JP2631678B2 - Circuit board and its manufacturing method - Google Patents
Circuit board and its manufacturing methodInfo
- Publication number
- JP2631678B2 JP2631678B2 JP63017396A JP1739688A JP2631678B2 JP 2631678 B2 JP2631678 B2 JP 2631678B2 JP 63017396 A JP63017396 A JP 63017396A JP 1739688 A JP1739688 A JP 1739688A JP 2631678 B2 JP2631678 B2 JP 2631678B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- circuit board
- projection
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、突起部を設けてある回路基板およびその製
法に関する。Description: TECHNICAL FIELD The present invention relates to a circuit board provided with a projection and a method for manufacturing the same.
（従来の技術） 従来、突起部を設けてある回路基板の製法として、メ
ッキ適合プラスチックとメッキ不適合プラスチックとを
用いて２色成形によるものが知られている。(Prior Art) Conventionally, as a method of manufacturing a circuit board provided with a projection, a method of two-color molding using a plating-compatible plastic and a plating-incompatible plastic is known.
（発明が解決しようとする課題） しかしながら、この方法では、２色成形であるために
装置が複雑となり、そして材料としてメッキ適合プラス
チックとメッキ不適合プラスチックとの２種類を必要と
しているために材料の選択の自由度が低く、異種の材質
からなるために両者の密着性が良くなく、さらに回路基
板用のメッキ不適合プラスチックとして適当なものが少
なく、実際に製品化するには不十分なものであった。(Problems to be Solved by the Invention) However, in this method, the apparatus is complicated due to the two-color molding, and the selection of the material is required because two kinds of materials, a plating-compatible plastic and a plating-incompatible plastic, are required. The degree of freedom was low, the adhesion between the two was poor due to the use of different materials, and there were few suitable plastics that were not compatible with plating for circuit boards, which was insufficient for actual commercialization. .
本発明の目的は、簡単な装置で確実に製作することが
でき、材料の選択の幅が広く、密着不良の問題も生じな
い回路基板およびその製法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit board which can be reliably manufactured with a simple apparatus, has a wide selection of materials, and does not cause a problem of poor adhesion, and a method for manufacturing the same.
（課題を解決するための手段） 本発明の特許請求の範囲第１項記載の回路基板の特徴
は、基板１に突起部3,3a〜3dを形成し、この突起部の回
りに堀部31a〜31dを設けてあり、上記突起部に回路部４
を形成してあり、上記堀部に突起部の回路部４と基板１
の回路部5,5a,5bと接続する橋部32,32bを設けているも
のである。(Means for Solving the Problems) A feature of the circuit board according to the first aspect of the present invention is that a protrusion 3, 3a to 3d is formed on the substrate 1, and a moat 31a to 311 around the protrusion. 31d is provided, and the circuit portion 4
Are formed on the moat part, and the circuit part 4 of the protrusion part and the substrate 1 are formed.
Bridge portions 32, 32b connected to the circuit portions 5, 5a, 5b.
本発明の特許請求の範囲第２項記載の回路基板の製法
の特徴は、突起部3,3a〜3dの回りに堀部31,31bを設け、
かつこの堀部に上記突起部と基板本体とを連絡する橋部
32,32bを形成している基板の表面をメッキし、つぎにこ
の基板本体の基板面および橋部上のメッキ膜７の回路部
を形成すべき位置にレジスト８を付着させ、その後、上
記突起部を、注入治具9aの注入穴部91aの一方の開口92a
に対向させて、上記突起部の回路部４を形成すべきメッ
キ膜７を上記注入穴部に位置させて、この注入穴部の他
方の開口93aからエッチングレジスト11を注入して、こ
のエッチングレジストによって、上記突起部の回路部４
を形成すべきメッキ膜７と、このメッキ膜に連続してい
る橋部上のメッキ膜７を覆うレジスト８とを、それぞれ
被覆させたことを特徴とするものである。The feature of the method of manufacturing a circuit board according to claim 2 of the present invention is that moat portions 31 and 31b are provided around the projections 3 and 3a to 3d,
And a bridge connecting the protrusion and the substrate body to the moat
The surface of the substrate on which the 32, 32b is formed is plated, and then a resist 8 is attached to the substrate surface of the substrate main body and the bridge portion at the position where the circuit portion of the plating film 7 is to be formed. Part, one opening 92a of the injection hole 91a of the injection jig 9a.
With the plating film 7 on which the circuit portion 4 of the projection is to be formed positioned in the injection hole, an etching resist 11 is injected from the other opening 93a of the injection hole, and the etching resist is As a result, the circuit portion 4
And a resist 8 covering the plating film 7 on the bridge portion continuous with the plating film.
（実施例） まず、回路基板の具体的構成を説明する。(Example) First, a specific configuration of a circuit board will be described.
第１図において、回路基板１には、その上面へ突出し
た円筒状、円柱状の突起部2,2aと円柱状、角柱状の突起
部3,3a,3b,3c,3dを設けてある。そこで、以下、各突起
部の形状について説明する。In FIG. 1, a circuit board 1 is provided with cylindrical and columnar projections 2, 2a and columnar and prismatic projections 3, 3a, 3b, 3c, 3d projecting from the upper surface thereof. Therefore, the shape of each projection will be described below.
先ず、一方突起部２は基部にこの突起部の径より大き
な径の段部21を備えており、この突起部の表面にメッキ
膜からなる回路部４を形成してある。なお、突起部2a
も、突起部２と同様の形状の段部21aを設けてあり、こ
の突起部の表面には回路部４を形成してある。First, the projection 2 has a step 21 having a diameter larger than the diameter of the projection at the base, and a circuit portion 4 made of a plating film is formed on the surface of the projection. The protrusion 2a
Also, a step 21a having the same shape as the projection 2 is provided, and a circuit section 4 is formed on the surface of the projection.
また他方の突起部３もその表面に回路部４を形成して
あり、その基部の回りが堀部31となっている。この堀部
には、橋部32を設けて、突起部３と基板１とを連絡して
いる。橋部32上には、基板１上の線状の回路部５のうち
の１つの回路部5aの一端が伸びてきており、この一端が
橋部上で突起部３の回路部４と接続している。なお、突
起部3a,3b,3c,3dも突起部３と同様の構成であり、その
回りに堀部31a,31b,31c,31dが配設され、橋部（橋部32b
のみ図示）を配置している。なお、突起部3bの表面の回
路部４は、橋部32b上で回路部5bと接続している。The other protruding portion 3 also has a circuit portion 4 formed on its surface, and a moat portion 31 is formed around the base portion. A bridge 32 is provided in the moat to connect the protrusion 3 to the substrate 1. One end of one circuit portion 5a of the linear circuit portion 5 on the substrate 1 extends on the bridge portion 32, and this one end is connected to the circuit portion 4 of the projection 3 on the bridge portion. ing. The projections 3a, 3b, 3c, 3d have the same configuration as the projection 3, and moats 31a, 31b, 31c, 31d are arranged around the projections 3a, 3b, 3c, 3d.
(Only shown). The circuit section 4 on the surface of the projection 3b is connected to the circuit section 5b on the bridge section 32b.
基板１の下面にも回路部６を形成してあり、図示の例
では突起部２の回路部４と導通している。The circuit portion 6 is also formed on the lower surface of the substrate 1, and is electrically connected to the circuit portion 4 of the projection 2 in the illustrated example.
次に回路基板の製法を説明する。 Next, a method of manufacturing a circuit board will be described.
第２図（ａ）〜（ｃ）に示すように基板１全面に公知
の方法で銅メッキ膜７を形成する。同時、突起部２の軸
心を貫通する孔22の内面にもメッキ膜７が形成される。
なお、第２図（ｂ）の鎖線は、基板１上に回路部５を形
成すべき位置を示す。As shown in FIGS. 2A to 2C, a copper plating film 7 is formed on the entire surface of the substrate 1 by a known method. At the same time, the plating film 7 is formed on the inner surface of the hole 22 passing through the axis of the projection 2.
2 (b) indicates a position where the circuit section 5 is to be formed on the substrate 1.
第３図（ａ）〜（ｃ）に示すようにメッキした基板の
回路パターンを形成すべき位置に電着塗装によりフォト
レジスト８を形成する。すなわち、基板１をレジスト8a
の溶液に浸漬して電荷を負荷することにより、水に分散
した感光性樹脂を陽極である基板上へ析出させ、析出し
たレジストに対して紫外線を照射して、露光し、現像を
行うことにより水溶性ネガティブ型レジスト８を形成す
る。As shown in FIGS. 3 (a) to 3 (c), a photoresist 8 is formed on a plated substrate at a position where a circuit pattern is to be formed by electrodeposition coating. That is, the substrate 1 is
By applying a charge by immersing in a solution of the above, the photosensitive resin dispersed in water is deposited on the substrate serving as an anode, and the deposited resist is irradiated with ultraviolet rays, exposed, and developed. A water-soluble negative type resist 8 is formed.
その後、基板１を第４図（ａ）〜（ｃ）に示すように
注入治具９上に載せ、突起部２を治具の注入穴91内に嵌
合し、この突起部の基部に設けてある段部21を注入穴の
一方（上端）の開口92の縁部上にセットする。この時、
注入穴91の開口92の内径は段部21より狭く、突起部２の
外形より大きいので、この突起部と注入穴の内面との間
に間隔10ができる。その後、注入穴91の他端開口である
注入口側93からエッチングレジスト11を注入し、このレ
ジストは上端開口より上方に溢れて、開口92の縁部のフ
ォットレジスト８をその外周を残して覆う。エッチング
レジスト11の注入工程では、段部21が注入穴91の一端
（上端）開口92の縁部に密着するので（第４図）、この
レジストがこの開口から外側へ漏れることがない。そし
て第５図（ａ），（ｂ）に示すように基板１を注入治具
９から外し、その後、基板をエッチングをして、基板か
らフォトレジスト８及びエッチングレジスト11を剥離す
ると、第６図（ａ）〜（ｃ）に示すような回路部４が形
成された突起部２を有する回路基板が形成される。Thereafter, the substrate 1 is placed on the injection jig 9 as shown in FIGS. 4 (a) to 4 (c), the projection 2 is fitted into the injection hole 91 of the jig, and provided at the base of the projection. The set step 21 is set on the edge of the opening 92 at one (upper end) of the injection hole. At this time,
Since the inner diameter of the opening 92 of the injection hole 91 is smaller than the step 21 and larger than the outer shape of the projection 2, a space 10 is formed between the projection and the inner surface of the injection hole. Thereafter, an etching resist 11 is injected from the injection port side 93, which is the other end opening of the injection hole 91, and this resist overflows from the upper end opening and covers the photo resist 8 at the edge of the opening 92 except for its outer periphery. . In the step of injecting the etching resist 11, the step 21 is in close contact with the edge of the one end (upper end) opening 92 of the injection hole 91 (FIG. 4), so that the resist does not leak outside from this opening. Then, as shown in FIGS. 5 (a) and 5 (b), the substrate 1 is removed from the injection jig 9, and then the substrate is etched to remove the photoresist 8 and the etching resist 11 from the substrate. A circuit board having the protruding portion 2 on which the circuit portion 4 is formed as shown in (a) to (c) is formed.
上例で突起部２の場合を例にとって製法を説明した
が、突起部３の場合を第７〜10図を参照して説明する。In the above example, the manufacturing method has been described by taking the case of the protrusion 2 as an example, but the case of the protrusion 3 will be described with reference to FIGS.
第７図に示すように、全面にメッキ膜７を形成した基
板１の回路パターンを形成すべきに位置に電着塗装によ
りフォトレジスト８を形成する。As shown in FIG. 7, a photoresist 8 is formed by electrodeposition coating at a position where a circuit pattern of the substrate 1 having the plating film 7 formed on the entire surface is to be formed.
その後、基板１を第８図に示すように注入治具9a上に
載せ、突起部３を治具の注入４穴91a内に嵌合し、この
突起部の基部に設けてある基板と突起部とを結合する橋
部32を注入穴91aの一端（上端）開口縁部92a上にセット
する。この時、注入穴91aの径は柱入穴内の突起部３の
それより大きいので、突起部と注入穴の内周との間に間
隙10aができる。その後、注入穴91aの他端開口である注
入口93aからエッチングレジスト11を注入すると、レジ
ストは突起部３のメッキ膜７および橋部32上のフォトレ
ジスト８を覆う。橋部32以外のレジスト11は堀部31の底
に向って伸び、注入のばらつきを堀部によって遮断す
る。Thereafter, the substrate 1 is placed on the injection jig 9a as shown in FIG. 8, the projection 3 is fitted into the injection hole 91a of the jig, and the substrate provided at the base of the projection and the projection are connected. Is set on one end (upper end) opening edge 92a of the injection hole 91a. At this time, since the diameter of the injection hole 91a is larger than that of the projection 3 in the pillar insertion hole, a gap 10a is formed between the projection and the inner periphery of the injection hole. Thereafter, when the etching resist 11 is injected from the injection port 93a, which is the other end opening of the injection hole 91a, the resist covers the plating film 7 of the projection 3 and the photoresist 8 on the bridge 32. The resist 11 other than the bridge portion 32 extends toward the bottom of the moat portion 31, and the variation in implantation is blocked by the moat portion.
そして第９図（ａ），（ｂ）に示すように基板１を注
入治具9aから外し、その後、基板をエッチングをして、
基板からフォトレジスト８及びエッチングレジスト11を
剥離すると、第10図（ａ），（ｂ）に示すような回路部
４が形成された突起部３を有する回路基板が形成され、
同時にこの回路部４は回路基板の回路部5aと連続され
る。Then, as shown in FIGS. 9 (a) and 9 (b), the substrate 1 is removed from the injection jig 9a, and thereafter, the substrate is etched.
When the photoresist 8 and the etching resist 11 are peeled off from the substrate, a circuit board having the projecting portions 3 on which the circuit portions 4 are formed as shown in FIGS. 10 (a) and 10 (b) is formed.
At the same time, the circuit section 4 is connected to the circuit section 5a on the circuit board.
突起部は上例では、基板１上面より突出させたが、突
起部上面は基板の面より低いものであってもよく、また
突起部を基板の上下両面に設けてもよい。In the above example, the protruding portion protrudes from the upper surface of the substrate 1, but the upper surface of the protruding portion may be lower than the surface of the substrate, or the protruding portions may be provided on both upper and lower surfaces of the substrate.
（発明の効果） 以上説明したように、本発明によれば、従来のような
メッキ適合不適合の２種類のプラスチックを用いて製作
しないので、材料の選択の幅が広く、かつ１つの金型で
１度の成形ですみ、密着性不良の問題も生じない。ま
た、突起部の回りに堀部を設けてあるので、レジストの
柱入のバラツキが堀部内にとどまり、回路基板の他の導
体部と短絡することがなく、確実に電気的絶縁がされた
回路基板を製作できる。突起部の基部に橋部を設けてい
るので、突起部の回路と回路基板本体の回路とを確実に
電気的に接続することができる。また突起部を有する回
路基板を、簡単な装置で複雑な工程を経ることなく製作
することができる。(Effects of the Invention) As described above, according to the present invention, since it is not manufactured using two types of plastics which are not compatible with plating as in the past, a wide range of materials can be selected and one mold can be used. Only one molding is required, and there is no problem of poor adhesion. In addition, since the moat is provided around the protruding portion, the variation in the insertion of the resist stays in the moat and does not short-circuit with other conductors of the circuit board, and the circuit board is reliably electrically insulated. Can be manufactured. Since the bridge is provided at the base of the protrusion, the circuit of the protrusion and the circuit of the circuit board main body can be reliably electrically connected. Further, a circuit board having a protruding portion can be manufactured with a simple apparatus without going through complicated steps.
第１図は回路基板の斜視図、 第２図〜第６図は突起部２の回路部の形成過程を示す段
階的に示す工程図であって、第2,3図（ａ），（ｂ），
（ｃ）は平面図、縦断面図、底面図であり、第４図
（ａ），（ｂ）は平面図、縦断面図、同図（ｃ）は第４
図（ｂ）のIV−IV線断面図、第5,6図（ａ），（ｂ）は
平面図、縦断面図、第６図（ｃ）は底面図であり、第７
図〜第10図は突起部３の回路部の形成過程を段階的に示
す工程図であり、第7,8図は断面図、第9,10図（ａ），
（ｂ）は断面図、底面図である。 １……回路基板、 3,3a〜3d……突起部、 31,31a〜31d……堀部、 32,32b……橋部、 4,5,5a,5b……回路部、 ７……メッキ膜、 ８……フォトレジスト、 9,9a……注入治具、 91,91a……注入穴部、 92,92a,93,93a……開口、 11……エッチングレジスト。FIG. 1 is a perspective view of a circuit board, and FIGS. 2 to 6 are step-by-step process diagrams showing a process of forming a circuit portion of a projection 2, and FIGS. ),
FIG. 4C is a plan view, a longitudinal sectional view, and a bottom view, and FIGS. 4A and 4B are a plan view, a longitudinal sectional view, and FIG.
FIG. 5B is a cross-sectional view taken along the line IV-IV, FIGS. 5A and 5B are plan views, longitudinal cross-sectional views, and FIG.
FIGS. 7 to 10 are process drawings showing stepwise the process of forming the circuit portion of the projection 3. FIGS. 7 and 8 are sectional views, and FIGS.
(B) is sectional drawing and bottom view. 1 ... Circuit board, 3,3a-3d ... Protrusion, 31,31a-31d ... Hori, 32,32b ... Bridge, 4,5,5a, 5b ... Circuit, 7 ... Plating film 8 Photoresist 9,9a Injection jig 91,91a Injection hole 92,92a 93,93a Opening 11 Etching resist.
Claims (2)
に堀部を設けてあり、上記突起部に回路部を形成してあ
り、上記堀部に突起部の回路部と基板の回路部とを接続
する橋部を設けてあることを特徴とする回路基板。1. A projecting portion is formed on a substrate, a moat is provided around the projecting portion, a circuit portion is formed on the projecting portion, and a circuit portion of the projecting portion and a circuit portion of the substrate are formed on the moat portion. A circuit board provided with a bridge portion for connecting to a circuit board.
記突起部と基板本体とを連絡する橋部を形成している基
板の表面をメッキし、 この基板本体の基板面および橋部上のメッキ膜の回路部
を形成すべき位置にレジストを付着させ、 その後、上記突起部を、注入治具の注入穴部の一方の開
口に対向させて、上記突起部の回路部を形成すべきメッ
キ膜を上記注入穴部に位置させて、この注入穴部の他方
の開口からエッチングレジストを注入して、 このエッチングレジストによって、上記突起部の回路部
を形成すべきメッキ膜と、このメッキ膜に連続している
橋部上のメッキ膜を覆うレジストとを、それぞれ被覆さ
せたことを特徴とする回路基板の製法。2. A moat part is provided around the protrusion, and a surface of a substrate forming a bridge connecting the protrusion and the substrate main body is plated on the moat, and a substrate surface of the substrate main body and the bridge part are plated. A resist is adhered to a position where a circuit portion of the upper plating film is to be formed. Thereafter, the protrusion is opposed to one opening of the injection hole of the injection jig to form a circuit of the protrusion. A plating film to be formed is positioned in the injection hole, and an etching resist is injected from the other opening of the injection hole. A method of manufacturing a circuit board, comprising coating a resist covering a plating film on a bridge portion continuous with the film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63017396A JP2631678B2 (en) | 1988-01-29 | 1988-01-29 | Circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63017396A JP2631678B2 (en) | 1988-01-29 | 1988-01-29 | Circuit board and its manufacturing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31415096A Division JPH09107161A (en) | 1996-11-12 | 1996-11-12 | Circuit board and the manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01194382A JPH01194382A (en) | 1989-08-04 |
| JP2631678B2 true JP2631678B2 (en) | 1997-07-16 |
Family
ID=11942836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63017396A Expired - Lifetime JP2631678B2 (en) | 1988-01-29 | 1988-01-29 | Circuit board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2631678B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967961U (en) * | 1982-10-29 | 1984-05-08 | パイオニア株式会社 | Printed board |
-
1988
- 1988-01-29 JP JP63017396A patent/JP2631678B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01194382A (en) | 1989-08-04 |
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