JP2663638B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] Manufacture of a semiconductor device for connecting each outer end of a plurality of lead pieces whose inner ends are connected to a semiconductor chip to a conductor pattern formed on a semiconductor chip mounting substrate A method for easily and securely connecting the conductor pattern and the lead piece, and mounting a semiconductor chip on each outer end of a plurality of lead pieces having inner ends connected to the semiconductor chip. On a substrate on which a plurality of conductor patterns to be connected are formed, a connection conductor pattern is formed by connecting at least the respective inner ends of the conductor patterns provided on the same side of the semiconductor chip. After connecting the outer end portion of the lead piece to the pattern, the displacement between the corresponding conductor pattern and the lead piece is recognized by the displacement recognition means, and the corresponding displacement is obtained based on the displacement information obtained by the recognition means. The The connecting conductor pattern is cut so as to include the conductor pattern and the outer end of the lead piece.

[Industrial applications]

The present invention provides a method for mounting a semiconductor chip, particularly, an outer end of a lead piece having an inner end connected to a semiconductor chip, and a conductor pattern formed on a semiconductor chip mounting substrate, which is easily and reliably connected. Regarding the new method.

[Conventional technology]

Conventionally, a method of mounting a semiconductor chip for TAB (Tape Automated Bonding) on a ceramic substrate or a printed wiring board is to connect an inner end of a lead piece formed on a film carrier to the chip (inner bonding).
In this method, the outer end of each lead piece separated from the carrier is connected to the inner end of the conductor pattern formed on the chip mounting board (outer bonding).

FIG. 5 is a schematic plan view (a) in which a TAB IC chip is mounted on a ceramic substrate by a conventional method, and a schematic cross-sectional view thereof (b).

In FIG. 5, 1 is a ceramic substrate, 2 is a conductor pattern formed on the upper surface of the substrate 1, 3 is an IC chip, 4 is an inner end bonded to the IC chip 3 and an outer end is formed in the conductor pattern 2. Lead pieces (tapes) 5 bonded to the ends are an adhesive layer in which the IC chip 2 is bonded to the substrate 1, and a plurality of conductive patterns 2 are formed radially on each side of the mounted IC chip 3. You.

Generally, the conductor pattern 2 formed by etching the conductor film has a width of 100 μm to 200 μm, and the interval of alignment in the width direction is about 100 μm.

The lead piece 4 serving as a connection medium between the IC chip 3 and the conductor pattern 2 has a width of about 50 to 100 μm, and the outer end is formed at the same pitch as the conductor pattern 2. Is smaller than the pitch of the outer end portion so that many lead pieces 4 can be connected to the IC chip 3, and is generally about 70 μm. Therefore, some of the lead pieces 4 are formed in a straight shape, and others are formed in a shape in which an intermediate portion is bent into a hook shape.

[Problems to be solved by the invention]

However, the outer end of the lead piece 4 is
Positioning of the IC chip 3 prior to connection to
It is difficult to position the lead piece 4 cut out after being formed from the conductive film adhered to the film carrier so that the outer end of the lead piece 4 fits into the width of the conductive pattern 2 formed on the chip mounting board. There is a problem that the lead piece 4 having a low mechanical strength is easily deformed, and the lead piece 4 is easily detached from the conductor pattern 2 in the width direction and is connected.

In particular, the lead pieces 4 are 100
When more than one connection is made, the above problem becomes more pronounced.

[Means for solving the problem]

According to FIG. 1 showing an embodiment of the method for mounting a semiconductor chip according to the present invention for solving the above-mentioned problem, a plurality of semiconductor chips having a semiconductor chip 3 mounted and an inner end connected to the semiconductor chip 3 are connected. The substrate 1 on which the plurality of conductor patterns 2 connected to the respective outer ends of the lead pieces 4 are formed, at least the inner ends of the plurality of conductor patterns 2 disposed on the same side of the semiconductor chip 3. After forming the connecting conductor pattern 11 for connecting the parts and connecting the outer end of the lead piece 4 to the connecting conductor pattern 11, a displacement between the corresponding conductor pattern 2 and the lead piece 4 is detected by a displacement detecting means. The connection conductor pattern 11 is cut so as to include the corresponding conductor pattern 2 and the outer end of the lead piece 4 based on the positional displacement information obtained by the recognition means 13 and the recognition means 13.

[Action]

According to the above means, a conductor pattern and a connection conductor pattern for connecting an inner end of the conductor pattern are formed on the semiconductor chip mounting board, and an outer end of a lead connected to the semiconductor chip is formed on the connection conductor pattern. After the connection, the connection conductor pattern is cut so that each includes the conductor pattern and the outer end of the lead piece. When the semiconductor chip is mounted (adhered) to the substrate, the positioning of the conductor pattern and the lead piece is performed. That's a good thing.

Therefore, according to the method of the present invention, the mounting of the semiconductor chip is facilitated, and the outer ends of all the lead pieces are externally connected over the entire width.

〔Example〕

Hereinafter, a method for manufacturing a semiconductor device formed by TAB according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an explanatory view of main steps of mounting a TAB chip on a mounting board according to an embodiment of the present invention, FIG. 2 is an enlarged plan view showing an example of forming a cutting groove of a connection conductor pattern formed on the board, FIG. 3 is a system configuration diagram of a laser irradiation apparatus used for the cutting. In each of the drawings, the same reference numerals are used for the same parts as those in the preceding drawings.

Fig. 1 (a) which is a schematic plan view of a TAB chip mounting substrate.
The IC mounted on the upper surface of the ceramic substrate 1
A plurality of conductor patterns 2 to which lead pieces of a chip are connected
Then, a square frame-shaped connection conductor pattern 11 for connecting the inner ends of the respective conductor patterns 2 formed radially is formed.

The connecting conductor pattern 11 and the conductor pattern 2 which are formed so that the outer ends of the lead pieces of the IC chip overlap each other are formed simultaneously from the conductor film adhered to the substrate 1, and the substrate 1 made of ceramic Are formed, for example, in a three-layer structure made of tungsten, nickel, and gold. When a printed wiring board made of plastic or the like is used for the substrate 1, the three-layer structure is made of, for example, copper, nickel, and gold.

FIG. 1 is a schematic plan view in which an IC chip 3 is mounted on a substrate 1.
In FIG. 2B, the IC chip 3 is mounted on the upper surface of the substrate 1 using an adhesive layer, for example, silver paste, and the outer ends of the respective lead pieces 4 extending in all directions of the IC chip 3 are heat-pressed or the like. The connecting conductor pattern 11 is connected. At that time, the IC chip 3 is positioned substantially at the center of the connection conductor pattern 11.

Thereafter, as shown in FIG. 1 (c) which is a schematic plan view, one conductor pattern 2 and one lead piece 4 are respectively provided.
Then, a cutting groove 12 is formed in the connecting conductor pattern 11 by a laser, an ion beam, or a mechanical processing means so that the operation relating to the mounting of the IC chip 3 is completed.

In FIG. 2, reference numeral 12a denotes a groove obtained by cutting the connecting conductor pattern 11 in a right angle direction, 12b denotes a groove obtained by cutting the connecting conductor pattern 11 into an oblique straight shape, and 12c denotes a hook formed by connecting the connecting conductor pattern 11 at an intermediate portion. When the lead piece 4a is almost fitted in the extended area of the conductor pattern 2, the connecting conductor pattern
11 cuts both sides of the lead piece 4a with the cutting groove 12a. Then, the lead piece 4b slightly shifted in the lateral direction from the extended area of the conductor pattern 2 cuts the connecting conductor pattern 11 in the shifted direction by the cutting groove 12b, and the lead shifted further in the horizontal direction than the lead piece 4b. The piece 4c cuts the connecting conductor pattern 11 in the shifted direction by the cutting groove 12c.

As described above, the shape of the cut groove 12 of the connection conductor pattern 11 must be changed in accordance with the displacement of the lead piece 4, and the method will be described.

In FIG. 3, a position shift recognizing means (television camera or the like) 13 recognizes a shift between the conductor pattern 2 to be opposed and the lead piece 4 and a position of the lead piece 4 with respect to the conductive pattern 2. When the selection of the cutting grooves 12a, 12b and 12c for each conductor pattern 2 and the setting of the cutting start position are set based on the information from the controller 13, the stage on which the laser beam 17 or the ceramic substrate 1 is mounted is controlled based on the information from the control means 14. The XY driving means 15 for moving the 18 is operated, and the laser light emitted from the laser irradiation means 16 cuts the conductor pattern 11.

FIG. 4 is a schematic plan view showing a conductor pattern and a connection conductor pattern formed on a semiconductor chip mounting substrate according to another embodiment of the present invention, and shows a semiconductor chip mounting area 22 set on the upper surface of the substrate 1. The connecting conductor patterns 21a, 21b, 21c, 21d formed on the four sides respectively connect the inner ends of the conductor patterns 2 aligned on the same side of the mounting area 22, that is, the connection shown in FIG. The corner portion of the conductor pattern 11 is eliminated, and when the connection portion is cut in the same manner as the connection conductor pattern 11, the corner portion does not remain on the substrate, and the labor for removing the corner portion can be omitted.

〔The invention's effect〕

As described above, according to the method of the present invention, a conductor pattern and a connection conductor pattern for coupling an inner end of the conductor pattern are formed on a semiconductor chip mounting board, and an outer end of a lead connected to the semiconductor chip is formed. After connecting the connection conductor pattern, to cut the connection conductor pattern so that each includes the conductor pattern and the outer end of the lead piece,
Since the positioning of the lead piece with respect to the conductor pattern may be roughly performed, the work of mounting the semiconductor chip is facilitated, and the outer ends of all the lead pieces are externally connected over the entire width thereof. This has the effect of ensuring the reliability of the connection.

[Brief description of the drawings]

FIG. 1 is an explanatory view of one embodiment of the present invention, FIG. 2 is a view showing an example of forming a cutting groove of a connection conductor pattern according to the present invention, and FIG. 3 is a system main configuration of a laser irradiation apparatus used in the present invention. FIG. 4 is an explanatory view of another embodiment of the present invention, and FIG. 5 is an explanatory view of a conventional technique. In the figure, 1 is a semiconductor chip mounting substrate, 2 is a conductor pattern, 3 is an IC chip (semiconductor chip), 4 is a lead piece, 11,21a, 21b, 21c, 21d are connection conductor patterns, 12,12a, 12b, 12c indicates a cutting groove.

Claims (1)

(57) [Claims] 1. A plurality of lead pieces (4) having a semiconductor chip (3) mounted thereon and having an inner end connected to the semiconductor chip (3).
On the substrate (1) on which a plurality of conductor patterns (2) connected to each outer end of the semiconductor chip (3) are formed, at least a plurality of the conductor patterns (2) arranged on the same side of the semiconductor chip (3). 2) Connected conductor pattern (11) connecting the inner ends
After the outer end of the lead piece (4) is connected to the connecting conductor pattern (11), the displacement between the corresponding conductor pattern (2) and the lead piece (4) is corrected. The connection is performed such that the conductor pattern (2) and the outer end portion of the lead piece (4) corresponding to the conductor pattern (2) are recognized based on the displacement information obtained by the recognition means (13). A method of manufacturing a semiconductor device, comprising cutting a conductive pattern (11).