JP2696323B2 - Packaging method for electronic components - Google Patents
Packaging method for electronic componentsInfo
- Publication number
- JP2696323B2 JP2696323B2 JP62108365A JP10836587A JP2696323B2 JP 2696323 B2 JP2696323 B2 JP 2696323B2 JP 62108365 A JP62108365 A JP 62108365A JP 10836587 A JP10836587 A JP 10836587A JP 2696323 B2 JP2696323 B2 JP 2696323B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- electronic component
- powder composition
- resin powder
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000004806 packaging method and process Methods 0.000 title claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 38
- 229920000647 polyepoxide Polymers 0.000 claims description 38
- 239000000203 mixture Substances 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 31
- 239000004088 foaming agent Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000007654 immersion Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- -1 aliphatic amines Chemical class 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 2
- 235000019399 azodicarbonamide Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- KXPTYUSZHKUYSM-UHFFFAOYSA-N 1-n,4-n-dimethyl-2,3-dinitrosobenzene-1,4-dicarboxamide Chemical compound CNC(=O)C1=CC=C(C(=O)NC)C(N=O)=C1N=O KXPTYUSZHKUYSM-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XSXYESVZDBAKKT-UHFFFAOYSA-N 2-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1O XSXYESVZDBAKKT-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- BLJHFERYMGMXSC-UHFFFAOYSA-N 3-[3-(hydrazinesulfonyl)phenyl]sulfonylbenzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC(S(=O)(=O)C=2C=C(C=CC=2)S(=O)(=O)NN)=C1 BLJHFERYMGMXSC-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- VJRITMATACIYAF-UHFFFAOYSA-N benzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC=C1 VJRITMATACIYAF-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- RNCAJLLRSYSZAM-UHFFFAOYSA-N diazinane-3,6-dione Chemical compound O=C1CCC(=O)NN1 RNCAJLLRSYSZAM-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- YRZFHTRSHNGOSR-UHFFFAOYSA-N phenylmethanamine;trifluoroborane Chemical compound FB(F)F.NCC1=CC=CC=C1 YRZFHTRSHNGOSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品の外装方法に関し、より詳しく
は、新規なエポキシ樹脂粉体組成物を使用して、電子部
品に優れた特性を付与し得る電子部品の外装方法に関す
る。
従来技術とその問題点
従来コンデンサー、抵抗、コイル等の電子部品の封止
又は塗装方法として、エポキシ樹脂粉体組成物を使用す
る流動浸漬法、静電流動浸漬法、静電スプレー法、いわ
ゆる“振りかけ転がし法”等が行なわれている。しかし
ながら、従来技術により得られる硬化塗膜は、硬度が高
く、緻密でありすぎるために、耐ヒートサイクル性及び
耐クラック性に劣り、従ってピンホール発生を充分に防
止し得ず、電子部品の保護を効果的に行なうことが出来
ない。
問題点を解決するための手段
本発明者は、上記の如き従来技術の問題点に鑑みて種
々研究を重ねた結果、硬化後に多孔質となる新しいタイ
プのエポキシ樹脂粉体組成物を電子部品の外装材料とし
て使用する場合には、その様な問題点を実質的に解消若
しくは大幅に軽減し得ることを見出した。すなわち、本
発明は、エポキシ樹脂と硬化剤とを含むエポキシ樹脂粉
体組成物を電子部品に付着させた後、加熱する電子部品
の外装方法において、（ｉ）当該エポキシ樹脂粉体組成
物としてエポキシ樹脂100重量部に対して発砲剤１〜60
重量部を配合したエポキシ樹脂粉体組成物を使用し、
（ii）当該エポキシ樹脂粉体組成物を浸漬法により電子
部品に付着させ、（iii）当該電子部品を加熱して、電
子部品に付着させたエポキシ樹脂粉体組成物を溶融発泡
させて多孔質硬化体とし、（iv）多孔質硬化体で外装さ
れた当該電子部品を溶融ワックス又は樹脂液に浸漬して
多孔質硬化体を封孔することを特徴とする電子部品の外
装方法を提供するものである。
本発明で使用する粉体組成物中のエポキシ樹脂として
は、その分子中にエポキシ基を少くとも２個有する化合
物であれば、分子構造、分子量などの点で特に制限はな
く、従来から電子部品封止用エポキシ樹脂粉体組成物に
おいて使用されているものが、すべて使用可能である。
エポキシ樹脂の具体例としては、ビスフェノール型等の
芳香族系、シクロヘキサン誘導体等の肪環族系、ノボラ
ック型等が挙げられる。
本発明で使用する硬化剤も、従来から電子部品封止用
エポキシ樹脂粉体組成物において使用されているものと
何ら異なるところはない。具体的には、ジエチルアミノ
プロピルアミン、Ｎ−アミノエチルピペラジン、イソホ
ロンジアミン、メンセンジアミン、キシレンジアミン等
の脂肪族アミン；メタフェニレンジアミン、ジアミノジ
フェニルメタン、ジアミノジフェニルスルホン、3,9−
ビス（３−アミノプロピル）−2,4,8,10−テトラスピロ
［5,5］ウンデカン等の芳香族アミン；無水フタル酸、
無水マレイン酸、無水ピロメリット酸、無水メチルナリ
ジック酸、無水クロレンデック酸等の酸無水物；ジシア
ンアミド、フェニルビグアニド等のアミド類;2−メチル
イミダゾール、２−エチル−４−メチルイミダゾール等
のイミダゾール類；コハク酸ヒドラジド、アジピン酸ヒ
ドラジド、イソフタル酸ヒドラジド、サルチル酸ヒドラ
ジドの如きカルボン酸ヒドラジド等のヒドラジド類；三
フッ化ホウ素−モノエチルアミン、三フッ化ホウ素−ベ
ンジルアミン等のエポキシ樹脂用硬化剤が例示される。
これらのうちでも、酸無水物、イミダゾール類、アミド
類等がより好ましい。硬化剤の使用量も、公知のエポキ
シ樹脂組成物における量と変りなく、通常エポキシ樹脂
重量の１〜80％程度である。
本発明で使用する発泡剤としては、80〜120℃程度の
温度で分解若しくは発泡するものが挙げられる。具体的
には、2,2′−アゾビスイソブチロニトリル、アゾヘキ
サヒドロベンゾニトリル、アゾジカルボンアミド、ジア
ゾアミノベンゼン等のアゾ化合物系;N,N′−ジニトロソ
ペンタメチレンテトラミン、N,N′−ジニトロソ−N,N′
−ジニトロソ−N,N′−ジメチルテレフタルアミド等
の、ニトロソ化合物系；ベンゼンスルホニルヒドラジ
ド、ｐ−トルエンスルホニルヒドラジド、ジフェニルス
ルホン−3,3′−ジスルホニルヒドラジド、ジフェニル
オキシド−4,4′−ジスルホニルヒドラジド等のスルホ
ニルヒドラジド化合物系；並びにブタン、ノルマルヘキ
サン等の炭化水素を内包する熱膨脹性マイクロカプセル
等が例示される。このような発泡剤の使用量は、発泡剤
の種類、エポキシ樹脂組成物の用途及びそれに応じて定
まる多孔質樹脂硬化物の物性等により変り得るが、エポ
キシ樹脂100重量部に対し、１〜60重量部程度の範囲内
にある。
尚、本発明で使用するエポキシ樹脂組成物には、必要
に応じて常法に従って、炭酸カルシウム、水酸化アルモ
ニウム、酸化アルミニウム、石英ガラス粉、ケイ酸アル
ミニウム、鉄粉、ポリエチレンパウダー、ポリアミドパ
ウダー等の無機系及び有機系の充填材；三酸化アンチモ
ン、リン系、ハロゲン系等の難燃材；酸化チタン、カー
ボンブラック、ベンガラ、フタロシアニンブルー、群青
等の顔料等を配合しても良い。
本発明方法で使用するエポキシ樹脂粉体組成物は、公
知のエポキシ樹脂粉体組成物と同様の方法で製造され
る。例えば、所定割合の各成分を均一に混合し、発泡材
が実質的に分解もしくは発泡しない条件下に加熱溶融
し、押出機から押出した後、微粉砕し、分級すれば良
い。
本発明方法は、上述のエポキシ樹脂粉体組成物を使用
して、公知の電子部品の外装方法である流動浸漬法、静
電流動浸漬法等の浸漬法に従って、電子部品にエポキシ
樹脂粉体組成物を賦与した後、発泡剤の分解若しくは発
泡温度で加熱し、冷却すれば良い。
本発明方法においては、エポキシ樹脂粉体組成物の各
成分の配合割合等により定まる組成物自体の物性、加熱
温度、冷却速度等に応じて、独立気泡或いは連続気泡が
形成される場合があり、又この両者が混在する中間的気
泡が形成される場合もある。従って、発泡後の硬化体を
溶融ワックス、樹脂液等に浸漬して封孔を行なう
発明の効果
本発明で使用するエポキシ樹脂組成物は、電子部品に
付与後、加熱硬化時に発泡して多孔質化するので、電子
部品に柔軟性、耐ヒートサイクル性、ピンホール防止性
を付与する。従って、本発明方法により得られる電子部
品は、防湿性及び電気絶縁製に優れているので、その信
頼性が著るしく高められる。また、本発明方法は、使用
する粉体材料の取扱が容易で且つ量産に適しているの
で、製造コストを大幅に低下させることが出来る。
実施例
以下に実施例及び比較例を示し、本発明の特徴とする
ところをより一層明らかにする。
参考例１〜９及び比較参考例１〜３
第１表に示す割合で、エポキシ樹脂100重量部に対し
硬化剤、発泡剤及び必要に応じて炭酸カルシウムを配合
し、常温で混合し、粉砕して、エポキシ樹脂粉体組成物
を得た。流動浸漬塗装機を使用して、得られた組成物の
180℃×60秒での発泡性を判定した。結果を第１表に示
す。尚、第１表においては、使用したエポキシ樹脂を○
印により示す。
また、得られた粉体組成物を使用して、流動浸漬塗装
機によりJIS2号ばね座金に粉体塗装を行なった後、120
℃で60分間熱風乾燥して硬化及び発泡させた。次いで、
該塗装座金を、液状エポキシ樹脂（エポキシ当量200）
と芳香族アミン硬化剤との混合物に押込み成形した後、
100℃で120分間硬化させた。かくして得られた硬化体
を、−40℃×30分→140℃×30分を１サイクルとするヒ
ートサイクルテストに20回供して、その耐久性を調べ
た。検体10本中のクラック発生数で示される結果を第１
表に示す。
尚、第１表において、各記号は、以下の事項を示す。
（Ｉ）…ビスフェノール型エポキシ樹脂；エポキシ当量
650
（II）…脂環族系エポキシ樹脂；エポキシ当量600
（III）…ノポラック系エポキシ樹脂；エポキシ当量200
（IV）…アゾジカルボンアミド
（Ｖ）…N,N′−ジニトロソペンタメチレンテトラミン
（VI）…P,P′−オキシビス（ベンゼンスルホニルヒド
ラジド）
（VII）…ブタン及びノルマルヘキサンを内包する熱膨
脹性マイクロカプセル
（VIII）…２−メチルイミダゾール
（IX）…炭酸カルシウム
（Ｘ）…発泡性：
◎ 極めて良い
△ 良い
● 悪い
（XI）…耐久性：
◎ クラックなし
△ ５こまでクラックあり
● すべてにクラックあり
実施例１
参考例１で得た本発明エポキシ樹脂粉体組成物（軟化
温度約50℃）を使用して、予め約100℃に加熱したフィ
ルムコンデンサーを流動浸漬塗装した後、120℃で10秒
間加熱してコンデンサー表面に付着した粉体組成物を溶
融発泡させ、硬化させた。次いで、該フィルムコンデン
サーをケースに収容し、コンデンサーが浸漬するように
液状エポキシ樹脂を注型し100℃で30分間放置して、液
状エポキシ樹脂を完全に硬化させた。
かくして、絶縁防湿性に優れ、ピンホールのないフィ
ルムコンデンサーが得られた。
尚、参考例２〜９で得られた本発明エポキシ樹脂粉体
組成物を使用して、上記と同様の手法により、フィルム
コンデンサーを処理したところ、同様の優れた絶縁防湿
性に優れたフィルムコンデンサーが得られた。
比較例１
比較参考例１で得たエポキシ樹脂粉体組成物を使用し
て、実施例１と同様にしてフィルムコンデンサーの塗装
を行なった。
得られた塗装フィルムコンデンサーは、外見上緻密な
塗膜を備えていたが、ミクロ的には多数のピンホールが
存在しており、絶縁耐湿性に劣っていた。
また、比較参考例２〜３で得られたエポキシ樹脂粉体
組成物を使用して、同様にフィルムコンデンサーの塗装
を行なったが、やはり絶縁耐湿性は、不充分であった。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging an electronic component, and more particularly, to imparting excellent characteristics to an electronic component by using a novel epoxy resin powder composition. The present invention relates to a method for packaging an electronic component. Conventional technology and its problems Conventionally, as a method for sealing or coating electronic components such as capacitors, resistors, coils, etc., a fluid immersion method using an epoxy resin powder composition, an electrostatic fluid immersion method, an electrostatic spray method, a so-called “ Sprinkle rolling method "etc. are performed. However, the cured coating obtained by the prior art has a high hardness and is too dense, and thus has poor heat cycle resistance and crack resistance. Therefore, it cannot sufficiently prevent the occurrence of pinholes and protects electronic components. Cannot be performed effectively. Means for Solving the Problems The present inventor has conducted various studies in view of the problems of the prior art as described above, and as a result, has found that a new type of epoxy resin powder composition which becomes porous after curing is used for an electronic component. It has been found that such a problem can be substantially eliminated or greatly reduced when used as an exterior material. That is, the present invention relates to a method for packaging an electronic component, which comprises applying an epoxy resin powder composition containing an epoxy resin and a curing agent to an electronic component and then heating the electronic component. Foaming agent 1 to 60 per 100 parts by weight of resin
Using an epoxy resin powder composition blended with parts by weight,
(Ii) attaching the epoxy resin powder composition to an electronic component by a dipping method; and (iii) heating the electronic component to melt-foam the epoxy resin powder composition attached to the electronic component to form a porous body. (Iv) A method for packaging an electronic component, wherein (iv) the electronic component packaged with the porous cured product is immersed in a molten wax or a resin solution to seal the porous cured product. It is. The epoxy resin in the powder composition used in the present invention is not particularly limited in terms of molecular structure, molecular weight, etc., as long as it is a compound having at least two epoxy groups in its molecule. All the ones used in the epoxy resin powder composition for sealing can be used.
Specific examples of the epoxy resin include an aromatic resin such as a bisphenol type, an alicyclic type such as a cyclohexane derivative, and a novolak type. The curing agent used in the present invention is not different from those conventionally used in epoxy resin powder compositions for sealing electronic parts. Specifically, aliphatic amines such as diethylaminopropylamine, N-aminoethylpiperazine, isophoronediamine, mensendiamine, xylenediamine; metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, 3,9-
Aromatic amines such as bis (3-aminopropyl) -2,4,8,10-tetraspiro [5,5] undecane; phthalic anhydride;
Acid anhydrides such as maleic anhydride, pyromellitic anhydride, methyl nalidic anhydride, and chlorendex anhydride; amides such as dicyanamide and phenylbiguanide; imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole Hydrazides such as carboxylic acid hydrazides such as succinic hydrazide, adipic hydrazide, isophthalic hydrazide, and salicyl hydrazide; curing agents for epoxy resins such as boron trifluoride-monoethylamine and boron trifluoride-benzylamine; Is done.
Among these, acid anhydrides, imidazoles, amides and the like are more preferable. The amount of the curing agent used is also the same as that in the known epoxy resin composition, and is usually about 1 to 80% of the weight of the epoxy resin. Examples of the foaming agent used in the present invention include those which decompose or foam at a temperature of about 80 to 120 ° C. Specifically, azo compounds such as 2,2'-azobisisobutyronitrile, azohexahydrobenzonitrile, azodicarbonamide, diazoaminobenzene; N, N'-dinitrosopentamethylenetetramine, N, N '-Dinitroso-N, N'
A nitroso compound such as dinitroso-N, N'-dimethylterephthalamide; benzenesulfonylhydrazide, p-toluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, diphenyloxide-4,4'-disulfonyl Examples include sulfonyl hydrazide compounds such as hydrazide; and heat-expandable microcapsules containing a hydrocarbon such as butane and normal hexane. The amount of the foaming agent used may vary depending on the type of the foaming agent, the use of the epoxy resin composition, and the physical properties of the cured porous resin determined according to the type of the foaming agent. It is in the range of about parts by weight. In addition, the epoxy resin composition used in the present invention, if necessary, according to a conventional method, such as calcium carbonate, aluminum hydroxide, aluminum oxide, quartz glass powder, aluminum silicate, iron powder, polyethylene powder, polyamide powder and the like. Inorganic and organic fillers; antimony trioxide, phosphorus-based, halogen-based flame-retardant materials; and pigments such as titanium oxide, carbon black, red iron oxide, phthalocyanine blue, and ultramarine blue. The epoxy resin powder composition used in the method of the present invention is produced in the same manner as a known epoxy resin powder composition. For example, a predetermined ratio of each component may be uniformly mixed, heated and melted under conditions where the foaming material does not substantially decompose or foam, extruded from an extruder, finely pulverized, and classified. The method of the present invention uses the above-described epoxy resin powder composition to form an epoxy resin powder composition on an electronic component according to a known dipping method such as a flow dipping method or an electrostatic flow dipping method, which is a method of packaging an electronic component. After applying the substance, heating may be performed at the decomposition temperature of the foaming agent or at the foaming temperature, followed by cooling. In the method of the present invention, depending on the physical properties of the composition itself, such as the mixing ratio of each component of the epoxy resin powder composition, the heating temperature, the cooling rate, etc., closed cells or open cells may be formed, In some cases, an intermediate bubble in which both are mixed is formed. Therefore, the effect of the invention in which the cured body after foaming is immersed in a molten wax, a resin liquid or the like to form a seal is provided. The epoxy resin composition used in the present invention is foamed during heat curing after being applied to an electronic component. This imparts flexibility, heat cycle resistance, and pinhole prevention to the electronic component. Therefore, since the electronic component obtained by the method of the present invention is excellent in moisture-proof property and electric insulation, its reliability is remarkably enhanced. In addition, the method of the present invention facilitates handling of the powder material used and is suitable for mass production, so that the manufacturing cost can be significantly reduced. Examples Examples and comparative examples are shown below to further clarify features of the present invention. Reference Examples 1 to 9 and Comparative Reference Examples 1 to 3 At the ratios shown in Table 1, a curing agent, a foaming agent and, if necessary, calcium carbonate were added to 100 parts by weight of the epoxy resin, mixed at ordinary temperature, and ground. Thus, an epoxy resin powder composition was obtained. Using a fluid immersion coating machine, the resulting composition
Foamability at 180 ° C. for 60 seconds was determined. The results are shown in Table 1. In Table 1, the epoxy resin used was
Indicated by a mark. Further, using the obtained powder composition, after performing powder coating on JIS No. 2 spring washer with a fluid immersion coating machine, 120
It was cured and foamed by drying with hot air at 60 ° C for 60 minutes. Then
The painted washer is liquid epoxy resin (epoxy equivalent 200)
After extrusion molding into a mixture of and an aromatic amine curing agent,
Cured at 100 ° C. for 120 minutes. The cured product thus obtained was subjected to a heat cycle test in which -40 ° C. × 30 minutes → 140 ° C. × 30 minutes was one cycle, and its durability was examined. The result indicated by the number of cracks generated in 10 samples
It is shown in the table. In addition, in Table 1, each symbol shows the following matters. (I) bisphenol type epoxy resin; epoxy equivalent 650 (II) alicyclic epoxy resin; epoxy equivalent 600 (III) nopolak epoxy resin; epoxy equivalent 200 (IV) azodicarbonamide (V) N , N'-Dinitrosopentamethylenetetramine (VI) ... P, P'-oxybis (benzenesulfonylhydrazide) (VII) ... Heat-expandable microcapsules containing butane and normal hexane (VIII) ... 2-Methylimidazole (IX) ... calcium carbonate (X) ... foaming property: ◎ extremely good △ good ● bad (XI) ... durability: ◎ no cracks △ up to 5 cracks ● all cracks Example 1 Using the epoxy resin powder composition of the present invention obtained in Reference Example 1 (softening temperature: about 50 ° C.), a film condenser previously heated to about 100 ° C. was subjected to fluid immersion coating, and then 120 ° C. for 10 seconds. The powder composition adhered to the surface of the condenser by heating was melted and foamed and cured. Next, the film capacitor was housed in a case, and a liquid epoxy resin was cast so that the capacitor was immersed, and left at 100 ° C. for 30 minutes to completely cure the liquid epoxy resin. Thus, a film capacitor having excellent insulating and moisture-proof properties and having no pinhole was obtained. In addition, when using the epoxy resin powder composition of the present invention obtained in Reference Examples 2 to 9 and treating the film capacitor in the same manner as described above, the same film capacitor excellent in insulation and moisture resistance was obtained. was gotten. Comparative Example 1 Using the epoxy resin powder composition obtained in Comparative Reference Example 1, a film capacitor was coated in the same manner as in Example 1. The resulting coated film capacitor had an apparently dense coating film, but had many pinholes microscopically and was inferior in insulation and moisture resistance. Further, using the epoxy resin powder compositions obtained in Comparative Reference Examples 2 and 3, coating of a film capacitor was performed in the same manner, but the insulation moisture resistance was still insufficient.
フロントページの続き (72)発明者 渡辺 茂雄 高槻市道鵜町３丁目58番地 サンユレジ ン株式会社内 (72)発明者 金井 洋一 高槻市道鵜町３丁目58番地 サンユレジ ン株式会社内 (72)発明者 川崎 正雄 高槻市道鵜町３丁目58番地 サンユレジ ン株式会社内 (56)参考文献 実開 昭55−173127（ＪＰ，Ｕ)Continuation of front page (72) Inventor Shigeo Watanabe 3-58, Umachi, Takatsuki-shi Sanyuresi Inc. (72) Inventor Yoichi Kanai 3-58, Umachi, Takatsuki-shi Sanyuresi Inc. (72) Inventor Masao Kawasaki 3-58, Umachi, Takatsuki-shi Sanyuresi Inc. (56) References Japanese Utility Model Sho 55-173127 (JP, U)
Claims (1)
成物を電子部品に付着させた後、加熱する電子部品の外
装方法において、 （ｉ）当該エポキシ樹脂粉体組成物としてエポキシ樹脂
100重量部に対して発泡剤１〜60重量部を配合したエポ
キシ樹脂粉体組成物を使用し、 （ii）当該エポキシ樹脂粉体組成物を浸漬法により電子
部品に付着させ、 （iii）当該電子部品を加熱して、電子部品に付着させ
たエポキシ樹脂粉体組成物を溶融発泡させて多孔質硬化
体とし、 （iv）多孔質硬化体で外装された当該電子部品を溶融ワ
ックス又は樹脂液に浸漬して多孔質硬化体を封孔 することを特徴とする電子部品の外装方法。(57) [Claims] An epoxy resin powder composition containing an epoxy resin and a curing agent is applied to an electronic component, and then heated.
Using an epoxy resin powder composition in which 1 to 60 parts by weight of a foaming agent is blended with respect to 100 parts by weight; (ii) adhering the epoxy resin powder composition to an electronic component by a dipping method; The electronic component is heated, and the epoxy resin powder composition adhered to the electronic component is melted and foamed to form a porous cured product. (Iv) The electronic component packaged with the porous cured product is melted with a wax or a resin liquid. A method of packaging an electronic component, characterized in that the porous cured body is sealed by immersion in a porous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62108365A JP2696323B2 (en) | 1987-04-30 | 1987-04-30 | Packaging method for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62108365A JP2696323B2 (en) | 1987-04-30 | 1987-04-30 | Packaging method for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63273310A JPS63273310A (en) | 1988-11-10 |
| JP2696323B2 true JP2696323B2 (en) | 1998-01-14 |
Family
ID=14482908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62108365A Expired - Lifetime JP2696323B2 (en) | 1987-04-30 | 1987-04-30 | Packaging method for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2696323B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095609A (en) | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | Outer sheath varistor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55173127U (en) * | 1979-05-28 | 1980-12-12 |
-
1987
- 1987-04-30 JP JP62108365A patent/JP2696323B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63273310A (en) | 1988-11-10 |
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