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JP2609698B2 - Prediction method of directivity and film thickness distribution of evaporation material - Google Patents
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JP2609698B2 - Prediction method of directivity and film thickness distribution of evaporation material - Google Patents

Prediction method of directivity and film thickness distribution of evaporation material

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Publication number
JP2609698B2
JP2609698B2 JP63244048A JP24404888A JP2609698B2 JP 2609698 B2 JP2609698 B2 JP 2609698B2 JP 63244048 A JP63244048 A JP 63244048A JP 24404888 A JP24404888 A JP 24404888A JP 2609698 B2 JP2609698 B2 JP 2609698B2
Authority
JP
Japan
Prior art keywords
directivity
film thickness
thickness distribution
evaporation
crucible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63244048A
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Japanese (ja)
Other versions
JPH0293067A (en
Inventor
彰夫 藤原
邦夫 松本
昭一 岩永
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Hitachi Ltd
Original Assignee
Hitachi Ltd
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Publication of JPH0293067A publication Critical patent/JPH0293067A/en
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Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、真空蒸着法で得られる蒸発物質の指向性及
び膜厚分布の予測する方法に関する。
TECHNICAL FIELD The present invention relates to a method of predicting the directivity and film thickness distribution of an evaporated substance obtained by a vacuum vapor deposition method.

[従来の技術] 真空蒸着法で得られる蒸発物質の指向性を予測する従
来の方法としては、例えばバキューム、36、346(198
6)(Vacuum,36,346(1986))において論じられたよう
に、モンテカルロ法を用いる方法がある。
[Prior Art] As a conventional method for predicting the directivity of a vaporized substance obtained by a vacuum deposition method, for example, Vacuum, 36 , 346 (198
6) (Vacuum, 36 , 346 (1986)), there is a method using the Monte Carlo method.

一方真空蒸着法で得られる蒸発物質の膜厚分布を予測
する従来の方法としては、例えばジャーナル オブ バ
キューム サイエンス アンド テクノロジー、B3、53
1(1985)(J.Vac.Sci.Technol.,B3,531(1985))にお
いて論じられているように、るつぼをメッシュ分解し、
実空間で1000次元以上の行列方程式を立て、これを解く
ことによって膜厚分布を計算する方法がある。
On the other hand, as a conventional method for predicting the film thickness distribution of the vaporized substance obtained by the vacuum evaporation method, for example, Journal of Vacuum Science and Technology, B3 , 53.
1 (1985) (J. Vac. Sci. Technol., B3, 531 (1985)), the crucible is meshed,
There is a method of calculating the film thickness distribution by establishing a matrix equation of 1000 dimensions or more in the real space and solving it.

[発明が解決しようとする課題] 上記いずれの方法でも、ただ一回の計算でさえも多大
な計算時間を要し、真空蒸着装置の設計に必要な大量の
計算データを得ることは実際上極めて困難であった。
[Problems to be Solved by the Invention] In any of the above methods, even a single calculation requires a large amount of calculation time, and it is extremely extremely difficult to obtain a large amount of calculation data required for designing a vacuum evaporation apparatus. It was difficult.

本発明の目的は、真空蒸着法で得られる蒸発物質の指
向性及び膜厚分布を計算するのに要する計算時間を大幅
に短縮し、真空蒸着装置の設計に必要な大量の計算デー
タを得るための実際的な計算方法を提供することにあ
る。
An object of the present invention is to greatly reduce the calculation time required for calculating the directivity and the film thickness distribution of an evaporating substance obtained by a vacuum evaporation method, and to obtain a large amount of calculation data necessary for designing a vacuum evaporation apparatus. It is to provide a practical calculation method of.

[課題を解決するための手段] 上記課題は、真空蒸着法で得られる蒸着物質の指向性
の予測をする方法において、 蒸着源内の蒸着物質が蒸着源外へ飛び出す過程を f(z,φ)=ψ(z,φ)+∬k(z,φ;z′,φ′)f
(z′,φ′)r0dz′dφ′ の2変数の積分方程式で記述し、 該積分方程式を変数変換して と表し、 該変数変換された積分方程式に直交関数系の を代入することで を導き、 その行列方程式を解くことにより達成される。
[Means for Solving the Problems] The above-mentioned problem is solved by a method for predicting the directivity of a deposition material obtained by a vacuum deposition method, wherein a process in which a deposition material in a deposition source jumps out of a deposition source is f (z, φ). = Ψ (z, φ) + ∬k (z, φ; z ', φ') f
(Z ′, φ ′) r 0 dz′dφ ′ Described as a two-variable integral equation, and the integral equation is transformed into a variable. The integral equation of the variable is expressed by By substituting And solving the matrix equation.

[作用] 第3図のように、蒸着源内の壁面を円筒座標で指定す
る。蒸着源内の蒸着物質が蒸着源外へ飛びだす過程をマ
ルコフ過程として捕らえることにより、次の型の2変数
の積分方程式が得られる。
[Operation] As shown in FIG. 3, the wall surface in the evaporation source is designated by cylindrical coordinates. By catching the process in which the deposition material in the deposition source jumps out of the deposition source as a Markov process, the following type of two-variable integral equation can be obtained.

f(z,φ)=ψ(z,φ)+∬k(z,φ;z′,φ′)f
(z′,φ′)r0dz′dφ′ これは、ツァイトシュリフト フュア フィズィー
ク、66、471(1930)(Z.Phys.,66,471(1930))にお
いて論じられたClasingの1変数積分方程式の拡張にな
っており、より一般の場合にも成立する基本方程式であ
る。引き続き適当な変数変換、 例えば、 Z=1/2{(T+r0tanδcosφ)x+T−r0tanδcos
φ} により、上記積分方程式をつぎの正規化した型に直す。
f (z, φ) = φ (z, φ) + ∬k (z, φ; z ′, φ ′) f
(Z ', φ') r 0 dz'dφ ' This Zeit shoe lift fur Fizuiku, 66, 471 (1930) ( Z.Phys., 66, 471 (1930)) 1 variable integral Clasing discussed in This is an extension of the equation, and is a basic equation that holds in more general cases. Subsequent suitable variable transformation, for example, Z = 1/2 {(T + r 0 tanδcosφ) x + T−r 0 tanδcos
φ} reconverts the above integral equation into the following normalized form.

引き続き適当な直交関数系、たとえばチェビシェフ多
項式および三角関数を用いて解を展開する。
Subsequently, the solution is developed using a suitable orthogonal function system, for example, Chebyshev polynomials and trigonometric functions.

これを上記積分方程式に代入し、直交性を用いれば、
次の行列方程式が得られる。
By substituting this into the above integral equation and using orthogonality,
The following matrix equation is obtained.

一般にM、Nはそれぞれ15〜25、5〜7程度で良く、
従って上記行列方程式は通常200次元以下となる。この
方程式を解くのに要する計算時間は数秒である。一方、
モンテカルロ法や実空間のメッシュ分解による行列方程
式法では、一回の計算時間は数時間にも及ぶ。このよう
に、本方法を用いれば、真空蒸着法で得られる蒸発物質
の指向性及び膜厚分布を計算するのに要する計算時間を
大幅に短縮することができ、真空蒸着装置の設計に必要
な大量の計算データを容易に得ることができる。
Generally, M and N may be about 15 to 25 and about 5 to 7, respectively.
Therefore, the above matrix equation is usually less than 200 dimensions. The computation time required to solve this equation is a few seconds. on the other hand,
In the Monte Carlo method and the matrix equation method based on the mesh decomposition of the real space, a single calculation takes several hours. Thus, using this method, it is possible to significantly reduce the calculation time required to calculate the directivity and film thickness distribution of the vaporized substance obtained by the vacuum evaporation method, and it is necessary to design the vacuum evaporation apparatus. A large amount of calculation data can be easily obtained.

[実施例] 本発明の一実施例として、蒸発源から飛び出す蒸発物
質の角度分布の計算方法について図を用いて説明する。
第1図に本発明を実施するためのシステム構成の一例を
示す。1は各種情報処理を行うホスト計算機、2はキー
ボードとグラフィックディスプレイ装置を備え、適当な
回線を介して対話形式でホスト計算機1と交信するTSS
端末、3はTSS端末2を用いて作成した情報を記憶して
おく記憶装置、4は出力用のラインプリンタである。第
2図は本発明で対象とする蒸着装置の概略図である。真
空チャンバー5がこれに接続した真空ポンプ(図示せ
ず)により10-3Pa以下に排気された後、るつぼ型蒸発源
6内の蒸発物質7が適当な方法で加熱され溶融、蒸発
し、蒸発物質蒸気8となり、基板9上に蒸着される。蒸
発物質蒸気8の角度分布を計算するため、るつぼ型蒸発
源6上に第3図に示す座標系を導入する。るつぼ物理的
状況は、10:るつぼ直径2r0、11:液面の深さT、12:るつ
ぼの傾きδで指定できる。第5図は本発明においてホス
ト計算機1が行う処理の概略をフローチャートで表した
ものである。このうち、処理17はオペレータによる第3
図に示したパラメータr0、T、δのTSS端末からの入
力、処理18,19,20はホスト計算機による処理、処理22は
グラフィックディスプレイ装置による表示やラインプリ
ンタへの出力、あるいは記憶装置への書き込みである。
オペレータは第3図に示したパラメータr0、T、δのTS
S端末2のキーボードから入力すると、ホスト計算機1
は行列要素Ψijを生成し、それらの記憶装置4に記憶させた後、前述の
行列方程式を解く。引続きステップ20で蒸発物質の指向
性を計算するが、その計算方法は以下の通りである。ま
ず、るつぼ型蒸発源6内の蒸発物質7から直接蒸発源の
外に飛び出す蒸発物質の寄与D1を周知の幾何学的方法に
より求める。次に、るつぼ型蒸発源6内の蒸発物質7か
ら直接蒸発源の外に飛び出さずに一旦蒸発源の壁面で1
回以上反射してから飛び出す蒸発物質の寄与D2を D2=∬P(θ,φ,z′,φ′)f(z′,φ′)dz′d
φ′ なる関係式から求める。ここにP(θ,φ,z′,φ′)
は周知の幾何学的方法により求まる係数であり、f(z,
φ)は本発明で得られた分布関数である。以上により求
める角度分布はD=D1+D2となる。第6図は本発明によ
り得られた指向性の出力例である。計算に用いたパラメ
ータはT=1、2r0=1、δ=45゜であり。計算機とし
てHITAC M280を用いた。計算時間は行列要素の計算やグ
ラフィック等も含め、約6分であった。比較のため、同
じ物理的状況を同じ計算機を用いて前述の実空間のメッ
シュ分解法で解くのに要する計算時間は、るつぼ型蒸発
源の壁面をz、φ方向共に100分割と粗く分割した場合
でも、約186時間と見積もられ、本発明の優位性は明ら
かである。
[Embodiment] As one embodiment of the present invention, a method of calculating the angular distribution of the vaporized substance ejected from the evaporation source will be described with reference to the drawings.
FIG. 1 shows an example of a system configuration for implementing the present invention. 1 is a host computer which performs various information processing, 2 is a TSS which has a keyboard and a graphic display device and communicates with the host computer 1 interactively via an appropriate line.
Terminals 3, 3 are storage devices for storing information created using the TSS terminal 2, and 4 is a line printer for output. FIG. 2 is a schematic view of a vapor deposition apparatus targeted in the present invention. After the vacuum chamber 5 is evacuated to 10 −3 Pa or less by a vacuum pump (not shown) connected to the vacuum chamber 5, the evaporation material 7 in the crucible evaporation source 6 is heated by an appropriate method to melt, evaporate, and evaporate. It becomes the substance vapor 8 and is deposited on the substrate 9. In order to calculate the angular distribution of the vaporized substance vapor 8, the coordinate system shown in FIG. 3 is introduced on the crucible type vaporization source 6. The physical condition of the crucible can be designated by 10: crucible diameter 2r 0 , 11: liquid surface depth T, 12: crucible inclination δ. FIG. 5 is a flowchart schematically showing the processing performed by the host computer 1 in the present invention. Of these, the process 17 is the third by the operator.
The parameters r 0 , T, and δ shown in the figure are input from the TSS terminal, the processes 18, 19, and 20 are processes by the host computer, and the process 22 is a display by a graphic display device or an output to a line printer or a storage device Writing.
The operator sets the TS of the parameters r 0 , T, and δ shown in FIG.
When input from the keyboard of the S terminal 2, the host computer 1
Is the matrix element Ψ ij , Are generated and stored in the storage device 4, and then the above-described matrix equation is solved. Subsequently, the directivity of the vaporized substance is calculated in step 20, and the calculation method is as follows. First, the contribution D 1 of the evaporated substance jumping out of direct evaporation source from the evaporation material 7 in the crucible-type evaporation source 6 by a well-known geometric methods. Next, without jumping directly out of the evaporation source from the evaporation substance 7 in the crucible-type evaporation source 6, one time on the wall surface of the evaporation source
The contribution D 2 of the evaporating substance that is emitted after being reflected more than once is given by D 2 = {P (θ, φ, z ′, φ ′) f (z ′, φ ′) dz′d
Obtained from the relational expression φ '. Where P (θ, φ, z ′, φ ′)
Is a coefficient obtained by a well-known geometric method, and f (z,
φ) is the distribution function obtained in the present invention. From the above, the angle distribution obtained is D = D 1 + D 2 . FIG. 6 is an example of directivity output obtained by the present invention. The parameters used for the calculation are T = 1, 2r 0 = 1, and δ = 45 °. HITAC M280 was used as a computer. The calculation time was about 6 minutes, including calculation of matrix elements and graphics. For comparison, the calculation time required to solve the same physical situation using the same computer by the mesh decomposition method of the real space described above is when the wall surface of the crucible type evaporation source is roughly divided into 100 in both z and φ directions. However, it is estimated to be about 186 hours, and the superiority of the present invention is clear.

本発明の他の実施例として、蒸発源から飛び出す蒸発
物質が基板9上に蒸着した場合の膜厚分布の計算方法に
ついて図を用いて説明する。第1図に本発明を実施する
ためのシステム構成の一例を示す。1は各種情報処理を
行うホスト計算機、2はキーボードとグラフィックディ
スプレイ装置を備え、適当な回線を介して対話形式でホ
スト計算機1と交信するTSS端末、3はTSS端末2を用い
て作成した情報を記憶しておく記憶装置、4は出力用の
ラインプリンタである。第2図は本発明で対象とする蒸
着装置の概略図である。真空チャンバー5がこれに接続
した真空ポンプ(図示せず)により10-3Pa以下に排気さ
れた後、るつぼ型蒸発源6内の蒸発物質7が適当な方法
で加熱され溶融、蒸発し、蒸発物質蒸気8となり、基板
9上に蒸着される。蒸発物質蒸気8が基板9に蒸着した
場合の膜厚分布を計算するため、るつぼ型蒸発源6上に
第3図に示す座標系を、また第4図に示したパラメータ
を導入する。るつぼの物理的状況は、10:るつぼ直径2
r0、11:液面の深さT、12:るつぼの傾きδで指定でき
る。またるつぼ型蒸発源6と基板9との位置関係は、1
3:基板中心Oの座標、14:基板の法線ベクトルn、15:液
面中心Cの座標、16:るつぼ型蒸発源の中心軸のベクト
ルlで指定できる。第5図は本発明においてホスト計算
機1が行う処理の概略をフローチャートで表したもので
ある。このうち、処理17はオペレータによる第3,4図に
示したパラメータr0、T、δ、O、n、C、lのTSS端
末からの入力、処理18,19,21はホスト計算機による処
理、処理22はグラフィックディスプレイ装置による表示
やラインプリンタへの出力、あるいは記憶装置への書き
込みである。オペレータは第3,4図に示したパラメータr
0、T、δ、O、n、C、lおよび膜厚を計算したい基
板9上の点Pの座標をTSS端末2のキーボードから入力
すると、ホスト計算機1は行列要素Ψijを生成し前述の行列方程式を解き、蒸発物質の膜厚分布
を計算するが、その計算方法は以下の通りである。ま
ず、るつぼ型蒸発源6内の蒸発物質7から直接蒸発源の
外に飛び出す蒸発物質からの寄与t1を周知の幾何学的方
法により求める。次に、るつぼ型蒸発源6内の蒸発物質
7から直接蒸発源の外に飛び出さずに一旦蒸発源の壁面
で1回以上反射してから飛び出す蒸発物質の寄与t2を t2=∬T(P;z,φ)f(z,φ)dzdφ により求める。ここにT(P;z,φ)は周知の幾何学的方
法により求まる係数であり、f(z,φ)は本発明で得ら
れた分布関数である。よって求めるPでの膜厚はt=t1
+t2となる。以上の手続きを基板上の種々の点Pについ
て行えば、膜厚分布が得られる。第7図は本発明により
得られた膜厚分布の出力例である。計算機としてHITAC
M280を用いた。計算時間は行列要素の計算やグラフィッ
ク等も含め、約10分であった。比較のため、同じ物理的
状況を同じ計算機を用いて前述の実空間のメッシュ分解
法で解くのに要する計算時間は、るつぼ型蒸発源の壁面
をz,φ方向共に100分割と粗く分割した場合でも、約186
時間と見積もられ、本発明の優位性は明らかである。
As another embodiment of the present invention, a method of calculating a film thickness distribution when an evaporating substance jumping out of an evaporation source is deposited on a substrate 9 will be described with reference to the drawings. FIG. 1 shows an example of a system configuration for implementing the present invention. 1 is a host computer that performs various information processing, 2 is a TSS terminal that has a keyboard and a graphic display device, and communicates with the host computer 1 in an interactive manner via an appropriate line, and 3 is an information created using the TSS terminal 2. The storage device 4 for storing is a line printer for output. FIG. 2 is a schematic diagram of a vapor deposition apparatus targeted by the present invention. After the vacuum chamber 5 is evacuated to 10 -3 Pa or less by a vacuum pump (not shown) connected to the vacuum chamber 5, the evaporation material 7 in the crucible evaporation source 6 is heated by an appropriate method to melt, evaporate, and evaporate. The material vapor 8 is deposited on the substrate 9. In order to calculate the film thickness distribution when the vaporized substance vapor 8 is deposited on the substrate 9, the coordinate system shown in FIG. 3 and the parameters shown in FIG. 4 are introduced on the crucible type evaporation source 6. The physical condition of the crucible is 10: crucible diameter 2
r 0 , 11: liquid surface depth T, 12: crucible inclination δ. The positional relationship between the crucible type evaporation source 6 and the substrate 9 is 1
3: the coordinates of the substrate center O, 14: the normal vector n of the substrate, 15: the coordinates of the liquid surface center C, 16: the vector 1 of the central axis of the crucible evaporation source. FIG. 5 is a flowchart showing the outline of the processing performed by the host computer 1 in the present invention. Of these, processing 17 is input by the operator from the TSS terminal of the parameters r 0 , T, δ, O, n, C and l shown in FIGS. 3 and 4, processing 18, 19 and 21 are processing by the host computer, Process 22 is display by a graphic display device, output to a line printer, or writing to a storage device. The operator uses the parameter r shown in Figs.
When 0 , T, δ, O, n, C, l and the coordinates of the point P on the substrate 9 for which the film thickness is to be calculated are input from the keyboard of the TSS terminal 2, the host computer 1 calculates the matrix elements Ψ ij , Is generated, the above-described matrix equation is solved, and the film thickness distribution of the evaporated substance is calculated. The calculation method is as follows. First, the contribution t 1 from the evaporation material that directly jumps out of the evaporation source from the evaporation material 7 in the crucible type evaporation source 6 is obtained by a known geometric method. Next, the contribution t 2 of the evaporating substance that is not reflected directly from the evaporating substance 7 in the crucible-type evaporating source 6 but at least once on the wall surface of the evaporating source without jumping out of the evaporating source and then jumps out is represented by t 2 = ∬T (P; z, φ) f (z, φ) dzdφ Here, T (P; z, φ) is a coefficient obtained by a known geometric method, and f (z, φ) is a distribution function obtained in the present invention. Therefore, the film thickness at P obtained is t = t 1
+ A t 2. By performing the above procedure for various points P on the substrate, a film thickness distribution can be obtained. FIG. 7 is an output example of the film thickness distribution obtained by the present invention. HITAC as a computer
M280 was used. The calculation time was about 10 minutes, including calculation of matrix elements and graphics. For comparison, the calculation time required to solve the same physical situation using the same computer by the mesh decomposition method of the real space described above is the case where the wall of the crucible type evaporation source is roughly divided into 100 in both z and φ directions. But about 186
Estimated time, the advantage of the present invention is clear.

[発明の効果] 本発明によれば、真空蒸着法で得られる蒸発物質の指
向性及び膜厚分布を計算するのに要する計算時間を大幅
に短縮することができる。
[Effects of the Invention] According to the present invention, the calculation time required for calculating the directivity and the film thickness distribution of the evaporated substance obtained by the vacuum evaporation method can be greatly reduced.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明を実施するためのシステム構成を示す図
である。第2図は本発明の対象とする蒸着装置の概略図
である。第3図は蒸発源の概略図である。第4図は蒸発
源と基板との位置関係を示す図である。第5図は本発明
においてホスト計算機が行う処理のフローチャートであ
る。第6図は本発明により得られた指向性の出力を示す
図である。第7図は本発明により得られた膜厚分布の出
力を示す図である。 符号の説明 1……ホスト計算機、2……TSS端末、3……記憶装
置、4……ラインプリンタ、5……真空チャンバ、6…
…蒸発源、7……蒸発物質、8……蒸発物質蒸気、9…
…基板、10……蒸発源半径、11……液面の深さ、12……
蒸発源の傾き、13……基板中心Cの座標、14……基板の
法線ベクトル、15……液面中心、16……蒸発源の中心軸
のベクトル、17……幾何情報の入力ステップ、18……行
列要素の生成ステップ、19……行列方程式を解くステッ
プ、20……角度分布の計算ステップ、21……膜厚分布の
計算ステップ、22……出力ステップ。
FIG. 1 is a diagram showing a system configuration for implementing the present invention. FIG. 2 is a schematic diagram of a vapor deposition apparatus which is the object of the present invention. FIG. 3 is a schematic diagram of an evaporation source. FIG. 4 is a diagram showing a positional relationship between the evaporation source and the substrate. FIG. 5 is a flowchart of a process performed by the host computer in the present invention. FIG. 6 is a diagram showing the directivity output obtained by the present invention. FIG. 7 is a diagram showing the output of the film thickness distribution obtained by the present invention. DESCRIPTION OF SYMBOLS 1 ... Host computer, 2 ... TSS terminal, 3 ... Storage device, 4 ... Line printer, 5 ... Vacuum chamber, 6 ...
… Evaporation source, 7 ... Evaporation material, 8 ... Evaporation material vapor, 9 ...
… Substrate, 10 …… Evaporation source radius, 11 …… Depth of liquid level, 12 ……
Inclination of evaporation source, 13: coordinates of substrate center C, 14: normal vector of substrate, 15: center of liquid surface, 16: vector of central axis of evaporation source, 17: input step of geometric information, 18 ... step of generating matrix elements, 19 ... step of solving a matrix equation, 20 ... step of calculating angular distribution, 21 ... step of calculating thickness distribution, 22 ... output step.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 Block J.H,“Diffus ion at the vacuum− solid and gas−soli d interface:Some c omments.”(1988) Diff us Interfaces:Micr osc Concepts−P.67−69 ──────────────────────────────────────────────────続 き Continuation of front page (56) References H, "Diffusion at the vacuum- solid and gas-solid interface: Some matters." (1988) Diffus Interfaces: Microsoc Concepts-P. 67−69

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】真空蒸着法で得られる蒸着物質の指向性の
予測をする方法において、 蒸着源内の蒸着物質が蒸着源外へ飛び出す過程を f(z,φ)=ψ(z,φ)+∬k(z,φ;z′,φ′)f
(z′,φ′)r0dz′dφ′ の2変数の積分方程式で記述し、 該積分方程式を変数変換して と表し、 該変数変換された積分方程式に直交関数系の を代入することで を導き、 その行列方程式を解くことにより上記積分方程式を解く
ことを特徴とする蒸発物質の指向性の予測方法。
1. A method for predicting the directivity of a deposition material obtained by a vacuum deposition method, wherein a process in which a deposition material in a deposition source jumps out of the deposition source is represented by f (z, φ) = ψ (z, φ) + ∬k (z, φ; z ', φ') f
(Z ′, φ ′) r 0 dz′dφ ′ Described as a two-variable integral equation, and the integral equation is transformed into a variable. Where the variable-converted integral equation is By substituting And estimating the directivity of the evaporated substance by solving the above integral equation by solving the matrix equation.
JP63244048A 1988-09-30 1988-09-30 Prediction method of directivity and film thickness distribution of evaporation material Expired - Lifetime JP2609698B2 (en)

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JP2609698B2 true JP2609698B2 (en) 1997-05-14

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Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Block J.H,"Diffusion at the vacuum−solid and gas−solid interface:Some comments."(1988) Diffus Interfaces:Microsc Concepts−P.67−69

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