JP2644546B2 - Ultra-thin cutting blade - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is an ultra-thin cutting having a total thickness of 0.5 mm or less for precisely cutting or grooving hard brittle materials such as silicon, ferrite, glass, and ceramics. It concerns the blade.

[Prior Art] Conventionally, as a blade for precisely cutting this kind of hard and brittle material, a cutting blade made of a plate-like material containing abrasive grains is used.

Generally, the abrasive layer portion of these cutting blades is generally a single-layer cutting blade composed of only one kind of composition. For example, as disclosed in JP-A-62-88577, Some have a layered structure in the thickness direction.

[Problems to be Solved by the Invention] The three-layer structure cutting blade manufactured by the method shown in the above-mentioned layer constitution method (Japanese Patent Publication No. 62-88577) has the thickness of each layer, the abrasive grains and the resin bonding material for bonding. The thickness of each layer is determined by embedding a mixture of the above and the thickness of each layer by the technique of embedding the mixture which is very difficult to control, so that thickness unevenness within one layer is likely to occur.

For the same reason, it is difficult to manufacture a multi-layer cutting blade having an extremely thin layer structure with good reproducibility.

For the same reason, there is a disadvantage that it is difficult to produce a cutting blade having an extremely thin overall thickness with good reproducibility.

Further, as shown in FIG. 5, the cutting blade of a conventional cutting blade composed of only one kind of composition is easily bent during cutting, so that the cut surface of the material to be cut does not become a right angle.

 The straightness of the cut surface in the cutting direction is poor.

The cutting blade is easy to hit and the cut surface is scratched.
Chipping is likely to occur.

As a result, it is necessary to frequently perform the work of correcting the shape of the cutting blade tip.

There are drawbacks. This disadvantage is remarkable in an ultra-thin cutting blade having a total thickness of 0.5 mm or less.

This is because the cutting blade made of a single-layer plate-like material ideally wears the cutting blade edge symmetrically in cross section as shown in FIG. 3 if the components of the cutting blade are uniformly dispersed. However, in practice, uneven wear of the cutting blade components causes uneven wear as shown in FIG. 4, and a lateral force is applied to the blade tip of the unevenly worn blade. This is because, as shown in FIG.

[Means for Solving the Problems (and Action)] In the present invention, in a multi-layer ultra-thin cutting blade, the abrasive grains of each layer and the bonding resin bonding material are adjusted to a paste-like material,
By applying this paste-like material on the substrate sheet in an easy-to-control method, it is possible to eliminate the thickness unevenness of each layer as much as possible, and since the pressing pressure is not used for forming each layer, pressing between the layers is performed. Density unevenness due to pressure non-uniformity does not occur, and therefore, unbalanced internal stress is not left in the ultra-thin cutting blade, so that warpage does not occur after integral molding.

As described above, the ultra-thin cutting blade of the present invention does not vary the thickness of each layer even among the layers, and can precisely control the thickness. Does not occur.

In addition, in order to solve the problem of bending during cutting of an ultra-thin cutting blade made of a single-layer plate-like material, the amount of the central layer has a structure in which the side layer has a smaller wear rate than the central layer, and the ultra-thin cutting blade By providing a portion that easily wears and a portion that hardly wears in the thickness direction, a structure that is less likely to cause uneven wear can be obtained.

[Examples] In the ultrathin cutting blade having a multilayer structure of the present invention, superabrasive grains are preferable as abrasive grains to be contained in at least the outer layer, but other general abrasive grains may be used in some cases. In particular, natural or synthetic diamond, CBN, carborundum (C), green carborundum (GC), alundum (A), white alundum (WA), boron carbide, etc. are used alone or in combination according to the purpose. Can be

The grain size of the abrasive grains is selected according to the purpose of ultra-thin cutting. Abrasive grain ratio (degree of concentration) is usually 2 to 70vol%, generally 6 to 30v
ol%, preferably about 7.5 to 20 vol%.

The abrasive layer may contain an appropriate amount of other predetermined aggregate or filler other than the abrasive grains. As the aggregate, an inorganic or organic filler is used, and as the inorganic material, Ca, Mg, B
carbonates such as a, K and Na, sulfates such as Ca and Ba, Zn, Zr, Al, Cr, Se
And metal powders such as brass, Cu, Ag, Fe, Ni, Co, etc., inorganic fibers such as asbestos, short glass fiber, carbon fiber, etc., graphite, carbon, Mos _{2 and the} like.

 It is easy to control the layer thickness by manufacturing by printing method.

 Density unevenness and pressure unevenness do not occur in the layer.

 A plate having a uniform composition can be obtained stably.

It is desirable from such a viewpoint.

FIG. 1 shows a multi-layered ultra-thin cutting blade obtained by a printing method, wherein each layer is made of a range binder containing an abrasive.
It has a 1,2,3 multilayer structure.

As the resin binder in this case, a thermosetting or thermoplastic resin binder can be used. For example, an epoxy resin, a phenol resin (a novolak type, a resol type or a mixture thereof), various modified phenol resins (epoxy-modified, Aniline modification, rubber modification, thermoplastic resin modification, furan modification, etc.), melamine resin, polyimide resin, natural rubber, rigid rubber, diallyl phthalate resin, silicone rubber,
Urea resin, nylon, saturated or unsaturated polyester resin, silicon resin, fluorine resin, cellulose resin, acrylic resin and the like are used. Preferably, a novolak type or resol type phenol resin or a modified phenol resin is used. In addition, known binders for resin bond grindstones can be used.

Acrylic ester resin,
Methacrylate resin, cellulose ester resin,
Organic solvent solutions such as butyral resins and vinyl acetate resins, aqueous solutions or emulsions are preferred.

The abrasive and resin binder in each of the layers 1, 2, and 3 shown in FIG.
The resin solution is mixed according to the degree of concentration of the abrasive grains and the ratio of the binder of the target grindstone, the resin solution is mixed according to the fluidity and particle size of the printing paste, and the abrasive material and the resin binder are uniform using a kneader etc. Knead well so as to distribute the mixture.

Next, the paste obtained by kneading is screen-printed on a substrate sheet. As a material of the substrate sheet,
Polyester film, silicon paper, copper foil and the like are suitable.

The printing screen preferably uses a Tetron, Nylon, or stainless steel screen having about 40-500 mesh, and is implemented by applying the paste to a substrate sheet through a screen as is known.

After drying the substrate sheet on which the abrasive layer made of the mixed paste of the abrasive and the resin binder is formed, the substrate sheet is separated from the abrasive layer plate. The obtained plate-like material is cut into a predetermined size and shape, and then laminated, and then heated and press-molded to be integrally formed.

Embodiment 1 FIG. 1 shows an example in which the present invention is applied.

Were weighed, transferred into a mortar, and thoroughly mixed and stirred.

To this mixture, an appropriate amount of the above-described printing resin solution was added and kneaded to prepare a paste-like material.

Further, for the purpose of a three-layer structure, the above-mentioned paste mixing ratio or material is changed to give a difference in hardness, softness, that is, abrasion rate.

Here, in the above-mentioned preparation, a paste-like material in which the whole amount of white alundum (WA) was a phenol resin was separately prepared for a soft layer.

The obtained hard and soft paste materials were printed on a polyester film as a substrate sheet by screen printing using a # 120 tetron mesh. After drying each printed matter, the substrate sheet was peeled off to obtain two types of hard and soft plate-like materials. This plate material is cut into a predetermined size, laminated so that the center of the three layers in the mold becomes a soft abrasive layer plate material, and heated in an oven from room temperature to 190 ° C. for about 8 hours while pressing. An ultra-thin cutting blade having a uniform three-layer structure with a total thickness of 200 μm and a thickness variation of ± 5 μm or less was obtained.

When a silicon wafer was repeatedly cut using this three-layer resin-bond cutting blade, the tip of the cutting blade gradually moved to the outer layer side as shown in FIG.
Worn into a shape with two peaks. This is because the outer layer, the second plate-shaped material, is harder to abrasion than the first plate-shaped material, the center layer, because of the hard abrasive layer. This is because they wear while regulating each other. As a result, uneven wear is less likely to occur, and the central layer, which is easily worn, is reduced quickly and the outer surface side is left, so that the shape as shown in FIG. 2 is obtained. At this time, the cutting surface does not bend, the cutting straightness is excellent, and the cutting blade is not subjected to excessive force, as compared with a case where the silicon wafer is cut with a conventional single-layer cutting blade. Due to the reduced vibration, scratches and chipping generated on the cut surface were also reduced. The reason is that the uneven wear of the cutting blade is small, no excessive force is applied to the cutting blade, and the crests on both side surfaces first hit the work to be cut. This is because the cutting of the entire blade thickness proceeds while two grooves are provided and the two grooves regulate the course of each other. Also, the deviation of cutting dimensions is small,
Since the cutting in a stable state can be performed for a long time, the work interval for performing the shape correction processing (truing, dressing) of the ultra-thin cutting blade has been greatly extended.

Example 2 By changing the ratio between the abrasive grains made of synthetic diamond and the resin binder in Example 1, that is, by changing the degree of concentration, a hardness difference between the three layers was provided. Here, the soft agent is 10 vol% synthetic diamond abrasive, and the hard agent is 25 vol% synthetic diamond abrasive. Otherwise in the same manner as in Example 1, an ultrathin cutting blade having a three-layer structure was obtained.

In this embodiment, the same effect as that of the first embodiment was obtained.

[Other Examples] Similar to Examples 3 and 2, the first plate-like material obtained by mixing diamond abrasive grains and the resin bonding material for bonding has a first plate-like wear rate on both side surfaces. The same composition as the first plate-shaped material further outside the three-layer plate-shaped material in which the second plate-shaped material is laminated in which the mixing ratio of the diamond abrasive grains and the bonding resin bond material is changed so as to be smaller than the material. Were laminated to form a five-layered plate-like material, which was an ultra-thin cutting blade having a five-layered structure. The manufacturing method is the same as that of Example 2 except that the manufacturing method is a five-layer structure.

When the silicon wafer was repeatedly cut using the resin-bonded ultrathin cutting blade having a five-layer structure manufactured as described above, not only the same effects as those in Examples 1 and 2 were obtained, but also the outermost Since the third plate-like material, which is the layer, has a relatively small content of abrasive grains, scratches, chipping, and the like generated on the cut surface of the material to be cut were further reduced than in Example 2.

Further, in this embodiment, an ultrathin cutting blade having a three-layer or five-layer structure has been described. However, an extremely thin blade having a multilayer structure in which a plurality of thin layers are superposed while gradually changing the composition from the center of the thickness. Thin cutting blades can also be obtained. However, in this case, it is necessary to arrange the thickness of the same composition symmetrically in the thickness direction.

[Effects of the Invention] According to the present invention, a multi-layered ultra-thin cutting blade has a configuration in which thickness unevenness of each layer is eliminated as much as possible. However, the thickness of each layer is precisely controlled.

In addition, since a printing method that makes it easy to automate the management of manufacturing is adopted, it is easy to mass-produce ultra-thin cutting blades with uniform performance. Furthermore, in this ultra-thin cutting blade, by making the wear rate of both side layers smaller than that of the center layer, uneven wear is less likely to occur even though it is an ultra-thin cutting blade with a total thickness of 0.5 mm or less. An ultra-thin cutting blade with a layer structure that does not bend, has good cutting straightness, hardly causes scratches, chipping, etc. on the cutting surface, and can greatly eliminate the work of correcting the shape of the ultra-thin cutting blade can get.

[Brief description of the drawings]

FIG. 1 is an external view of an ultra-thin cutting blade having a three-layer structure embodying the present invention, and FIG. 2 is a sectional view taken along the line AA 'of FIG. This shows the state of tip wear. FIG. 3 is a sectional view of the tip of a conventional single-layer cutting blade having a uniform composition, showing an ideally worn state. FIG. 4 is a cross-sectional view of the tip of a conventional single-layer cutting blade having a uniform composition, showing an unevenly worn state. FIG. 5 is a cross-sectional view schematically showing a state in which a conventional single-layer cutting blade having a uniform composition bends during cutting. DESCRIPTION OF SYMBOLS 1 ... The 1st layer (inner layer) which comprises a cutting blade 2, 3 ... The 2nd layer (outer layer) which comprises a cutting blade 4 ... The cutting blade which has a three-layer structure 5 ... The single layer cutting of uniform composition Blade 6: Material to be cut

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Takashi Kosakai 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Toshio Kashino 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Co., Ltd. (72) Inventor Mitsuhiro Sato 4-18-12 Tamagawa, Setagaya-ku, Tokyo (72) Inventor Yoshikazu Mikuni 314-2 Nonaka-cho, Kurume-shi, Fukuoka (56) References JP-A-56-62764 (JP) JP-A-64-40278 (JP, A) JP-B-42-15192 (JP, B1)

Claims (3)

(57) [Claims] 1. A paste-like material in which fine powder abrasive grains and a bonding resin bonding material are dispersed in a solvent is applied to a substrate sheet, dried, and then separated from the substrate sheet to form a first plate-like material. After applying a paste material having a composition different from that of the paste material to a substrate sheet on both side surfaces of the plate material and drying the same,
An ultrathin cutting blade having a total thickness of 0.5 mm or less, wherein the blade has a layer structure in which each layer is integrally formed by laminating a second plate-like material peeled from the substrate sheet, and heating while pressing. 2. The electrode having a total thickness of 0.5 mm or less according to claim 1, wherein the composition of the second plate material in the first item is smaller in wear rate than that of the first plate material. Thin cutting blade. 3. An extremely thin structure having a total thickness of 0.5 mm or less, wherein a plurality of plate-like members are provided outside the second plate-like member according to the first aspect in the same manner as in the first aspect. Cutting blade.