JP2605752B2 - Input device - Google Patents
Input deviceInfo
- Publication number
- JP2605752B2 JP2605752B2 JP26611587A JP26611587A JP2605752B2 JP 2605752 B2 JP2605752 B2 JP 2605752B2 JP 26611587 A JP26611587 A JP 26611587A JP 26611587 A JP26611587 A JP 26611587A JP 2605752 B2 JP2605752 B2 JP 2605752B2
- Authority
- JP
- Japan
- Prior art keywords
- input device
- substrates
- substrate
- spacer
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 125000006850 spacer group Chemical group 0.000 claims description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Landscapes
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
- Input From Keyboards Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電圧又は電流検出型入力装置の構造に関す
るものである。Description: TECHNICAL FIELD The present invention relates to a structure of a voltage or current detection type input device.
従来の入力装置では、対向する基板間のギャップは、
第６図に示した様な、直径50〜500μｍ、高さ30〜100μ
ｍ程度の円錐、又は円錐台形をしたドットスペーサ６に
より維持されていた。In conventional input devices, the gap between opposing substrates is
As shown in Fig. 6, 50-500μm in diameter and 30-100μ in height
It was maintained by a dot spacer 6 having a conical or frusto-conical shape of about m.
（１） かかる入力装置では、入力モードは第７図に示
した様に、フレキシブルな上基板の面弾性に依る為、入
力キーの大きさがドットスペーサのピッチにより限定さ
れてしまい、約3mm角程度の大きさ以下のキーでは、指
などの接触面積の広い入力物体では入力に要す荷重が非
常に大きくなり、キーの大きさを自由に選択するのは不
可能であった。(1) In such an input device, since the input mode depends on the surface elasticity of the flexible upper substrate as shown in FIG. 7, the size of the input keys is limited by the pitch of the dot spacer, and the input mode is about 3 mm square. With a key having a size smaller than a certain size, an input object having a large contact area such as a finger requires an extremely large load for input, and it is impossible to freely select a key size.
（２） ドッドスペーサの形成に、メタルマスク、又は
シルクスクリーン印刷を用いる為、工数が大きく且つ、
歩留りが低くなっていた。(2) Since a metal mask or silk screen printing is used to form the dod spacer, the man-hour is large and
Yield was low.
（３） 従来の入力装置が透明、又は半透明である場
合、機能上又は装飾上の必要から何らかの印刷を施すの
に、ドットスペーサとは別に印刷工程を必要としてい
た。(3) In the case where the conventional input device is transparent or translucent, a printing process is required separately from the dot spacer to perform any printing for functional or decorative needs.
そこで、本発明はこのような問題点を解決するもの
で、その目的とすることろはキーの大きさを自由に設定
でき且つ歩留りが高く容易に製造可能な入力装置を提供
することにある。SUMMARY OF THE INVENTION The present invention has been made in order to solve such a problem, and an object of the present invention is to provide an input device in which the size of a key can be freely set and which has a high yield and can be easily manufactured.
本発明の入力装置は、一対の基板がシールを介し間隙
をもって対向接着されてなり、該基板の内面には電極が
形成され該電極を接触させることにより位置検出を行
い、少なくとも一方の基板が可撓性を有してなる入力装
置において、前記一対の基板のどちらか一方の基板内面
の電極上には、少なくとも他方の基板の内面の電極と平
面的に重なる領域の中央部から周辺部にわたって微少な
ドットからなるスペーサがマトリクス状に配置されてな
り、前記スペーサと前記他方の基板内面に形成された電
極とが間隙を有し当接していないことを特徴とする。In the input device of the present invention, a pair of substrates are adhered to each other with a gap therebetween via a seal, electrodes are formed on the inner surface of the substrates, and position detection is performed by bringing the electrodes into contact with each other. In the input device having flexibility, a minute amount is formed on the electrode on the inner surface of one of the pair of substrates from the central portion to the peripheral portion of a region overlapping at least with the electrode on the inner surface of the other substrate. Spacers made of various dots are arranged in a matrix, and the spacers and the electrodes formed on the inner surface of the other substrate have a gap and are not in contact with each other.
また、前記一対の基板がフィルムからなることを特徴
とする。Further, the pair of substrates is formed of a film.
また、前記一対の基板の内、一方の基板がフィルムか
らなり、他方の基板がカラスからなることを特徴とす
る。Further, one of the pair of substrates is made of a film, and the other substrate is made of a crow.
また、前記スペーサの大きさが直径１〜20μｍもしく
は１〜20μｍ角、高さ１〜20μｍ、前記スペーサの間隙
が１〜2000μｍであることを特徴とする。The size of the spacer is 1 to 20 μm in diameter or 1 to 20 μm square, the height is 1 to 20 μm, and the gap between the spacers is 1 to 2000 μm.
また、前記スペーサが、シリコン系、アクリル系、エ
ポキシ系またはウレタン系の透明樹脂からなることを特
徴とする。The spacer is made of a silicon-based, acrylic-based, epoxy-based, or urethane-based transparent resin.
〔実施例１〕 第１図（ａ）と、第１図（ｃ）は本発明の一実施例の
平面図と側面図、第１図（ｂ）は、第１図（ａ）のＡ部
を拡大図示したものである。以下第１図（ａ）、第１図
（ｂ）、第１図（ｃ）に基づいて詳述する。Embodiment 1 FIGS. 1 (a) and 1 (c) are a plan view and a side view of an embodiment of the present invention, and FIG. 1 (b) is a portion A in FIG. 1 (a). Is an enlarged view of FIG. Hereinafter, it will be described in detail with reference to FIGS. 1 (a), 1 (b) and 1 (c).
透明なポリエステル、ポリカーボネート、アクリル、
ポリエーテルサルホン、ポリサルホン等のフィルムを用
いた、基板１の対向面側に、スパッター法又は、直蒸着
法でITO（イソジウム−スズ酸化物）などの金属酸化物
の薄膜、金、銀、銅、Al等の金属薄膜、又は、金属線な
どにより上電極２を形成する。シール３には、シリコン
系、ポリエステル系、ウレタン系等の接着剤又は粘着剤
を用いる。下基板４には、ソーダガラス又は、ホウ珪酸
ガラスを用い、スパッター法、蒸着法、CVD法等で形成
したITO、SnO2薄膜などを対向面上に、下電極５として
形成する。上基板１の下基板４との対向面上には、シー
ル３の内側全域に微小のドットスペーサ６を、オフセッ
ト印刷、スクリーン印刷、グラビア印刷などを用いて形
成する。この時ドットスペーサ６としては、シリコン
系、アクリル系、エポキシ系、ウレタン系等の透明樹脂
を用いる。又、ドットスペーサの大きさは、直径１〜20
μｍもしくは１〜20μｍ角、高さ１〜20μｍでありその
間隙は、１〜2000μｍ程度である。Transparent polyester, polycarbonate, acrylic,
A thin film of a metal oxide such as ITO (isodium-tin oxide), gold, silver, or copper is formed on the opposite surface side of the substrate 1 using a film such as polyethersulfone or polysulfone by a sputtering method or a direct evaporation method. The upper electrode 2 is formed of a thin metal film such as Al, Al, or a metal wire. For the seal 3, an adhesive or pressure-sensitive adhesive such as a silicone-based, polyester-based, or urethane-based material is used. As the lower substrate 4, soda glass or borosilicate glass is used, and an ITO, SnO 2 thin film or the like formed by a sputtering method, an evaporation method, a CVD method, or the like is formed as a lower electrode 5 on the facing surface. On the surface of the upper substrate 1 facing the lower substrate 4, minute dot spacers 6 are formed over the entire area inside the seal 3 by using offset printing, screen printing, gravure printing, or the like. At this time, a transparent resin such as a silicon-based, acrylic-based, epoxy-based, or urethane-based resin is used as the dot spacer 6. The size of the dot spacer is 1 to 20 in diameter.
μm or 1 to 20 μm square, 1 to 20 μm in height, and the gap is about 1 to 2000 μm.
以上の方法で構成した本実施例は、第５図に示した様
に、入力物体７として指を使用した場合でもドットスペ
ーサが微小な為、上基板１が厚さ方向に局部的な弾性変
形を発生させて、上下の電極２、５が接触し位置検出す
ることができる。従ってドットスペーサ以上の大きさの
キーは、大きさに関係なく入力することができ、従来２
−3mmピッチでしか入力できなかったキーを、はるかに
小さいピッチで形成することができ、キーの大きさを自
由に選択することが可能となった。In the present embodiment configured as described above, as shown in FIG. 5, even when a finger is used as the input object 7, since the dot spacer is minute, the upper substrate 1 is locally elastically deformed in the thickness direction. Is generated, and the upper and lower electrodes 2 and 5 come into contact with each other to detect the position. Therefore, a key larger than the dot spacer can be input regardless of the size.
Keys that could only be entered at a pitch of −3 mm can be formed at a much smaller pitch, and the size of the keys can be freely selected.
又、ドットスペーサが小さく、その形成方法にオフセ
ット印刷等、従来のメタル、シルクスクリーン印刷より
印刷スピードの速い方法を用いることができる為、歩留
が向上し且つ生産性がアップした。Further, since the dot spacer is small and a method of forming the dot spacer, which has a higher printing speed than conventional metal or silk screen printing such as offset printing, can be used, the yield is improved and the productivity is improved.
〔実施例２〕 第２図（ａ）、第２図（ｂ）、第２図（ｃ）は本実施
例２の平面図、側面図及び、第２図（ａ）のＢ部を拡大
図示したものである。Embodiment 2 FIGS. 2 (a), 2 (b), and 2 (c) are a plan view, a side view, and an enlarged view of a portion B of FIG. 2 (a). It was done.
本実施例は、実施例１のドットスペーサ６を着色又は
不透明の樹脂を使用したもので、このことにより従来ド
ットスペーサの形成とは別工程であった着色印刷が、同
時に行なうことができる様になり、大巾なコストダウン
が可能となった。This embodiment uses a colored or opaque resin for the dot spacer 6 of the first embodiment, so that colored printing, which is a separate step from the conventional formation of dot spacers, can be performed simultaneously. As a result, large cost reductions became possible.
〔実施例３〕 第３図は、本実施例の入力装置を、示す図であり、実
施例２のドットスペーサ６を下基板４側に形成したもの
である。この場合も、実施例２と同様の効果を有してい
る。Third Embodiment FIG. 3 is a view showing the input device of the present embodiment, in which the dot spacer 6 of the second embodiment is formed on the lower substrate 4 side. In this case, the same effect as in the second embodiment is obtained.
〔実施例４〕 第４図は、本実施例の入力装置を、示す図であり、実
施例３の下基板４に、ポリエステル、アクリル、ポリカ
ーボネート等のフィルムを用いたものである。この場合
も実施例２と同様の効果を有することが認められた。Fourth Embodiment FIG. 4 is a view showing an input device of the present embodiment, in which a film of polyester, acrylic, polycarbonate or the like is used for the lower substrate 4 of the third embodiment. Also in this case, it was recognized that the same effect as in Example 2 was obtained.
以上述べたように本発明によれば、一対の基板のどち
らか一方の基板内面の電極上には少なくとも他方の基板
の内面の電極の平面的に重なる領域の中央部から周辺部
にわたって微少なドットスペーサがマトリクス状に配置
されてなり、スペーサと他方の基板内面に形成された電
極とが間隙を有し当接していないことにより、電極が平
面的に重なる領域に形成されるキーの面積の大小に関わ
らず、キーのいかなる部分に入力を意図しない軽い押圧
力が加えられても、電極どうしが接触し誤った入力を検
出するということを防止でき、極めて信頼性の高い入力
装置を提供できるものである。As described above, according to the present invention, fine dots are formed on the electrode on the inner surface of one of the pair of substrates from the central portion to the peripheral portion of at least the region where the electrodes on the inner surface of the other substrate overlap. Since the spacers are arranged in a matrix and the spacers and the electrodes formed on the inner surface of the other substrate have a gap and are not in contact with each other, the size of the area of the key formed in a region where the electrodes overlap in a plane is small or large. Irrespective of the light pressing force that is not intended for input to any part of the key, it is possible to prevent the electrodes from touching each other and to detect erroneous input, and to provide an extremely reliable input device. It is.
更に、スペーサ周辺の入力死点もごく微少なものとな
るため、狭い接触面積であっても、確実に両基板の電極
を導通させることができ、操作における信頼性を高めた
入力装置を提供できるものである。Furthermore, since the input dead center around the spacer is very small, the electrodes of both substrates can be reliably conducted even with a small contact area, and an input device with improved reliability in operation can be provided. Things.
更には、スペーサにより制約を受けることがなく、キ
ーの大きさの自由度を向上させることができるものであ
る。Furthermore, the degree of freedom of the size of the key can be improved without being restricted by the spacer.
また、スペーサの密度の変更により、入力と認識され
る荷重をどの程度にするかという制御も容易とすること
ができ、設計の自由度を極めて高めることができるもの
である。Further, by changing the density of the spacers, it is possible to easily control how much the load recognized as an input is made, and the degree of freedom in design can be greatly increased.
更に、スペーサの形成も迅速且つ高品質に行うことが
でき、歩留まりの向上や工数の削減を可能とし、安価で
品質の高い入力装置を提供できるものである。Further, it is possible to form a spacer quickly and with high quality, to improve the yield and reduce the number of steps, and to provide an inexpensive and high-quality input device.
そして、スペーサが他方の基板と当接せず間隙を有し
ているので、ニュートンリングの発生を抑え、視認性と
外観品質を向上させた入力装置を提供できるものであ
る。Further, since the spacer has a gap without being in contact with the other substrate, it is possible to provide an input device in which the generation of Newton rings is suppressed and the visibility and appearance quality are improved.
第１図（ａ）は本発明の入力装置の一実施例を示す平面
図。 第１図（ｂ）は第１図（ａ）のＡ部の拡大図。 第１図（ｃ）は本発明の入力装置の一実施例を示す側面
図。 第２図（ａ）は本発明の入力装置の一実施例を示す平面
図。 第２図（ｂ）は第２図（ａ）のＢ部の拡大図。 第２図（ｃ）は本発明の入力装置の一実施例を示す側面
図。 第３図は本発明の入力装置の一実施例を示す側面図。 第４図は本発明の入力装置の一実施例を示す側面図。 第５図は、本発明の入力装置の入力状態を示す図。 第６図（ａ）は従来の入力装置の平面図。 第６図（ｂ）は従来の入力装置の側面図。 第７図は従来の入力装置の入力状態を示す図。 １……上基板 ２……上電極 ３……シール ４……下基板 ５……下電極 ６……ドットスペーサ ７……入力物体FIG. 1A is a plan view showing an embodiment of the input device of the present invention. FIG. 1B is an enlarged view of a portion A in FIG. 1A. FIG. 1 (c) is a side view showing one embodiment of the input device of the present invention. FIG. 2A is a plan view showing an embodiment of the input device of the present invention. FIG. 2 (b) is an enlarged view of a portion B in FIG. 2 (a). FIG. 2 (c) is a side view showing one embodiment of the input device of the present invention. FIG. 3 is a side view showing one embodiment of the input device of the present invention. FIG. 4 is a side view showing an embodiment of the input device of the present invention. FIG. 5 is a diagram showing an input state of the input device of the present invention. FIG. 6A is a plan view of a conventional input device. FIG. 6 (b) is a side view of a conventional input device. FIG. 7 is a diagram showing an input state of a conventional input device. 1 Upper substrate 2 Upper electrode 3 Seal 4 Lower substrate 5 Lower electrode 6 Dot spacer 7 Input object
Claims (5)
向接着されてなり、該基板の内面には電極が形成され該
電極を接触させることにより位置検出を行い、少なくと
も一方の基板が可撓性を有してなる入力装置において、 前記一対の基板のどちらか一方の基板内面の電極上に
は、少なくとも他方の基板の内面の電極と平面的に重な
る領域の中央部から周辺部にわたって微少なドットから
なるスペーサがマトリクス状に配置されてなり、前記ス
ペーサと前記他方の基板内面に形成された電極とが間隙
を有し当接していないことを特徴とする入力装置。A pair of substrates are adhered to each other with a gap therebetween via a seal, electrodes are formed on the inner surface of the substrates, and position detection is performed by bringing the electrodes into contact with each other, and at least one of the substrates is flexible. In the input device having a small dot on the electrode on the inner surface of either one of the pair of substrates, from the center to the peripheral portion of the area that at least overlaps the electrode on the inner surface of the other substrate An input device, wherein spacers made of are arranged in a matrix, and the spacers and the electrodes formed on the inner surface of the other substrate have a gap and are not in contact with each other.
特徴とする特許請求の範囲第１項記載の入力装置。2. The input device according to claim 1, wherein said pair of substrates are made of a film.
ムからなり、他方の基板がカラスからなることを特徴と
する特許請求の範囲第１項記載の入力装置。3. The input device according to claim 1, wherein one of the pair of substrates is formed of a film, and the other substrate is formed of a crow.
しくは１〜20μｍ角、高さ１〜20μｍ、前記スペーサの
間隔が１〜2000μｍであることを特徴とする特許請求の
範囲第１項記載の入力装置。4. The method according to claim 1, wherein said spacer has a diameter of 1 to 20 μm or 1 to 20 μm square, a height of 1 to 20 μm, and an interval between said spacers of 1 to 2000 μm. Input device.
系、エポキシ系またはウレタン系の透明樹脂からなるこ
とを特徴とする特許請求の範囲第１項記載の入力装置。5. The input device according to claim 1, wherein said spacer is made of a silicon-based, acrylic-based, epoxy-based, or urethane-based transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26611587A JP2605752B2 (en) | 1987-10-21 | 1987-10-21 | Input device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26611587A JP2605752B2 (en) | 1987-10-21 | 1987-10-21 | Input device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8224228A Division JPH09251824A (en) | 1996-08-26 | 1996-08-26 | Input device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01107428A JPH01107428A (en) | 1989-04-25 |
| JP2605752B2 true JP2605752B2 (en) | 1997-04-30 |
Family
ID=17426533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26611587A Expired - Lifetime JP2605752B2 (en) | 1987-10-21 | 1987-10-21 | Input device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2605752B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6087128U (en) * | 1983-11-15 | 1985-06-15 | アルプス電気株式会社 | Thin input device |
| JPS6113424U (en) * | 1984-06-29 | 1986-01-25 | アルプス電気株式会社 | thin film switch |
| JPS6273738U (en) * | 1985-10-26 | 1987-05-12 |
-
1987
- 1987-10-21 JP JP26611587A patent/JP2605752B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01107428A (en) | 1989-04-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
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