JP2618344B2 - Embossed carrier tape molding machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an emboss carrier tape molding machine for storing small electronic components such as chip capacitors, ceramic capacitors and resistors used in electronic equipment such as computers.

[0002]

2. Description of the Related Art Small electronic components such as chip capacitors, ceramic capacitors, resistors and the like used in electronic devices such as computers are mainly used in the field of computers. is there. The industry adopts a system in which such small electronic components are generally stored in a belt-shaped tape called a carrier tape and wound around a reel.

[0003] As a method for storing parts using the carrier tape, for example, as shown in Fig. 4, a strip-shaped tape body (paper, plastic, etc.) 10 is provided with a sprocket hole 10-1 and a storage box 10- having a predetermined size. There is a method in which a small electronic component is stored in a tape storage box 10-2 and wound around a reel using a carrier tape provided at equal intervals.

The method of manufacturing the carrier tape having the storage box 2 differs depending on the material of the tape material. In the case of a plastic tape, for example, a strip-shaped tape wound on a reel is unwound to a molding machine. The embossed carrier tape is manufactured by a method of feeding, where heating for forming, preforming, and main forming are performed, followed by perforation of a sprocket hole, side cut, and winding on another reel. I have. The manufacturing process includes a material feeding process of feeding a tape body wider than a product width to a molding machine while rewinding the material, a preheating process of heating the material to a predetermined temperature, a preforming and main forming process, a sprocket hole drilling process, and a side process. And a product winding step for cutting the product into a standard width.

[0005]

However, such a conventional method has the following disadvantages. That is, the conventional embossing molding machine is a method in which a molding punch is provided on the upper mold while the lower mold is fixed, and embossing is performed on the material located on the upper surface of the lower mold by the lowering operation of the upper mold. For this reason, if the molded portion is large, waving occurs in the side portion of the material when embossing is performed. For this reason, it is necessary to use a material having a width wider than a specified width in consideration of the waving, and a side cutting step is essential. In addition, since the upper mold is not provided with a material heating means and is a method of heating the material from above with a material heating heater holder provided adjacent to the upper mold, heat is transferred from top to bottom. Therefore, a heater having a large capacity has to be used, and as a result, the temperature of the whole mold is unnecessarily high, which adversely affects the product quality. Further, since preforming is required before the main forming, the line speed is low and productivity is low. Further, since the intermittent feeding of the material is performed by using the formed portion instead of the sprocket hole, the accuracy of the intermittent feeding of the material cannot be sufficiently secured, and the formed portion may be deformed by the pilot, which is not preferable.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the conventional embossing molding machine, and it is not necessary to perform preforming, and embossing can be performed without waving in a side portion by one molding. Provide an embossed carrier tape molding machine that can efficiently and stably heat the material with a small-capacity heater and can efficiently produce high-quality embossed carrier tape without deformation of the molded part at high speed. What you want to do.

[0007]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems by adopting an upward molding method by lowering the upper die instead of the conventional downward molding method by lowering the upper die. The gist is an embossed carrier tape forming machine in which a storage box and a sprocket hole of a predetermined size are provided at equal intervals in a band-shaped tape body, and includes an upper die and a lower die driven by a cylinder, The lower mold has a forming punch and a heating punch, and the forming punch has a forming heater holder, and the heating punch has a material heating heater holder incorporated in the lower part of the punch,
While holding a material of a specified width with a sprocket hole located on a fixed stripper disposed between the upper mold and the lower mold with the upper mold, preheat the material with a lower mold heating punch, and simultaneously form the molding punch. It is characterized in that it is embossed from below and a mechanism that intermittently feeds the material with sprocket holes, and that a cooling air injection nozzle is provided in the upper mold corresponding to the lower molding punch Things.

[0008]

According to the present invention, a material having a specified width in which a sprocket hole is drilled is fed to a molding machine, and a material on a fixed stripper disposed between an upper mold and a lower mold is first placed on the upper mold. Descends to press the material, and then the lower mold rises in that state, and preheating by the heating punch and molding by the molding punch are performed simultaneously. Thereafter, when the upper die and the lower die return to the original positions, the material is intermittently fed by being piloted by the sprocket holes, and the next molding is performed again by the lowering of the upper die and the raising operation of the lower die. The above operation is continuously repeated to form the embossed carrier tape.

Air or hydraulic pressure is generally used as the power source for the cylinder-driven lower and upper dies in the present invention. However, since the operating speed of hydraulic pressure is lower than that of air, it is necessary to use air or hydraulic pressure to increase the speed. Is preferred.

[0010] Each heater of the heating punch and the forming punch,
Since each is incorporated under the punch, the heat of the heater is efficiently transferred to the punch. Therefore, a heater having a small capacity can be used, the set temperature of each punch can be maintained without variation, and only the molded portion can be efficiently heated to the set temperature. This enables embossing without waving in the side portions by one molding.

In order to speed up the return operation of the upper and lower dies, a spring can be used in addition to the cylinder. In that case, the spring can be interposed between the lower mold and the fixed stripper and between the upper mold and the fixed stripper.

Further, by providing a cooling air injection nozzle on the upper mold corresponding to the lower molding punch, it is possible to promote the cooling of the formed high-temperature storage box.

The present invention employs an upward molding method by a lower die ascending operation, and incorporates a molding heater holder and a material heating heater holder into a lower molding punch and a heating punch, respectively, to heat and mold the material. Preliminary shaping is not required because it is performed simultaneously from below. In addition, the intermittent feeding of the material can be performed smoothly and accurately because the pilot is performed in the sprocket hole, and the deformation of the formed portion can be completely eliminated. Further, according to the present invention, a standard size (product size) material in which a sprocket hole is drilled can be directly used because the standard size (accurately formed) material can be directly used, and the sprocket hole drilling and side cutting steps after molding can be omitted. it can.

[0014]

FIG. 1 is a plan view showing an overall configuration example of an embossed carrier tape molding machine according to the present invention, FIG. 2 is a side view of the same molding machine, and FIG. 3 is an enlarged side view of a main body of the same molding machine. In the figure, 1 is a machine base, 2 is a base board, 3 is a fixed stripper,
3-1 is a stripper fixing support, 4 is a lower mold mounting plate, 4-1 is a lower mold operating air cylinder, 4-2 is a forming heater holder, 4-3 is a material heating heater holder, and 4-4 is forming. Punch, 4-5 heating punch, 5
Is an upper mold mounting plate, 5-1 is an upper mold operating air cylinder, 5-2 is a forming die, 6 is a guide post, 6-1 is a spring, 7 is a material intermittent feed motor, 7-1 is a feed gear, Reference numeral 8 denotes a pilot pin for a sprocket, 9 denotes a cooling air injection nozzle, 10 denotes a material, 10-1 denotes a sprocket hole, and 10-2 denotes a storage box.

That is, in the embossed carrier tape molding machine according to the present invention, the fixed stripper 3 is installed on the base 2 fixed to the machine base 1 via the stripper fixing column 3-1, and the base 2 and the fixed stripper are mounted. 3, a lower mold mounting plate 4 is supported by a lower mold operating air cylinder 4-1 attached to a lower portion of the machine base 1 so as to be able to move up and down. The lower mold is composed of the mounting plate 4, a molding heater holder 4-2 and a material heating heater holder 4-3 fixed on the plate, a molding punch 4-4 and a heating punch 4-5. A molding punch 4-4 and a heating punch 4-5 are moved up and down through a window hole 3-1 formed in the fixed stripper 3 by a mold operating air cylinder 4-1. Since the heating punch 4-5 only heats the material 10 on the fixed stripper 3 at its tip, the length thereof is shorter than that of the forming punch 4-4. 4-2A is a molding heater, and 4-3A is a heating heater.

On the other hand, the upper die is composed of an upper die mounting plate 5 vertically suspended from an upper die operating air cylinder 5-1 fixed to the upper part of the machine base 1 and a lower die formed on the plate. A mechanism comprising a forming die 5-2 attached at a position facing the punch 4-4 and the heating punch 4-5, and a mechanism for moving up and down between the fixed stripper 3 and the air cylinder 5-1 for operating the upper die; Has become.

The guide posts 6 are upper and lower guides for raising and lowering the upper die and the lower die.
Slidingly penetrates through the fixed stripper 3 and the upper die mounting plate 5 so as to protrude therefrom, and between the lower die mounting plate 4 and the fixed stripper 3, and between the lower die mounting plate 4 and the fixed stripper 3 in order to speed up the return operation of the upper die and the lower die. A spring 6-1 is fitted between the stripper 3 and the upper die mounting plate 5, respectively.

The intermittent feed mechanism for the material 10 is such that a feed gear 7-1 rotationally driven by a material intermittent feed motor 7 installed at an end of the machine base 1 is formed of a material sprocket hole 10-1.
And intermittently fed in conjunction with the forming operation. The sprocket pilot pin 8 is
It is attached to the upper molding die 5-2.

The cooling air injection nozzle 9 is provided to promote cooling of the molding portion (storage box), and is incorporated into the upper die mounting plate 5 so as to open in each molding hole of the molding die 5-2. In addition, cooling air is supplied from an air pipe 9-1 passed through the plate.

As the material to be fed to the embossed carrier tape molding machine having the above configuration, a material having a specified width (product width) in which the sprocket hole 10-1 has been previously drilled by a drilling machine is used. Material 10 with sprocket hole of specified width 10
Is set by being wound on a reel in a material delivery section (not shown).

When manufacturing the embossed carrier tape, the material 10 with sprocket holes wound on the reel of the material feeding section is partially rewound, passed through a molding machine, and brought into contact with the upper surface of the fixed stripper 3 in the intermittent state. A sprocket hole 10-1 is provided in the feed gear 7-1 of the feed mechanism.
And connected to a product take-up reel (not shown) to set a material.

The embossing procedure is as follows. First, the upper mold operating air cylinder 5-1 operates downward against the material 10 on the fixed stripper 3 against the spring 6-1. The material 10 is pressed down by a predetermined stroke and pressed by the forming die 5-2. Next, in this state, the lower die operating air cylinder 4-1 operates upward against the spring 6-1 and the lower die mounting plate 4 rises by a predetermined stroke. By raising the lower mold mounting plate 4, the material 10 is preheated by the heating punch 4-5 heated by the material heating heater holder 4-3 mounted on the plate 4, and at the same time, the molding heater is heated. Forming punch 4- heated by holder 4-2
4 embossed and the storage box 10-2
Is molded. Then, air cylinder 5 for upper mold operation
-1 and the lower mold operating air cylinder 4-1 operate in the opposite direction to the molding operation, respectively, so that the upper mold mounting plate 5 and the lower mold mounting plate 4 return to their original positions, and the molding die 5-2.
And the forming punch 4-4 and the heating punch 4-5 are the material 10
More away. At the same time, the drive motor 7 of the intermittent feed mechanism operates to intermittently feed the material by one pitch via the feed gear 7-1 and the sprocket hole 10-1. By this intermittent feed, the portion preheated by the heating punch 4-5 moves to the position of the lower forming punch 4-4, and the same operation as above is repeated again to perform embossing. That is, in the present invention, fixing of material → preheating → final molding (heating)
→ Material release → Intermittent feed (1 pitch) is continuously repeated to produce an embossed carrier tape.

At the time of molding, an air pipe 9- is connected to a cooling air injection nozzle 9 incorporated in the upper mold mounting plate 5.
1, the air is supplied from the injection nozzle 9, and the storage box 10-2 is cooled.

Reference numeral 11 in the figure denotes an automatic pinhole detection device for automatically detecting a pinhole in the component storage box 10-2 formed on the carrier tape. In the case of a plastic carrier tape, pinholes may be generated in the storage box 10-2 due to a change in a feed amount due to a material of a film, a malfunction of a machine, abrasion of a molding die, and the like. The carrier tape with the storage box in which this pinhole is present is inferior in quality and must be treated as a defective product, resulting in lower yield and higher costs. Is done. Various such devices are known.

The operation of the air cylinder 5-1 for operating the upper die and the air cylinder 4-1 for operating the lower die, the intermittent feeding operation of the material 10, the forming heater holder 4-2, the heating heater in the embossed carrier tape forming machine. It goes without saying that the control of the holders 4-3 and the like is automatically controlled by the control panel.

[0026]

As described above, the embossed carrier tape molding machine according to the present invention employs the upward molding method by the raising operation of the lower die, and simultaneously heats and molds the material from below, so that the heater having a small capacity is used. Thus, the material can be efficiently and stably heated, and the molding can be performed efficiently without preforming. Therefore, according to this molding machine, the material of the standard size (product size) in which the sprocket holes are drilled can be directly used, and the drilling and side cutting steps of the sprocket holes after the molding can be omitted, and the material can be omitted. Since intermittent feeding is performed in a sprocket hole, piloting can be performed smoothly and accurately, and there is no deformation of the molded part.As a result, a high quality embossed carrier tape can be manufactured with high efficiency and high productivity. It has a great effect of being able to do it.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall configuration example of an embossed carrier tape forming machine according to the present invention.

FIG. 2 is a side view of the molding machine.

FIG. 3 is an enlarged side view showing a main body of the molding machine.

FIG. 4 is a perspective view showing an example of an embossed carrier tape to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Machine stand 2 Board 3 Fixed stripper 3-1 Stripper fixing support 4 Lower die mounting plate 4-1 Lower cylinder operating air cylinder 4-2 Heater holder for molding 4-3 Heater holder for material heating 4-4 Molding punch 4 -5 Heating punch 5 Upper die mounting plate 5-1 Upper die operating air cylinder 5-2 Forming die 6 Guide post 6-1 Spring 7 Material intermittent feed motor 7-1 Feed gear 8 Sprocket pilot pin 9 Cooling air Injection nozzle 10 Material 10-1 Sprocket hole 10-2 Storage box 11 Pinhole automatic detection device

Claims (2)

(57) [Claims] An embossed carrier tape forming machine in which a storage box and sprocket holes of a predetermined size are provided at equal intervals in a band-shaped tape body, comprising a cylinder-driven upper die and a lower die. Has a forming punch and a heating punch, and the forming punch has a forming heater holder,
In the heating punch, a heater holder for material heating is incorporated at the bottom of the punch, and a material of a specified width with a sprocket hole located on a fixed stripper located between the upper die and the lower die is pressed by the upper die. An embossed carrier tape molding machine, characterized in that the material is preheated by a lower heating punch, and at the same time, the material is embossed from below by a forming punch to intermittently feed the material through sprocket holes. 2. A cooling air injection nozzle is provided on an upper mold corresponding to a lower molding punch.
An embossed carrier tape molding machine as described.