JP2642852B2 - Chip electronic component holding method and jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a jig for holding a chip-shaped electronic component, and more particularly, to holding the surface of a chip-shaped electronic component upward when performing processing such as printing on a surface other than the end face. The present invention relates to a method for holding a chip-shaped electronic component and a holding jig therefor.

[0002]

2. Description of the Related Art A chip-shaped electronic component has a circuit in which a plurality of electronic elements such as capacitors and inductors are provided in a single rectangular ceramic body, and elements are connected on the body or on the surface of the body. The circuit terminal is led out to the end face of the body and connected to an external electrode formed on the end face of the body.

[0003] For example, in an EMI noise removal filter in which two inductors and one capacitor are provided inside a laminate in which a ferrite magnetic material and a ceramic dielectric are integrally formed, a perspective view of FIG. As shown in the equivalent circuit diagram of b), an input terminal (IN terminal) 2 and an output terminal (OUT terminal) 3 are formed on both end surfaces of a chip element 1 made of a thin rectangular ceramic laminate, and a ground terminal is provided on a side surface. A (G terminal) 4 is formed, and a connection point (NC terminal) 5 for connecting the two inductors and the capacitor is formed on a side surface facing the (G terminal) 4.

The following method is known as a method of forming such an external electrode.

That is, as shown in an exploded perspective view of FIG. 4, a plurality of circular through holes 8 are formed at equal intervals in a flat plate composed of an elastic body 7 supported by a frame-shaped metal frame 6. Then, a holding plate 9 for holding the chip element with the elasticity of the elastic body in the circular through hole and a metal guide plate 10 for guiding the chip element to the through hole of the holding plate are prepared.

A through hole 8 is formed in the guide plate 10 at a position corresponding to the through hole of the holding plate. One end of the through hole 8 is a funnel-shaped opening 11.

In order to form external electrodes on the end face of the element using these jigs, the holding plate 9 and the guide plate 10 are overlapped, the chip element is placed on the guide plate, and when the plate is vibrated, the chip element becomes funnel-shaped. One by one enters the hole having the opening while standing in the longitudinal direction (vertical installation). After the chip elements that did not enter the holes were removed, the elements that entered the holes of the guide plate were pushed with a push plate in which pins corresponding to the holes of the plate were implanted, and the ends of the elements were inserted through the holes of the holding plate. In this state, the conductive paste layer is applied so as to be exposed.

The G terminal and the NC terminal are formed on the side surface of the body. For this purpose, the longitudinal direction of the body is inserted sideways (horizontally) into the hole of the holding plate, and the side surface of the body is placed on the surface of the holding plate. It is necessary to carry out printing or the like while keeping in parallel.

[0009]

As described above, the holes of the holding plate used for printing or the like on the main surface or the side surface of the rectangular element are provided with elasticity at the four corners of the element by placing the rectangular element horizontally. Since it is operated and held, it is held in a state where the holding force is inferior to that held vertically.

In the conventional method, the hole of the guide plate is a hole opened in a funnel shape, the direction of the chip element entered therein is random, and it is attempted to insert the chip element horizontally into the holding plate. Then, the pressing force of the push plate pin is not necessarily applied uniformly to the four corners, and if the balance of the force applied to the four corners is lost, it sinks into the hole from one corner and finally falls into the vertical position and falls into the hole However, there is a problem that the probability of being held by the holding plate is low, and the productivity is poor.

Accordingly, an object of the present invention is to provide a method of holding a chip-shaped electronic component for holding a rectangular element in a stable horizontal position, and a holding jig for the method.

[0012]

Means for Solving the Problems As a result of research conducted to achieve the above object, the present inventors have found that a through hole is formed on a support plate in which a plurality of pins are provided on a metal flat plate so as to be vertically movable. It has been found that the conventional problem can be solved by superposing a holding plate made of an elastic body and a guide plate for guiding the chip element into the through hole and pushing the chip element into the through hole. Reached.

Accordingly, the present invention firstly provides a method for coating or printing a conductor on a surface other than an end surface of a chip-shaped electronic component while holding the chip-shaped electronic component having a rectangular cross section using a holding plate jig. A method of holding a chip-shaped electronic component, wherein a through-hole is formed in a main surface of an elastic body on a support plate having a structure in which a plurality of pins are vertically movably mounted on a flat plate, and the elasticity of the through-hole is A holding plate having a structure capable of holding the electronic component chip element in a horizontal state is overlapped so that the plurality of pins are inserted into the through holes at the corresponding positions, and further thereon, the chip element is inserted into the through hole of the holding plate. A plurality of guide plates having a structure in which a plurality of funnel-shaped holes for guiding are provided corresponding to the respective through holes of the holding plate are stacked, and a chip element is introduced into the funnel-shaped opening, and a push pin provided separately. With each chip element A chip-shaped electronic component characterized in that it is pushed in against the elasticity provided by the support pins of the support plate inserted into the through holes and horizontally holds the surface of each chip element and the upper surface of the holding plate. Secondly, a holding plate having a structure in which a plurality of pins are vertically movably mounted on a flat plate, and a through-hole formed in a main surface of the elastic body, and the elasticity of the through-hole allows a chip element for an electronic component to be formed. A guide having a structure in which a plurality of holding plates having a structure capable of being held in a horizontal state and a plurality of holes formed in a funnel shape for guiding chip elements to through holes of the holding plate are provided corresponding to the respective through holes of the holding plate. The present invention provides a chip-shaped electronic component holding plate jig, wherein a plate and a plate are stacked in the above order.

[0014]

According to the method of the present invention, a vertically movable pin provided on the support plate is inserted into the through hole of the holding plate, and the bottom is constituted by the end face of the pin in the through hole. In this state, when a chip element having a rectangular cross section is inserted horizontally, the chip element is inserted into the through hole of the holding plate by the pressing force of the push pin.

If the forces applied to the four corners of the chip element at the time of insertion are not balanced, the chip element is inserted deeply from one corner, and the chip element tends to tilt and drop. It is supported and the fall is prevented.

When the push pin is further lowered, the chip element is corrected and becomes horizontal. When the push pin further descends, the support pin descends while opposing the pushing force of the push pin. When the pushing pin has finished descending, the chip element is horizontally held by the elasticity of the support plate. Since the elasticity of the support pins is designed to be weaker than the elasticity of the holding plate for holding the chip element, the equilibrium state is maintained as it is.

Therefore, even if an unbalanced force acts on the chip element at the time of insertion, the chip element does not fall down and has a function of being surely placed horizontally. The elasticity of the support pin of the support plate is given by a spring-like spring.

[0018]

FIG. 1 is a perspective view showing the appearance of a holding plate jig used in this embodiment, and FIG. 2 is a perspective view (a in FIG. 1) of a guide plate constituting the uppermost layer of the jig of FIG. FIG. 3 is a cross-sectional view showing the shape of a through hole provided in the plate (FIG. 3B);
1 is a perspective view of the support plate constituting the lowermost layer of the jig of FIG. 1 (FIG. 1A) and a cross-sectional view showing the structure of a plurality of support pins provided on the support plate (FIG. 1B). This will be described below with reference to FIG.

(1) A coil conductor is formed on a ferrite magnetic green sheet, and an internal counter electrode is formed on a ceramic dielectric green sheet. The provided laminated EMI noise removing filter element is prepared, and as shown in FIG. 5, an input terminal (IN terminal) 2 and an output terminal (OUT terminal) are provided at both end surfaces of the ceramic laminate having a rectangular cross section.
3 was formed.

(2) Next, a plurality of circular through holes 8 are formed at equal intervals in a flat plate composed of a silicone elastic body 7 supported by a frame-shaped metal frame 6 as shown in FIG. A holding plate 9 is prepared. The circular through-hole of the holding plate is formed in such a size that the chip element can be inserted horizontally and inserted against the elasticity. When the chip element is inserted into the through-hole, it is held by the elasticity of the elastic body. .

(3) Separately, a metal guide plate 1 for guiding a chip element to a through hole of the holding plate.
Prepare 0. The guide plate 10 is formed of a rigid body such as a metal, and a through-hole 8 is formed at a position corresponding to the through-hole of the holding plate. It is of a size that can be placed and inserted so as to form a funnel-shaped opening 11 at one end.

(4) The support plate 12 further has a plurality of support pins 13 planted in a metal flat plate at positions corresponding to the through holes of the holding plate. It has a diameter slightly smaller than the hole, and the height h of the portion protruding above the plate is equal to or slightly lower than the depth of the through hole.

The support pin 13 can move up and down and is provided with an elastic force upward by a spring 14. The elastic force is strong enough to move the chip element inserted into the through hole of the holding plate. Absent. A positioning pin 15 used for relative positioning with the holding plate is attached to the support plate.

(5) The holding plate 9 is superimposed on the support plate 12 and the guide plate 10 is further superimposed so that the through holes coincide with each other. Then, a plurality of chip elements are formed on the guide plate surface having the funnel-shaped opening. When the chips are mounted and the plate is vibrated, the chip elements enter the openings one by one in a state in which the longitudinal direction is parallel to the plate surface (sideways).

(6) After the chip elements that have not entered the opening are removed, the push pins are provided with push pins corresponding to the holes of the plate prepared separately from the chip elements. The chip element is pushed into the hole of the holding plate until the upper end of the chip element coincides with the upper surface of the holding plate. At this time, the support pins 13 of the support plate 12 make the chip elements contact the tips of the support pins,
It is pushed down by the pushing force of the push pin and descends. When the push pin stops descending, it stays stopped.

(7) Next, the guide plate 10 is removed, and
An NC terminal was formed by screen printing on the main surface or side surface of the chip with the holding plate 9 and the support plate 12 overlapping. Similarly, a G terminal was formed.

[0027]

As described above, according to the holding method using the holding plate jig of the present invention, the supporting plate is provided with the vertically movable support pins, and the bottom of the through hole of the holding plate is fixed. Since the chip element is formed and a horizontal chip element is inserted here, even if the elasticity of the through-hole of the holding plate holding the chip element becomes unbalanced, the posture is kept balanced by the support pins of the support plate. As a result, it does not fall into the through-hole of the holding plate as in the prior art, which is effective in improving the productivity.

[Brief description of the drawings]

FIG. 1 is a perspective view of a holding plate jig used in one embodiment of the present invention.

FIG. 2 is a perspective view (FIG. 2A) of a guide plate constituting the uppermost layer of the jig of FIG. 1 and a cross-sectional view (FIG. 2B) showing the shape of a plurality of through holes provided in the guide plate.

FIG. 3 is a perspective view (FIG. 3A) of a support plate constituting the lowermost layer of the jig of FIG. 1 and a cross-sectional view (FIG. 2B) showing the structure of a plurality of support pins provided on the support plate.

FIG. 4 is an exploded perspective view showing an example of a conventional holding plate jig.

5A is a perspective view of a multilayer chip EMI noise removal filter, and FIG. 5B is an equivalent circuit diagram thereof.

[Explanation of symbols]

 Reference Signs List 1 chip element 2 IN terminal 3 OUT terminal 4 G terminal 5 NC terminal 6 metal frame 7 elastic body 8 through hole 9 holding plate 10 guide plate 11 funnel-shaped opening 12 support plate 13 support pin 14 spring 15 positioning pin

Claims (2)

(57) [Claims] 1. A chip-shaped electronic component for coating or printing a conductor on a surface other than an end surface of the electronic component while holding the chip-shaped electronic component having a rectangular cross section using a holding plate jig. In a holding method, a through-hole is formed in a main surface of an elastic body on a support plate having a structure in which a plurality of pins are vertically movably mounted on a flat plate, and a chip element for an electronic component is formed by the elasticity of the through-hole. A holding plate having a structure capable of holding in a horizontal state is overlapped so that the plurality of pins are inserted into the through holes at corresponding positions, and further opened in a funnel shape for guiding the chip element to the through hole of the holding plate. Holes, the guide plate having a plurality of structures provided corresponding to the respective through holes of the holding plate are overlapped, the chip element is introduced into the funnel-shaped opening, and each chip element is separately provided with a push pin, Pre-inserted into the through hole A chip-like electronic component, which is pushed in against the elasticity provided by the support pins of the support plate, and horizontally holds the surface of each chip element and the upper surface of the holding plate. 2. A support plate having a structure in which a plurality of pins are vertically movably mounted on a flat plate, and a through hole is formed in a main surface of an elastic body, and the chip element for an electronic component is horizontally placed by the elasticity of the through hole. A holding plate having a structure capable of holding in a state, and a guide plate having a structure in which a plurality of holes formed in a funnel shape for guiding the chip element to the through holes of the holding plate are provided in correspondence with the respective through holes of the holding plate. Are stacked in the order described above.