JP2665376B2 - Annular mask, manufacturing method thereof, plating method and plating apparatus using the mask - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ring-shaped mask for masking a conductive strip member when plating, a manufacturing method thereof, a plating method using the mask, and a plating apparatus.

[Prior Art] A plated conductive strip member is generally used as a material for electrical components such as electrical contacts, semiconductor element holders, and integrated circuits.

The conductive strip member is plated, for example, as follows (see Japanese Patent Publication No. 60-20476).

First, the conductive strip member to be plated is brought into contact with the outer periphery of the rotating member in contact with the electrolytic solution, and is moved with the rotation of the rotating member.

Next, the annular mask is brought into contact with the surface of the conductive strip member and circulates with the movement of the conductive strip member to mask the conductive strip member in the electrolytic solution.

In addition, while the conductive strip member as a cathode,
An anode is provided near the spraying means, and an electrolytic current flows between the conductive strip member and the anode.

Then, the electrolytic solution is sprayed on the surface of the masked conductive strip member in the electrolytic solution.

In general, a ring-shaped mask used for masking a conductive strip member is a rubber-like soft vinyl chloride resin having a thickness of about 5 mm, with a mesh-like tetron having a grid size of about 0.3 mm square on one side. Is used.

The mask is manufactured by arranging a reticulated tetron in a mold, pouring a soft vinyl chloride resin, and molding.

[Problems to be Solved by the Invention] However, in the related art, since the annular mask is made of a soft vinyl chloride resin, when it is hung on a roller for circulating movement, it expands in the length direction, and thus, in the width direction. Shrink.

For this reason, in the conventional annular mask, when masking the conductive strip member to be plated, the masking area narrows in the width direction, which results in the plating area protruding into the masking area and improving the precision of the boundary of the plating area. There was a problem that can not be.

For this reason, in the related art, the deformation amount of the annular mask is reduced by increasing the thickness of the annular mask. However, when the annular mask is thickened, the conductive strip member is masked by the two annular masks. hand,
When a thin plating is to be formed between two annular masks, a deep groove is formed between them, and metal ions in the electrolyte do not sufficiently diffuse to the surface of the conductive strip member to be plated.

As a result, there has been a problem that the plating thickness is insufficient at the boundary between the plating areas.

On the other hand, a tape-shaped mask made of a polymer synthetic resin coated with an adhesive has been developed in order to prevent the plating area of the conductive strip member from protruding.

However, when masking is performed using the tape-shaped mask, the mask used once cannot be used again and must be disposable each time.
There was a problem that the economy was poor.

In addition, the masked conductive strip members
The adhesive on the mask remains, and the strip member must be cleaned in order to remove the adhesive, so that the plating process is complicated and the productivity is poor.

The present invention has been made in view of such problems of the conventional technology, the plating area does not protrude from the conductive strip member to be plated, particularly, even when formed thin, An object of the present invention is to provide a ring-shaped mask and a method of manufacturing the same, and a plating method and a plating apparatus using the mask, in which a plating thickness is prevented from being insufficient at a boundary portion of a plating area.

[Means for Solving the Problems] A conventional annular mask is made of a rubbery soft vinyl chloride resin and has elasticity, so that it deforms when tension is applied. For this reason, in the conventional annular mask, when masking the conductive strip member to be plated, it is found that the masking area narrows in the width direction, so that the plating area protrudes and the precision of the boundary of the plating area cannot be improved. Was.

Also, in the conventional ring-shaped mask, when the ring-shaped mask is thickened in order to prevent the influence of elasticity, the conductive strip member is masked by the two ring-shaped masks, and a thin plating is formed between the two ring-shaped masks. During the formation, a deep groove is formed therebetween, and metal ions in the electrolytic solution do not sufficiently diffuse to the surface of the conductive strip member to be plated, resulting in insufficient plating thickness at a boundary portion of the plating area. I understand.

Therefore, in order to achieve the object, the first invention of the present application is to contact the outer periphery of the rotating member in contact with the electrolytic solution, and to contact with the surface of the conductive strip member to be moved and plated with the rotation of the rotating member. A circular mask that circulates and moves with the movement of the conductive strip member to mask the conductive strip member in the electrolytic solution, wherein the ring mask is formed by forming a polyether ether ketone resin into a ring shape. It is characterized by.

The second invention of the present application is directed to contacting the outer periphery of the rotating member in contact with the electrolyte, contacting the surface of the conductive strip member to be moved and rotated with the rotation of the rotating member, and A method of manufacturing a circular mask for circulating and masking the conductive strip member in the electrolytic solution, comprising cutting a polyether-ether-ketone resin sheet into strips to form a strip mask member, It is characterized in that both ends of the member are welded to form a ring.

The third invention of the present application is directed to contacting the outer periphery of the rotating member in contact with the electrolyte, moving with the rotation of the rotating member, contacting the surface of the conductive strip member to be plated, and moving with the conductive strip member. A method of manufacturing a circular mask for circulating and masking the conductive strip member in the electrolytic solution, wherein a pipe made of a polyether-ether-ketone resin is cut at a right angle to a longitudinal direction. .

The fourth invention of the present application is directed to contacting the outer periphery of the rotating member in contact with the electrolyte, moving with the rotation of the rotating member, contacting the surface of the conductive strip member to be plated, and moving with the conductive strip member. A method of manufacturing a circular mask for circulating and masking the conductive strip member in the electrolytic solution, wherein a polyester resin sheet is formed into a ring shape.

The fifth invention of the present application is directed to contacting the outer periphery of the rotating member in contact with the electrolytic solution, contacting the surface of the conductive strip member to be moved and rotated with the rotation of the rotating member, and A method of manufacturing a circular mask for circulating and masking the conductive strip member in the electrolytic solution, comprising cutting a polyether-ether-ketone resin sheet into a bag-like shape. .

A plating method according to a sixth aspect of the present invention includes: a step of bringing a conductive strip member to be plated into contact with an outer periphery of a rotating member in contact with an electrolytic solution, and moving the rotating strip member together with the rotation of the rotating member; Contacting the surface of the conductive strip member, and circulating the conductive strip member together with the conductive strip member, and masking the conductive strip member in the electrolytic solution. A step of injecting an electrolytic solution, and a step of providing an anode in the electrolytic solution, using the conductive strip member as a cathode, and flowing an electrolytic current between the anode and the cathode. It is characterized by being formed in a ring shape from an ether / ether / ketone resin.

A seventh invention of the present application is a plating apparatus for masking and plating a conductive strip member, comprising: a container for containing an electrolyte; a rotating member in contact with the electrolyte; a conductive strip member to be plated; Strip guide means for guiding and contacting the outer periphery of the rotating member inside, the conductive strip being in contact with the surface of the conductive strip member, circulating and moving with the movement of the conductive strip times, and A ring-shaped mask for masking a member; a mask guiding means for guiding the ring-shaped mask to the outer periphery of the rotating member; an injection means for injecting an electrolytic solution onto the masked surface of the conductive strip member in the electrolytic solution; An anode provided in contact with the electrolyte, and the conductive strip member as a cathode, and an electrolytic current flowing between the cathode and the anode. Flow means consist, it said annular mask is characterized in that by forming a polyether ether ketone resin ring.

[Operation] Since the annular mask has a small elasticity, it does not deform even when tension is applied. For this reason, when the annular mask is hung on a roller for circulating movement and the conductive strip member to be plated is masked, the masking area does not narrow in the width direction.

Therefore, the annular mask does not protrude into the masking area from the predetermined area, and forms a plating area with good boundary accuracy.

In addition, the ring-shaped mask has a small elasticity, and thus can be formed thin. In this case, when the conductive strip member is masked by the two annular masks and a thin plating is to be formed between the two annular masks, a deep groove is not formed therebetween, and the electrolytic solution is not formed. Since the metal ions therein can sufficiently diffuse to the surface of the conductive strip member to be plated, it is possible to prevent the plating thickness from becoming insufficient at the boundary between the plating areas.

[Examples] Hereinafter, various examples of the present invention will be described with reference to the drawings.

In the various embodiments, the same parts are denoted by the same reference numerals, and redundant description will be omitted.

 FIG. 1 shows an embodiment of the present invention.

FIG. 1 is a schematic sectional view of a plating apparatus for masking and plating a conductive strip member.

An electrolyte 12 is contained in the container 11. Electrolyte
Reference numeral 12 denotes a solution containing metal ions to be plated, and the metal ions are, for example, silver ions, nickel ions, and the like.

In the container 11, a cylindrical rotating member 3 is provided rotatably with the lower half thereof in contact with the electrolytic solution 12. The rotating member 3 is rotated by an electric motor (not shown). In FIG. 1, the rotating member 3 is rotating counterclockwise.

A conductive strip member 1 is stretched around the outer periphery of the rotating member 3 in the electrolyte solution 12.

The conductive strip member 1 is an elongated metal member to be plated by this plating apparatus.
It is made of 000m long copper member. Light tension is applied to both ends of the conductive strip member 1 so as not to sag.

The conductive strip member 1 is connected to an electrode (not shown) and serves as a cathode.

The roller 2 guides the conductive strip member 1 from the right-hand direction in FIG. 1 to the outer periphery of the rotating member 3 in the electrolytic solution 12 to make contact therewith, and the roller 5 causes the plated conductive strip member 1 to Electrolyte so as not to shift from rotating member 3
Guide outside 12

On the other hand, a circular mask 8 having a thickness of 0.3 mm, a width of 20 mm and a diameter of 1.1 m
Touches the surface of the conductive strip member 1 before entering the electrolytic solution 12, and circulates with the movement of the conductive strip member 1 to mask a part of the conductive strip member 1 in the electrolytic solution 12. I do.

The annular mask 8 includes a rotating member 3 and rollers 6, 7, 9, 10
Has been passed over.

The roller 6 guides the annular mask 8 to the outer periphery of the rotating member 3 so that the annular mask 8 masks the conductive strip member 1 at an accurate position without shifting, and the roller 7 controls the annular mask 8 immediately after the masking. So as not to be displaced from the rotating member 3 and the conductive strip member 1.
It is guided to the outside of the electrolytic solution 12.

The annular mask 8 is guided by the roller 7, further passes through the roller 9 and the roller 10, and is returned to the roller 6.
It circulates to

The roller 9 is urged by a spring (not shown) in a direction in which the annular mask 8 is spread so that the annular mask 8 does not sag, and functions as a tension wheel.

Below the rotating member 3 in the electrolyte 12, there is provided a jetting means 13 for jetting the electrolyte 12 on the surface of the conductive strip member 1 masked by the annular mask 8.

An anode 14 is provided below the jetting means 13 in the electrolytic solution 12, and an electrolytic current flows between the anode 14 and the conductive strip member 1.

 Next, the annular mask 8 will be described.

The annular mask 8 has an endless loop shape and a thickness of 0.1 mm or more and 3 mm.
It is made of the following polyether-ether-ketone resin, the thinner the better.

The annular mask 8 is configured to be thinner than the conductive strip member 1 or formed by forming holes or grooves, and masks a part of the conductive strip member 1 to apply predetermined plating to the conductive strip member 1. Is to be applied.

The synthetic resin used for the annular mask 8 may be an electrolytic solution.
A material having high resistance to 12 and low elasticity is preferable.

 The annular mask 8 is manufactured by the following method.

 In the first embodiment, it is manufactured by the following method.

A sheet made of polyetheretheretherketone synthetic resin (PEEK) having a thickness of 0.3 mm is cut into strips having a length of 3.5 m and a width of 20 mm with an accuracy of 50 μm or less to form a strip mask member.

Both ends of the strip mask member are welded and joined by high frequency welding.

As shown in the enlarged sectional view of FIG. 2, the welding method is to cut the end portions 21 and 22 diagonally so that the end portions become thinner toward the tip end, and to make the end portions 21 and 22 uniform in thickness. And overlap.

Further, as shown in FIG. 3, the ends 21 and 22 may be cut in parallel in the thickness direction, and the ends 21 and 22 may be joined at the end faces so as not to be shifted.

In the plan view, the ends 21 and 22 are cut by straight lines parallel to the width direction as shown in FIG. However, as shown in FIG. 5, the end portions 21 and 22 may be cut into an irregular shape that meshes alternately and joined at the end surfaces so as not to shift.

In addition, welding may be ultrasonic welding or normal heating welding other than high frequency welding.

Next, the strip mask member is shaved off at the protruding portion of the welded portion, the side cut portion is ground using a grinder machine, and the plane portion is ground. Further, as a finish, the flat portion of the strip mask member is polished smoothly by a polishing machine.

With the annular mask 8 thus manufactured, the electrolyte 12
A silver ion solution was used to perform a resistance test of applying silver plating to a copper strip member.

As a result, it was possible to obtain a silver-plated strip member having a plating area with an accuracy of 100 μm or less and having a sufficient plating amount even at the boundary even after 10,000 repeated uses.

In addition, three ring-shaped masks 8 are prepared and have a thickness of 0.11 mm.
Placed parallel to the 67mm wide copper strip member,
Two strip-shaped silver platings having a width of 8 mm were formed.

As a result, the width accuracy was within 50 μm, and the meandering accuracy between 10 m was also within 50 μm. Also, no bleeding of silver plating was observed in the plating area.

Further, an experiment was conducted to examine the relationship between the amount of change and the tension of the annular mask 8 manufactured according to the present embodiment.

First, a circular mask 31 made of polyetheretherketone synthetic resin (PEEK) having a thickness of 0.31 mm, and
0.19mm thick polyethylene terephthalate resin (PE
An annular mask 32 made of T) was manufactured, and an annular mask 33 made of a polyvinyl chloride resin (PVC) having a thickness of 4.0 mm according to the prior art was prepared.

Then, tension was applied to these ring-shaped masks, and the amount of change in the width was measured.

 The result is shown in FIG.

From FIG. 6, it can be seen that the annular mask 31 according to the present embodiment has a significantly smaller width shrinkage with respect to the applied tension than the conventional annular mask 33.

In a plating apparatus, a ring mask usually has 2 to 4K.
Since a g-weight tension is applied, the width of the annular mask of the present example hardly shrinks.

 In the second embodiment, it is manufactured by the following method.

Poly ether ether with a thickness of 0.2mm and a diameter of 1.1m
A pipe made of ketone synthetic resin (PEEK) was cut at right angles to the longitudinal direction into a ring shape having a width of 20 mm with an accuracy of 50 μm or less to obtain a ring-shaped mask 8.

With the annular mask 8 thus manufactured, the electrolyte 12
A silver ion solution was used to perform a resistance test of applying silver plating to a copper strip member.

As a result, it was possible to obtain a silver-plated strip member having a plating area with an accuracy of 100 μm or less and having a sufficient plating amount even at the boundary even after 5,000 repeated uses.

 In the third embodiment, it is manufactured by the following method.

Polyetheretheretherketone synthetic resin (PEEK) was poured into a mold for molding and processing a ring-shaped mask having a thickness of 0.3 mm, a width of 20 mm and a diameter of 1.1 m, and was solidified to produce a ring-shaped mask.

 In the fourth embodiment, it is manufactured by the following method.

A 0.3 mm thick sheet made of polyetheretheretherketone synthetic resin (PEEK) is formed into a bag shape,
Cut into a ring of 1.1m and width of 20mm with accuracy within 50μm,
An annular mask was manufactured.

 Next, the operation will be described.

The conductive strip member 1 to be plated includes a roller 2
, And comes into contact with the outer periphery of the rotating member 3 in contact with the electrolytic solution 12. The conductive strip member 1 is moved in the direction of the roller 5 with the rotation of the rotating member 3 in the counterclockwise direction due to friction with the rotating member 3 because tension is applied to both ends.

Before the conductive strip member 1 enters the electrolytic solution 12, the annular mask 8 is guided by the rollers 6 and contacts the surface of the conductive strip member 1.

Since the annular mask 8 is tensioned by the rollers 9, the rotating member 3 is sandwiched between the conductive strip members 1.
Conductive strip member 1 pressed against and plated
Adhere to

The annular mask 8 is moved from the roller 6 to the roller 7, the roller 9, the roller 9 with the movement of the conductive strip member 1.
It circulates to 10 and masks a part of the conductive strip member 1 in the electrolytic solution 12, that is, a part that is not plated.

In the electrolytic solution 12, the spraying means 13 sprays the electrolytic solution 12 onto the surface of the conductive strip member 1 masked by the annular mask 8.

In the electrolytic solution 12, since an electrolytic current flows between the anode 14 and the conductive strip member 1, an unmasked portion of the conductive strip member 1 is plated.

Since the annular mask 8 is as thin as 0.3 mm or less, the conductive strip member 1 is masked by the two annular masks 8 to form a thin plating between the two annular masks 8. However, no deep groove is formed therebetween, and the metal ions in the electrolytic solution sufficiently diffuse to the surface of the conductive strip member 1 to be plated. This prevents the plating thickness from becoming insufficient at the boundary between the plating areas.

Further, the material of the annular mask 8 is made of a polyether ether ketone resin having high resistance to the electrolyte solution 12 and low elasticity, so that it is not easily deformed.

Therefore, when masking the conductive strip member 1 to be plated, the annular mask 8 does not narrow the masking area in the width direction, so that the plating area is prevented from protruding into the masking area.

In the examples, the dimensions are described on the conductive strip member 1 and the annular mask 8, and the like, but the dimensions are shown as a preferred embodiment, and the dimensions of the components of the present invention are , Is not limited to that value.

[Effects of the Invention] According to the present invention, since the annular mask does not narrow in the width direction, the plating area is prevented from protruding into the masking area.

In addition, even when the annular mask is formed to be thin,
Insufficient plating thickness is prevented at the boundary of the plating area.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a plating apparatus for masking and plating a part of a conductive strip member, FIG. 2 is an enlarged cross-sectional view of an end portion of a ring-shaped mask showing a welding method of the ring-shaped mask, and FIG. FIG. 4 is an enlarged sectional view of an end portion of the annular mask showing another welding method of the annular mask. FIG. 4 is an enlarged plan view of an end portion of the annular mask showing the welding method of the annular mask. And FIG. 6 is a graph showing the relationship between the tension of the annular mask and the amount of change in the width of the annular mask. DESCRIPTION OF SYMBOLS 1 ... Conductive strip member, 3 ... Rotating member 2,5,6,7,9,10 ... Roller 8 ... Ring mask, 11 ... Container, 12 ... Electrolyte 13 ... Injection means, 14 ……anode

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-96291 (JP, A) JP-A-59-13090 (JP, A) JP-A-63-195290 (JP, A) 20476 (JP, B2)

Claims (4)

(57) [Claims] 1. A rotating member which comes into contact with an electrolyte contacts an outer periphery of the rotating member, moves with the rotation of the rotating member, contacts a surface of a conductive strip member to be plated, and circulates with the movement of the conductive strip member. And a circular mask for masking the conductive strip member in the electrolytic solution, wherein the circular mask is made of a polyether-ether-ketone resin. 2. A method for manufacturing a ring-shaped mask according to claim 1, wherein the polyether-ether-ketone resin sheet is cut into a strip shape to form a strip mask member, and both end portions of the strip mask member are welded into a ring shape. A method for manufacturing a ring-shaped mask, characterized by being formed. 3. A step of bringing a conductive strip member to be plated into contact with the outer periphery of a rotating member in contact with an electrolytic solution and moving the rotating member along with the rotation of the rotating member; Making the conductive strip member circulate and move along with the movement of the conductive strip member to mask the conductive strip member in the electrolytic solution. In the electrolytic solution, the surface of the masked conductive strip member is And a step of providing an anode in the electrolytic solution, using the conductive strip member as a cathode, and flowing an electrolytic current between the anode and the cathode. A plating method comprising forming an ether-ether-ketone resin into a ring shape. 4. A plating apparatus for masking and plating a conductive strip member, comprising: a container for containing an electrolytic solution; a rotating member that comes into contact with the electrolytic solution; Strip guide means for guiding and contacting the outer periphery of the rotating member in the liquid, and contacting the surface of the conductive strip member, circulating and moving with the movement of the conductive strip member, and A ring-shaped mask for masking a conductive strip member; mask guiding means for guiding the ring-shaped mask to the outer periphery of the rotating member; and spraying an electrolytic solution on the masked surface of the conductive strip member in the electrolytic solution. An injection means, an anode provided in contact with the electrolytic solution, and a conductive strip member serving as a cathode, and an electrode provided between the cathode and the anode. A means for passing a current, wherein the annular mask plating apparatus characterized by comprising a polyether ether ketone resin ring.