JP2643878B2 - Electronic component cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for electronic components, which cools electronic components directly or indirectly.

[0002]

2. Description of the Related Art An example of a cooling device for an electronic device such as an electronic component that generates heat is disclosed in Japanese Utility Model Laid-Open No. 2-55072.

The apparatus described in this publication will be described in detail with reference to FIG.

Referring to FIG. 3, the cooling device includes a heat radiating plate 120 in which a plurality of passages 11 are formed in parallel, a cooling medium introduction chamber 30 attached to an entrance of the passages 11, and
A pump 70 for feeding water as a cooling medium 110 into the introduction chamber 30, a storage tank 80 for storing the cooling medium 110 sent out by the pump 70, a flow rate adjusting plate 20 made of a bimetal attached to an outlet of the passage 11, A cooling medium discharge chamber 50 for discharging the cooling medium 110 discharged through the adjustment plate 20 and a heat exchanger 90 for cooling the cooling medium discharged from the discharge chamber 50 and returning the cooling medium to the storage tank 80 are provided.

[0005]

In the above-described cooling device,
The temperature of the cooling medium 110 warmed up through the passage 11 is sensed by a bimetal or bellows 130 to adjust the flow rate. For this reason, the temperature of the electronic device 100 to be cooled cannot be measured without passing through the housing 11 and the cooling medium 110 provided through a passage in the housing 11.
Since the flow rate of the cooling medium is adjusted based on the measurement result, there is a disadvantage that the refrigerant may flow an unnecessary amount and the cooling efficiency is deteriorated.

Further, in the above-described measurement of the cooling device, if the temperature of the electronic device 100 to be cooled does not rise in time for the measurement, the electronic device 100 to be cooled can be cooled.
Can not prevent the destruction of

Further, even if a failure occurs in the flow rate adjusting plate or the cooling medium circulating means in the above-described cooling device, there is a disadvantage that no one notices the failure.

An object of the present invention is to provide a cooling device for an electronic component in which cooling is performed efficiently by flowing a minimum amount of a cooling medium.

Another object of the present invention is to provide a cooling device for an electronic component which prevents the electronic component as a cooling medium from being destroyed due to a rise in temperature.

It is another object of the present invention to provide a cooling device for an electronic component which ensures detection of a failure in a refrigerant supply system and improves reliability of an alarm.

It is another object of the present invention to provide a cooling device for an electronic component having a part of a refrigerant supply system for the electronic component so as to improve the cooling efficiency.

[0012]

Means for Solving the Problems A first device of the present invention is provided with a nozzle for supplying an electronic component cooling refrigerant for each electronic component and an electronic component to be cooled by the refrigerant supplied from the nozzle. A temperature sensor, a flow control valve for controlling the flow rate of the refrigerant supplied to the nozzle, a bypass flow path for flowing the refrigerant as a bypass for the flow path of the refrigerant flowing through the flow control valve, and a control circuit.

[0013] A second device of the present invention is characterized in that the nozzle in the first device supplies a refrigerant to a radiator for cooling the electronic component.

[0014] A third device of the present invention is the first device or the second device, wherein when the temperature information measured by the temperature sensor becomes equal to or higher than a predetermined temperature, the opening degree of the flow control valve is increased. And a control circuit for controlling the

[0015] A fourth device of the present invention is the first device or the second device, wherein, when the temperature information measured by the temperature sensor exceeds a predetermined temperature, an alarm signal is generated, A control circuit for controlling an opening degree of the flow control valve;

A fifth device of the present invention is characterized in that, in the first device, the nozzle, the temperature sensor, and the flow control valve are provided corresponding to the electronic components.

In a sixth aspect of the present invention, in the first or fifth aspect, an air flow path for supplying a refrigerant to the flow control valve and a refrigerant flowing through the air flow path are provided around the apparatus. And a cooler for cooling based on temperature.

The seventh device of the present invention is the sixth device according to the sixth device, wherein a refrigerant reservoir for accumulating the refrigerant to be supplied to the cooler, and a refrigerant accumulated in the refrigerant reservoir flows to the nozzle at a predetermined pressure. And a pressurizer for compressing a refrigerant introduced from the outside.

An eighth device according to the present invention is characterized in that, in the seventh device, the pressurizer pressurizes based on a pressure of a pressure sensor attached to the refrigerant reservoir.

In a ninth aspect of the present invention, in the sixth aspect, the cooler cools the refrigerant based on a temperature detected by a temperature sensor provided at a refrigerant intake of the pressurizer. Features.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a first embodiment of the present invention comprises a system to be cooled and a system to cool.

The parts to be cooled are electronic parts 1 and 1 to be cooled.
A temperature sensor 2 which is one of the features of the first embodiment of the present invention, which is mounted on the electronic component 1 and detects the temperature of the electronic component 1 and outputs temperature information as a detection result, is provided.

In the refrigerant supply system, a refrigerant reservoir 6 for accumulating air to be injected into the electronic component 1 to be cooled is sensed by a pressure sensor of the refrigerant reservoir 6 as to whether or not the pressure is sufficient to inject the electronic component 1 for cooling. When it is determined that the pressure is equal to or less than the predetermined pressure, the electronic component 1 is pressurized based on the temperature measured by the temperature sensor mounted on the pressurizer 5 which pressurizes the air which is the refrigerant supplied from the outside. A cooler 7 for cooling the refrigerant to a temperature required for cooling, an air passage 9 for sending air as a refrigerant provided from the cooler 7, and air sent through the air passage 9 to the electronic component 1. Nozzle 3 for jetting, flow rate adjusting valve 4 for adjusting the amount of air supplied to nozzle 3, bypass flow path 10 for flowing air supplied to valve 4 as a bypass for valve 4, and temperature sensor 2 And a control circuit 8 for controlling the opening of the valve 4 by the temperature information et.

Next, the operation of the first embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a refrigerant for cooling electronic components is pressurized by a pressurizer 5 and then sent to a cooler 7 through a refrigerant reservoir 6. The temperature of the refrigerant can be set to an arbitrary temperature by the cooler 7. In this embodiment, the temperature of the refrigerant will be described as the ambient temperature of the apparatus for convenience of description. As the refrigerant, a liquid refrigerant such as an inert substance or pure water, which is a kind of fluorine compound, is advantageous,
It is difficult to handle because the entire cooling system needs to be closed loop. In this embodiment, the structure of the cooling supply system is simplified,
An embodiment using air as a refrigerant will be described. The air pressurized by the pressurizer 5 and temperature-controlled by the cooler 7 passes through a previously created air flow path 9 and flows through the flow control valve 4.
Sent to The opening of the flow control valve 4 is controlled by a control circuit 8 which receives a signal from the temperature sensor 2 attached to the electronic component 1. In the vicinity of the flow control valve 4, a bypass flow path 10, which is one of the features of the first embodiment of the present invention, is provided. This bypass flow path 10
Regardless of the opening degree of the valve 4, the electronic component 1 is supplied with an amount of air determined by the pressure difference between the pressurized air and the air near the electronic component and the cross-sectional area of the bypass channel 10. By the function of the bypass passage 10, even if the flow control valve 4 is completely closed due to a failure, the cooling capacity for preventing the destruction of the component to be cooled can be left. The probability of breaking the component 1 can be reduced.

Next, the operation of the control circuit 8, which is another feature of the first embodiment of the present invention, which determines the amount of refrigerant supplied to the electronic components, will be described in detail with reference to the drawings. .

The control circuit 8 controls the flow control valve 4 so that the temperature of the electronic component 1, especially the temperature of the mounting portion of the temperature sensor 2, is kept below the preset temperature, in this embodiment, the maximum temperature at which the component to be cooled operates. The opening is feedback-controlled based on the temperature information from the temperature sensor 2. That is, if the temperature of the electronic component 1, particularly the temperature of the mounting portion of the temperature sensor 2, is higher than a preset maximum operation temperature of the component to be cooled, the control circuit 8 sets the electronic component 1
A signal for opening the flow control valve 4 attached to the path for supplying the refrigerant to the flow control valve 4 is transmitted. The opening degree of the valve is determined by the temperature (T ₁ ) of the mounting part of the temperature sensor 2,
Control is performed so as to approach the set temperature (Tset).

Further, the related operation of the control circuit 8 and the flow control valve 4 in the first embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, upon receiving a signal for opening the valve from the control circuit 8, the flow control valve 4 first opens the valve according to the received signal to supply the refrigerant to the electronic component 1. Next, the control circuit 8 sequentially takes in the temperature information from the temperature sensor 2, and increases the refrigerant supply amount until the temperature of the mounting portion of the temperature sensor 2 reaches the set temperature (Tset).
That is, a signal for increasing the opening of the valve is transmitted. The opening of the flow control valve is adjusted by the difference between the set temperature and the temperature of the temperature sensor.

The electronic component 1 is cooled by the increase in the supply amount of the refrigerant, and the temperature of the mounting portion of the temperature sensor 2 decreases. When the temperature of the temperature sensor 2 mounting portion has decreased to a preset temperature, the control circuit 8 narrows the opening degree of the flow control valve 4 to reduce the amount of the refrigerant supplied to the electronic component 1.
The opening degree of the flow control valve 4 is controlled so that the temperature of the mounting portion becomes the same as the set temperature. This is based on an empirical rule that, when the temperature of the electronic component 1 has dropped to the set temperature, the probability of failure or malfunction of the electronic component 1 becomes extremely low if a cooling capacity sufficient to prevent the temperature rise is supplied. .
When the temperature of the temperature sensor 2 mounting portion rises again and exceeds the set temperature for some reason, the opening degree of the flow control valve 4 is increased to increase the flow rate of the refrigerant, and the temperature of the temperature sensor 2 mounting portion becomes the set temperature. The opening of the flow control valve 4 is adjusted so as to be the same as the above.

Next, when the temperature change value shows a positive value even when the flow control valve 4 is fully opened, that is, when the temperature rises, the control circuit 8 controls the flow control valve 4, the air flow path 9, And a pressurizer 5 and a refrigerant reservoir 6 forming a refrigerant supply system
And it is determined that at least one portion of the cooler 7 has failed, and an alarm signal is generated. This alarm signal is transmitted to a peripheral device such as a power supply circuit, and can be used for triggering necessary operations such as stopping the system when an abnormality occurs. In the first embodiment of the present invention, the electronic component 1 can be provided with an adequate cooling capacity by going through the steps described before the description of the generation of the warning signal.

Next, a second embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, a feature of the second embodiment is that a radiator 11 is attached to the electronic component 1 in order to cool the electronic component more efficiently as compared with the first embodiment. . Due to this feature, heat transfer from the electronic component 1 to the air is performed efficiently.

The second embodiment of the present invention includes a component to be cooled and a cooling supply system as in the first embodiment.

The component system to be cooled includes an electronic component 1 to be cooled, a temperature sensor 2 mounted on the electronic component 1 and detecting a temperature of the electronic component 1, and a radiator 11 attached to the electronic component 1. Have.

The refrigerant supply system injects the refrigerant air to the radiator 11 attached to the electronic component 1 to be cooled. The refrigerant reservoir 6 stores the air. A pressurizer 5 for detecting whether or not the pressure is such that the refrigerant can be supplied at a predetermined pressure. When the pressure is lower than the predetermined pressure, the pressurizer 5 pressurizes the air as the refrigerant supplied from the outside. A cooler 7 that cools air serving as a refrigerant so that the sensor 2 of the electronic component 1 measures this temperature by an installed temperature sensor, and air for flowing air supplied from the cooler 7. The flow path 9 corresponds to the radiator 11 for injecting the air sent to the radiator 11 through the air flow path 9. If the radiator 11 is not provided, the nozzle 3 is provided for the electronic component 1. With the refrigerant given to nozzle 3 Flow control valve 4 for adjusting the supply amount of air to be supplied, a bypass passage 10 provided near the valve 4 and commonly using the inlet and outlet of the valve 4 and having the same function as in the first embodiment, and a temperature sensor The control circuit 8 controls the opening degree of the valve 4 based on the temperature information from the controller 2.

Next, the operation of the second embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, water, which is a refrigerant for cooling the radiator 11, is pressurized by the pressurizer 5, and then supplied to the cooler 7 through the refrigerant reservoir 6. The temperature of the refrigerant can be set to an arbitrary temperature by the cooler 7. In this embodiment, for convenience of explanation, the temperature of the refrigerant will be described as the ambient temperature of the device as in the first embodiment.

The refrigerant pressurized by the pressurizer 5 and temperature-controlled by the cooler 7 is sent to the flow control valve 4 through the air passage 9. The opening of the valve 4 is controlled by the control circuit 8. This control is performed based on temperature information from a temperature sensor 2 mounted on the electronic component 1. In the vicinity of the flow control valve 4, a bypass flow path 10, which is one of the features of the second embodiment of the present invention, is provided. The amount of air determined by the pressure difference between the pressurized air and the air near the electronic component and the flow path cross-sectional area of the bypass flow path 10 is supplied to the radiator 11 regardless of the opening degree of the valve 4. Serves to supply. By the function of the bypass passage 20, even if the flow control valve 4 is completely closed due to a failure, it is possible to leave a cooling capacity for preventing breakage of the component to be cooled. For this reason, even when the cooling system is abnormal, the probability of breaking the electronic component 1 can be reduced.

Next, the operation of the control circuit 8 for determining the amount of refrigerant supplied to the electronic components will be described in detail with reference to the drawings.

Referring to FIG. 2, the opening degree of the flow control valve 4 is feedback-controlled based on the temperature information from the temperature sensor 2 so as to stay below the maximum temperature at which the electronic component 1 operates. That is, when the temperature of the mounting portion of the temperature sensor 2 is higher than the maximum operation temperature of the electronic component 1, the control circuit 8 supplies the refrigerant to the radiator 1 on the electronic component 1 to which the temperature sensor 2 is mounted. A signal for opening the flow control valve 4 attached to the valve 9 is transmitted. The opening degree of the valve is controlled so that the temperature (T ₁ ) of the mounting portion of the temperature sensor 2 approaches the set temperature (Tset).

Further, the related operation of the control circuit 8 and the flow control valve 4 in the second embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, according to an instruction signal from the control circuit 8, the flow control valve 4 first causes the refrigerant to radiate
To supply. Next, the control circuit 8 sequentially takes in the temperature information from the temperature sensor 2 and increases the refrigerant supply amount until the temperature of the mounting portion of the temperature sensor 2 reaches the set temperature (Tset), that is, increases the valve opening. Send a signal to The opening of the flow control valve is adjusted by the difference between the set temperature and the temperature of the temperature sensor.

The radiator 11 is cooled by the increase in the supply amount of the refrigerant, and the temperature of the electronic component 1 mounted with the radiator 11 at the temperature sensor 2 mounting portion decreases. When the temperature of the temperature sensor 2 mounting portion decreases to a preset temperature, the control circuit 8 reduces the amount of refrigerant supplied to the radiator 11 by narrowing the opening of the flow control valve 4 and is attached to the radiator 11. The opening of the flow control valve 4 is controlled such that the temperature of the temperature sensor mounting portion of the electronic component 1 becomes the same as the set temperature. This is based on an empirical rule that, since the temperature of the electronic component 1 has dropped to the set temperature, if the cooling capacity sufficient to prevent the temperature rise is supplied, the probability of failure and malfunction of the electronic component 1 becomes extremely low. I have. When the temperature of the temperature sensor 2 mounting portion of the electronic component 1 rises again and exceeds the set temperature for some reason, the opening degree of the flow control valve 4 is increased to increase the flow rate of the refrigerant, and the temperature sensor of the electronic component 1 is increased. (2) Adjust the opening of the flow control valve 4 so that the temperature of the mounting portion becomes the same as the set temperature.

Next, when the temperature change value shows a positive value even when the flow control valve 4 is fully opened, that is, when the temperature rises, the control circuit 8 controls the flow control valve 4, the air flow path 9 and the refrigerant. It is determined that at least one of the pressurizer 5, the refrigerant reservoir 6, and the cooler 7 forming the supply system has failed, and an alarm signal is generated. This alarm signal is transmitted to a peripheral device such as a power supply circuit, and can be used for triggering necessary operations such as stopping the system when an abnormality occurs.

[0047]

The present invention provides an electronic component 1 which is a component to be cooled.
Is directly measured, and the amount of the refrigerant supplied to the component to be cooled is adjusted based on the measured temperature. Due to this feature, in the present invention, the amount of refrigerant to be used can be minimized, and efficient cooling can be achieved.

The present invention is also characterized in that the temperature of the electronic component 1 to be cooled is directly measured, and the control circuit 8 detects an abnormality in the temperature based on the measured temperature. Due to this feature, in the present invention, clogging of the air flow path 9 and
Even if the cooling of the electronic component 1 becomes impossible or difficult due to a failure of the refrigerant supply system such as a failure of the flow control valve 4, the failure can be reliably detected and notified by an alarm signal. As a result, the present invention can improve the reliability of the alarm.

The present invention is also characterized in that a bypass passage 10 is provided as a bypass for the passage of the flow regulating valve 4.

According to the present invention, even if the flow control valve 4 is completely closed due to a failure, it is possible to leave a cooling capacity for preventing breakage of a component to be cooled. As a result, the present invention can reduce the probability that the electronic component 1 will be destroyed even when the cooling system is abnormal.

The present invention relates to a nozzle 3, a valve 4, a sensor 2
And by providing the control circuit 8 corresponding to the electronic component,
The cooling capacity required by each electronic component can be given to the electronic component without excess or deficiency.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

FIG. 3 is a diagram showing an example of a conventional technique.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component 2 temperature sensor 3 nozzle 4 flow control valve 5 pressurizer 6 refrigerant reservoir 7 cooler 8 control circuit 9 air flow path 10 bypass flow path 11 radiator

Claims (4)

(57) [Claims] A nozzle for supplying an electronic component cooling refrigerant for each electronic component; a temperature sensor mounted on the electronic component to be cooled by the refrigerant supplied from the nozzle; and a temperature measured by the temperature sensor. based on the information, the flow rate adjusting valve for adjusting the flow rate of the refrigerant supplied to the nozzle, and a bypass flow path of the refrigerant flowing through the flow regulation valve
An electronic component cooling device, comprising: a bypass passage through which a refrigerant flows . 2. The cooling device for an electronic component according to claim 1, wherein the nozzle supplies a coolant to a radiator for cooling the electronic component. 3. The control circuit according to claim 1, further comprising a control circuit for controlling an opening of said flow regulating valve when the temperature information measured by said temperature sensor becomes equal to or higher than a predetermined temperature. The cooling device for an electronic component according to claim 2. 4. A control circuit for generating an alarm signal when the temperature information measured by the temperature sensor becomes equal to or higher than a predetermined temperature, and controlling a degree of opening of the flow control valve. The cooling device for an electronic component according to claim 1 or 2.