JP2669094B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP2669094B2 JP2669094B2 JP2032805A JP3280590A JP2669094B2 JP 2669094 B2 JP2669094 B2 JP 2669094B2 JP 2032805 A JP2032805 A JP 2032805A JP 3280590 A JP3280590 A JP 3280590A JP 2669094 B2 JP2669094 B2 JP 2669094B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- present
- view
- circuit board
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は一体成形型ICカードに関するものである。Description: TECHNICAL FIELD The present invention relates to an integrally molded IC card.
第３図は従来のICカードの分解斜視図、第４図は第３
図を組立てた状態を示す縦断側面図である。図におい
て、（１）は回路基板で、半導体素子など電子部品
（２）を装着している。（３）は合成樹脂成形品からな
りかつ回路基板（１）を収納したフレーム、（４）は金
属板からなる１対のパネルで、フレーム（３）の両面に
接着シートや接着剤等の接着材料（５）を介して接着さ
れる。（６）は表裏パネル（４）の導通をとるためのコ
イルスプリングであり、パネル（４）間の導通を保つた
め適度のばね力を有する。FIG. 3 is an exploded perspective view of a conventional IC card, and FIG.
It is a vertical side view which shows the state which assembled the figure. In the figure, (1) is a circuit board on which electronic parts (2) such as semiconductor elements are mounted. (3) is a frame made of a synthetic resin molded product and containing the circuit board (1), and (4) is a pair of panels made of a metal plate, and an adhesive sheet or an adhesive agent is adhered to both sides of the frame (3). Bonded via the material (5). Reference numeral (6) is a coil spring for establishing conduction between the front and back panels (4), and has an appropriate spring force for maintaining continuity between the panels (4).
従来のICカードは以上のように構成されているため、
表裏パネル（４）間での導電がとれて同電位となるた
め、ICカード内部の回路基板（１）上の半導体素子
（２）の静電破壊によるデータ破損が防止できる。Since the conventional IC card is configured as above,
Since electrical conductivity is removed between the front and back panels (4) to have the same potential, data damage due to electrostatic breakdown of the semiconductor element (2) on the circuit board (1) inside the IC card can be prevented.
従来のICカードは以上のように構成されているので、
両面のパネル（４）を同電位にするためのパネルコンタ
クトに小形のコイルスプリング（６）を用いなければな
らず、作業性が悪く、自動化にも向いていない上、コス
トも高いという問題点があり、また接続を確実に行うた
めのコイルスプリング（６）のバネ力が大き過ぎた場
合、パネル（４）がフレーム（３）から外れたり、感圧
タイプの接着剤（５）でパネル（４）を固定している場
合、バネ力によるクリープによつてパネル（４）が浮
き、接続が不確実になるなどの問題点があつた。Since conventional IC cards are configured as described above,
A small coil spring (6) must be used for a panel contact for making the both sides of the panel (4) have the same electric potential, resulting in poor workability, not suitable for automation, and high cost. If the spring force of the coil spring (6) for ensuring connection is too large, the panel (4) may come off the frame (3) or the panel (4) may be pressed with a pressure-sensitive adhesive (5). 2) is fixed, the panel (4) floats due to the creep due to the spring force, resulting in uncertain connection.
この発明は上記のような問題点を解消するためになさ
れたもので、作業性が良く、工程も簡略化でき、自動化
に向いているとともに、コストも安く、その上ICカード
自体の曲げ強度等の機械強度を向上させることのできる
ICカードを得ることを目的とする。The present invention has been made to solve the above problems, and has good workability, can simplify the process, is suitable for automation, is low in cost, and furthermore has a bending strength of the IC card itself. Can improve the mechanical strength of
The purpose is to get an IC card.
この発明に係るICカードは、導電性封止樹脂を使用し
てICカードの外装パッケージを一体成形したものであ
る。The IC card according to the present invention is obtained by integrally molding an external package of the IC card using a conductive sealing resin.
この発明におけるICカードは、ICカードの外装パッケ
ージを導電性封止樹脂により一体成形することによつて
ICカード全体を同電位に保つ。The IC card according to the present invention is obtained by integrally molding an outer package of the IC card with a conductive sealing resin.
Keep the entire IC card at the same potential.
以下、この発明の一実施例を図について説明する。第
１図は分解斜視図、第２図は第１図を一体成形した状態
を示す縦断側面図であり、前記従来のものと同一または
相当部分には同一符号を付して説明を省略する。図にお
いて、（７）は回路基板（１）全体を封止したICカード
の外装パッケージを構成する導電性封止樹脂である。な
お、図中点線については実際は分割できない部分を示し
ている。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view, and FIG. 2 is a longitudinal sectional side view showing a state in which FIG. 1 is integrally molded. In the figure, reference numeral (7) denotes a conductive sealing resin constituting an exterior package of an IC card in which the entire circuit board (1) is sealed. The dotted line in the figure indicates a portion that cannot be actually divided.
次に動作について説明する。この発明によるICカード
は第２図に示すように導電性封止樹脂（７）により一体
成形されているため、ICカードの外装パッケージ全体が
同一電位に保たれる。従つて、ICカード内部の回路基板
（１）上の半導体素子（２）の静電破壊によるデータ破
壊が防止できる。Next, the operation will be described. Since the IC card according to the present invention is integrally molded with the conductive sealing resin (7) as shown in FIG. 2, the entire outer package of the IC card is kept at the same potential. Therefore, data destruction due to electrostatic destruction of the semiconductor element (2) on the circuit board (1) inside the IC card can be prevented.
上記実施例では封止材料として導電性樹脂を示した
が、絶縁性プラスチックに導電性フィラーを混合したも
のでもよい。Although a conductive resin is shown as a sealing material in the above-described embodiment, a material obtained by mixing a conductive filler with an insulating plastic may be used.
以上のように、この発明によればICカードの外装パッ
ケージ全体を同一電位に保つ目的で導電性樹脂を用いて
一体成形を行つているため、安価でしかも作業性がよ
く、自動化が容易なICカードが得られるという効果があ
る。As described above, according to the present invention, since the entire exterior package of an IC card is integrally molded using a conductive resin in order to maintain the same potential, an IC that is inexpensive, has good workability, and is easy to automate. The effect is that you can get a card.
第１図はこの発明の一実施例によるICカードを示す分解
斜視図、第２図はこの発明の一実施例によるICカードを
示す断面図、第３図は従来のICカードを示す分解斜視
図、第４図は従来のICカードの断面図である。 図において、（１）は回路基板、（２）は電子部品、
（７）は導電性封止樹脂を示す。 なお図中、同一符号は同一、又は相当部分を示す。1 is an exploded perspective view showing an IC card according to an embodiment of the present invention, FIG. 2 is a sectional view showing an IC card according to an embodiment of the present invention, and FIG. 3 is an exploded perspective view showing a conventional IC card. FIG. 4 is a sectional view of a conventional IC card. In the figure, (1) is a circuit board, (2) is an electronic component,
(7) shows a conductive sealing resin. In the drawings, the same reference numerals indicate the same or corresponding parts.
フロントページの続き (72)発明者 大渕 淳 兵庫県伊丹市瑞原４丁目１番地 三菱電 機株式会社北伊丹製作所内 (56)参考文献 特開 昭56−157590（ＪＰ，Ａ)Continuation of front page (72) Inventor Atsushi Atsushi 4-1-1 Mizuhara, Itami-shi, Hyogo Mitsubishi Electric Corporation Kita-Itami Works (56) References JP-A-56-157590 (JP, A)
Claims (1)
ト配線基板に搭載して構成された電子回路と外装パッケ
ージとを一体成形したICカードにおいて、前記外装パッ
ケージは導電性封止樹脂としたことを特徴とするICカー
ド。1. An IC card in which an electronic circuit formed by mounting a semiconductor element or a discrete component on a printed wiring board and an exterior package are integrally formed, wherein the exterior package is made of a conductive sealing resin. IC card to do.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2032805A JP2669094B2 (en) | 1990-02-13 | 1990-02-13 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2032805A JP2669094B2 (en) | 1990-02-13 | 1990-02-13 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03234699A JPH03234699A (en) | 1991-10-18 |
| JP2669094B2 true JP2669094B2 (en) | 1997-10-27 |
Family
ID=12369055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2032805A Expired - Lifetime JP2669094B2 (en) | 1990-02-13 | 1990-02-13 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2669094B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424721C (en) * | 2006-11-22 | 2008-10-08 | 凤凰微电子（中国）有限公司 | Method for combining chips and components into a smart card by using plastic packaging technology |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2480008A1 (en) * | 1980-04-04 | 1981-10-09 | Flonic Sa | IMPROVEMENTS TO MEMORY CARDS |
| JPS62132694A (en) * | 1985-12-04 | 1987-06-15 | 株式会社東芝 | Integrated circuit card |
-
1990
- 1990-02-13 JP JP2032805A patent/JP2669094B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03234699A (en) | 1991-10-18 |
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