JP2617746B2 - Automatic wiring processing method - Google Patents
Automatic wiring processing methodInfo
- Publication number
- JP2617746B2 JP2617746B2 JP62310865A JP31086587A JP2617746B2 JP 2617746 B2 JP2617746 B2 JP 2617746B2 JP 62310865 A JP62310865 A JP 62310865A JP 31086587 A JP31086587 A JP 31086587A JP 2617746 B2 JP2617746 B2 JP 2617746B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- wiring
- area
- intersection
- main line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔概要〕 CAD等のコンピュータ支援による設計におけるプリン
ト板の自動配線処理方法において、配線すべき接続系の
近傍形状を認識することにより、部分領域に最適化した
自動配線処理を行なう方法に関し、 部品の実装密度が高いプリント板であっても高い自動
配線化率を達成することができるようにすることを目的
とし、 自動配線処理方法を、配線対象の領域を所定の基準で
分割する第1の処理、注目した部分領域のランド群の重
心を求め領域の核とする第2の処理、部分領域中で電気
的に接続された同一接続系のランド群の重心を求め接続
系の核とする処理、領域の核及び接続系の核から夫々ラ
ンドへのベクトル結線を行なう処理、注目部分領域中に
おいて上記部分領域のランド群と上記同一接続系のラン
ド群との有効配線の相対的な量の評価を行なう第5の処
理、注目領域のベクトル結線で得られたベクトル矩形領
域が重複する交差領域の重複度を示す交差量の評価を行
なう第6の処理、上記交差量の評価に基づいて交差量が
最小となる領域路を候補として選択する第7の処理、配
線対象の層分割を行なう第8の処理、部分系の核から水
平垂直方向に基幹ラインを引き、基幹ラインに水平又は
垂直に結線する第9の処理、電気的に接続された領域の
核から水平垂直方向に基幹ラインを引き、基幹ラインに
水平又は垂直に結線する第10の処理、及び上記第9及び
第10の処理結果の処理を行い水平垂直方向の配線領域の
少ない処理結果と、上記第6の処理結果とで最小成分容
量の配線区間を設定する第11の処理を含むものとして構
成する。DETAILED DESCRIPTION OF THE INVENTION [Overview] In an automatic wiring processing method for a printed board in a computer-aided design such as CAD, the automatic wiring processing optimized for a partial area by recognizing a shape near a connection system to be wired. The purpose of this method is to make it possible to achieve a high automatic wiring ratio even on a printed circuit board with a high component mounting density. The first process of dividing by the above, the second process of obtaining the center of gravity of the land group of the focused partial area, and the center processing of the region, the obtaining of the center of gravity of the land group of the same connection system electrically connected in the partial area and connecting Processing as a system nucleus, processing for performing vector connection from the nucleus of the area and the nucleus of the connection system to each land, and the land group of the partial area and the land group of the same connection system in the target partial area A fifth process of evaluating the relative amount of effective wiring, a sixth process of evaluating the amount of intersection indicating the degree of overlap of the intersection region where the vector rectangular regions obtained by the vector connection of the region of interest overlap, A seventh process of selecting a region road having the smallest intersection amount as a candidate based on the evaluation of the intersection amount, an eighth process of dividing the wiring target into layers, and a process of forming a main line in the horizontal and vertical directions from the nucleus of the subsystem. A ninth process for connecting the main line horizontally or vertically to the main line, a tenth process for drawing the main line horizontally and vertically from the nucleus of the electrically connected region, and connecting the main line horizontally or vertically, and Assuming that the ninth and tenth processing results are processed and the eleventh processing of setting a wiring section having the minimum component capacitance is performed by using the processing result having a small wiring area in the horizontal and vertical directions and the sixth processing result. Configure.
本発明はCAD等のコンピュータ支援による設計におけ
るプリント板の自動配線処理方法において配線すべき接
続系の近傍形状を認識することにより、部分領域に最適
化した自動配線処理を行なう方法に関する。The present invention relates to a method for performing an automatic wiring process optimized for a partial area by recognizing a nearby shape of a connection system to be wired in a method for automatically wiring a printed board in a computer-aided design such as a CAD.
最近のプリント板の高密度化に伴なうSMT実装部品
(表面実装部品)搭載のプリント板及び層数削減による
コストダウンを図る目的等のため配線パターンの高密度
化指向が高く、これに伴ない、より領域的な観点を考慮
した自動配線手法が必要とされている。Due to the recent trend toward higher density of printed circuit boards, printed circuit boards with SMT mounted components (surface mounted components), and the aim of reducing costs by reducing the number of layers, wiring pattern densification is highly oriented. There is a need for an automatic routing method that takes into account a more regional viewpoint.
従来自動配線方法として次のようなものがある。これ
は第5図に示すような手順を踏んで自動的にプリント板
の配線経路を決定する自動配線処理をするものである。Conventional automatic wiring methods include the following. This is an automatic wiring process for automatically determining the wiring path of the printed board by following the procedure shown in FIG.
以下の説明における各ステップ番号は第5図に記載し
てあるステップ(ST)番号と対応している。Each step number in the following description corresponds to the step (ST) number described in FIG.
ステップ310 プリント板の総数と有効配線チャネルとを定義し、同
電位の接続系を最短解経路の分解によって、ネットをワ
イヤの区分に分解する。Step 310 The total number of printed boards and the effective wiring channel are defined, and the connection system having the same potential is decomposed into the wire segments by decomposing the shortest solution path.
ステップ320 結線するべき自分自身の系のx,yによるラインサーチ
処理により、配線経路を求める。Step 320 A wiring route is obtained by a line search process using x and y of the own system to be connected.
ステップ330 ワイヤの区間の接続経路を発見し、進路決定する。経
路決定を行なうとき、チャネルの使用方法の順序性によ
りチャネルの割り付けを行なう。Step 330 The connection route of the section of the wire is found and the route is determined. When a route is determined, channels are allocated according to the order of use of the channels.
ステップ340 接続の区間のチャネルの容量が自動配線処理が可能で
あるかを判断して、配線が可能であれば自動配線処理を
続行する。チャネルの容量が不十分であれば次のステッ
プへ進む。Step 340: Determine whether the capacity of the channel in the connection section is capable of automatic wiring processing, and if the wiring is possible, continue the automatic wiring processing. If the capacity of the channel is insufficient, proceed to the next step.
ステップ350 自動配線処理が不可能な個所についてマニュアルで配
線を行ない、これでプリント板の配線処理は終了する。Step 350 Manual wiring is performed at a place where automatic wiring processing is impossible, and the wiring processing of the printed board is completed.
ところで、上述した従来の自動配線処理方法にあって
は、固定されたチャネルを元に、接続系の1ネット単位
でチャネルに対して2点の最短経路長によってチャネル
をアサインし配線経路を決定しており、これらは自分自
身の系で構成されている。このため、ある領域の他の接
続系の影響及び自動配線処理のための相対的な領域の有
効利用が考慮されていないため、自動配線の処理の順序
性が領域の使用度に大きく影響を与えている。即ち、配
線処理が後になるほど、配線可能な領域が減少していき
自動配線処理ができにくくなり、自動配線化率が低いも
のとなり、特にプリント板への実装密度が高いものとな
るほど自動配線化率は低いものとなる。By the way, in the above-mentioned conventional automatic wiring processing method, based on the fixed channel, the channel is assigned by the shortest path length of two points with respect to the channel for each net of the connection system, and the wiring route is determined. And these are made up of their own systems. For this reason, since the influence of other connection systems in a certain area and the effective use of the relative area for the automatic wiring processing are not taken into consideration, the order of the automatic wiring processing greatly affects the usage of the area. ing. That is, the later the wiring process, the smaller the area that can be wired, the more difficult the automatic wiring process becomes, the lower the automatic wiring ratio becomes, and especially the higher the mounting density on the printed board becomes, the higher the automatic wiring ratio becomes. Is low.
そこで、本発明の目的は部品の実装密度が高いプリン
ト板であっても高い自動配線化率を達成することができ
る自動配線処理方法を提供することである。Accordingly, an object of the present invention is to provide an automatic wiring processing method that can achieve a high automatic wiring ratio even on a printed board having a high component mounting density.
本発明において、上記の問題点を解決するための手段
は、下記の処理により、配線すべき経路を決定すること
を特徴とする自動配線処理方法である。In the present invention, a means for solving the above problem is an automatic wiring processing method characterized in that a route to be wired is determined by the following processing.
(A)配線対象の領域を所定の基準で分割する第1の処
理。(A) First processing for dividing a wiring target area based on a predetermined reference.
(B)注目した部分領域のランド群の重心を求め領域の
核とする第2の処理、 (C)部分領域中で電気的に接続された同一接続系のラ
ンド群の重心を求め接続系の核とする第3の処理。(B) a second process in which the center of gravity of the land group of the focused partial region is determined and the center of the region is determined, and (C) the center of gravity of the land group of the same connection system electrically connected in the partial region is determined. Third process as a core.
(D)領域の核及び接続系の核から夫々ランドへのベク
トル結線を行なう第4の処理、(E)注目部分領域中に
おいて上記部分領域のランド群と上記同一接続系のラン
ド群との有効配線の相対的な量の評価を行なう第5の処
理。(D) Fourth processing for performing vector connection from the nucleus of the region and the nucleus of the connection system to each land, and (E) Effectiveness of the land group of the partial region and the land group of the same connection system in the focused partial region Fifth processing for evaluating the relative amount of wiring.
(F)注目領域のベクトル結線で得られたベクトル矩形
領域が重複する交差領域の重複度を示す交差量の評価を
行なう第6の処理。(F) Sixth processing for evaluating the amount of intersection indicating the degree of overlap of the intersection area where the vector rectangular areas obtained by the vector connection of the attention area overlap.
(G)上記交差量の評価に基づいて交差量が最小となる
領域路を候補として選択する第7の処理。(G) A seventh process of selecting, as a candidate, an area road having the minimum intersection amount based on the evaluation of the intersection amount.
(H)配線対象の層分割を行なう第8の処理。(H) Eighth process for dividing the wiring target layer.
(I)部分系の核から水平垂直方向に基幹ラインを引
き、基幹ラインに水平又は垂直に結線する第9の処理。(I) Ninth processing for drawing a main line in the horizontal and vertical directions from the core of the subsystem and connecting the main line to the main line horizontally or vertically.
(J)電気的に接続された領域の核から水平垂直方向に
基幹ラインを引き、基幹ラインに水平又は垂直に結線す
る第10の処理。(J) Tenth processing for drawing a main line in the horizontal and vertical directions from the nucleus of the electrically connected area and connecting the main line horizontally or vertically.
(K)上記第9及び第10の処理結果の処理を行い水平垂
直方向の配線領域の少ない処理結果と、上記第6の処理
結果とで最小成分容量の配線区間を設定する第11の処
理。(K) An eleventh process in which the ninth and tenth processing results are processed, and the processing result with a small horizontal and vertical wiring area and the sixth processing result are used to set the minimum component capacity wiring section.
本発明によれば、注目領域のベクトル結線で得られた
ベクトル矩形領域が重複する交差領域の重複度を示す交
差量の評価を行ない、この上記交差量の評価に基づいて
交差量が最小となる領域路を候補として選択するベクト
ル矩形での交差による配線の評価と、ランドからの水平
垂直基幹ラインに基づく配線の評価に基づき、自動配線
を行うものとしているので、自動配線処理は自らのネッ
ト系だけでなく他のネット系まで考慮しており、配線処
理の順序によらず高い自動設計可率を達成することがで
きるようになる。According to the present invention, the intersection amount indicating the degree of overlap of the intersection region where the vector rectangular region obtained by the vector connection of the attention region overlaps is evaluated, and the intersection amount is minimized based on the evaluation of the intersection amount. Automatic routing is performed based on the evaluation of wiring based on intersections at vector rectangles that select area roads as candidates and the evaluation of wiring based on horizontal and vertical trunk lines from lands. Not only the other net systems are considered, but also a high automatic design ratio can be achieved regardless of the order of the wiring processing.
以下本発明に係る自動配線処理方法の実施例を図面に
基づいて説明する。第2図乃至第4図は本発明に係る自
動配線処理方法の実施例を示すものである。本実施例は
第2図に示すフローチャートに従って作動する。An embodiment of the automatic wiring processing method according to the present invention will be described below with reference to the drawings. 2 to 4 show an embodiment of the automatic wiring processing method according to the present invention. This embodiment operates according to the flowchart shown in FIG.
本実施例では、上記問題点を解決する手段で示した
(A)〜(E)の処理の後(H)〜(J)の処理の処理
を先に行いその後(F)(G)の処理を行い最終的に
(K)の処理を行なうものとしている。In this embodiment, the processing of (H) to (J) is performed first, and then the processing of (F) and (G) is performed after the processing of (A) to (E) described in the means for solving the above problem. And finally the processing of (K) is performed.
ステップ10 プリント板の機能分割処理:形状類似処理により全体
を幾つかの部分領域に分割処理する(上記問題点を解決
するための手段の(A)に相当)。Step 10: Function division processing of the printed board: The whole is divided into several partial areas by shape similarity processing (corresponding to (A) of the means for solving the above problem).
ステップ20 前処理として部品配置と接続関係から形状的に類似度
の高い領域と形状的に類似度が低くランダムな領域とに
分け、ランダムな領域において注目すべき領域内で領域
内のランド群の核を重心法で求め、この核を部分領域の
カーネルとする(同(B)に相当)。Step 20 As pre-processing, a region having a high similarity in shape and a random region having a low similarity in shape are divided into a region having a high similarity based on the component arrangement and the connection relationship. The nucleus is obtained by the centroid method, and this nucleus is used as the kernel of the partial region (corresponding to (B)).
ステップ30 領域部分に有る電気的に接続するランド群の系の核を
重心法で求め、この核を接続系のカーネルとする(同
(C)に相当)。Step 30 The nucleus of the system of electrically connected lands in the region is determined by the centroid method, and this nucleus is used as the kernel of the connection system (corresponding to (C)).
ステップ40 領域のカーネルから電気的に接続されている系のラン
ドに向うベクトルを出力し、また接続系のカーネルから
電気的に接続されている系のランドにベクトルを出力
し、夫々のベクトル結線処理を行なう(同(D)に相
当)。Step 40 Output a vector from the kernel of the region to the land of the electrically connected system, and output a vector from the kernel of the connected system to the land of the electrically connected system, and perform the respective vector connection processing. (Equivalent to (D)).
ステップ50 部分領域の占有度を水平垂直方向成分を相対評価し、
配線可能領域をクロスポイント、ビア、水平垂直方向の
配線ルートセグメント、配線容量をパラメータとする状
態関数で認識して、これを背景有効配線可能領域とする
(同(E)に相当)。Step 50 The occupancy of the partial area is evaluated relative to the horizontal and vertical components,
The wirable area is recognized by a state function using the cross point, the via, the wiring route segment in the horizontal and vertical directions, and the wiring capacity as parameters, and this is defined as a background effective wirable area (corresponding to (E)).
ステップ60 注目領域で発生したカーネルと、電気的に接続されて
いるランド系との傾きにより例えば+方向の傾きのある
ものと、−方向の傾きのあるものとを特定の範囲で切り
分けて配線層分割処理を行なう(同(H)に相当)。Step 60 The wiring layer is separated from the kernel having a tilt in the + direction and the one having a tilt in the-direction, for example, according to the inclination between the kernel generated in the region of interest and the land system electrically connected to the wiring layer. A division process is performed (corresponding to (H)).
ステップ70 層分割処理した系でランド位置が同一方向、即ち水平
または垂直方向にあるものを優先的に接続処理をする。Step 70 Connection processing is preferentially performed on a system in which the lands are located in the same direction, that is, in the horizontal or vertical direction, in the system subjected to the layer division processing.
ステップ80 電気接続がされた接続系のカーネルから水平垂直に基
幹ラインを引き、ランドから基幹ラインに水平または垂
直に結線処理を行なう(同(J)に相当)。Step 80 A trunk line is drawn horizontally and vertically from the kernel of the connection system that has been electrically connected, and a horizontal or vertical connection process from the land to the trunk line is performed (corresponding to (J)).
ステップ90 ステップ80で処理した配線の領域占有部分の評価処理
を行なう(同(I)の前段の第9の処理結果の処理に相
当)。これは、上記結線処理された結線を第3図に示す
ように、水平、垂直方向に投影して、その重なりの程度
を評価することにより行なう。Step 90 The evaluation processing of the area occupied area of the wiring processed in step 80 is performed (corresponding to the processing of the ninth processing result in the former stage of (I)). This is performed by projecting the connections subjected to the connection processing in the horizontal and vertical directions as shown in FIG. 3 and evaluating the degree of overlap.
ステップ100 領域系のカーネルから水平垂直方向に基幹ラインを引
き基幹ラインに水平垂直に結線処理を行なう(同(I)
に相当)。Step 100: A main line is drawn in the horizontal and vertical directions from the kernel of the area system, and a connection process is performed horizontally and vertically to the main line ((I)).
Equivalent).
ステップ110 ステップ100で処理した配線の領域占有成分の評価処
理を行なう(同(K)の前段の10の処理に相当)。これ
はステップ90と同様の処理である。Step 110 The processing of evaluating the area occupancy component of the wiring processed in step 100 is performed (corresponding to the preceding step 10 in the same (K)). This is a process similar to step 90.
ステップ120 ステップ80で処理した配線の領域占有部分とステップ
100で処理した領域占有部分とを比較し配線量の小さい
ほうを自動配線処理の対象とする(同(K)の前段に相
当)。Step 120 The area occupied part of the wiring processed in step 80 and the step
The area having the smaller wiring amount is compared with the area occupied portion processed in step 100, and the smaller wiring amount is set as an object of the automatic wiring processing (corresponding to the former stage of the same (K)).
ステップ130 注目領域においてステップ120によって求めた領域に
ついてのステップ40で求めたベクトルを両隅とする各矩
形領域が重複する交差領域の重複度を示す交差量の評価
する交差評価を行なう(同(F)に相当)。In step 130, an intersection evaluation is performed to evaluate the amount of intersection indicating the degree of overlap of the intersection area where each of the rectangular areas having the two corners with the vector obtained in step 40 for the area obtained in step 120 in the area of interest. )).
ステップ140 交差量の評価に基づいて交差量が最小となる領域路を
候補として選び(同(G)に相当)、矩形領域で上記交
差評価に基づいて配線の取りうる経路をエンベロープと
して抽出して、方向変換配線経路を決定していく(同
(K)に相当)。Step 140 Based on the evaluation of the amount of intersection, an area route having the minimum amount of intersection is selected as a candidate (corresponding to (G)), and a route that can be taken by a wiring is extracted as an envelope in the rectangular area based on the above-mentioned intersection evaluation. , And determines a direction conversion wiring path (corresponding to (K)).
ステップ150 以上の処理の後配線の直角部を斜め45°に配線しなお
す配線処理、背景領域の容量不足によって発生した配線
領域の拡大により迂回路処理等の補正処理等を行なう。Step 150 After the above processing, a wiring process for re-routing the right-angled portion of the wiring at an oblique angle of 45 °, a correction process such as a detour process due to an expansion of the wiring region caused by insufficient capacity of the background region, and the like are performed.
交差評価によって発生した交差領域路の輪郭を配線路
でつないだエンベロープでの方向変化点がより少ない配
線区間で配線処理するように優先させたパラメータによ
って処理する。また交差が発生した場合と迂回をした場
合との選択条件をパラメータで予め設定された値によっ
て補正修正処理を行なう。Processing is performed by using a parameter that has priority so that wiring processing is performed in a wiring section having a smaller number of direction change points in an envelope formed by connecting the contours of the intersection area roads generated by the intersection evaluation with the wiring roads. In addition, the correction conditions are corrected based on the selection conditions for the case where the intersection has occurred and the case where the detour has been made, using values set in advance by using parameters.
次に本実施例に係る自動配線処理方法により実際に配
線をした場合について説明する。第3図は上述した本実
施例にかかる、自動配線処理方法によって自動配線をし
た例を示すものである。第3図において符号ln1乃至ln6
は配線すべきランドを示している。そして、これらのラ
ンドln1〜ln6より領域の核SKNLと接続系の核CKNLとを求
め、これらにベクトル結線をして(第3図中細線及び破
線を示した)、領域が少ない結果を選択し、(この例に
おいて領域の核を選択している)更に、ビア(VIA)の
発生を少なくするため補正を加えている。第4図に示す
第3図と同一のランドに対する従来に示した自動配線処
理方法で自動配線した例にくらべると下表に示すよう
に、配線の水平方向、垂直方向及び総合的な占有率とビ
アの数とも少ないものとなっている。Next, a case where wiring is actually performed by the automatic wiring processing method according to the present embodiment will be described. FIG. 3 shows an example in which automatic wiring is performed by the automatic wiring processing method according to the above-described embodiment. In FIG. 3, symbols ln1 to ln6
Indicates a land to be wired. Then, the nucleus SKNL of the region and the nucleus CKNL of the connection system are obtained from these lands ln1 to ln6, and vector connections are made to these (thin lines and broken lines in FIG. 3). (In this example, the nucleus of the region is selected.) Further, correction is made to reduce the occurrence of vias (VIA). As shown in the table below, the horizontal and vertical directions of the wiring and the overall occupancy ratio are different from those in the case where the automatic wiring processing method shown in FIG. The number of vias is also small.
このように各成分とも大幅に減少しており本実施例によ
り自動配線を効率良く実施することができることが解
る。 As described above, each component is greatly reduced, and it can be seen that the automatic wiring can be efficiently implemented according to this embodiment.
以上説明したように、本発明によれば、注目領域のベ
クトル結線で得られたベクトル矩形領域が重複する交差
領域の重複度を示す交差量の評価を行ない、この上記交
差量の評価に基づいて交差量が最小となる領域路を候補
として選択するベクトル矩形での交差による配線の評価
と、ランドからの水平垂直基幹ラインに基づく配線の評
価に基づき、自動配線を行うものとしているので、効率
よく自動配線を行なうことができる。即ち、同一接続系
と注目領域の接続関係にあるネット系を考慮したランダ
ム型の相対自動配線方法を採用したため無用な容量を削
減し、ビアの発生を必要最小限にすることができるほ
か、高密度配線処理の自動配線率の向上をも図ることが
でき、さらに、無駄なビアの発生を防止することができ
るという効果を奏する。As described above, according to the present invention, the intersection amount indicating the degree of overlap of the intersection region where the vector rectangular region obtained by the vector connection of the attention region overlaps is evaluated, and based on the evaluation of the intersection amount, Automatic wiring is performed based on the evaluation of wiring by intersection at a vector rectangle that selects the area road with the smallest amount of intersection as a candidate and the evaluation of wiring based on horizontal and vertical backbone lines from lands, so efficient Automatic wiring can be performed. That is, since a random relative automatic wiring method is adopted in consideration of a net system having a connection relationship between the same connection system and the attention area, unnecessary capacity can be reduced, and the occurrence of vias can be minimized. It is also possible to improve the automatic wiring rate of the density wiring processing, and to prevent the useless via from being generated.
第1図は本発明の原理図、第2図は本発明に係る自動配
線処理方法の実施例を示すフローチャート、第3図は第
2図に示した自動配線処理方法による自動配線処理の例
を示す図、第4図は従来の自動配線処理方法による第3
図と同一の配線例を示す図、第5図は従来の自動配線処
理方法を示すフローチャートである。FIG. 1 is a principle diagram of the present invention, FIG. 2 is a flowchart showing an embodiment of an automatic wiring processing method according to the present invention, and FIG. 3 is an example of automatic wiring processing by the automatic wiring processing method shown in FIG. FIG. 4 is a diagram showing a third example of the conventional automatic wiring processing method.
FIG. 5 is a flow chart showing a conventional automatic wiring processing method.
Claims (1)
することを特徴とする自動配線処理方法。 (A)配線対象の領域を所定の基準で分割する第1の処
理。 (B)注目した部分領域のランド群の重心を求め領域の
核とする第2の処理。 (C)部分領域中で電気的に接続された同一接続系のラ
ンド群の重心を求め接続系の核とする第3の処理。 (D)領域の核及び接続系の核から夫々ランドへのベク
トル結線を行なう第4の処理。 (E)注目部分領域中において上記部分領域のランド群
と上記同一接続系のランド群との有効配線の相対的な量
の評価を行なう第5の処理。 (F)注目領域のベクトル結線で得られたベクトル矩形
領域が重複する交差領域の重複度を示す交差量の評価を
行なう第6の処理。 (G)上記交差量の評価に基づいて交差量が最小となる
領域路を候補として選択する第7の処理。 (H)配線対象の層分割を行なう第8の処理。 (I)部分系の核から水平垂直方向に基幹ラインを引
き、基幹ラインに水平又は垂直に結線する第9の処理。 (J)電気的に接続された領域の核から水平垂直方向に
基幹ラインを引き、基幹ラインに水平又は垂直に結線す
る第10の処理。 (K)上記第9及び第10の処理結果の処理を行い水平垂
直方向の配線領域の少ない処理結果と、上記第6の処理
結果とで最小成分容量の配線区間を設定する第11の処
理。1. An automatic wiring processing method, wherein a route to be wired is determined by the following processing. (A) First processing for dividing a wiring target area based on a predetermined reference. (B) A second process in which the center of gravity of the land group of the focused partial region is determined and used as the core of the region. (C) Third processing for determining the center of gravity of a group of lands of the same connection system electrically connected in the partial area and using the lands as the core of the connection system. (D) Fourth processing for performing vector connection from the nucleus of the region and the nucleus of the connection system to the land, respectively. (E) Fifth processing for evaluating the relative amount of effective wiring between the land group of the partial area and the land group of the same connection system in the partial area of interest. (F) Sixth processing for evaluating the amount of intersection indicating the degree of overlap of the intersection area where the vector rectangular areas obtained by the vector connection of the attention area overlap. (G) A seventh process of selecting, as a candidate, an area road having the minimum intersection amount based on the evaluation of the intersection amount. (H) Eighth process of dividing the wiring target into layers. (I) Ninth processing for drawing a main line in the horizontal and vertical directions from the core of the subsystem and connecting the main line to the main line horizontally or vertically. (J) Tenth processing for drawing a main line in the horizontal and vertical directions from the nucleus of the electrically connected area and connecting the main line horizontally or vertically. (K) An eleventh process in which the ninth and tenth processing results are processed, and the processing result with a small horizontal and vertical wiring area and the sixth processing result are used to set the minimum component capacity wiring section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62310865A JP2617746B2 (en) | 1987-12-10 | 1987-12-10 | Automatic wiring processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62310865A JP2617746B2 (en) | 1987-12-10 | 1987-12-10 | Automatic wiring processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01152578A JPH01152578A (en) | 1989-06-15 |
| JP2617746B2 true JP2617746B2 (en) | 1997-06-04 |
Family
ID=18010320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62310865A Expired - Fee Related JP2617746B2 (en) | 1987-12-10 | 1987-12-10 | Automatic wiring processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2617746B2 (en) |
-
1987
- 1987-12-10 JP JP62310865A patent/JP2617746B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01152578A (en) | 1989-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH07152802A (en) | Wiring designing method | |
| JP3608832B2 (en) | Automatic wiring method and automatic wiring apparatus | |
| JP2617746B2 (en) | Automatic wiring processing method | |
| JP4086816B2 (en) | Layer number estimation apparatus and method for BGA component mounting board, and layer number estimation program | |
| JP2005267302A (en) | Wiring route determination method and system | |
| JPH10198722A (en) | Interactive wiring pattern creation system | |
| JP2566788B2 (en) | Printed circuit board wiring method | |
| JP2001203272A (en) | Layout design method for semiconductor integrated circuit | |
| JP2007115959A (en) | Semiconductor device having redundant via structure | |
| US5373628A (en) | Automatic wiring method | |
| KR100199009B1 (en) | Automatic wiring method of printed circuit board by target-oriented maze search | |
| JP3077383B2 (en) | Automatic wiring mechanism for printed circuit board CAD | |
| JP2001345386A (en) | Automatic wiring method of semiconductor integrated circuit | |
| JP2818247B2 (en) | Automatic wiring method for semiconductor device | |
| JPS63272094A (en) | Automatic wiring method for printed wiring board | |
| JP2721712B2 (en) | Automatic wiring method | |
| JPH05159025A (en) | Area division wiring method | |
| JPH06177252A (en) | On-grid wiring method automatic | |
| JP3721304B2 (en) | Plating lead wire wiring method | |
| JP2607694B2 (en) | CAD system | |
| JPH05290126A (en) | Inter-layer connection method | |
| JPH0645443A (en) | Hierarchical wiring method | |
| JPH09232434A (en) | Automatic peeling and rewiring method | |
| CN118627459A (en) | Method, device and computer readable medium for assisting design of printed circuit board | |
| JP2713969B2 (en) | Automatic wiring pattern setting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |