JP2629502B2 - Connection method of film mounted with semiconductor chip - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TAB (Tape Automate).
The present invention relates to a method of connecting a film mounted with a semiconductor chip, which is referred to as a d-bonding technique, and more particularly to a connection method adapted to a reduction in the cost of the panel and a finer terminal pitch to be connected when applied to a liquid crystal display panel.

In the liquid crystal display industry, price competition is fierce, and how to produce high quality and low price liquid crystal displays is not only an important point, but also an increase in screen size and definition. Accordingly, the TAB mounting form is also finely pitched.

Therefore, when connecting a semiconductor chip mounting film (TAB film) to a panel substrate (substrate) using glass, it is important to align a TAB connection terminal formed on the substrate with a terminal provided on the TAB film. It will be a point.

[0004]

2. Description of the Related Art In a liquid crystal display panel, a plurality of TAs having a driving IC mounted thereon and provided with positioning marks are provided.
The connection between the B film and the display panel on which the positioning marks corresponding to those of the plurality of TAB films are formed is made by positioning a plurality of TAB films one by one on the panel and thermocompressing them. I was using.

[0005]

In a liquid crystal display device in which a plurality of TAB films must be connected to one substrate, it is necessary to repeatedly position and connect (thermo-compression bonding) the TAB films one by one to the substrates. Is difficult to reduce the price of the connection,
Automated methods have become essential.

[0006]

Above problems SUMMARY OF THE INVENTION A semiconductor chip mounting film (5) and when to connect to the panel substrate using glass (1), the shuttle table base plate (1) is fixed (13) a step of detecting at positioning mark at the right end provided on said substrate (1) (2 _-1) position and the imaging device position and the left edge of the positioning mark (2 _-n) (8) by for moving the, From the position information of the right and left end positioning marks (2 ₋₁ , 2 _−n ), the positioning mark (2) with respect to the moving direction of the shuttle table (13) is obtained.
_-1 , 2- _n ) A method for detecting a deviation angle (θ) in the alignment direction of a row.
The semiconductor chip mounting film (5) and the substrate so that the horizontal inclination of the pair of positioning marks (6) provided on the semiconductor chip mounting film (5) coincides with the deviation angle (θ). (1) a method of connecting a semiconductor chip mounting films and wherein <br/> comprise aligning the further after the aligning step, an anisotropic conductive resin off
A plurality of the semiconductor chips are mounted on the substrate (1) via a film.
Temporarily bonding the mounting film (5), and
The plurality of semiconductor chips temporarily crimped at a high temperature and a high pressure.
Including a step of thermocompression bonding the mounting film (5)
This is achieved by the method for connecting a semiconductor chip mounting film described above.

[0007]

According to the above means, when connecting the substrate 1 to a plurality of semiconductor chip mounting films, the inclination angle of the film positioning mark array formed on the substrate 1 is detected, and the film to be connected according to the inclination angle is detected. 5 contact by performing the position adjustment of the tilt angle and the horizontal direction of (the film set table)
To continue, further lower pressure than the normal thermocompression bonding conditions, the temporary pressure bonding of the film 5 at low temperature, after repeated only single number of times of the film 5, the temporary crimped plurality of films 5 by simultaneously thermocompression bonding, Compared to the conventional method in which thermocompression bonding is repeated one by one, connection of a plurality of films 5 is facilitated , and high precision and automation can be achieved.

In this method, since the pre-compression is performed at a lower pressure and a lower temperature than in full-scale thermo-compression, the alignment of the film 5 is easier and more accurate than the method in which the thermo-compression is repeated one by one. Therefore, automation that is difficult to achieve by a method in which thermocompression bonding is repeated one by one becomes possible, and the present invention is applied to a liquid crystal display device, which saves labor, increases productivity, and achieves cost reduction.

[0009]

FIG. 1 is a perspective view for explaining main steps of the method of the present invention, FIG. 2 is a front view of a crimping apparatus according to an embodiment of the present invention, and FIG. 3 is a plan view of the apparatus shown in FIG. .

In FIG. 1A, a rectangular substrate (liquid crystal display panel) 1 made of glass has positioning marks (for example, a pair of + marks) 2 corresponding to a plurality of TAB films to be connected, and connection terminals 3. Is formed, and a thin anisotropic conductive film 4 is laminated thereon.

In FIG. 1B, the substrate 1 is fixed to a shuttle table (not shown) which moves in the left-right direction, and an image pickup device (CCD) 8 disposed below the shuttle table is used. The position coordinates of the positioning mark _2-1 located at are detected.

Next, as shown in FIG. 1C, the substrate 1 (shuttle table) is moved rightward, and the position coordinates of the positioning mark 2- _n located at the leftmost end of the substrate 1 are determined using the imaging device 8. detecting, from the detected coordinates of the mark 2 _-1 and 2 _-n, the moving direction and the mark 2 _-1 substrate 1, to detect the displacement angle θ between the straight line connecting the 2 _-n.

As shown in FIG. 1D, a pair of marks 6 corresponding to the positioning marks 2 and terminals 7 corresponding to the terminals 3 are formed on the TAB film 5 on which an IC (not shown) is mounted. Mounted on a TAB film table (not shown) that can move in the direction and rotate in the horizontal plane,
One TAB film 5 transported so that the pair of marks 6 and the terminals 7 are located above the substrate 1 is disposed below the shuttle table and is moved to a pair of imaging devices 9 and 10 which can move in the left-right direction. opposite.

Then, the imaging devices 9 and 10 move the position coordinates of the pair of marks 6 formed on the TAB film 5 and the pair of marks 2 opposed to each other by the pair of marks 6 (2 and 2 _{-1 in} FIG. 1D). ) Is detected, and the position of the film 5 is adjusted by a control device (not shown).

TA by operation of TAB film table
The position adjustment of the B film 5 is performed by rotating the straight line connecting the pair of marks 6 so as to be parallel to the straight line connecting the marks _2-1 and 2- _n , and moving the left and right directions so that the marks 2 and 6 are aligned. Since the terminals 3 and 7 overlap in the length direction thereof, the operation is not performed in the front-back direction of the TAB film 5 in principle.

Thereafter, the TAB film 5 is temporarily bonded to the substrate 1 as shown in FIG. The temporary crimping is TA
The temperature and pressure of the B film 5 are set to a lower temperature and a lower pressure, for example, 120 ° C. and 5 kg / cm ² than the conditions for thermocompression bonding of the substrate 1 to the substrate 1.
When the final compression bonding is performed under the conditions of 150 ° C. and 20 kg / cm ² , the terminals 3 and 7 are electrically connected via the anisotropic conductive film 4, and the connection is performed by bonding the cured anisotropic conductive film 4. , Will be maintained by the contraction force.

2 and 3, an automatic crimping apparatus 11 for crimping a plurality of TAB films 5 on a substrate 1 along one side of a rectangular substrate 1 is used to compress a substrate (1) supplied to a substrate setting stage 12. The transfer arm 14 that moves in the left-right direction and moves up and down moves to the shuttle table 13.

The TAB film (5) mounted on the TAB film supply table 16 from the TAB film supply section 15 is:
It is mounted on a TAB film set table 18 by a transfer arm 17 that moves in the left-right direction and moves up and down, and is fixed by vacuum suction.

A shuttle table 13 movable in the left and right directions as shown by arrows in FIG. 2 fixes the mounting substrate by vacuum suction, and stops at a position where the TAB film set table 18 and the temporary pressure wedge 19 face each other. A TAB film (5) is temporarily bonded to the substrate (1) by the method described with reference to FIG.

While moving the shuttle table 13 by a predetermined amount, a new TAB film (5) is supplied to the TAB film set table 18, and when the predetermined number of TAB films (5) are temporarily pressed, the shuttle table 13 is moved to a buffer. When located at the left end of the table 20, the substrate (1) mounted on the shuttle table 13 is transferred to the buffer table 20 by the transfer arm 21 that can move in the left-right direction, and the substrate (1) mounted on the buffer table 20 is moved. ) Is transferred to the thermocompression bonding table 23 by the transfer arm 21.

A thermocompression table 23 movable in the front-rear direction.
When the TAB film crimping part is retracted to the position facing the thermocompression wedge 24 and the TAB film crimping operation is completed by the downward pressing operation of the thermocompression wedge 24, it returns to the forward position and completes the full crimping of the TAB film (5). Substrate (1)
Is the substrate unloading table 25 by operating the transfer arm 21.
Moved to

2 and 3, 26 is a main operation panel, 27 is a temporary crimping operation panel, 28 is a main crimping operation panel, 29 is a display device for a control device (personal computer), and 30 is a display device for an imaging device. Device, 31 is a guide rail when the transfer arm 14 moves in the left and right direction, 32 is the transfer arm 17
Is a guide rail when the transfer arm 21 moves in the left-right direction, 33 is a guide rail when the transfer arm 21 moves in the left-right direction, and 34 is a housing containing various control devices and the like.

[0023]

As described above, according to the method of the present invention, since the temporary compression is performed at a lower pressure and lower temperature than the thermal compression, the alignment of the film 5 is easier and higher than in the method of repeating the thermal compression one by one. Accuracy. Therefore, automation that is difficult to achieve by a method in which thermocompression bonding is repeated one by one becomes possible, and the present invention can be applied to a liquid crystal display device to make the connection terminal pitch finer and improve the reliability of connection, thereby reducing labor and productivity. Improvements and lower prices are achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view for explaining main steps of the method of the present invention.

FIG. 2 is a front view of a crimping device according to an embodiment of the method of the present invention.

FIG. 3 is a plan view of the device shown in FIG. 2;

[Explanation of symbols]

1 is a liquid crystal display panel (square substrate) 2, 2, _-1 and 2- _n are TAB film connection positioning marks formed on a square substrate 5 is a TAB film (semiconductor chip mounting film) 6 is a mark formed on a TAB film 8, 9 and 10 are imaging devices 13 is a shuttle table 18 is a TAB set table (film set table) 19 is a temporary crimp wedge 24 is a full crimp wedge

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Toshiaki Sukeda 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited (56) References JP-A-55-140239 (JP, A) JP-A-64-28621 (JP, A) JP-A-63-152134 (JP, A) JP-A-3-108789 (JP, A) JP-A-3-129843 (JP, A) JP-A-2-142569 (JP, U)

Claims (2)

(57) [Claims] 1. A method of connecting a semiconductor chip mounting film (5) to a panel substrate (1) using glass, wherein a shuttle table (13) to which the substrate (1) is fixed is moved.
The rightmost position provided on the substrate (1) by moving
Positioning mark (2 _-1 ) position and leftmost positioning mark
Step of detecting the position of (2- _n ) by the imaging device (8)
And the positions of the right and left end positioning marks (2 ₋₁ , 2 _−n )
According to the information, the direction of movement of the shuttle table (13) is
The positioning mark (2 _-1, 2 _-n) to not column alignment direction
Detecting the tilt angle (θ), and a pair of positions provided on the semiconductor chip mounting film (5).
The inclination of the decision mark (6) in the left-right direction is the deviation angle (θ).
The semiconductor chip mounting film (5)
And a step of aligning the substrate and the substrate (1) . 2. An anisotropic conductive tree after the positioning step.
A plurality of the semiconductor chips are attached to the substrate (1) through a resin film.
Temporarily mounting the film (5), and the plurality of the plurality of pieces temporarily pressed at a higher temperature and a higher pressure than the temporary bonding.
Thermocompression bonding of the semiconductor chip mounting film (5)
The method for connecting a film mounted with a semiconductor chip according to claim 1, wherein: