JP2665865B2 - Mounting method of column capacitor - Google Patents
Mounting method of column capacitorInfo
- Publication number
- JP2665865B2 JP2665865B2 JP4311010A JP31101092A JP2665865B2 JP 2665865 B2 JP2665865 B2 JP 2665865B2 JP 4311010 A JP4311010 A JP 4311010A JP 31101092 A JP31101092 A JP 31101092A JP 2665865 B2 JP2665865 B2 JP 2665865B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit board
- electronic circuit
- split
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【0001】[0001]
【産業上の利用分野】この発明は、柱状コンデンサの電
子回路基板への取付方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a columnar capacitor on an electronic circuit board.
【0002】[0002]
【従来の技術】一般に、電解コンデンサとして、円柱状
の外形を有し、この円柱状の端部にリード部が突設され
たものが知られている。このようなコンデンサは、電子
回路基板に実装された状態では、その長手方向が前記電
子回路基板の板面に対して垂直になるのが普通である。
ここで、実装とは、コンデンサのリード部を電子回路基
板のプリントパターンに半田付けすることにより、この
コンデンサが前記電子回路基板に電気的に接続され、か
つ機械的に取り付けられることを言う。2. Description of the Related Art In general, there is known an electrolytic capacitor having a columnar outer shape and a lead portion protruding from the columnar end. When such a capacitor is mounted on an electronic circuit board, its longitudinal direction is generally perpendicular to the plate surface of the electronic circuit board.
Here, mounting means that the capacitor is electrically connected to the electronic circuit board and mechanically attached by soldering a lead portion of the capacitor to a printed pattern of the electronic circuit board.
【0003】ところで、電子回路基板の板面に対してコ
ンデンサの長手方向が垂直になると、次のような問題を
生ずる。 高さの制限がある電子機器での使用が困難になり、こ
のため高価な偏平コンデンサを使用することもあった。 電子回路基板に装着された前記コンデンサを有する電
子機器が、その輸送時等に受ける連続的な横揺れ、機械
的な衝撃により前記コンデンサのリード部に多大なスト
レスがかかり、このためコンデンサのリード部が破損し
たり、実装されている電子回路基板の周辺パターンが剥
がれたりすることがあった。これに対処するため、従来
では実装されたコンデンサを電子回路基板に接着剤によ
り接着して固定していた。When the longitudinal direction of the capacitor is perpendicular to the surface of the electronic circuit board, the following problem occurs. It has been difficult to use the electronic device having a height limitation, and an expensive flat capacitor has sometimes been used. An electronic device having the capacitor mounted on an electronic circuit board is subjected to a great amount of stress on a lead portion of the capacitor due to continuous rolling and mechanical shock received during transportation or the like. May be damaged, or the peripheral pattern of the mounted electronic circuit board may be peeled off. In order to cope with this, conventionally, the mounted capacitor is bonded and fixed to an electronic circuit board with an adhesive.
【0004】しかし、前記したコンデンサは比較的重量
が大きく、しかも実装された状態では電子回路基板から
前記コンデンサの重心までの距離が比較的長いので、前
記の機械的な衝撃等に対しての安定度が低くなる。この
ため、前記機械的な衝撃に耐えるためには前記接着剤を
用いて強固に固定しなければならない。このように強固
に固定するためには、多量の接着剤を必要とするという
欠点があった。また、人手により前記接着剤を塗布する
場合には、接着剤の量、接着剤の塗布位置等にバラツキ
を生じることがあり、例えば接着剤が少量の場合には電
子回路基板から前記コンデンサが剥がれることもある
等、信頼性が低下するという欠点もあった。このように
接着剤を用いて固定する場合の欠点を除去すべく、電子
回路基板に前記のようなコンデンサを固定するための固
定具を設けることも考えられるが、小型の電子機器では
電子回路基板も小型であるため、電子回路基板に前記コ
ンデンサのリード部を挿通する孔の他に、このコンデン
サを固定するのに用いる孔を設けることは困難である。However, since the above-mentioned capacitor is relatively heavy and the distance from the electronic circuit board to the center of gravity of the capacitor is relatively long when the capacitor is mounted, it is stable against the mechanical shock and the like. The degree becomes lower. For this reason, in order to withstand the mechanical shock, it must be firmly fixed using the adhesive. There is a drawback that a large amount of adhesive is required to firmly fix in this way. In addition, when the adhesive is applied manually, the amount of the adhesive, the application position of the adhesive, and the like may vary, for example, when the amount of the adhesive is small, the capacitor is peeled from the electronic circuit board. There was also a disadvantage that the reliability was lowered, for example. It is conceivable to provide a fixing device for fixing the above-described capacitor on the electronic circuit board in order to eliminate the drawbacks when the fixing is performed by using the adhesive as described above. Is small, it is difficult to provide a hole for fixing the capacitor in addition to the hole for inserting the lead of the capacitor in the electronic circuit board.
【0005】前記の問題を解決すべく、柱状コンデ
ンサの長手方向が電子回路基板の板面とほぼ平行になる
ように前記柱状コンデンサを配置することも考えられ
る。In order to solve the above problem, it is conceivable to arrange the columnar capacitors so that the longitudinal direction of the columnar capacitors is substantially parallel to the plate surface of the electronic circuit board.
【0006】[0006]
【発明が解決しようとする課題】しかし、前記のように
柱状コンデンサの長手方向が電子回路基板の板面とほぼ
平行になるように前記柱状コンデンサを配置すると、こ
のコンデンサを半田槽によって他の電子部品と共に実装
することが困難になり、作業効率が大幅に低下する。こ
の発明は上記の欠点を除去し、柱状コンデンサの長手方
向が電子回路基板の板面とほぼ平行になるように前記柱
状コンデンサを配置してもこのコンデンサを他の電子部
品と共に実装することが容易にでき、作業効率が向上す
る柱状コンデンサの取付方法を提供することを目的とし
ている。However, when the columnar capacitors are arranged such that the longitudinal direction of the columnar capacitors is substantially parallel to the plate surface of the electronic circuit board as described above, the capacitors are separated by another solder tank. It becomes difficult to mount with components, and the working efficiency is greatly reduced. The present invention eliminates the above-mentioned drawbacks and makes it easy to mount the columnar capacitor together with other electronic components even if the columnar capacitor is arranged so that the longitudinal direction of the columnar capacitor is substantially parallel to the plate surface of the electronic circuit board. It is an object of the present invention to provide a method for mounting a columnar capacitor which can improve the working efficiency.
【0007】[0007]
【課題を解決するための手段】上記の課題を解決するた
めの、この発明の柱状コンデンサの取付方法は、電子回
路基板へ実装すべき柱状コンデンサが実装されたときの
このコンデンサにほぼ沿うように、前記電子回路基板に
割目を設け、この割目により割基板となるところにおけ
る前記コンデンサのリード部が接続されるべきプリント
パターンを前記電子回路基板の前記割基板となるところ
を除くところに接続するように、複数のジャンパー線を
前記割基板となるところの一縁側に配設し、しかる後に
前記割基板に実装された前記コンデンサの長手方向を前
記電子回路基板の板面とほぼ平行ならしめるべく前記ジ
ャンパー線の近傍を回動の中心軸として倒し、この倒れ
た状態の前記コンデンサを前記電子回路基板に固定手段
により固定することを特徴とするものである。In order to solve the above-mentioned problems, a method of mounting a columnar capacitor according to the present invention is provided so that the columnar capacitor to be mounted on an electronic circuit board is substantially aligned with the capacitor when the columnar capacitor is mounted. Providing a crevice on the electronic circuit board, and connecting a printed pattern to which a lead portion of the capacitor is to be connected at a place where the lead portion of the capacitor is to be connected to a place other than the place where the electronic circuit board is to be the cleaved board. A plurality of jumper wires are arranged on one edge side of the split board, and thereafter, the longitudinal direction of the capacitor mounted on the split board is made substantially parallel to the plate surface of the electronic circuit board. In order to fix the capacitor in the tilted state to the electronic circuit board, fix the capacitor to the electronic circuit board. The one in which the features.
【0008】[0008]
【作用】上記のような取付方法では、電子回路基板に前
記割目が設けられ、かつ前記ジャンパー線が配設された
状態で前記割目に沿って電子回路基板を割り、前記割基
板を形成する。この状態で前記コンデンサを前記ジャン
パー線の近傍を中心軸として倒し、この倒れたコンデン
サを固定手段により電子回路基板に固定する。この状態
では、電子回路基板の板面に対してコンデンサの長手方
向が垂直になっている場合に比較して前記電子回路基板
とコンデンサの重心との距離が短くなり、前記した機械
的な衝撃等に対しての安定度が高くなる。また、高さ制
限のある電子機器にも使用することができる。In the mounting method as described above, the electronic circuit board is divided along the split in a state where the split is provided on the electronic circuit board and the jumper wire is provided, and the split board is formed. I do. In this state, the capacitor is tilted with the vicinity of the jumper wire as a center axis, and the tilted capacitor is fixed to the electronic circuit board by the fixing means. In this state, the distance between the electronic circuit board and the center of gravity of the capacitor is shorter than in the case where the longitudinal direction of the capacitor is perpendicular to the plate surface of the electronic circuit board, and the mechanical shock and the like described above. The stability against is increased. Further, it can also be used for electronic devices having height restrictions.
【0009】[0009]
【実施例】以下に、この発明の一実施例を図1及び図2
について説明する。図1、図2において、1は周知の電
解コンデンサであり、円柱状の外形を有し、この円柱状
の一端面にはリード部が突出している。2は電子回路基
板であり、この電子回路基板2へ前記コンデンサ1が図
1(a)、図2のように実装されたときのこのコンデン
サ1にほぼ沿うように割目3を設ける。4はジャンパー
線であり、前記割目3に囲まれた割基板5になるところ
6における前記コンデンサ1のリード部が接続されるべ
きプリントパターン7を前記電子回路基板2の割基板5
になるところ6を除くところに接続するものであり、前
記割基板5となるところ6の一縁側に配設する。前記コ
ンデンサ1及びジャンパー線4は他の電子部品と共に半
田槽により周知の如く一緒に半田付けされて実装され
る。1 and 2 show an embodiment of the present invention.
Will be described. 1 and 2, reference numeral 1 denotes a well-known electrolytic capacitor having a columnar outer shape, and a lead portion protrudes from one end surface of the columnar shape. Reference numeral 2 denotes an electronic circuit board, and a crease 3 is provided along the capacitor 1 when the capacitor 1 is mounted on the electronic circuit board 2 as shown in FIGS. Reference numeral 4 denotes a jumper wire, and a printed pattern 7 to be connected to a lead portion of the capacitor 1 at a place 6 to be a split board 5 surrounded by the split 3 is formed by a split board 5 of the electronic circuit board 2.
The split substrate 5 is connected to a portion excluding the portion 6, and the split substrate 5 is disposed on one edge side of the portion 6. The capacitor 1 and the jumper wire 4 are mounted together with other electronic components by soldering together with a solder bath as is well known.
【0010】図1(a)及び図2は電子回路基板2に割
目3が設けられ、ジャンパー線4が配設され、かつコン
デンサ1が実装された状態を示す。この状態で前記割目
3に沿って電子回路基板1を割り、前記割基板5を形成
する。そして前記コンデンサ1を図1(b)の矢印のよ
うに前記ジャンパー線4の側に倒し、この倒れたコンデ
ンサ1の割基板5からなるべく離れたところ一箇所を接
着剤により電子回路基板2に固定する。FIGS. 1A and 2 show a state in which a split 3 is provided on the electronic circuit board 2, a jumper wire 4 is provided, and the capacitor 1 is mounted. In this state, the electronic circuit board 1 is split along the cut 3 to form the split board 5. Then, the capacitor 1 is tilted toward the jumper wire 4 as shown by an arrow in FIG. 1 (b), and one place is fixed to the electronic circuit board 2 with an adhesive as far as possible from the split board 5 of the tilted capacitor 1. I do.
【0011】上記実施例では、割基板5となるところ6
を電子回路基板2のほぼ中央部に設けたが、図3乃至4
に示すように、電子回路基板2の端部に割基板5となる
ところ6を設けてもよい。この場合には、コンデンサ1
を図3(b)のように電子回路基板2の下方位置に配置
することもできる。この状態のコンデンサ1を電子回路
基板2に固定するには、前記の接着剤に代え、束線バン
ド等を用い、この束線バンド等によりコンデンサ1を電
子回路基板2と固定の関係にある適宜の部材に固定す
る。尚、図3乃至4において、図1乃至2と同一符号は
同様のものを示す。In the above-described embodiment, the part 6 to be the split substrate 5
Is provided substantially at the center of the electronic circuit board 2, but FIGS.
As shown in the figure, a portion 6 serving as a split board 5 may be provided at an end of the electronic circuit board 2. In this case, the capacitor 1
Can be arranged below the electronic circuit board 2 as shown in FIG. In order to fix the capacitor 1 in this state to the electronic circuit board 2, instead of the above-mentioned adhesive, a tie band or the like is used, and the capacitor 1 is appropriately fixed to the electronic circuit board 2 by the tie band or the like. To the member. 3 and 4, the same reference numerals as those in FIGS. 1 and 2 indicate the same components.
【0012】上記図1(b)または図3(b)のように
構成することにより、柱状コンデンサ1が電子回路基板
2に固定された状態では、電子回路基板2の板面とコン
デンサ1の長手方向がほぼ平行になるので高さ制限のあ
る電子機器でも使用することができ、また電子回路基板
2から前記コンデンサ1の重心までの距離が比較的短く
なるので、前記機械的な衝撃等に対しての安定度が高く
なり、従って少量の接着剤により前記コンデンサ1を電
子回路基板2に充分に固定することができる。With the configuration as shown in FIG. 1B or FIG. 3B, when the columnar capacitor 1 is fixed to the electronic circuit board 2, the plate surface of the electronic circuit board 2 and the longitudinal Since the directions are substantially parallel, it can be used even in an electronic device having a limited height. Also, since the distance from the electronic circuit board 2 to the center of gravity of the capacitor 1 is relatively short, it can be used for the mechanical shock or the like. Therefore, the capacitor 1 can be sufficiently fixed to the electronic circuit board 2 with a small amount of adhesive.
【0013】[0013]
【発明の効果】以上説明したように、この発明によれ
ば、柱状コンデンサ1を電子回路基板2の板面とほぼ平
行になるように取り付けるに際し、このコンデンサ1を
他の電子部品と一緒に半田槽によって電子回路基板2に
実装することができ、作業効率が向上する。As described above, according to the present invention, when mounting the columnar capacitor 1 so as to be substantially parallel to the surface of the electronic circuit board 2, the capacitor 1 is soldered together with other electronic components. The tank can be mounted on the electronic circuit board 2 and the work efficiency is improved.
【図1】この発明の一実施例を説明するための斜視図で
ある。FIG. 1 is a perspective view for explaining an embodiment of the present invention.
【図2】この発明の一実施例を説明するためのものであ
り、図1(a)の平面図である。FIG. 2 is a view for explaining one embodiment of the present invention, and is a plan view of FIG. 1 (a).
【図3】この発明の他の実施例を説明するための斜視図
である。FIG. 3 is a perspective view for explaining another embodiment of the present invention.
【図4】この発明の他の実施例を説明するためのもので
あり、図3(a)の平面図である。FIG. 4 is a view for explaining another embodiment of the present invention, and is a plan view of FIG. 3 (a).
1 コンデンサ 2 電子回路基板 3 割目 4 ジャンパー線 5 割基板 6 割基板となるところ 7 プリントパターン DESCRIPTION OF SYMBOLS 1 Capacitor 2 Electronic circuit board 30% 4 Jumper wire 50% board 60% board 7 Print pattern
Claims (1)
ときのこのコンデンサにほぼ沿うように、前記電子回路
基板に割目を設け、 この割目により割基板となるところにおける前記コンデ
ンサのリード部が接続されるべきプリントパターンを前
記電子回路基板の前記割基板となるところを除くところ
に接続するように、複数のジャンパー線を前記割基板と
なるところの一縁側に配設し、 しかる後に前記割基板に実装された前記コンデンサの長
手方向を前記電子回路基板の板面とほぼ平行ならしめる
べく前記ジャンパー線の近傍を回動の中心軸として倒
し、 この倒れた状態の前記コンデンサを前記電子回路基板に
固定手段により固定することを特徴とする柱状コンデン
サの取付方法。1. A method for mounting a columnar capacitor, comprising: providing a split on the electronic circuit board so as to substantially follow the capacitor when the columnar capacitor to be mounted on the electronic circuit board is mounted; A plurality of jumper wires become the split board so that a printed pattern to be connected to the lead portion of the capacitor at the place where the split board is to be connected is connected to a place other than the place where the split board of the electronic circuit board is formed. However, in order to make the longitudinal direction of the capacitor mounted on the split board approximately parallel to the board surface of the electronic circuit board, the vicinity of the jumper wire is turned down as a center axis of the rotation. A method for mounting a columnar capacitor, comprising fixing the capacitor in the collapsed state to the electronic circuit board by fixing means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4311010A JP2665865B2 (en) | 1992-10-26 | 1992-10-26 | Mounting method of column capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4311010A JP2665865B2 (en) | 1992-10-26 | 1992-10-26 | Mounting method of column capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06140800A JPH06140800A (en) | 1994-05-20 |
| JP2665865B2 true JP2665865B2 (en) | 1997-10-22 |
Family
ID=18012041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4311010A Expired - Lifetime JP2665865B2 (en) | 1992-10-26 | 1992-10-26 | Mounting method of column capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2665865B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101478386B1 (en) * | 2010-09-07 | 2015-01-02 | 현대중공업 주식회사 | Method for installing car deck pillar with hinge for RoRo ship |
-
1992
- 1992-10-26 JP JP4311010A patent/JP2665865B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101478386B1 (en) * | 2010-09-07 | 2015-01-02 | 현대중공업 주식회사 | Method for installing car deck pillar with hinge for RoRo ship |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06140800A (en) | 1994-05-20 |
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