JP2680265B2 - Nesting mold equipment - Google Patents
Nesting mold equipmentInfo
- Publication number
- JP2680265B2 JP2680265B2 JP13271794A JP13271794A JP2680265B2 JP 2680265 B2 JP2680265 B2 JP 2680265B2 JP 13271794 A JP13271794 A JP 13271794A JP 13271794 A JP13271794 A JP 13271794A JP 2680265 B2 JP2680265 B2 JP 2680265B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- insert
- die
- fixed
- nesting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims description 31
- 238000001746 injection moulding Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 13
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 229920006351 engineering plastic Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000004043 responsiveness Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は入子型金型装置に関し、
更に詳細には金型本体に装着された入子型の壁面の各々
が、金型本体及び金型本体に設けられた位置決め部材の
各当接面に当接されてなる入子型金型装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a telescopic die device,
More specifically, a nesting die device in which each of the wall surfaces of the nesting die mounted on the die body is in contact with each abutting surface of the die body and a positioning member provided in the die body. Regarding
【０００２】[0002]
【従来の技術】近年、射出成形機に使用される金型装置
としては、多品種少量生産に適するように、金型本体に
入子型のみを交換可能に装着できる入子型金型装置が汎
用されている。かかる入子型金型装置においては、例え
ば特開昭６０−２４５５２６号公報及び特開平４−１７
６６０９号公報において提案されているように、入子型
に加熱手段又は冷却手段を設けることによって入子型を
単独冷却又は単独加熱することができ、金型装置全体を
加熱又は冷却して温度調整をする場合に比較して、金型
温度の安定性や応答性を良好とすることができる。とこ
ろで、最近、ポリエーテルサルフォン（ＰＥＳ）やポリ
エーテルエーテルケトン（ＰＥＥＫ）等のいわゆるスー
パーエンプラを射出成形することが試みられている。か
かる射出成形では、入子型温度を１４０℃以上、場合に
よっては１８０℃の高温まで昇温することが要求される
ことがある。しかし、１４０℃以上の高温に入子型温度
を昇温することは、特開平４−１７６６０９号公報の入
子型を単独加熱する入子型金型装置でも放熱が大きく極
めて困難であった。このため、本発明者等は、金型本体
と入子型との断熱を図るべく、特開昭６０−２４５５２
６号公報に記載されている如く、挿入される入子型の側
壁面に当接する入子挿入凹部の側壁面に、断熱層を形成
した入子型金型装置を試みた。尚、断熱層は、凹溝に繊
維状断熱材を充填したブロックを金型本体にボルト止め
したものである。2. Description of the Related Art In recent years, as a mold device used in an injection molding machine, there is an insert mold device capable of replacing only the insert mold in a mold body so as to be suitable for high-mix low-volume production. It is commonly used. In such a nesting die apparatus, for example, Japanese Patent Laid-Open Nos. 60-245526 and 4-17.
As proposed in Japanese Patent No. 6609, the insert die can be independently cooled or independently heated by providing the insert die with a heating means or a cooling means, and the temperature of the entire die apparatus can be adjusted by heating or cooling. The stability and responsiveness of the mold temperature can be improved as compared with the case of performing. By the way, recently, injection molding of so-called super engineering plastics such as polyether sulfone (PES) and polyether ether ketone (PEEK) has been attempted. In such injection molding, it may be required to raise the temperature of the insert mold to 140 ° C. or higher, and in some cases, to a high temperature of 180 ° C. However, it has been extremely difficult to raise the temperature of the insert mold to a high temperature of 140 ° C. or higher, because the insert mold apparatus for independently heating the insert mold disclosed in Japanese Unexamined Patent Publication No. 4-176609 produces large heat radiation. For this reason, the inventors of the present invention have disclosed in Japanese Laid-Open Patent Publication No. 60-24552 in order to insulate the mold body and the insert mold from each other.
As described in Japanese Patent Laid-Open No. 6, an attempt was made of a nesting die device in which a heat insulating layer was formed on the side wall surface of the nesting insertion recess that abuts the side wall surface of the nesting die to be inserted. The heat insulating layer is a block in which the groove is filled with a fibrous heat insulating material, which is bolted to the mold body.
【０００３】[0003]
【発明が解決しようとする課題】この様に、入子挿入凹
部の側壁面に断熱層を形成した入子型金型装置によれ
ば、入子型の側壁面から金型本体への伝熱による放熱を
減少できるために入子型温度の安定性等を一応向上する
ことができる。しかしながら、金型本体の入子挿入凹部
の底面には、入子型の底面又は上面が直接接触し、入子
型と金型本体との断熱が不充分であるため、満足し得る
入子型温度の安定性や応答性等を得ることができず、し
かも入子型温度を１４０℃以上に昇温することは困難で
あった。このため、高温成形が要請されるスーパーエン
プラの射出成形を工業的に行うことはできなかった。一
方、金型本体と入子型との断熱を図るべく、金型本体の
入子挿入凹部の底面に繊維状断熱材を充填したブロック
を装着しても、金型の型閉時の型締力によってブロック
が変形し、入子型の精密な位置決めができないおそれが
ある。そこで、本発明の目的は、入子型と金型本体との
充分な断熱を図りつつ入子型の精密な位置決めを行うこ
とのできる入子型金型装置を提供することにある。As described above, according to the insert type die device in which the heat insulating layer is formed on the side wall surface of the insert insertion recess, heat transfer from the side wall surface of the insert die to the mold body is achieved. Since the heat radiation due to can be reduced, the stability of the insert mold temperature can be improved. However, the bottom surface or the top surface of the insert die directly contacts the bottom surface of the insert insertion recess of the die body, and the heat insulation between the insert die and the die body is insufficient. It was not possible to obtain temperature stability and responsiveness, and it was difficult to raise the insert mold temperature to 140 ° C. or higher. Therefore, injection molding of super engineering plastics, which requires high temperature molding, could not be industrially performed. On the other hand, in order to insulate the mold body from the insert mold, even if a block filled with fibrous heat insulating material is attached to the bottom of the insert insertion recess of the mold body, the mold is closed when the mold is closed. The block may be deformed by the force, and it may not be possible to perform precise positioning of the insert type. Therefore, it is an object of the present invention to provide a nesting die device capable of precisely positioning the nesting die while sufficiently insulating the nesting die and the die body.
【０００４】[0004]
【課題を解決するための手段】本発明者等は前記目的を
達成すべく検討を重ねた結果、断熱材としてのセラミッ
ク板を入子型と当接する金型本体等の各当接面に装着す
ることによって、入子型と金型本体との断熱と入子型の
精密な位置決めを行うことができることを見出し、本発
明に到達した。すなわち、本発明は、金型本体に装着さ
れた入子型の壁面の各々が、金型本体及び金型本体に設
けられた位置決め部材の各当接面に当接されてなる入子
型金型装置において、該入子型壁面と当接する金型本体
及び位置決め部材の各当接面に、前記金型本体と入子型
とを断熱する断熱用のセラミック板が装着されているこ
とを特徴とする入子型金型装置にある。Means for Solving the Problems As a result of repeated studies to achieve the above object, the present inventors have attached a ceramic plate as a heat insulating material to each abutting surface of a die body or the like that abuts with a nesting die. By doing so, they have found that it is possible to perform heat insulation between the insert mold and the mold main body and to precisely position the insert mold, and have reached the present invention. That is, the present invention relates to a nesting die in which each of the wall surfaces of the nesting die mounted on the die body is brought into contact with the respective abutting surfaces of the die body and the positioning member provided on the die body. In the mold device, a ceramic plate for heat insulation that insulates the mold body and the insert mold is attached to each contact surface of the mold body and the positioning member that contact the insert mold wall surface. There is a nesting die device.
【０００５】かかる構成を有する本発明において、射出
成形機のノズル先端が当接する、金型本体のノズルタッ
チ部近傍に、金型本体に装着された入子型からの放熱を
防ぐ断熱用のセラミック板を装着することによって、入
子型と金型本体との断熱を向上できる。また、射出成形
機のノズル先端が当接する、金型本体のノズルタッチ部
近傍に、金型本体に装着された入子型からの放熱を防ぐ
放熱防止用のヒータを設けることによっても、入子型と
金型本体との断熱を更に向上することができる。特に、
射出成形機のノズル先端が当接する、金型本体のノズル
タッチ部近傍に、金型本体に装着された入子型のノズル
タッチ部側面と平行となるように装着した断熱用のセラ
ミック板に接して放熱防止用のヒータを設けた場合、入
子型と金型本体との断熱を更に一層向上できる。本発明
において使用するセラミック板としては、ジルコニア製
のセラミック板が強度的に好適である。更に、入子型を
金型本体に装着したとき、入子型に穿設された挿通孔に
挿入されるように、棒状ヒータを金型本体に設けた場
合、入子型にヒータを容易に装着できる。In the present invention having such a structure, a ceramic for heat insulation is provided in the vicinity of the nozzle touch portion of the mold body with which the tip of the nozzle of the injection molding machine abuts to prevent heat radiation from the insert mold mounted on the mold body. By mounting the plate, heat insulation between the insert mold and the mold body can be improved. Also, by providing a heat dissipation prevention heater to prevent heat dissipation from the insert mold attached to the mold body, near the nozzle touch part of the mold body, where the nozzle tip of the injection molding machine abuts, The heat insulation between the mold and the mold body can be further improved. Especially,
In the vicinity of the nozzle touch part of the mold body, where the nozzle tip of the injection molding machine abuts, contact the ceramic plate for heat insulation that is installed parallel to the side surface of the nozzle touch part of the insert mold installed in the mold body. If a heater for preventing heat radiation is provided, the heat insulation between the insert die and the die body can be further improved. As the ceramic plate used in the present invention, a ceramic plate made of zirconia is suitable in terms of strength. Furthermore, when the rod-shaped heater is provided in the die body so that when the die is attached to the die body, the heater can be easily installed in the die body so that the heater is inserted into the insertion hole formed in the die. Can be installed.
【０００６】[0006]
【作用】本発明によれば、入子型と当接する金型本体及
び位置決め部材の各当接面にセラミック板を装着するこ
とによって、入子型と金型本体との間の断熱を充分に行
うことができ、入子型から金型本体への伝熱に因る放熱
を防止できるため、入子型温度を１４０℃以上に容易に
昇温可能となり、更に入子型温度の安定性や応答性も良
好とすることができる。しかも、入子型との衝突等によ
って変形し難いセラミック板によって入子型の位置決め
がなされるため、入子型の精密な位置決めを行うことが
できる。According to the present invention, by mounting the ceramic plates on the contact surfaces of the mold body and the positioning member which are in contact with the insert mold, the heat insulation between the insert mold and the mold body is sufficiently achieved. Since it can be performed, and the heat radiation due to the heat transfer from the insert die to the die body can be prevented, the insert die temperature can be easily raised to 140 ° C. or higher, and the stability of the insert die temperature and Responsiveness can also be made good. Moreover, since the nesting die is positioned by the ceramic plate that is not easily deformed due to a collision with the nesting die, the nesting die can be precisely positioned.
【０００７】[0007]
【実施例】本発明を図面によって更に詳細に説明する。
図１は、本発明の一実施例に係る入子型金型装置の縦断
面図であって、金型本体を構成する固定型ベース１０と
可動型ベース１２との間に入子型１４が装着されてい
る。かかる固定型ベース１０は射出成形機の固定盤に固
着され、可動型ベース１２は射出成形機の可動盤に固着
される。このため、図１に示す金型装置では、可動型ベ
ース１２が射出成形機の可動盤の移動に伴い、固定型ベ
ース１０に一端が固着された複数本のロッド１６、１６
・・に沿って移動し、入子型１４を構成する固定型１４
ａと可動型１４ｂとの型閉じ及び型開きを行う。入子型
１４の固定型１４ａと可動型１４ｂとは、固定型ベース
１０及び可動型ベース１２に設けられた位置決め部材１
８ａ、２０ａに、入子型１４の固定型１４ａ及び可動型
１４ｂの各側面が当接して位置決めがなされる。BRIEF DESCRIPTION OF THE DRAWINGS FIG.
FIG. 1 is a vertical cross-sectional view of an insert mold apparatus according to an embodiment of the present invention, in which a insert mold 14 is provided between a fixed base 10 and a movable base 12 that form a mold body. It is installed. The fixed mold base 10 is fixed to the fixed plate of the injection molding machine, and the movable mold base 12 is fixed to the movable plate of the injection molding machine. Therefore, in the mold apparatus shown in FIG. 1, the movable mold base 12 is moved by the movable plate of the injection molding machine, and the plurality of rods 16 and 16 having one end fixed to the fixed mold base 10.
..Fixed mold 14 that moves along and constitutes the insert mold 14
Mold closing and mold opening of a and the movable mold 14b are performed. The fixed mold 14 a and the movable mold 14 b of the insert mold 14 are the positioning member 1 provided on the fixed mold base 10 and the movable mold base 12.
The side faces of the fixed mold 14a and the movable mold 14b of the insert mold 14 are brought into contact with 8a and 20a for positioning.
【０００８】かかる位置決め部材１８ａ、２０ａの各々
は、図１のＡ−Ａ矢視図である図２及び図１のＢ−Ｂ矢
視図である図３に示す様に、位置決め部材１８ｂ、２０
ｂに対して直角に設けられている。これら位置決め部材
のうち、位置決め部材１８ａ、１８ｂは入子型１４の固
定型１４ａの位置決めを行い、位置決め部材２０ａ、２
０ｂは入子型１４の可動型１４ｂの位置決めを行う。更
に、本実施例の金型装置の固定型ベース１０には、位置
決め部材１８ａ、１８ｂに壁面が当接して位置決めがな
された固定型１４ａの角部に当接し、固定型１４ａを固
定型ベース１０に固定する固定具２２ａがボルト２３に
よって固着されている。同様に、可動型ベース１２に
も、位置決め部材２０ａ、２０ｂに壁面が当接して位置
決めがなされた可動型１４ｂの角部に当接し、可動型１
４ｂを可動型ベース１２に固定する固定具２２ｂがボル
ト３８によって固着されている。かかる本実施例の金型
装置を構成する固定型ベース１０には、射出成形の際
に、射出成形機のノズル１７の先端が当接する、ノズル
タッチ部２４（図１）が設けられている。尚、位置決め
部材１８ａ、１８ｂの各々は複数本のボルト１９、１９
・・・によって固定型ベース１０に固着され、位置決め
部材２０ａ、２０ｂの各々も複数本のボルト２１、２１
によって可動型ベース１２に固着されている。Each of the positioning members 18a, 20a has a positioning member 18b, 20a as shown in FIG. 2 which is an AA arrow view of FIG. 1 and FIG. 3 which is an BB arrow view of FIG.
It is provided at a right angle to b. Among these positioning members, the positioning members 18a and 18b perform positioning of the fixed die 14a of the insert die 14, and the positioning members 20a and 2b.
0b positions the movable die 14b of the insert die 14. Further, the fixed mold base 10 of the mold apparatus of the present embodiment is brought into contact with the corners of the fixed mold 14a whose walls are brought into contact with the positioning members 18a and 18b, and the fixed mold 14a is fixed. A fixing tool 22a for fixing to is fixed by a bolt 23. Similarly, the movable die base 12 also comes into contact with the corners of the movable die 14b whose walls are brought into contact with the positioning members 20a and 20b, so that the movable die 1 is moved.
A fixing tool 22b for fixing the 4b to the movable base 12 is fixed by a bolt 38. A nozzle touch portion 24 (FIG. 1) with which the tip of the nozzle 17 of the injection molding machine abuts at the time of injection molding is provided in the fixed mold base 10 which constitutes the mold device of this embodiment. Each of the positioning members 18a and 18b has a plurality of bolts 19 and 19b.
Are fixed to the fixed base 10 by the ...
It is fixedly attached to the movable base 12.
【０００９】本実施例においては、固定型１４ａ及び可
動型１４ｂの位置決めを行う位置決め部材１８ａ、１８
ｂ、２０ａ、２０ｂの入子型１４との当接面に、セラミ
ック板２６ａ、２６ｂ、２８ａ、２８ｂがビス止め（図
示せず）固着されている。このため、固定型１４ａ及び
可動型１４ｂは、その各側面がセラミック板２６ａ、２
６ｂ、２８ａ、２８ｂの各当接面に直接当接し、固定型
１４ａ及び可動型１４ｂが位置決めされる。これらセラ
ミック板は、図１に示す様に、位置決め部材の幅よりも
幅狭に形成されていてるが、セラミック板と当接しない
入子型１４の壁面と位置決め部材面との間に、エアギャ
ップとしての隙間を形成できるように、位置決め部材面
よりもセラミック板の当接面が高ければよい。エアギャ
ップによって入子型と金型本体とを断熱できるからであ
る。In this embodiment, the positioning members 18a, 18 for positioning the fixed die 14a and the movable die 14b.
Ceramic plates 26a, 26b, 28a, 28b are fixed to the contact surfaces of b, 20a, 20b with the insert mold 14 with screws (not shown). For this reason, each of the fixed mold 14a and the movable mold 14b has a ceramic plate 26a,
The fixed die 14a and the movable die 14b are positioned in direct contact with the respective contact surfaces 6b, 28a and 28b. Although these ceramic plates are formed narrower than the width of the positioning member as shown in FIG. 1, an air gap is formed between the wall surface of the nest 14 that does not contact the ceramic plate and the positioning member surface. It is sufficient that the contact surface of the ceramic plate is higher than the surface of the positioning member so that a gap can be formed. This is because the air gap can insulate the insert mold and the mold body.
【００１０】本実施例では、固定型ベース１０及び可動
型ベース１２に設けられた固定具２２ａ、２２ｂの入子
型１４の角部と当接する当接面にも、セラミック板３４
ａ、３４ｂが装着され、入子型１４と金型本体との断熱
を図っている。更に、金型本体を構成する固定型ベース
１０及び可動型ベース１２の入子型１４との各当接面に
もセラミック板が装着されている。かかるセラミック板
としては、可動型ベース１２にビス止めされた図１に示
すセラミック板３０、３２と、固定型ベース１０にビス
止めされた図２に示すセラミック板３６ａ、３６ｂとが
ある。このセラミック板３６ａ、３６ｂは、図２に示す
様に、入子型１４の固定型ベース１４との当接面よりも
幅狭に形成されているため、固定型１４ａを固定型ベー
ス１０に装着した際に、図１に示す様に、エアギャップ
としての隙間３７が形成される。かかるエアギャップに
よっても、入子型１４と金型本体との断熱を図ることが
できる。In this embodiment, the ceramic plates 34 are also provided on the contact surfaces of the fixtures 22a and 22b provided on the fixed mold base 10 and the movable mold base 12 that come into contact with the corners of the insert mold 14.
a and 34b are mounted to insulate the insert mold 14 and the mold body. Further, a ceramic plate is also mounted on each of the contact surfaces of the fixed mold base 10 and the movable mold base 12 which make up the mold body with the insert mold 14. As such ceramic plates, there are ceramic plates 30 and 32 shown in FIG. 1 fixed to the movable base 12 with screws, and ceramic plates 36a and 36b shown in FIG. 2 fixed to the fixed base 10 with screws. As shown in FIG. 2, the ceramic plates 36a and 36b are formed narrower than the contact surface of the insert mold 14 with the fixed mold base 14, so that the fixed mold 14a is mounted on the fixed mold base 10. In doing so, as shown in FIG. 1, a gap 37 as an air gap is formed. The air gap can also provide heat insulation between the insert mold 14 and the mold body.
【００１１】また、本実施例では、入子型１４を単独加
熱できる様に、入子型１４を金型本体に装着する際に、
入子型１４に形成された挿通孔４４ａ、４４ｂ、４６
ａ、４６ｂに、固定型ベース１０に設けられた棒状ヒー
タ４０ａ、４０ｂ、４２ａ、４２ｂを挿通する。この様
に、予め棒状ヒータを金型本体に設けておくことによっ
て、入子型１４を金型本体に装着した後に、棒状ヒータ
を入子型１４に装着する作業を省略することができる。
ここで、棒状ヒータの外周面又は挿通孔の内壁面の少な
くとも一方に、遠赤外線授受材料から成る皮膜を形成す
ると、熱の授受が良好となり、入子型１４に形成する挿
通孔の径を拡大して棒状ヒータを遊嵌可能にでき、入子
型１４を金型本体に容易に装着できる。Further, in this embodiment, when the insert mold 14 is attached to the mold body so that the insert mold 14 can be heated independently,
Insertion holes 44a, 44b, 46 formed in nest 14
Rod-shaped heaters 40a, 40b, 42a, 42b provided on the fixed base 10 are inserted through a and 46b. In this way, by providing the rod-shaped heater in the mold body in advance, it is possible to omit the operation of attaching the rod-shaped heater to the nested mold 14 after the nesting mold 14 is attached to the mold body.
Here, if a film made of a far-infrared ray transfer material is formed on at least one of the outer peripheral surface of the rod-shaped heater or the inner wall surface of the insertion hole, heat transfer is improved, and the diameter of the insertion hole formed in the insert mold 14 is increased. As a result, the rod-shaped heater can be loosely fitted, and the insert mold 14 can be easily attached to the mold body.
【００１２】更に、本実施例では、入子型１４を単独加
熱するため、入子型１４からの放熱を更に一層防止すべ
く、固定型ベース１０のノズルタッチ部２４近傍に、固
定型１４ａの固定型ベース１０側面と略平行になる様
に、セラミック板４８を設けると共に、ヒータ５０をセ
ラミック板４８の入子型１４側面に設けている。この様
に、本実施例に係る金型装置では、入子型１４と金型本
体とをセラミック板及びエアーギャップによって断熱し
ているのである。また、本実施例において使用するセラ
ミック板としては、ジルコニア製のセラミック板を採用
した。ジルコニア製のセラミック板は、金型の型締力に
対しても充分な耐久性を併せ有するためである。尚、ヒ
ータ５０と固定型１４ａの固定型ベース１０側面との間
には、図１に示す様に、金属部材４９が挿入されてい
る。入子型１４を多数個取りとする場合、固定型１４ａ
の固定型ベース１０側面にランナ溝を形成するためであ
り、且つヒータ５０と固定型１４ａの固定型ベース１０
側面との間を空隙にしておくことに因るヒータ５０の空
焼きを防止するためである。Further, in this embodiment, since the insert mold 14 is heated independently, in order to further prevent heat radiation from the insert mold 14, a fixed mold 14a is provided near the nozzle touch portion 24 of the fixed mold base 10. The ceramic plate 48 is provided so as to be substantially parallel to the side surface of the fixed die base 10, and the heater 50 is provided on the side surface of the insert die 14 of the ceramic plate 48. Thus, in the mold apparatus according to the present embodiment, the insert mold 14 and the mold body are insulated by the ceramic plate and the air gap. In addition, a ceramic plate made of zirconia was used as the ceramic plate used in this example. This is because the zirconia ceramic plate also has sufficient durability against the mold clamping force. A metal member 49 is inserted between the heater 50 and the side surface of the fixed mold base 10 of the fixed mold 14a, as shown in FIG. When multiple insert molds 14 are used, fixed mold 14a
Is for forming a runner groove on the side surface of the fixed mold base 10 of the fixed mold base 10 of the heater 50 and the fixed mold 14a.
This is to prevent the heater 50 from being burned out due to the space between the heater and the side surface.
【００１３】これまで述べてきた図１〜図３に示す本実
施例の金型装置を使用して射出成形したときの金型本体
及び入子型との温度変化を図４に示す。図４は、スーパ
ーエンプラの一種であるポリエーテルサルフォン（ＰＥ
Ｓ）を溶融成形した際に、昇温時の金型本体及び入子型
との温度変化である。この際の入子型温度の設定温度を
１４０℃とした。図４から明らかな様に、入子型では固
定型及び可動型の温度が略１４０℃近傍で安定したのに
対し、金型本体では固定型ベース及び可動型ベースの温
度が約８０℃で安定化し、且つ入子型温度が金型本体温
度よりも早期に安定化した。この様に、入子型を１４０
℃以上に容易に昇温することができ、且つ入子型の温度
安定性及び応答性も良好である。FIG. 4 shows changes in temperature between the mold body and the insert mold when injection molding is performed using the mold device of this embodiment shown in FIGS. 1 to 3 described above. Figure 4 shows polyether sulfone (PE), a type of super engineering plastic.
It is the temperature change between the mold body and the insert mold when the temperature is raised when melt-molding S). The set temperature of the insert mold temperature at this time was 140 ° C. As is clear from FIG. 4, the temperature of the fixed mold and the movable mold was stable at around 140 ° C in the insert mold, whereas the temperature of the fixed mold base and the movable mold base was stable at about 80 ° C in the mold body. And the temperature of the insert mold was stabilized earlier than the mold body temperature. In this way, the nesting type 140
The temperature can be easily raised to not less than 0 ° C, and the temperature stability and responsiveness of the insert mold are also good.
【００１４】以上、述べてきた本実施例の金型装置は、
主として高温成形されるスーパーエンプラ用の金型装置
として使用されるものであるが、通常の汎用樹脂用の金
型装置には勿論のこと、熱硬化性樹脂又は熱加硫を伴う
ゴムの成形を行う金型装置に使用してもよい。この場
合、固定型ベース１０のノズルタッチ部２４近傍に、セ
ラミック板４８又はヒータ５０を単独で設けたのみであ
ってもよく、入子型温度が低温の場合には、セラミック
板４８及びヒータ５０を設けなくもよい。The mold apparatus of this embodiment described above is
It is mainly used as a mold device for super engineering plastics that is molded at high temperature, but it can be used not only for mold devices for ordinary general-purpose resins but also for molding thermosetting resins or rubber with heat vulcanization. It may be used in a mold device for performing. In this case, the ceramic plate 48 or the heater 50 may be solely provided in the vicinity of the nozzle touch portion 24 of the fixed mold base 10, and when the nesting mold temperature is low, the ceramic plate 48 and the heater 50. Need not be provided.
【００１５】[0015]
【発明の効果】本発明によれば、入子型と金型本体との
充分な断熱を図りつつ入子型の精密な位置決めを行うこ
とができるため、精密で且つ高温成形が要求されるスー
パーエンプラを成形することが可能となった。その際
に、入子型のみを加熱することによって、入子型温度の
制御を行うことができるため、金型装置全体を加熱する
従来の金型装置に比較して、省エネルギを図ることがで
きる。更に、入子型の温度応答性や立ち上がり性が良好
であるため、入子型温度の制御を容易に行うことができ
る。According to the present invention, since the insert die can be precisely positioned while the heat insulation between the insert die and the die main body is sufficiently achieved, the super mold requiring high precision and high temperature molding is required. It became possible to mold engineering plastics. At that time, since the temperature of the insert mold can be controlled by heating only the insert mold, energy saving can be achieved as compared with the conventional mold device that heats the entire mold device. it can. Further, since the insert die has good temperature response and rising property, the insert die temperature can be easily controlled.
【図１】本発明の一実施例に係る入子型金型装置の縦断
面図である。FIG. 1 is a longitudinal sectional view of a nesting die apparatus according to an embodiment of the present invention.
【図２】図１のＡ−Ａ矢視図である。FIG. 2 is a view as viewed in the direction of arrows AA in FIG. 1;
【図３】図１のＢ−Ｂ矢視図である。FIG. 3 is a view taken in the direction of arrows BB in FIG. 1;
【図４】昇温時の金型本体及び入子型との温度変化を示
すグラフである。FIG. 4 is a graph showing changes in temperature of the mold body and the insert mold during temperature rise.
１０ 固定型ベース １２ 可動型ベース １４ 入子型 １８ａ、１８ｂ、２０ａ、２０ｂ 位置決め部材 ２２ａ、２２ｂ 固定具 ２４ ノズルタッチ部 ２６ａ、２６ｂ、２８ａ、２８ｂ、３０、３２、４８
セラミック板 ４０ａ、４０ｂ、４２ａ、４２ｂ 棒状ヒータ ４４ａ、４４ｂ、４６ａ、４６ｂ 挿通孔 ４８ ヒータ10 Fixed Type Base 12 Movable Type Base 14 Nested Type 18a, 18b, 20a, 20b Positioning Member 22a, 22b Fixing Tool 24 Nozzle Touch Section 26a, 26b, 28a, 28b, 30, 32, 48
Ceramic plate 40a, 40b, 42a, 42b Rod-shaped heater 44a, 44b, 46a, 46b Insertion hole 48 Heater
Claims (5)
々が、金型本体及び金型本体に設けられた位置決め部材
の各当接面に当接されてなる入子型金型装置において、 該入子型壁面と当接する金型本体及び位置決め部材の各
当接面に、前記金型本体と入子型とを断熱する断熱用の
セラミック板が装着されていることを特徴とする入子型
金型装置。1. A nesting die, wherein each of the wall surfaces of the nesting die mounted on the die body is in contact with each abutting surface of a die body and a positioning member provided in the die body. In the device, a ceramic plate for heat insulation that insulates the mold body and the insert mold is attached to each contact surface of the mold body and the positioning member that contact the insert mold wall surface. Nesting die device.
型本体のノズルタッチ部近傍に、金型本体に装着された
入子型からの放熱を防ぐ断熱用のセラミック板が装着さ
れている請求項１記載の入子型金型装置。2. A ceramic plate for heat insulation, which prevents heat radiation from a mold inserted in the mold body, is mounted in the vicinity of the nozzle touch portion of the mold body, which contacts the tip of the nozzle of the injection molding machine. The insert mold apparatus according to claim 1.
型本体のノズルタッチ部近傍に、金型本体に装着された
入子型からの放熱を防ぐ放熱防止用のヒータが設けられ
ている請求項１又は請求項２記載の入子型金型装置。3. A heat dissipation preventing heater for preventing heat dissipation from an insert mold attached to the mold body is provided in the vicinity of the nozzle touch portion of the mold body, which is in contact with the nozzle tip of the injection molding machine. The insert mold apparatus according to claim 1 or 2.
されている請求項１〜３のいずれか一項記載の入子型金
型装置。4. The insert mold apparatus according to claim 1, wherein the ceramic plate is made of zirconia.
記入子型に穿設された挿通孔に挿入されるように、棒状
ヒータが金型本体に設けられている請求項１〜４のいず
れか一項記載の入子型金型装置。5. A rod-shaped heater is provided on the mold body so that when the nest mold is mounted on the mold body, the rod-shaped heater is inserted into an insertion hole formed in the mold. The nesting die device according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13271794A JP2680265B2 (en) | 1994-06-15 | 1994-06-15 | Nesting mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13271794A JP2680265B2 (en) | 1994-06-15 | 1994-06-15 | Nesting mold equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH081726A JPH081726A (en) | 1996-01-09 |
| JP2680265B2 true JP2680265B2 (en) | 1997-11-19 |
Family
ID=15087937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13271794A Expired - Fee Related JP2680265B2 (en) | 1994-06-15 | 1994-06-15 | Nesting mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2680265B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100768B (en) * | 2023-01-09 | 2024-06-21 | 余姚市德沃斯模具科技有限公司 | Mould structure of window frame plastic products behind car |
-
1994
- 1994-06-15 JP JP13271794A patent/JP2680265B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH081726A (en) | 1996-01-09 |
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