JP2649822B2 - Processing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing processing such as resist coating on an object to be processed such as a semiconductor wafer.

2. Description of the Related Art In semiconductor manufacturing, a semiconductor wafer goes through a plurality of processing steps. FIG. 3 shows an example of an apparatus for forming a photoresist film on the surface of the semiconductor wafer.

The semiconductor wafers (1) are unloaded one by one from a wafer cassette (2) containing the unprocessed semiconductor wafers (1) by a transport mechanism S (3) called a sender, and the next processing mechanism, a photoresist It is transported to the coating mechanism CT (4). Here, when the photoresist coating process is completed, the semiconductor wafer (1) is conveyed to a heating mechanism HP (5) for heating to stabilize the photoresist liquid into a film. When the heating process is completed, a transport mechanism R called a receiver
According to (6), the semiconductor wafers (7) are stored one by one in the wafer cassette (8).

As described above, the transfer mechanism S (3) takes out the semiconductor wafer (1) from the wafer cassette (2), and the transfer mechanism R (6) functions to store the semiconductor wafer (7) in the wafer cassette (8). Having only

(Problems to be Solved by the Invention) However, as the degree of integration of VLSIs has increased in recent years, for example, a photoresist processing step has become more complicated, and the number of processing steps and types of processing steps have also increased.

It is also being considered to combine a plurality of devices from the viewpoint of unmanned automation.

To cope with this, the configuration of the apparatus can be adapted to the actual situation such as, for example, the overall throughput can be optimally adjusted and set, or the apparatus can be partially used, and the connection and disconnection with other apparatuses are free. Configuration needs to be considered.

Therefore, a dedicated mechanism having only a single function of simply taking out and storing a semiconductor wafer as a semiconductor wafer transfer mechanism cannot cope with the above point.

For example, a transport mechanism disposed at a connection point between a certain processing mechanism and a certain processing mechanism cannot be handled by the above-described sender and receiver.

The present invention has been made in view of the above conventional circumstances,
An object of the present invention is to provide a semiconductor manufacturing apparatus capable of coping with various processes and layouts.

(Means for Solving the Problems) The present invention is a processing apparatus comprising: a processing mechanism for performing a predetermined process on a processing target; and a transport mechanism for transporting the processing target to the processing mechanism. The transport mechanism has a buffer function for temporarily holding an object to be processed when the processing of the processing mechanism is not completed before the object to be processed is transported to the processing mechanism; An over-processing prevention function for taking out an object being processed from the processing mechanism so that the object to be processed is not over-processed and temporarily holding the object, and a position at which the object processed by the processing mechanism can be viewed. And a pick-up function for moving the pick-up device to the processing device.

Further, the present invention is a processing apparatus including a processing mechanism for performing a predetermined process on a processing target, a transport mechanism for transporting the processing target to the processing mechanism, and a control mechanism for controlling the transport mechanism. The transport mechanism has a buffer function for temporarily holding the workpiece when the processing of the processing mechanism is not completed before transporting the workpiece to the processing mechanism; and An over-processing prevention function for taking out an object being processed from the processing mechanism so as to prevent the object being processed from being over-processed and temporarily holding the processed object, and visually observing the object processed by the processing mechanism. A pick-up function for moving to a possible position, wherein the control mechanism selects one of the functions and controls the transport mechanism to execute the selected function. I do.

Further, the present invention provides at least two processing mechanisms for performing a predetermined process on a processing target, a transport mechanism for transporting the processing target between these processing mechanisms, and a storage unit for storing the processing target. Wherein the transport mechanism has a loading function of loading the workpiece received from one of the processing mechanisms into the storage unit, and takes out the workpieces one by one from the storage unit and removes the other one from the storage unit. One of a transport function for transporting the processing object and a buffer function for temporarily holding the processing object when the processing of the processing mechanism is not completed before the processing object is transported to the other processing mechanism. An over-processing prevention function for taking out an object being processed from the processing mechanism so as to prevent the object being processed by the processing mechanism from being over-processed, and temporarily holding the processing object received from one of the processing mechanisms; Body A pass-through function for transporting to the other processing mechanism without storing it in the storage section,
There is provided a processing apparatus having a pickup function of moving an object to be processed, which has been processed by any one of the processing mechanisms, to a position where the object can be viewed.

Still further, the present invention provides at least two processing mechanisms for performing predetermined processing on a processing target, a transport mechanism for transferring the processing target between the processing mechanisms, and a storage unit for storing the processing target. A processing mechanism provided with a control mechanism for controlling the transport mechanism, wherein the transport mechanism has a loading function for loading the workpiece received from one of the processing mechanisms into the storage section, and a transport function for transporting the workpiece from the storage section. A transport function for taking out the processing objects one by one and transporting the processing objects to the other processing mechanism, and temporarily transporting the processing objects before transporting the processing object to the other processing mechanism when the processing of the processing mechanism is not completed. A buffer function for temporarily holding the object to be processed, and an over-processing prevention function for temporarily holding the object to be processed from the processing mechanism so that the object being processed by any of the processing mechanisms is not over-processed. , One side A pass-through function of transporting the object to be processed received from the processing mechanism to the other processing mechanism without being stored in the storage unit,
A pick-up function for moving the object to be processed, which has been processed by any of the processing mechanisms, to a position at which the processing object can be viewed, the control mechanism selects one of the functions, and executes the selected function. There is provided a processing apparatus characterized by controlling the transport mechanism.

In each of the above inventions, the at least one processing mechanism includes a resist coating mechanism for forming a resist film on the surface of the object to be processed.

In each of the above inventions, it is preferable that the transport mechanism executes the over-processing prevention function when the processing mechanism performs a thermal process on the object to be processed.

(Operation) In one aspect of the present invention, a processing apparatus provided with a processing mechanism for performing a predetermined process on a processing target and a transport mechanism for transporting the processing target to the processing mechanism is premised. Before the transport mechanism transports the object to the processing mechanism, when the processing of the processing mechanism is not completed, a buffer function for temporarily holding the object to be processed, and the processing mechanism is processed by the processing mechanism An over-processing prevention function that takes out the object being processed from the processing mechanism so that the object is not over-processed and temporarily holds the object, and a position where the object processed by the processing mechanism can be viewed. In another aspect, the apparatus has at least two processing mechanisms for performing a predetermined process on the object to be processed, and transports the object between the processing mechanisms. Transport mechanism Assuming that the processing apparatus includes a storage unit that stores the object to be processed, a transport mechanism is configured to carry in the object to be processed received from one of the processing mechanisms into the storage unit, and to perform processing on the object to be processed from the storage unit. And a transport function for taking out one by one and transporting the workpiece to the other processing mechanism, and temporarily transporting the workpiece before transporting the workpiece to the other processing mechanism when the processing of the processing mechanism is not completed. A buffer function to hold, and an over-processing prevention function of temporarily taking out an object being processed from the processing mechanism so that the object being processed by any of the processing mechanisms is not over-processed, and
A pass-through function that transports an object to be processed received from one processing mechanism to the other processing mechanism without being stored in the storage unit, and moves the processed object that has been processed by one of the processing mechanisms to a visible position Therefore, it is possible to realize extremely various types of conveyance when conveying the object to be processed, and to easily cope with a desired conveyance operation.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The body (11) includes an object to be processed, for example, a semiconductor wafer (12)
A conveying mechanism taken out from the accommodating the wafer cassette (13) one by one to the semiconductor wafer (12) _{I A (14) I B (} 15),
A first coating mechanism CT (16) for applying a first photoresist to the semiconductor wafer (12), and a first heating mechanism HP (for heating and evaporating the solvent remaining in the applied first photoresist). 17), a transport mechanism I _C (18) for transporting the semiconductor wafer (12) heated by the first heating mechanism HP (17) to a processing mechanism in the next step, and a semiconductor wafer (12).
Coating mechanism CT for applying a second photoresist to the surface
(19) and a second heating mechanism HP (20) for heating and evaporating the solvent remaining in the applied second photoresist.
And an interface mechanism I / F (temporary storage) for transferring the semiconductor wafer (12) heated by the second heating mechanism HP (20) to another apparatus such as an exposure apparatus (21) as indicated by a broken line. A transfer mechanism _ID (23) for transferring the semiconductor wafer (12) to 22) is arranged in series, and is configured on one housing so as to process and transfer the semiconductor wafer (12) according to a predetermined procedure in the above order.

The semiconductor wafer (12) exposed by the exposure apparatus (21) is carried out of the exposure apparatus (21). The semiconductor wafer (12) is located at a predetermined position on the main body (11) side of the interface mechanism I / F (22). A transport mechanism _IE (24) _IF (25) for receiving (12) one by one and storing it in the wafer cassette (13) is provided.

Each transfer mechanism _{I A (14) I B (} 15) I C (18) I D (23)
Controllers A (26) B (27) C (28) D (29) E for controlling the above-mentioned respective transport mechanisms are respectively provided at I _E (24) I _F (25).
(30) F (31) is connected. Each of the controllers controls each of the transport mechanisms in a predetermined procedure, and each of the controllers controls the main controller M (3).
It is configured to be controlled entirely by 2).

Here, the transport mechanism will be described. As shown in FIG. 2, for example, a bar-shaped support member A (33) is erected on the base (32), and a rubber belt A (34) or the like is provided on the upper end of the support member A (33). A transport unit A (35) for placing and transporting the semiconductor wafer (12) by using is provided. Further, a rod-shaped support member B (36) is erected on the base (32) so as to be symmetrical with the above-described parts, and a rubber belt B (37) or the like is provided on the upper end of the support member B (36). A transport section B (38) for placing and transporting the semiconductor wafer (12) by using is provided. In the transport units A (35) B (38), the rubber belts A (34) B (37) are driven by rotation generating means such as a motor.

On the other hand, at an intermediate position between the transport units A (35) and B (38),
A table (40) on which a wafer cassette (13) is placed and which can be raised and lowered by a predetermined distance by a lifting and lowering device (39) is provided in a state supported from one side. The table (40) is formed in a substantially H-shape, and the center of the table (40) and the sweater rib (41) of the wafer cassette (13) are transported by the transfer section A (35) B It is configured to be able to pass through the space provided in the middle of (38). Further, a controller (4
2) is connected.

A switch (not shown), a key (not shown) for selecting various functions provided on the controller (42),
The instruction of the main controller M (32), to each of the above transfer mechanism _{I A (14) ~I F (} 25), said wafer cassette (13)
, For example, a sender function of taking out semiconductor wafers (12) one by one from a wafer cassette (13) and sending them to the next processing mechanism, and transporting the semiconductor wafers (12) immediately to the next processing mechanism. A buffer function for temporarily storing the semiconductor wafer (12) when not possible, an overprocessing prevention function for temporarily storing the processed semiconductor wafer (12) to prevent overprocessing by a certain processing mechanism, and the next processing A pass-through function for immediately transporting and passing the semiconductor wafer (12) to the mechanism, a pickup function for moving the semiconductor wafer (12) processed by a processing mechanism to a predetermined position, for example, so as to be visible, and a semiconductor wafer (12) A receiver function to be carried into and stored in the cassette (13) can be selected and operated.

The specific operation corresponding to each of the above functions is set, for example, as follows. First, at the time of the sender function, the wafer cassette (13) is lowered by a predetermined distance, and the semiconductor wafer (12) is placed on the transport section A (35) B (38), and the rubber belt A (34) B (37) Is moved to take out the semiconductor wafers (12) one by one from the wafer cassette (13).

Next, in the case of the pass-through function, the table (40) is raised to pass the semiconductor wafer (12) below the table, or the upper surface of the wafer cassette (13)
(35) Lower the wafer cassette (13) below the transfer level position of B (38), or move the wafer to a position where the semiconductor wafer (12) can be transferred and passed through the wafer cassette (13) without any trouble. Position the cassette (13).

In the case of the buffer function, when the semiconductor wafer (12) is transferred into the wafer cassette (13), the wafer cassette (13) is raised and temporarily stored and stored, and the wafer cassette (13) is stored as needed. Lower and take out like a sender.

When the overbake prevention function is used, for example, a heat-resistant wafer cassette (13) is used to temporarily store and store,
Send out after the elapse of a predetermined time.

In the case of the pickup function, for example, when the semiconductor wafer (12) comes into the wafer cassette (13), the wafer cassette (13) is raised by a predetermined distance, and the semiconductor wafer (12) can be extracted from the wafer cassette (13). To

In the case of the receiver function, the wafer cassette (13) is lowered in advance, and when the semiconductor wafer (12) is conveyed into the wafer cassette (13), the wafer cassette (13) is raised by a predetermined distance, and the semiconductor wafers (13) are moved one by one. (12) is stored.

 Next, the operation will be described.

In FIG. 1, in the case of a process using all the mechanisms, each function of each transport mechanism is selected and operated, for example, as follows.

Transfer mechanism I _A (14) I _B (15) with sender function, I _C (18)
By selecting I _D (23) for the buffer function and I _E (24) I _F (25) for the receiver function, the transport mechanism I _A (14) I
_{B Take} out the semiconductor wafers (12) one by one from (15), apply photoresist, heat treatment, and transport mechanism I
_{At C} (18), the semiconductor wafer (12) is temporarily stored and stored according to the process, and then sent out. Then, after applying and heating the second photoresist, it is temporarily stored and stored in the transport mechanism _ID (23) to adjust the operation with the interface mechanism I / F (22) of the exposure apparatus (21). The semiconductor wafer (12) is sent out to the exposure apparatus (21) while performing. Then, received in the exposure process is completed interface mechanism I / F (22) carrying the semiconductor wafer (12) from the mechanism _{I E (24) I F (} 25), housed in the wafer cassette (13).

Then, for example, a first coating mechanism CT and (16) in the case of a process using only the first heating mechanism HP (17) is, sender function conveyance mechanism _{I A (14) I B (} 15), transport Organization I _C (18)
Select for the receiver function.

Further, for example, in the case of a process using only the second coating mechanism CT (19) and the second heating mechanism HP (20), the transport mechanism I _C (18) has a sender function and the transport mechanism I _D (23 ) For the receiver function.

The selection of the function for each of the transport mechanisms may be operably set for each controller, or may be configured to be collectively selected by the main controller M (32).

Further, in the above-described embodiment, the coating process of the semiconductor wafer has been described. Although the case where semiconductor wear is used as the object to be processed has been described, it is needless to say that the present invention is not limited to this, and other objects to be processed may be used.

〔The invention's effect〕

As described above, according to the present invention, it is possible to realize extremely various types of conveyance when conveying an object to be processed, and to easily cope with a desired conveyance operation. Therefore, it is possible to cope with various manufacturing processes.

[Brief description of the drawings]

FIG. 1 is a configuration diagram for explaining an embodiment of the present invention,
FIG. 2 is an explanatory diagram of a main part of FIG. 1, and FIG. 3 is a diagram of a conventional example. 12… Semiconductor wafer, 13… Wafer cassette, 14,15,18,23,24,25 …… Transport mechanism, 26,27,28,29,30,31 …… Controller, 32 …… Main controller.

Claims (6)

(57) [Claims] 1. A processing apparatus comprising: a processing mechanism for performing a predetermined process on an object to be processed; and a transport mechanism for transporting the object to be processed to the processing mechanism, wherein the transport mechanism includes the processing mechanism. If the processing mechanism is not finished before transporting the object to be processed, the buffer function for temporarily holding the object to be processed and the object being processed by the processing mechanism are not over-processed As described above, the apparatus has an over-processing prevention function of taking out an object to be processed from the processing mechanism and temporarily holding the same, and a pickup function of moving the object to be processed to a position at which the processing is completed by the processing mechanism. A processing device characterized by the above-mentioned. 2. A processing mechanism for performing a predetermined process on an object to be processed, a transport mechanism for transporting the object to be processed to the processing mechanism,
A control mechanism for controlling the transport mechanism, wherein the transport mechanism, before transporting the processing target to the processing mechanism, when the processing of the processing mechanism is not finished, the processing target A buffer function for temporarily holding the object, and an over-processing prevention function for taking out the object being processed from the processing mechanism and temporarily holding the object being processed so that the object being processed by the processing mechanism is not over-processed And a pick-up function for moving the object to be processed, which has been processed by the processing mechanism, to a position where the object can be viewed, wherein the control mechanism selects one of the functions and executes the selected function. A processing apparatus for controlling the transport mechanism. 3. A processing apparatus comprising: at least two processing mechanisms for performing predetermined processing on a processing target; a transport mechanism for transferring the processing target between the processing mechanisms; and a storage unit for storing the processing target. A processing device comprising: a transport function that transports an object to be processed received from one of the processing mechanisms into the storage unit; and a processing unit that takes out the objects to be processed from the storage unit one by one and performs the other processing. A transport function for transporting the object to the mechanism, a buffer function for temporarily holding the object to be processed when the processing of the processing mechanism is not completed before transporting the object to the other processing mechanism; An over-processing prevention function for taking out an object being processed from the processing mechanism so as to prevent the object being processed by the processing mechanism from being over-processed, and temporarily holding the object to be processed; and an object received from one of the processing mechanisms Into the storage section A processing apparatus having a pass-through function of transporting a processed object to another processing mechanism without being stored, and a pickup function of moving an object to be processed, which has been processed by one of the processing mechanisms, to a visible position. An at least two processing mechanism for performing predetermined processing on the object, a transport mechanism for transporting the object between the processing mechanisms, a storage unit for storing the object, A processing apparatus having a control mechanism for controlling the transport mechanism, wherein the transport mechanism has a loading function of loading an object to be processed received from one of the processing mechanisms into the storage unit, and a processing object from the storage unit. And a transport function for taking out one by one and transporting the workpiece to the other processing mechanism, and temporarily transporting the workpiece before transporting the workpiece to the other processing mechanism when the processing of the processing mechanism is not completed. A buffer function for holding, and an over-processing prevention function for taking out the object being processed from the processing mechanism so as to prevent the object being processed by any of the processing mechanisms from being over-processed, and temporarily holding the same. From the processing mechanism of A pass-through function of transporting the received workpiece to the other processing mechanism without being stored in the storage unit, and a pickup function of moving the workpiece that has been processed by one of the processing mechanisms to a visible position. The processing apparatus, wherein the control mechanism selects one of the functions and controls the transport mechanism to execute the selected function. 5. The processing apparatus according to claim 1, wherein said at least one processing mechanism includes a resist coating mechanism for forming a resist film on a surface of the object to be processed. 6. The apparatus according to claim 1, wherein the transport mechanism executes the over-processing prevention function when the processing mechanism performs thermal processing on the object to be processed.
The processing device according to any one of the above.