護層を形成
した。前記第１の保護層の形成において、スパッタリン
グ、CVDいずれもワーク温度が高くなりまた膜厚も必要
なため形成時間が長くなる。従って、第２の保護層
（８）は少なくともこの温度における耐熱性を必要とす
る。上記の一連の第２の保護層材料では、熱処理温度が
400〜550℃程度であってこの熱処理温度よりおよそ100
℃低い側の温度までの耐熱性はある。熱処理温度につい
ては、特に熱処理雰囲気と、発熱抵抗層の酸化等の熱変
化に注意しなければならないが、大気雰囲気で第２の保
護層を熱処理した場合では、450℃程度までの温度では
発熱抵抗層の特性に変化がでにくく、むしろ耐パルス性
が向上する。上記結晶性の低融点カラスでは、耐熱温度
は上記熱処理温度より高く、第２の保護層形成と後工程
において有利であるといえるが、結晶が大きく成長する
材料は、サーマルヘッドの表面に粗さが生じ、感熱記録
紙等と接触するとキズ等の問題が発生する危惧があり、
表面粗さが10分の数ミクロン以下となるガラスを用いる
か、記録媒体と接触することのない程の距離を発熱体
（３）との間に設ける必要がある。On the other hand, with regard to the second protective layers (8) and (9), the present inventors have proposed amorphous low-melting glass containing PbO or B 2 O 3 as a main component, crystalline low-melting glass, A second protective layer was formed using various materials such as polyimide resin, alkoxides of Si oxide and Ta oxide, by a method of screen printing and heat treatment, and a method of coating, heat treatment and patterning. In the formation of the first protective layer, both sputtering and CVD require a high work temperature and a thick film, so that the formation time is long. Therefore, the second protective layer (8) needs heat resistance at least at this temperature. In the above series of second protective layer materials, the heat treatment temperature is
About 400-550 ° C, about 100
There is heat resistance up to a temperature lower by ° C. Regarding the heat treatment temperature, it is necessary to pay particular attention to the heat treatment atmosphere and heat changes such as oxidation of the heat-generating resistance layer. The characteristics of the layer hardly change, and the pulse resistance is improved. In the case of the above-mentioned crystalline low-melting-point crow, the heat-resistant temperature is higher than the above-mentioned heat-treating temperature, which can be said to be advantageous in the formation of the second protective layer and the subsequent steps. May occur, and if it comes in contact with heat-sensitive recording paper, there is a concern that problems such as scratches may occur.
It is necessary to use glass whose surface roughness is several tenths of microns or less, or to provide a distance between the heating element (3) and the heating element (3) so as not to contact the recording medium.
また、第２の保護層と電極、および前記第１の保護層
との密着性については、ポリイミド樹脂を除いて、上記
いずれの層間とも密着性に優れていた。ポリイミド樹脂
については、酸素プラズマ等で表面を荒す処理をした方
が良好な結果を得る。Further, regarding the adhesion between the second protective layer and the electrode and the first protective layer, the adhesiveness was excellent with any of the above-mentioned layers except for the polyimide resin. As for the polyimide resin, better results are obtained when the surface is roughened by oxygen plasma or the like.
第４図は、第１図に示したサーマルヘッドの第１の保
護層を形成する時の断面図であり、（11）は第１の保護
層を形成しない部分を覆うマスクである。このマスク
（11）は、ステンレス等の金属からなる。発熱体（３）
が基板（１）の端部近傍に設けられたいわゆるエッジタ
イプのサーマルヘッドでは、サーマルヘッド基板を屋根
瓦式に積み上げ、サーマルヘッド自身をマスクとするこ
ともある。第４図のようにマスク（11）をセットする
と、このマスクは第２の保護層（８）、（９）によって
電極（４）に直接接触することがなく、この電極をキズ
付ける心配がない。たとえ第２の保護層（８）にマスク
（11）でキズが入ってしまっても機能上、信頼性上なん
ら問題は生じない。特に前記低融点ガラスを第２の保護
層としてスクリーン印刷で塗布形成した場合には、この
第２の保護層の厚さは、５〜20ミクロンはありとくに外
乱に強い保護層となる。また、第２の保護層を厚くした
場合、第１の保護層のマスク（11）下部への回り込みも
少なかった。FIG. 4 is a cross-sectional view of the thermal head shown in FIG. 1 when a first protective layer is formed, and (11) is a mask that covers a portion where the first protective layer is not formed. This mask (11) is made of metal such as stainless steel. Heating element (3)
However, in the case of a so-called edge type thermal head provided near the end of the substrate (1), the thermal head substrate may be stacked in a roof tile type and the thermal head itself may be used as a mask. When the mask (11) is set as shown in FIG. 4, the mask does not directly contact the electrode (4) by the second protective layers (8) and (9), and there is no fear of scratching the electrode. . Even if the second protective layer (8) is scratched by the mask (11), there is no problem in function and reliability. In particular, when the low-melting-point glass is applied as a second protective layer by screen printing, the thickness of the second protective layer is 5 to 20 microns, and the protective layer is particularly resistant to disturbance. Further, when the second protective layer was made thicker, the first protective layer was less wrapped under the mask (11).
ところで、第１の保護層は、前述したようにスパッタ
リングやCVD等の高価な設備を必要とし、かつ長時間の
成膜時間を必要としており、設備の有効活用等のため第
１の保護層形成の手前までは大判のウェハーに複数のサ
ーマルヘッドを形成しておき、第１の保護層形成時に
は、上記ウェハーを分割して不良品を取り除いておく等
の方法をとることも行われている。このようにウェハー
を分割した場合印刷等の工程における作業性低下や加工
時間増といった問題が生じるが、本発明においては第１
の保護層形成前に第２の保護層を形成するため、スクリ
ーン印刷、熱処理といった工程をウェハー単位で処理す
ることができ、合理的である。By the way, as described above, the first protective layer requires expensive equipment such as sputtering and CVD, and requires a long film forming time, so that the first protective layer is formed for effective use of the equipment. Up to this point, a plurality of thermal heads are formed on a large-sized wafer, and when the first protective layer is formed, a method of dividing the wafer and removing defective products is also employed. When the wafer is divided in this manner, problems such as a decrease in workability and an increase in processing time in processes such as printing occur.
Since the second protective layer is formed before the formation of the protective layer, processes such as screen printing and heat treatment can be performed on a wafer basis, which is reasonable.
第２図は、別の実施例のサーマルヘッドの断面図であ
る。（13）は基板（１）上に設けられた銀等からなる厚
膜導体パターンで、共通電極の配線抵抗を下げるために
薄膜の共通電極（14）と重なって形成してある。（12）
は第２の保護層で（８）の保護層と同時に形成されてお
り、第１の保護層（７）が第２の保護層（12）を覆って
いる。このようなサーマルヘッドでは上記薄膜厚膜で構
成された共通電極（13）、（14）の表面を第２の保護
（12）が覆っているため、第２の保護層として低融点非
結晶性ガラス等の適当に厚くかつ表面が平滑な仕上げが
可能な材料を選択すると、前記共通電極の材料構成によ
る電解腐食を防止する耐湿コートになり、また厚膜特有
の表面粗さがサーマルヘッド表面に現れないため、記録
媒体と接触しても発色、キズ等の問題が生じない。また
第１の保護層が表面に形成されているため、記録紙によ
る摩耗も心配ないため上記厚膜導体を（13）を発熱体
（３）に近接して設けることができる。FIG. 2 is a sectional view of a thermal head according to another embodiment. (13) is a thick film conductor pattern made of silver or the like provided on the substrate (1), and is formed so as to overlap with the thin film common electrode (14) in order to reduce the wiring resistance of the common electrode. (12)
Is a second protective layer formed simultaneously with the protective layer of (8), and the first protective layer (7) covers the second protective layer (12). In such a thermal head, since the surface of the common electrodes (13) and (14) composed of the thin film and the thick film is covered with the second protection (12), a low-melting amorphous material is used as the second protection layer. If a material such as glass that can be finished with an appropriately thick and smooth surface can be selected, it becomes a moisture-resistant coat that prevents electrolytic corrosion due to the material composition of the common electrode. Since it does not appear, there is no problem such as coloring or scratching even when it comes into contact with the recording medium. In addition, since the first protective layer is formed on the surface, there is no fear of abrasion due to the recording paper, so that the thick film conductor (13) can be provided near the heating element (3).
第２図は、端面型サーマルヘッドにおける本発明の応
用例である。第５図は、この端面型サーマルヘッドの第
１の保護層形成時の断面図であって、第２の保護層
（８）によってサーマルヘッドを重ねて配置しても、電
極（４）がサーマルヘッド間でこすれ合ったり、また第
１の保護層が側面の電極に回り込んでしまうことが起こ
りにくくなる。FIG. 2 shows an application example of the present invention in an end face type thermal head. FIG. 5 is a cross-sectional view of the end face type thermal head when the first protective layer is formed. Even if the thermal head is overlapped by the second protective layer (8), the electrode (4) is not thermally protected. Rubbing between the heads and wrapping of the first protective layer around the side electrodes are less likely to occur.
以上述べたように、本発明によれば、耐摩耗、耐酸化
機能を備えた第１の保護層の形成における、膜の密着
性、電極のキズ等の品質、信頼性上の問題を解決し、製
造の容易性向上、第１の保護層の有効領域の拡大等によ
って、品質、信頼性の優れたサーマルヘッドを低コスト
で提供できるものである。As described above, according to the present invention, in the formation of the first protective layer having the abrasion resistance and the oxidation resistance function, it is possible to solve the problems of quality and reliability such as film adhesion and electrode flaws. By improving the manufacturing easiness and expanding the effective area of the first protective layer, a thermal head having excellent quality and reliability can be provided at low cost.
第１図、第２図、第３図は、本発明によるサーマルヘッ
ドの断面図、第４図、第５図は、本発明における第１の
保護層形成時のサーマルヘッド断面図、第６図は、本発
明のサーマルヘッドの要部拡大断面図、第７図は、従来
のサーマルヘッドの断面図、第８図は、従来のサーマル
ヘッドにおける第１の保護層形成時の断面図、第９図
は、従来のサーマルヘッドの要部拡大断面図である。 １……基板 ３……発熱体 ４、13、14……電極 ７……第１の保護層 ８、９、12……第２の保護層 11……マスキング部材 ６……第１の保護層エッジFIGS. 1, 2, and 3 are cross-sectional views of a thermal head according to the present invention, FIGS. 4 and 5 are cross-sectional views of a thermal head when a first protective layer is formed in the present invention, and FIG. Is an enlarged sectional view of a main part of the thermal head of the present invention, FIG. 7 is a sectional view of a conventional thermal head, FIG. 8 is a sectional view of a conventional thermal head when a first protective layer is formed, and FIG. FIG. 1 is an enlarged sectional view of a main part of a conventional thermal head. DESCRIPTION OF SYMBOLS 1 ... Substrate 3 ... Heating element 4, 13, 14 ... Electrode 7 ... 1st protective layer 8, 9, 12 ... 2nd protective layer 11 ... Masking member 6 ... 1st protective layer Edge
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−285362（ＪＰ，Ａ) 特開 昭57−64576（ＪＰ，Ａ) 特開 昭62−288060（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-285362 (JP, A) JP-A-57-64576 (JP, A) JP-A-62-288060 (JP, A)
Claims (3)
保護層が少なくとも発熱体を覆うように形成されたサー
マルヘッドの製造方法であって、 発熱体とこの発熱体に接続する電極とを基板上に形成す
る工程と、 前記電極が設けられた領域のうち、少なくとも前記発熱
体の周辺を除いて選ばれた部分に第２の保護層を形成す
る工程と、 少なくとも前記第２の保護層が形成されていない発熱体
の周辺と前記第２の保護層の発熱体側の端部とが露出す
るように、別の基板を屋根瓦状に重ねる工程と、 重なり合った複数の基板上に、同時に第１の保護層を形
成する工程とを有し、 前記第１の保護層の端部を前記第２の保護層上に位置さ
せることを特徴とするサーマルヘッドの製造方法。1. A method of manufacturing a thermal head, wherein a first protective layer having a wear resistance and an oxidation resistance function is formed so as to cover at least a heating element, wherein the heating element is connected to the heating element. Forming an electrode on a substrate; forming a second protective layer on a portion of the region where the electrode is provided except at least around the heating element; Stacking another substrate in a roof tile shape such that the periphery of the heating element on which the protective layer is not formed and the end of the second protective layer on the heating element side are exposed; And forming a first protective layer at the same time, wherein an end of the first protective layer is located on the second protective layer.
保護層が少なくとも発熱体を覆うように形成されたサー
マルヘッドの製造方法であって、 発熱体とこの発熱体に接続する電極とを基板上に形成す
る工程と、 前記電極が設けられた領域のうち少なくとも前記発熱体
の周辺を除いて選ばれた部分に、第１の保護層と十分に
密着するために、第１の保護層と異なる材料により粗い
表面を有する第２の保護層を形成する工程と、 前記第２の保護層が形成されていない部分のうち少なく
とも前記発熱体の周辺部に第１の保護層を形成する工程
とを有し、 前記第１の保護層の端部を前記第２の保護層上に位置さ
せることを特徴とするサーマルヘッドの製造方法。2. A method for manufacturing a thermal head, wherein a first protective layer having a function of abrasion resistance and oxidation resistance is formed so as to cover at least a heating element, wherein the heating element is connected to the heating element. Forming an electrode on the substrate; and forming a first protective layer on a portion of the region where the electrode is provided except for at least a periphery of the heating element. Forming a second protective layer having a rough surface with a material different from that of the first protective layer, and forming a first protective layer on at least a peripheral portion of the heating element in a portion where the second protective layer is not formed. Forming a first protective layer on the second protective layer, the method comprising the steps of: forming an end of the first protective layer on the second protective layer.
イミドを塗布する工程と、前記ポリイミドの少なくとも
第１の保護層と重なる部分の表面を粗面加工する工程と
を含んだことを特徴とする請求項２記載のサーマルヘッ
ドの製造方法。3. The method according to claim 1, wherein the step of forming the second protective layer includes a step of applying a polyimide and a step of roughening a surface of at least a portion of the polyimide that overlaps the first protective layer. 3. The method for manufacturing a thermal head according to claim 2, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1331808A JP2603877B2 (en) | 1989-12-20 | 1989-12-20 | Manufacturing method of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1331808A JP2603877B2 (en) | 1989-12-20 | 1989-12-20 | Manufacturing method of thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03190762A JPH03190762A (en) | 1991-08-20 |
| JP2603877B2 true JP2603877B2 (en) | 1997-04-23 |
Family
ID=18247877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1331808A Expired - Lifetime JP2603877B2 (en) | 1989-12-20 | 1989-12-20 | Manufacturing method of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2603877B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5495883B2 (en) * | 2010-03-25 | 2014-05-21 | 京セラ株式会社 | Method for manufacturing mounting structure and method for manufacturing thermal head |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01285362A (en) * | 1988-05-12 | 1989-11-16 | Fujitsu Ltd | Production of thermal head |
-
1989
- 1989-12-20 JP JP1331808A patent/JP2603877B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03190762A (en) | 1991-08-20 |
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