JP2697181B2 - Manufacturing method of infrared detector - Google Patents
Manufacturing method of infrared detectorInfo
- Publication number
- JP2697181B2 JP2697181B2 JP1229735A JP22973589A JP2697181B2 JP 2697181 B2 JP2697181 B2 JP 2697181B2 JP 1229735 A JP1229735 A JP 1229735A JP 22973589 A JP22973589 A JP 22973589A JP 2697181 B2 JP2697181 B2 JP 2697181B2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- substrate
- manufacturing
- layer
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Solid State Image Pick-Up Elements (AREA)
Description
【発明の詳細な説明】 〔概 要〕 裏面入射型赤外線検知器のうち、特にレンズを設けた
赤外線検知アレイの製造方法に関し、 製造工程を簡略にして、且つ、検知アレイを高性能化
させることを目的とし、 赤外線透過基板の受光面に球状マスクを形成し、該球
状マスクと共に前記基板をイオンミリングして該基板面
にレンズを形成するレンズ作製工程と、次いで、該レン
ズを通して光を照射し、前記基板の反対面に焦点を結ば
せて局部的に加熱し、該加熱部分に検知素子層を選択成
長させる気相エピタキシャル成長工程とが含まれてなる
ことを特徴とする。DETAILED DESCRIPTION OF THE INVENTION [Outline] Among back-illuminated infrared detectors, the present invention relates to a method of manufacturing an infrared detection array provided with a lens, in particular, to simplify the manufacturing process and improve the performance of the detection array. Forming a spherical mask on the light receiving surface of the infrared transmitting substrate, ion milling the substrate together with the spherical mask to form a lens on the substrate surface, and then irradiating light through the lens. A step of locally heating the substrate by focusing on the opposite surface of the substrate, and a step of vapor-phase epitaxial growth for selectively growing the sensing element layer in the heated portion.
本発明は裏面入射型赤外線検知器の製造方法に係り、
特にレンズを設けた赤外線検知アレイの製造方法に関す
る。The present invention relates to a method for manufacturing a back-illuminated infrared detector,
In particular, the present invention relates to a method for manufacturing an infrared detection array provided with a lens.
赤外線撮像などに使用される赤外線検知器が急速な進
歩をみせて、ハイテク産業への広い応用が展開されつつ
ある。第4図(a),(b)はそのような裏面入射型赤
外線検知器を示す図で、同図(a)は平面図,同図
(b)はそのAA断面図である。図中の記号1はCdTe基
板,2はpn接合を有するHgCdTe層,3はInバンプ電極,4は信
号読み出しCCDである。通常、赤外線検知器は受光部分
と電荷転送部分とが異種材料のハイブリッド型に構成さ
れ、受光部分はアレイ状の光起電力型素子から構成され
ている。且つ、図のように、CdTe基板1の受光面は1セ
ル(素子)当り1つずつのレンズ5が設けられて、各セ
ルへの入射光量が増大されて感度の向上が図られてい
る。このレンズ5は、第5図に示すレンズ部分図のよう
に、例えば、レンズ5までの高さ寸法t=223μm,レン
ズの幅d=100μm,CdTe基板1の厚みl=200μm,レンズ
間の距離p=120μmにして、焦点f=2とするレンズ
で、HgCdTe部2に焦点が結ばれる構造である。With the rapid progress of infrared detectors used for infrared imaging and the like, wide applications to the high-tech industry are being developed. FIGS. 4 (a) and 4 (b) show such a back-illuminated infrared detector, wherein FIG. 4 (a) is a plan view and FIG. 4 (b) is a sectional view taken along the line AA. Symbol 1 in the figure is a CdTe substrate, 2 is a HgCdTe layer having a pn junction, 3 is an In bump electrode, and 4 is a signal readout CCD. Normally, the infrared detector has a light receiving portion and a charge transfer portion formed of a hybrid type of different materials, and the light receiving portion is formed of an array of photovoltaic elements. Further, as shown in the drawing, the light receiving surface of the CdTe substrate 1 is provided with one lens 5 per cell (element), and the amount of light incident on each cell is increased to improve the sensitivity. As shown in the lens partial view of FIG. 5, the lens 5 has, for example, a height t up to the lens 5 = 223 μm, a lens width d = 100 μm, a thickness 1 of the CdTe substrate 1 = 200 μm, and a distance between the lenses. The lens has a focal point f = 2 with p = 120 μm, and the focal point is focused on the HgCdTe portion 2.
且つ、この受光部になる赤外線検知アレイはCdTe基板
1にHgCdTe層2を成長させ、次に、レンズを形成する製
造方法によつて作製されている。そのCdTe基板1にHgCd
Te層2を成長させる場合、全面にHgCdTe層を成長させた
後、フォトリソグラフィ技術を用いてパターンニングす
る方法が採られているが、選択成長法も使用されてい
る。従来のHgCdTe層2の選択成長とは、CdTe基板に凹部
を形成し、凹部に反応ガスが停留し易いことを利用し
て、その凹部にHgCdTeを選択成長させる方法である。The infrared detecting array serving as the light receiving portion is manufactured by a method of growing a HgCdTe layer 2 on a CdTe substrate 1 and then forming a lens. HgCd on the CdTe substrate 1
When the Te layer 2 is grown, a method of growing the HgCdTe layer over the entire surface and then patterning using a photolithography technique is employed, but a selective growth method is also used. The conventional selective growth of the HgCdTe layer 2 is a method in which a concave portion is formed in a CdTe substrate and HgCdTe is selectively grown in the concave portion by utilizing the fact that the reaction gas easily stays in the concave portion.
しかし、そのように、HgCdTe層を成長した後にレンズ
を形成する製造方法は、両工程に関連がなく、微細な加
工のために、レンズの焦点がHgCdTe層2に一致するとは
限らない。However, such a manufacturing method of forming a lens after growing the HgCdTe layer is not related to both steps, and the focus of the lens does not always coincide with the HgCdTe layer 2 due to fine processing.
本発明はそのような問題点を解消させて、製造工程を
簡略にし、且つ、検知アレイを高性能化させることを目
的とした製造方法を提案するものである。The present invention proposes a manufacturing method for solving such problems, simplifying the manufacturing process, and improving the performance of the detection array.
その課題は、第1図および第2図のように、赤外線透
過基板1の受光面にマスク6を形成し、該マスクと共に
前記基板をイオンミリングして該基板面にレンズ5を形
成するレンズ作製工程と、 次いで、第3図のように、該レンズを通して光を照射
し、前記基板の反対面に焦点を結ばせて局部的に加熱
し、該加熱部分に検知素子層2を選択成長させる気相エ
ピタキシャル成長工程とが含まれる製造方法によつて解
決される。The problem is that as shown in FIGS. 1 and 2, a lens is formed by forming a mask 6 on a light receiving surface of an infrared transmitting substrate 1 and ion milling the substrate together with the mask to form a lens 5 on the substrate surface. Then, as shown in FIG. 3, light is radiated through the lens to focus on the opposite surface of the substrate to locally heat the light, and to selectively grow the sensing element layer 2 on the heated portion. The problem is solved by a manufacturing method including a phase epitaxial growth step.
即ち、本発明は、予め基板の受光面にマスク(例えば
レジスト)を用いてレンズを作製しておき、次いで、そ
のレンズを利用して局部的加熱によって検知素子層を選
択成長させる。そうすれば、検知素子層に焦点が一致し
て高性能な検知アレイが得られ、しかも、製造工程が簡
略になる。That is, according to the present invention, a lens is prepared in advance using a mask (for example, a resist) on the light-receiving surface of the substrate, and then the sensing element layer is selectively grown by local heating using the lens. By doing so, a high-performance sensing array can be obtained by focusing on the sensing element layer, and the manufacturing process is simplified.
以下に図面を参照して実施例によつて詳細に説明す
る。Hereinafter, embodiments will be described in detail with reference to the drawings.
第1図(a)〜(e)および第2図(a)〜(e)は
本発明にかかるレンズ作製工程の工程順断面図と工程順
平面図を示しており、第1図に示す断面図は部分断面、
第2図に示す平面図は全体の平面図を示している。この
両図を参照して、レンズ作製工程を説明すると、 第1図(a)および第2図(a)参照;まず、CdTe基板
1の全面にレジスト6(マスク)を塗布して厚みDを所
要値(例えば30μm程度)になるようにする。この厚み
Dは塗布する前のレジスト粘度とレジスト塗布機(スピ
ンナー)の回転数によって決めることができる。FIGS. 1 (a) to 1 (e) and 2 (a) to 2 (e) are a sectional view and a plan view in the order of steps of a lens manufacturing process according to the present invention, and are sectional views shown in FIG. The figure is a partial section,
The plan view shown in FIG. 2 shows the entire plan view. The lens manufacturing process will be described with reference to FIGS. 1A and 1A. First, a resist 6 (mask) is applied to the entire surface of the CdTe substrate 1 to reduce the thickness D. It is set to a required value (for example, about 30 μm). This thickness D can be determined by the viscosity of the resist before coating and the number of revolutions of the resist coating machine (spinner).
第1図(b)および第2図(b)参照;次いで、フォト
リソグラフィ技術を用いてレジスト6をパターンニング
して、円柱形のレジストをアレイ状に形成する。Referring to FIGS. 1B and 2B, the resist 6 is patterned by photolithography to form a columnar resist in an array.
第1図(c)および第2図(c)参照;次いで、温度10
0〜200℃でベーキングして溶媒を蒸発させ、円柱形のレ
ジストを乾燥させて半球状のレジスト6に変成させる。
このレンズ作製工程においては、この球状レジストの形
状が極めて大切である。See FIG. 1 (c) and FIG. 2 (c);
The solvent is evaporated by baking at 0 to 200 ° C., and the cylindrical resist is dried to be transformed into a hemispherical resist 6.
In the lens manufacturing process, the shape of the spherical resist is extremely important.
第1図(b)および第2図(d)参照;次いで、アルゴ
ンガスを用いたイオンミリング法によつて全面ミリング
をおこない、レジスト6とCdTe基板1とを同時に削り取
る。本図はそのイオンミリング工程途中を図示してい
る。1 (b) and 2 (d); next, the entire surface is milled by an ion milling method using an argon gas, and the resist 6 and the CdTe substrate 1 are simultaneously removed. This figure illustrates the ion milling process.
第1図(e)および第2図(e)参照;かくして、レジ
スト6が完全に除去されてCdTe基板1面にレンズ5が形
成される。1 (e) and 2 (e); thus, the resist 6 is completely removed, and the lens 5 is formed on the surface of the CdTe substrate 1.
次に、第3図(a),(b)は本発明にかかるHgCdTe
層の選択成長工程を説明する図で、同図(a)は気相エ
ピタキシャル成長装置、同図(b)は選択成長後のCdTe
基板の部分断面図を示している。Next, FIGS. 3A and 3B show HgCdTe according to the present invention.
FIGS. 4A and 4B are diagrams for explaining a layer selective growth process, wherein FIG. 4A shows a vapor phase epitaxial growth apparatus, and FIG. 4B shows CdTe after selective growth.
FIG. 4 shows a partial cross-sectional view of the substrate.
第3図(a)に示す気相エピタキシャル成長装置にお
いて、記号1はレンズ5を作製したCdTe基板,10は反応
チャンバ,11は高周波加熱コイル,12は反応ガス導入口,1
3は排気口,14は光透過窓,15は水銀灯である。その選択
成長方法を説明すると、反応チャンバ10内にレンズアレ
イを形成したCdTe基板1を収容し、レンズ5が光透過窓
14に対向するように装着する。反応ガス導入口12から水
素ガスをキャリアガスとして、ジメチルカドミウム(約
10-5atm),ジアイソプソピルテルル(約10-5atm),水
銀(約10-3atm)を供給して、最初に、高周波加熱コイ
ル11によってCdTe基板1を350℃に加熱して、レンズア
レイとは反対面のCdTe基板1の全面に0.2μm程度のHgC
dTe層2′(このHgCdTe層2′は共通電極にするために
形成されるもの)を成長させ、次に、温度を300℃に下
げて水銀灯15を光透過窓14から照射し、CdTe基板の反対
面に焦点を結ばせて局部的に加熱し、加熱部分に島状の
HgCdTe層2を選択成長させる。かくして、水銀灯15を照
射して12時間選択成長させた結果、50μm程度のHg1-xC
dxTe層(x=0.22)2を成長させることができる。第3
図(b)はその部分断面図を示している。In the vapor phase epitaxial growth apparatus shown in FIG. 3 (a), reference numeral 1 denotes a CdTe substrate on which the lens 5 is formed, 10 denotes a reaction chamber, 11 denotes a high-frequency heating coil, 12 denotes a reaction gas inlet, 1
3 is an exhaust port, 14 is a light transmission window, and 15 is a mercury lamp. The selective growth method will be described. A CdTe substrate 1 having a lens array formed therein is accommodated in a reaction chamber 10, and a lens 5 is provided with a light transmitting window.
Attach so as to face 14. Dimethyl cadmium (approximately
10 -5 atm), diisopsopirtellurium (about 10 -5 atm), and mercury (about 10 -3 atm). First, the CdTe substrate 1 is heated to 350 ° C. by the high-frequency heating coil 11. HgC of about 0.2 μm is formed on the entire surface of the CdTe substrate 1 opposite to the lens array.
A dTe layer 2 ′ (this HgCdTe layer 2 ′ is formed to be a common electrode) is grown, and then the temperature is lowered to 300 ° C., and a mercury lamp 15 is irradiated from a light transmission window 14 to form a CdTe substrate. Focus on the opposite surface and heat locally, and add an island
The HgCdTe layer 2 is selectively grown. Thus, the selective growth was performed for 12 hours by irradiating a mercury lamp 15 to obtain a Hg 1-x C of about 50 μm.
A d x Te layer (x = 0.22) 2 can be grown. Third
FIG. 2B shows a partial cross-sectional view thereof.
上記実施例のようにして受光部になる赤外線検知アレ
イを形成すれば、既に作製したレンズアレイを利用して
HgCdTe層を選択成長させることができ、従来法のよう
に、最初に形成したアレイ状のHgCdTe層に一致するよう
にレンズアレイを形成する方法と比べ、本発明にかかる
形成方法は位置合わせが必要なくなるなど、製造工程が
簡単化される。しかも、レンズの焦点がHgCdTe層に一致
した高性能な検知アレイが得られる。If an infrared detection array serving as a light receiving unit is formed as in the above-described embodiment, it is possible to use an already manufactured lens array.
The HgCdTe layer can be selectively grown, and the formation method according to the present invention requires alignment compared to the conventional method in which a lens array is formed so as to match the initially formed HgCdTe layer in the form of an array. For example, the manufacturing process is simplified. Moreover, a high-performance detection array in which the focal point of the lens matches the HgCdTe layer can be obtained.
なお、上記赤外線透過基板としてCdTe結晶の他、サフ
ァイヤ,GaAs,Si等を用い、また、検知素子としてはHgCd
Teの他、PbSnTe,InSb,InAsなどを用いることができる。Note that, in addition to CdTe crystal, sapphire, GaAs, Si, etc. were used as the infrared transmitting substrate, and HgCd was used as the detecting element.
In addition to Te, PbSnTe, InSb, InAs and the like can be used.
以上の説明から明らかなように、本発明にかかる製造
法は最初にレンズアレイを作製し、そのレンズアレイを
利用して検知素子層を選択成長させる製造方法であるか
ら、検知素子層にレンズの焦点が一致した高性能な検知
アレイが形成されて、しかも、その製造工程が簡単にな
る効果が得られる。従って、赤外線検知器の高性能化と
低価格化とを同時に実現することができる。As is apparent from the above description, the manufacturing method according to the present invention is a manufacturing method in which a lens array is first manufactured, and the sensing element layer is selectively grown using the lens array. A high-performance sensing array having the same focal point is formed, and the manufacturing process is simplified. Therefore, high performance and low cost of the infrared detector can be realized at the same time.
第1図(a)〜(e)は本発明にかかるレンズ作製工程
の工程順断面図、 第2図(a)〜(e)は本発明にかかるレンズ作製工程
の工程順平面図、 第3図(a),(b)は本発明にかかるHgCdTe層の選択
成長工程を説明する図、 第4図(a),(b)は赤外線検知器を示す図、 第5図はレンズ部分図である。 図において、 1はCdTe基板(赤外線透過基板)、 2,2′はHgCdTe層(検知素子層)、 3はInバンプ電極、 4は信号読み出しCCD、 5はレンズ、 6はレジスト(マスク)、 10は反応チャンバ、 11は高周波加熱コイル、 12は反応ガス導入口、 13は排気口、 14は光透過窓、 15は水銀灯 を示している。1 (a) to 1 (e) are sectional views in the order of steps in a lens manufacturing process according to the present invention, and FIGS. 2 (a) to 2 (e) are plan views in the order of steps in a lens manufacturing process according to the present invention. 4A and 4B are views for explaining a selective growth process of the HgCdTe layer according to the present invention, FIGS. 4A and 4B are views showing an infrared detector, and FIG. 5 is a partial view of a lens. is there. In the figure, 1 is a CdTe substrate (infrared transmitting substrate), 2, 2 'is a HgCdTe layer (detection element layer), 3 is an In bump electrode, 4 is a signal readout CCD, 5 is a lens, 6 is a resist (mask), 10 Denotes a reaction chamber, 11 denotes a high-frequency heating coil, 12 denotes a reaction gas inlet, 13 denotes an exhaust port, 14 denotes a light transmission window, and 15 denotes a mercury lamp.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平1−308927(JP,A) 特開 昭63−150976(JP,A) 特開 昭62−111416(JP,A) 特開 昭61−267313(JP,A) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-308927 (JP, A) JP-A-63-150976 (JP, A) JP-A-62-1111416 (JP, A) JP-A-61-1 267313 (JP, A)
Claims (1)
し、該マスクと共に前記基板をイオンミリングして該基
板面にレンズを形成するレンズ作製工程と、 次いで、該レンズを通して光を照射し、前記基板の反対
面に焦点を結ばせて局部的に加熱し、該加熱部分に検知
素子層を選択成長させる気相エピタキシャル成長工程と
が含まれてなることを特徴とする赤外線検知器の製造方
法。A lens forming step of forming a mask on the light receiving surface of the infrared transmitting substrate, ion milling the substrate together with the mask to form a lens on the substrate surface, and then irradiating light through the lens; A method of manufacturing an infrared detector, comprising: a step of locally heating a focus on the opposite surface of the substrate, and a step of selectively growing a sensing element layer in the heated portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1229735A JP2697181B2 (en) | 1989-09-04 | 1989-09-04 | Manufacturing method of infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1229735A JP2697181B2 (en) | 1989-09-04 | 1989-09-04 | Manufacturing method of infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0391960A JPH0391960A (en) | 1991-04-17 |
| JP2697181B2 true JP2697181B2 (en) | 1998-01-14 |
Family
ID=16896869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1229735A Expired - Lifetime JP2697181B2 (en) | 1989-09-04 | 1989-09-04 | Manufacturing method of infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2697181B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133456U (en) * | 1991-05-31 | 1992-12-11 | 日本電気株式会社 | Infrared image sensor and infrared detector |
| FR2838561B1 (en) * | 2002-04-12 | 2004-09-17 | Commissariat Energie Atomique | PHOTODECTOR MATRIX, PIXEL ISOLATED BY WALLS, HYBRIDED ON A READING CIRCUIT |
| DE102009013112A1 (en) | 2009-03-13 | 2010-09-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a multiplicity of microoptoelectronic components and microoptoelectronic component |
-
1989
- 1989-09-04 JP JP1229735A patent/JP2697181B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0391960A (en) | 1991-04-17 |
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