JP2622348B2 - Resin packaging method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin packaging method and an apparatus therefor, for example, for a semi-finished product in a state after predetermined electronic and electric elements such as semiconductor elements and resistors are mounted on a lead frame. Further, the present invention relates to a resin packaging method and an apparatus for performing resin packaging using a thermosetting resin material.

[0002]

2. Description of the Related Art Conventionally, various devices have been proposed for packaging a semi-finished product after a semiconductor element, a resistor and the like are mounted on a lead frame using a thermosetting resin material. . For example, Japanese Utility Model Application Laid-Open No. 56-30841 discloses a configuration example in which a semiconductor element is sealed with resin. Briefly describing the proposal with reference to the drawings, FIG. 12 is a plan view as viewed from above the separating surface (parting line) of the mold, and a part thereof is cut along a surface along the separating surface of the cavity. It is shown.

In the figure, a pot 104 is formed at a central portion of the upper die, and is provided with a material input portion for supplying a thermosetting resin such as a preheated epoxy resin. One large-sized plunger (not shown) is movably provided in the pot 104, and the pressurizing operation by the plunger thermally cures the runners 105A to 105E communicating with the pot 104. The thermosetting resin is introduced into the cavity 107 via the gate 106 provided so as to branch right and left from the longitudinal direction of each runner while introducing the thermosetting resin. A plurality of cavities 107 are formed in the cavity block 117 as shown in the drawing.

In the above configuration, after a lead frame on which a predetermined electronic element is mounted is positioned and set in a lead frame loading portion provided on a separation surface of a mold, the mold is clamped, and An epoxy resin or the like, which is a thermosetting resin, which has been preheated in advance, is introduced into each cavity 107 via each runner by pressing with a plunger.

[0005] Thereafter, after the resin is cured, the mold is opened, and the cavity 107 is opened by an ejector pin (not shown).
By pressing the runners 105A to 105E at the circled portions in the drawing, the cull portion cured in the pot 104, the runner portion cured in the runners 105A to 105E, and the lead frame are incorporated. The integrated part of the package portion cured in the cavity 107 is taken out of the mold. As described above, so-called multi-piece resin packaging is performed.

Next, Japanese Utility Model Laid-Open No. 57-53324 discloses a configuration example in which a resin is directly introduced into a cavity in order to encapsulate a semiconductor element with a resin. FIG.
3 is a cross-sectional view of a main part of the proposed structure cut along a surface along the pot 117, and FIG. 14 is a plan view of the mold of FIG. 13 viewed along a separation surface. In FIG. 14, while two cavities 107 are formed in the left and right cavity blocks, each cavity block is disposed in a mold so as to face each other. Gates 106 communicating with the respective cavities 107 are provided radially in the middle of the respective cavities 107 as shown in the figure. Also, this gate 10
13, a small-sized pot 117 is located as shown in FIG.
The plunger 118 is configured to be individually driven up and down by the hydraulic device 123 inside. In the above configuration, after setting the lead frame on which the semiconductor element is mounted at a predetermined position on the separation surface between the upper mold and the lower mold, a thermosetting resin such as an epoxy resin which is not heated is supplied into the pot 117. After the mold is clamped, the molding material is pressurized with a plunger 118 and the thermosetting resin molding material in a plastic state in the pot 104 is injected into the cavity 107 through the gate 106 under pressure. Thus, the semiconductor device is molded in a sealed state. Also, Japanese Patent Application Laid-Open
According to the "resin sealing method" described in Japanese Patent No. 128931, after supplying a resin to a runner of a resin sealing mold, a plunger having a flat surface having substantially the same shape as the runner is lowered to inject the resin into the cavity. There is disclosed a technology for minimizing unnecessary resin by encapsulating the element with resin. According to the "semiconductor resin encapsulation apparatus" disclosed in Japanese Patent Application Laid-Open No. 1-223733, a rectangular pot and a gate are provided in a bottom region of a rectangular wall surface, and a plurality of cavities connected in series have the same shape as the pot. By lowering the plunger and injecting a resin into the cavity to seal the semiconductor element with the resin, the production efficiency and the product quality are both improved. And, JP
Japanese Patent Application Laid-Open No. 3-237910 discloses a technique for manufacturing a tablet which is formed into a cylindrical shape for a semiconductor mold.

[0007]

However, in the former case described above, the molding material for the resin package includes a package portion molded in the cavity 107, a cull portion formed in the pot 104, and the respective runners 105A to 105A. E and the runner part and each gate 10
The gate portion formed at 6 is taken out of the mold in an integrated state. For this reason, the efficiency of use of the molding material is that the ratio of the amount of resin used for the resin package to the total resin consumption is 20% or less, and the molding material for the resin package is thermosetting. However, it is impossible to re-grind and reuse the resin like a thermoplastic resin, and the cull portion and each runner portion must be discarded, which is uneconomical.

Further, according to this proposal, the resin flows first from the outer periphery of the pot 104 toward each runner, so that the resin first enters the cavity 107 provided at the position closest to the pot 104. The difference between the time and the time required for the resin to enter the cavity 107 farthest from the pot 104 may be about 5 seconds. As a result, the overall manner of entering the cavity 107 is not uniform, and the resin package has a hollow portion (void). Such as molding failure,
There was a problem that the yield was reduced.

On the other hand, according to the latter proposal, the cavity 107 is arranged substantially radially around the cylindrical pot 117, and the introduction of the resin into the cavity becomes substantially uniform. The problem that a void or the like occurs in the portion is eliminated. However, in this proposal,
Since the number of cavities 107 is as small as four, the amount of resin used is naturally small, and accordingly, the heat capacity of the resin is also small. For this reason, since the resin cannot be sufficiently heated in advance, the resin in a hard state is pushed toward the cavity 107 by the plunger 118 in the pot 117, so that the pot 117 and the plunger 1
18 friction becomes remarkable. As a result, the durable time of each part is about 1/3 of that of the former, and there is a problem that the maintenance cost required for each part replacement becomes enormous. Further, Japanese Patent Application Laid-Open Nos. 57-128931 and 1-23
According to No. 2733, the amount of unnecessary resin used other than resin packaging can be reduced, but the runner is formed in a rectangular cross-sectional shape after the mold is opened, so that the volume increases. Furthermore, according to each of the publications, since the configuration in which the runner is not directly pressed by the ejector pin is not employed, it is necessary to secure mechanical strength when removing the integrated lead frame from the mold after completion of the resin package. Therefore, it was necessary to increase the number of runners to be discarded to some extent, which was still uneconomic.

Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a resin packaging for preventing the occurrence of defects such as voids and chips in a resin packaging portion of a lead frame. When performing different types of resin packaging using a rod-shaped material preformed from a granular thermosetting resin material, a runner and a gate used for purposes other than the resin packaging of the lead frame are used. A resin packaging method and a resin packaging device that are extremely profitable by ensuring that mold release can be reliably performed even if the waste of a molded part that is discarded as it is impossible to reproduce after resin packaging is minimized. Is to provide.

Another object of the present invention is to make it possible to appropriately prepare a thermosetting material having an optimum volume and shape in response to a change of a type of a resin package. Another object of the present invention is to provide a die set that is easy to disassemble, is inexpensive, and has excellent thermal stability for molding a thermosetting material.

[0012]

In order to solve the above-mentioned problems and to achieve the object, a resin packaging method according to the present invention is intended to perform resin packaging on a lead frame on which a predetermined electronic element is mounted. A resin packaging method comprising: preforming a rod-shaped material using a granular thermosetting resin material so as to substantially conform to an inner shape of a horizontally long horizontally long runner, and then performing resin packaging, the resin packaging method comprising: A preparatory step of variably setting the volume of the space of the die set in accordance with the horizontal runner provided in the lower die of the apparatus, and the die set having a space that substantially matches the internal shape of the horizontal runner A first step of supplying the thermosetting resin material in such a manner that the thermosetting resin material is distributed substantially uniformly, and the punching of the thermosetting resin material supplied into the die set. A second step of compression molding to obtain the rod-shaped material, a third step of taking out the rod-shaped material after opening the die set, and charging the rod-shaped material into the horizontally elongated runner; With the mold closing operation of the packaging device, the rod-shaped material is disposed at a line symmetric position along a longitudinal direction of the horizontal runner by a movable runner driven in the horizontal runner, and the lead frame is previously set. A female shape portion comprising a shape portion and a gate provided on an upper mold for forming a runner thin portion at a portion opposed to the opening of the horizontally long runner for pressure feeding toward a plurality of cavities which are positioned and set. A fourth step of pressure feeding through the mold and taking out of the integrated body of the lead frame after the end of the resin package out of the mold with the mold opening operation And a fifth step of releasing by an ejector pin for pressing the integrated body and an ejector pin disposed on the shape portion to press the runner thin portion formed by the shape portion. It is characterized by doing.

Preferably, in order to perform resin packaging on a lead frame on which a predetermined electronic element is mounted, a granular thermosetting resin material is formed so as to substantially conform to the internal shape of a horizontally long elongated runner. A resin packaging apparatus for pre-forming a rod-shaped material by using a resin packaging apparatus, wherein a die set space section is provided in a lower mold of the resin packaging apparatus and varies a volume of a space of the die set according to a horizontally long runner. Variable means, material supply means for supplying the thermosetting resin material to the die set having a space substantially conforming to the internal shape of the horizontally long runner so that the thermosetting resin material is substantially uniformly distributed, and supply into the die set. Compression molding means for compressing and molding the thermosetting resin material by a punch to obtain the rod-shaped material, and after opening the die set, the rod A conveying means for taking out the material, conveying the material into the horizontal runner, and supplying the material; and a movable runner driven in the horizontal runner along with a mold closing operation of the resin packaging device for the resin packaging. A plurality of cavities arranged at line-symmetrical positions along the longitudinal direction of the horizontal runner, and an opening of the horizontal runner in order to feed the pressure toward the cavity in which the lead frame is positioned in advance. A pressurizing unit for press-feeding through a female portion comprising a gate, a shape portion provided on an upper die for molding a runner thin portion at a portion to be formed, and a resin package along with a mold opening operation of the resin packaging device. In order to take out the integrated body of the lead frame after completion from the mold,
An ejector pin for pressing the integrated object, and an ejector for taking out of the mold by pressing the ejector pin disposed on the shape portion to press the runner thin portion formed by the shape portion. It is characterized by having.

[0014] Preferably, the die set is provided with die set space portion changing means for changing the volume of the space portion of the die set in accordance with the internal shape of the horizontally long runner. Also, preferably, in accordance with the internal shape of the horizontal runner, a die set bottom changing means for changing a bottom height of the space in order to change the volume of the space of the die set is provided in the die set. Provided.

Preferably, the die set space portion changing means is configured to change the height of the bottom surface of the space portion so as to change the volume of the space portion of the die set. The die set is composed of a fixed die and a movable die, and the fixed die and the movable die form the space, and an inclined surface continuous with the space is joined to the fixed die and the movable die. It is characterized in that it is configured to perform mold release by forming it on a surface.

[0016]

According to the above construction, a thermosetting material is formed into a shape that can be put into a horizontally long runner of a press device, and is uniformly introduced into each cavity through each gate by a pressurizing operation of a movable runner. In doing so, waste of used raw materials can be eliminated.

Further, it is possible to appropriately prepare a thermosetting material having an optimum volume and shape in accordance with the type of resin package to be exchanged. Further, the die set for molding the thermosetting material can be configured to be easily disassembled, inexpensive, and excellent in thermal stability.

[0018]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an essential part cutaway view showing an essential part of the resin packaging apparatus in a cutaway manner, and shows a configuration substantially common to each embodiment. In this drawing, the components related to the upper mold indicated by adding a B after each reference number, and the components related to the lower mold indicated by adding an A after each reference number, as shown in FIG. It is installed at a predetermined position of the press device, and when the press device P is open, it is configured to be separated from the separation surface (parting line PL) formed between the upper and lower cavity blocks 2B and 2A.

As described above, the upper and lower cavity blocks 2B and A provided so as to be separable with the separation plane PL as a boundary surface have cavities 15B and 15 for forming a resin package.
A is processed and formed as described later. These upper and lower cavity blocks 2B, A are fixed to upper and lower backup plates 9A, B for positioning each other, respectively.
Between them, the guide 13 fixed to the upper backup plate 9B and the bush 14 provided on the lower guide bush 14 perform mutual positioning.

On the other hand, the package formed in the cavity 15B and the ejector pin 11B for pushing out the runner 5 from the upper cavity block 2B to the outside obtain the pushing force by the movement of the ejector pin receiving upper base 12B holding the ejector pin 11B. Like that. Further, the ejector pin 11A for pushing out the package formed in the lower cavity 15A from the lower cavity block 2A to the outside obtains a pushing force by the movement of the ejector pin receiving lower base 12A holding the ejector pin 11A.

The upper and lower ejector pin receiving bases 1
2B and 12A are configured to operate by the pressing force at the time of the opening operation of the press device P and the upper and lower springs 25B and 25A. And, the mold having the above configuration is composed of the upper and lower
It is attached to the press device P via A and B. Next, a gate 6 is formed between the lower cavity 15A and the lower cavity block 2A so as to communicate with the runner 5, and the movable runner 1 obtains a driving force from the actuator 8 below the runner 5. Arrow F in the figure,
It is provided movably in the J direction.

The shape of the movable runner 1 is not limited to a conventional cylindrical shape in consideration of the arrangement of the cavities, but is formed into a rectangular shape, for example. FIG. 2 is a plan view of the lower cavity block 2A viewed from the separation plane PL of FIG. 1 and shows an example of the arrangement of the lower cavity 15A, which is the most characteristic part of the present invention. That is,
In this drawing, the lower cavity 15A is formed with "N" portions along the longitudinal direction of the lower cavity block 2A, and communicates with the horizontally long runner 5 via the gate 6 communicating with each lower cavity 15A. Is formed. Below the runner 5 provided in this manner,
It is a resin having a broken shape close to the outer shape of the runner 5, and a resin material put into the movable runner 1 is located. The lower cavity block 2A is provided with positioning pins 20 for inserting positioning holes 3E formed in the lead frame 3 to position the lead frame 3 relative to the cavity block. In the upper cavity block 2B, upper cavities 15B are formed at positions facing the lower cavities 15A, respectively.
A shape portion 2C is formed at a position facing the runner 5 of FIG. 1A as shown in FIG.
The formed portion formed in the runner 5 is pushed out so that 1B passes.

The operation of the configuration described above will be described with reference to FIGS.
Referring to the operation explanatory diagram of FIG.
The state shown in FIG. 3 is obtained. At this time, since the movable runner is retracted in the runner 5 by the operation of the actuator 8, the thermosetting resin 19 is automatically charged since the thermosetting resin 19 is ready to be charged. Before or after this, the lead frame 3 is set on the positioning pins 20 provided on the lower cavity block 2A using a chucking hand device (not shown), and then the upper cavity block 2B is joined on the separation plane PL. Close the mold as you do.

Thereafter, as shown in FIG. 4, the movable runner 1 is driven in the direction of arrow F by the operation of the actuator 8, and the thermosetting resin 19 moves up and down through the gate 6 in the direction of arrow M in the figure. It is gradually introduced into the cavities 15A, 15B. Thereafter, as shown in FIG. 5, the filling of the resin into the upper and lower cavities 15A and 15B is completed, and the movable runner 1 stops at the final position.

Thereafter, the press device P is opened, the mold is opened, and the ejector pins 11B, 11A are pushed out, so that the resin package portions are moved to the cavities 15B, 1B.
Ejected from 5A, gripped by chucking hand and removed from mold. FIG. 6 is an external perspective view of a semi-finished product obtained through each of the steps described above. In FIG. 6, what is indicated by a two-dot chain line is the movable runner 1 described above.
Is a thermosetting resin 19 formed in a rod shape as shown by a two-dot chain line because the pressure is moved in the direction of arrow F by the arrow.
As can be seen from the drawing, since the thermosetting resin 19 is preliminarily processed into a shape along the bottom surface of the runner forming portion 5E, the inside of the runner 5 is substantially uniformly directed to the cavity as the movable runner 1 rises. Can be moved through the gate 6. The resin package portion 15E is formed on the upper and lower surfaces of the lead frame 3 as shown in FIG.
Only in the resin package portion 15E formed on the lower surface of the lead frame 3, the gate forming portion 6E is formed continuously with the runner forming portion 5E, and a semi-finished product as an integral product is obtained.

Thereafter, the semi-finished product is inserted into the positioning holes 3E.
The bridge portion 3B is cut and removed so that the lead portion 3A of the lead frame 3 is left, and the lead portion 3A is bent in a predetermined manner to obtain a finished product. On the other hand, there is a change in the type of resin packaged, and when resin packaging is performed using cavities having different shapes, it is preferable that the movable runner 1 be shared. With such a configuration, the multi-pot 117 and the multi-plunger 11 can be compared with those described in Japanese Utility Model Laid-Open No. 57-53324.
Since the replacement of the hydraulic unit 123 and the hydraulic unit 123 becomes unnecessary, the number of parts to be replaced at the time of replacement can be greatly reduced, and the time required for replacing the mold can be shortened. .

FIG. 7 is a perspective view (a view from the back) of the sealed product of the second embodiment, showing a state in which the thermosetting resin 19 has been completely pushed into the movable runner unit 1. It is. In this embodiment, a portion other than the gate on the opposite side of the movable runner portion 1 is formed into a slidable convex shape, and this convex portion is pushed by the movable runner portion 1 so that the convex portion is retracted. Since the amount of resin between the gates is smaller, the use efficiency of the resin can be further increased. For this purpose, the thermosetting resin 19 is individually introduced into the cavity by the movable runner 1.

As described above, the runner forming portion 5E
Since the volume of the resin is greatly reduced, the use efficiency of the resin is more than doubled. In addition, there is no time difference between filling the cavities with the thermosetting resin 19, and all the cavities can be filled in the same manner, so that voids and the like are not generated, and the yield can be improved. In addition, since the size of the movable runner 1 can be set large, the resin can be preheated, so that the resin in a soft state can be filled into the cavity via the runner and the gate, so that the friction of the mold can be reduced. In addition, the number of replacement parts at the time of product replacement is greatly reduced, and the cost of parts is easily reduced.

Next, a preparation process for preparing the above-described thermosetting resin 19 so as to substantially conform to the shape of the runner 5 will be described. FIG. 8 is an external perspective view of the thermosetting resin manufacturing apparatus Q, in which a main part is cut away. In this figure, a die set 31 having a rectangular opening 32 as shown is fixed on a base 30 serving as a base of the device Q. A required amount of a granular epoxy resin as a material for molding the resin 19 and a compound material are supplied.

After the required amount is supplied into the die set 31 in this manner, it is moved by the action of the punch hydraulic cylinder 39 in the direction of the arrow D1 toward the opening 32 of the die set 31 as shown by the broken line in the figure. As a result of the compression action of the punch 40 compressing the granular epoxy resin and the predetermined compound material in the die set 31, the thermosetting resin 19 cured to a desired shape is formed in the die set 31. As described above, the die set 31
In order to supply a required amount of the inside, a granular epoxy resin and a predetermined compound material are previously supplied into the hopper 50 through the hopper tube 48 in the direction of arrow E1 in the figure. The hopper 50 is fixed on the base 30 via an arm 51 shown in the figure, and an opening / closing valve (not shown) provided below the hopper 50 opens and closes the granular epoxy resin and a predetermined compound material. A predetermined amount is naturally dropped in the direction of arrow E2, so that it is temporarily stored in the supply unit 41 provided movably in the directions of arrows D2 and D3 below the hopper 50.

An arm 42 having the other end fixed to the carriage 43 is fixed to the supply unit 41.
As the carriage 43 is moved on the guide rail 44 in the direction of arrow D2 by the predetermined drive of the carriage motor 45, the granular epoxy resin and a predetermined compound material are opened through the opening 41a below the supply unit 41. The unit 32 is configured to be uniformly supplied into the die set 31.

When it is difficult to uniformly supply the granular epoxy resin and the predetermined compound material into the die set 31 only by natural fall, a squeegee is provided near the opening 41a of the supply unit 41. May be provided, and the material supplied in excess in the opening 32 may be removed. Alternatively, supply unit 4
A small amount may be constantly dropped by giving a slight vibration to one.

Next, FIG. 9 shows the thermosetting resin 1 after completion of molding.
FIG. 9 is an external view showing a state of a transfer device R that transfers a sheet 9 from the die set 31 to the above-described press device P after removing the same 9 from the die set 31. In this drawing, when the thermosetting resin 19 has a predetermined shape due to the moving compression action of the punch 40 in the die set 31 provided on the base 30, the die set 3
The movable die 34 moves so as to open the opening 32 in the width direction, and between the movable die 34 and the fixed die 33, the holding portion 55 h of the robot hand 55 is moved to the opening 32 of the die set 31.
To be able to sneak in. Thereafter, the gripping portion 55h of the robot hand 55 descends into the opening 32 of the die set 31, grips the thermosetting resin 19, and then ascends and temporarily takes it out of the die set 31. Thereafter, the thermosetting resin 19 is transferred in the direction of the arrow D5 in the figure while maintaining the gripping state of the gripping portion 55h of the robot hand 55, and the thermosetting resin 19 is prevented from dropping as shown in the drawing. Is placed on the guide 57 having

The thermosetting resin 19 placed on the guide 57 in this manner is conveyed to the runner 5 of the above-described press P by pressing the thermosetting resin 19 in the direction of arrow D6 in FIG. It is configured to be. By arranging the above-described thermosetting resin production apparatus and transport apparatus on the upstream side of the press apparatus P, a series of apparatuses capable of continuously supplying the thermosetting resin 19 having a desired shape can be configured. The volume of the runner formation portion can be greatly reduced, and the use efficiency of the thermosetting resin material and the compound can be increased to twice or more.

Next, a die set in which the thermosetting resin 19 is arbitrarily formed so as to have a desired cross-sectional shape is shown in FIG.
A description will be given with reference to FIGS. First, FIG.
2A, a bottom block 60 having a step 60a is built in a portion corresponding to the bottom of a die set 31 provided on a base 30, and forms the bottom of the die set 31. This bottom block 60 has an arm 6
6 is fixed, and by driving the arm 66 in the direction of the arrow D7 by driving the cylinder 65, the bottom block 6 is fixed.
0 can be moved in the direction of arrow D7.

On the other hand, below the bottom block 60, a bottom block retainer 61 having a step portion 61a is provided so that the step portions 60a, 61a can coincide with each other. A screw shaft 63 is screwed into a female screw portion 61e formed on the bottom block retainer 61.
And a motor 6 having a screw shaft 63 as an output shaft.
The bottom block retainer 61 is configured to be driven in the direction of arrow H in FIG.

In the configuration described above, when the punch 40 is moved in the direction of the arrow from the state shown in FIG. Compression molded. Next, when it is desired to make the height of the thermosetting resin 19 smaller, the cylinder 65 is driven to move the bottom block 60 upward through the arm 66 in FIG. Thereafter, the motor 62 having the screw shaft 63 as an output shaft
Is performed, and the bottom block retainer 61 is driven in the direction of arrow H in the figure so that the steps of the bottom block 60 and the bottom block retainer 61 coincide with each other at a higher position. 60e is at a higher position.

From the state shown in FIG.
When the punch 40 is moved in the direction of the arrow, the pressure is applied to the upper surface 6.
The thermosetting resin 19 is compression molded in the die set 31 as received at 0e, but the completed thermosetting resin 19 becomes smaller in the height direction. The thermosetting resin 19 completed through the above-described steps can be arbitrarily set in the height direction, so that the volume can be set arbitrarily. As a result, since a desired quantity can be arbitrarily prepared for each lot to be resin-packaged, waste of the thermosetting resin 19 can be eliminated. Providing a desired quantity arbitrarily for each lot in this manner is very important because unlike epoxy resin, epoxy resin cannot be reused once it is cured.

Next, FIGS. 11A and 11B are plan views of projection onto the base 30 showing the form of the die set 31 being opened. FIG. FIG. 11B shows a state where the die set 31 is open. In both figures, the die set 31
Is composed of a fixed die 33 and a movable die 34, and forms an opening 32. Through the opening 32, the material is uniformly supplied as described above and compressed by the punch 40. The thermosetting resin material 19 is obtained by
The inclined portions 33a and 34a and the inclined portions 33b and 34b are formed in each die continuously from the opening 32.

Further, counterbores 33e, 34e are formed in each die in a state where the compression spring 72 is compressed, and the inclined portion slides by the action of the compression spring 72 as shown in FIG. In this way, the thermosetting resin after molding can be taken out to the outside by the above-mentioned robot hand 55 so that the opening 32 extends in parallel with the width direction.

On the other hand, a cylinder 71 is attached to the movable die 34, and the movable die 34 is indicated by an arrow D in FIG.
It can be driven in 8 and 9 directions. In the configuration described above, the punch 40 in the state shown in FIG.
11 (b) after obtaining a molded product withstanding the compressive force of
Is configured to be taken out to the outside in the state shown in FIG.

By configuring the die set 31 in this manner, a parallel guide mechanism for driving the movable die 34 in parallel with the fixed die 33 is not required, and the die set 31 can be manufactured at lower cost. be able to. In addition, even when a dimensional change occurs in each component part due to thermal expansion, the dimensional change can be absorbed in the inclined portion, so that there is an advantage that dimensional management at the time of part processing or the like becomes relatively easy.
Further, since the number of components is small, the disassembling operation of the die set can be performed easily and within a short time.

As described above, according to this embodiment, FIG.
The thermosetting resin 19 appropriately manufactured using the thermosetting resin manufacturing apparatus Q shown in FIG.
, And set in the runner 5 of the press device P, and then the resin packaging can be performed by the press device P. As a result, the use efficiency of the resin for resin packaging can be greatly improved.

Further, since the thermosetting resin 19 having the optimal volume for resin packaging can be appropriately molded using the variable volume die set shown in FIG. A resin packaging material having a different shape and volume can be prepared at any time.

[0045]

As described above, according to the present invention, voids, chips, etc. of a resin packaging portion of a lead frame can be obtained by using a resin packaging mold that is exchanged for each type of electronic component. When performing resin packaging using a rod-shaped material that is pre-formed from a granular thermosetting resin material in order to perform resin packaging that prevents the occurrence of defects, a rod-shaped material having an optimal volume and shape is appropriately selected. By preparing, runners and gates that are molded at the same time other than for the resin packaging of the lead frame are assured even after minimizing waste of molded parts that are discarded as they are impossible to reproduce after resin packaging. To provide a resin packaging method and a resin packaging apparatus which are extremely excellent in profitability especially in small lot production. It is possible.

Further, it is possible to provide a die set which is easy to disassemble, is inexpensive and has excellent thermal stability for molding a thermosetting material.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part showing an embodiment of a resin packaging apparatus of the present invention.

FIG. 2 is a plan view of the cavity block of the first embodiment.

FIG. 3 is a cross-sectional view showing a state of resin packaging when the mold is opened.

FIG. 4 is a cross-sectional view showing a state of resin packaging when the mold is closed.

FIG. 5 is a cross-sectional view showing a state where filling of resin packaging is completed when the mold is closed.

FIG. 6 is an external perspective view of a semi-finished product after resin packaging.

FIG. 7 is an external perspective view of a semi-finished product after resin packaging.

FIG. 8 is an external perspective view of a thermosetting resin material manufacturing apparatus Q.

FIG. 9 is an external perspective view of a transfer device R for a thermosetting resin material.

FIG. 10 (a) shows a die set for arbitrarily molding the thermosetting resin 19 so as to have a desired cross-sectional shape.
It is the figure shown as X arrow sectional drawing. FIG. 9B is a view showing a die set for arbitrarily forming the thermosetting resin 19 so as to have a desired cross-sectional shape as a cross-sectional view taken along line XX of FIG. 8.

FIG. 11A is a plan view showing a state in which a die set is closed. (B) It is the top view showing the state where the die set was opened.

FIG. 12 is a plan view of a conventional mold as viewed from a separation surface.

FIG. 13 is a sectional view of a main part of a conventional mold.

FIG. 14 is a plan view of a conventional mold as viewed from a separation surface.

[Explanation of symbols]

 Reference Signs List 1 movable runner, 2A lower cavity block, 2B upper cavity block, 2C shape part, 3 lead frame, 3E positioning hole, 5 runner, 6 gate, 8 actuator, 9A lower backup plate, 9B upper backup plate, 19 Thermosetting resin, 20 positioning pin, 30 base, 31 die set, 32 opening, 33 fixed side die, 34 movable side die, 40 punch, 41 supply unit, 55 robot hand, 60 bottom block, 62 bottom block motor is there.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification number Agency reference number FI Technical display location // B29K 101: 10 B29L 31:34

Claims (3)

(57) [Claims] 1. A rod-like material made of a thermosetting resin material in a granular form so as to substantially conform to the inner shape of a horizontally long horizontally long runner in order to perform resin packaging on a lead frame on which a predetermined electronic element is mounted. A resin packaging method for performing resin packaging after forming a material in advance, wherein the volume of the space of the die set is variably set according to a horizontally long runner provided in a lower mold of a resin packaging device. A first preparation step of supplying the thermosetting resin material to the die set having a space that substantially matches the internal shape of the horizontally long runner so that the thermosetting resin material is distributed substantially uniformly; and A second step of compression-molding the thermosetting resin material supplied into the set by a punch to obtain the rod-shaped material; and after opening the die set, the rod-shaped A third step of taking out the material, charging the rod-shaped material into the horizontal runner, and moving the rod-shaped material by a movable runner driven in the horizontal runner with a mold closing operation of the resin packaging device. At a position opposed to the opening of the horizontally long runner, the lead frame is disposed at a line symmetrical position along the longitudinal direction of the horizontally long runner and is pressure-fed toward a plurality of cavities in which the lead frame is positioned and set in advance. A fourth step of pressure-feeding through a female-shaped part comprising a shape part and a gate provided on the upper die to form the runner thin-walled part, and integration of the lead frame after completion of the resin package with the mold opening operation An ejector pin for pressing the integrated object and the runner formed by the shape portion in order to remove the object from the mold Resin packaging method characterized by comprising a fifth step of releasing the the ejector pins that are arranged in the shaped portion in order to press the meat portion. 2. In order to perform resin packaging on a lead frame on which a predetermined electronic element is mounted, a rod-like member is formed by using a granular thermosetting resin material so as to substantially conform to the inner shape of a horizontally long horizontally long runner. A resin packaging apparatus for forming a resin in advance by molding a material, wherein a die set space section variable means is provided in a lower mold of the resin packaging apparatus and varies a volume of a space of the die set according to a horizontally long runner. Material supply means for supplying the thermosetting resin material to the die set having a space substantially conforming to the internal shape of the horizontally long runner so that the thermosetting resin material is substantially uniformly distributed; and A compression molding means for compressing and molding the thermosetting resin material by a punch to obtain the rod-shaped material; and removing the die-shaped material after opening the die set. Conveying means for feeding and feeding into the horizontal elongated runner, and with the mold closing operation of the resin packaging apparatus for the resin packaging, the rod-shaped material is previously transferred by a movable runner driven in the horizontal elongated runner. A plurality of cavities arranged at line-symmetrical positions along the longitudinal direction of the laterally long runner, and a portion opposed to the opening of the laterally long runner in order to feed the lead frame toward the positioned cavity. Pressing means for pressure-feeding through a female part consisting of a gate and a shape part provided on the upper die for molding the runner thin part, with the mold opening operation of the resin packaging device, after completion of the resin package An ejector pin for pressing the integrated body to take the integrated body of the lead frame out of the mold; A resin-packaging device, comprising: a take-out unit that presses out the runner thin-walled portion formed by the above-mentioned shape portion with an ejector pin disposed on the shape portion to take out the runner from the mold. . 3. The die set space portion changing means is configured to change a height of a bottom surface of the space portion to change a volume of the space portion of the die set, or the die set. Is composed of a fixed-side die and a movable-side die, and the space is formed by the fixed-side die and the movable-side die, and an inclined surface continuous with the space is formed on a joint surface of the fixed-side die and the movable-side die The resin packaging apparatus according to claim 2, wherein the resin packaging apparatus is configured to perform release.